MPC860TZQ66D4 - 66MHz PowerQUICC MPU, 357-PBGA | NXP
料号： MPC860TZQ66D4 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $135.47 | $135.47 |
| 10 | $121.92 | $1,219.20 |
| 100 | $108.38 | $10,838.00 |
| 500 | $94.83 | $47,415.00 |
| 1,000 | $81.28 | $81,280.00 |
MPC860TZQ66D4 概述
What is a PowerQUICC MPU? A PowerQUICC (PowerPC QUICC Integration Communications Controller) is a family of integrated communications microprocessors from NXP (formerly Motorola/Freescale) that combines a PowerPC processor core with specialized communications peripherals, most notably the CPM (Communications Processor Module). The MPC8xx series was the original PowerQUICC line, optimized for embedded networking and telecom equipment where deterministic peripheral handling was critical. The hierarchy is: MPU -> microprocessor -> processor -> integrated circuit.
Key features include 1 CPU core (32-bit PowerPC), 66 MHz core frequency, integrated CPM with multiple SCCs, SMCs, and serial channels for networking, 357-ball PBGA package, and an industrial/commercial operating range. The on-chip CPM offloads protocol handling from the core, enabling line-rate performance for WAN, LAN, and serial protocols without software bottlenecks.
The MPC860TZQ66D4 uses a Harvard-architecture core with separate instruction and data MMUs, an integrated LCD controller on some derivatives, and a flexible system bus. The communications processor module handles HDLC, Ethernet, UART, and other serial protocols in hardware. With 3.3 V I/O and 3.3 V core supply, it is suitable for low-power embedded designs compared to 5 V predecessors.
Typical applications include telecom line cards, ISDN routers, ATM switches, protocol converters, industrial serial gateways, and legacy networking equipment. The MPC860 family was widely adopted in 1990s-era networking infrastructure.
When designing with this device, note that NXP has marked the part End of Life (EOL). New designs should evaluate modern replacements such as the MPC8xx successors (MPC82xx PowerQUICC II) or ARM-based alternatives. The 357-PBGA requires careful PCB layout with controlled-impedance traces and a 6-layer or more stack-up.
This page synthesizes distributor pricing, lifecycle status, and practical design notes not found in the manufacturer datasheet alone, with cross-references to related NXP PowerQUICC parts.
直接替换替代料： MPC860TZQ66D4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC860TZQ66D4 （相同外形与封装尺寸） ——差异在于 RoHS Status, Core Architecture, Operating Temperature, Package / Case, Processor Type.
快速对比工具——选择替代料号进行并排对比：
MPC860PCZQ66D4
✅ 直接替换📋 参考替代料（不在目录中）
MPC860DPZQ66D4
✅ 直接替换✓ 有现货
$25.28 / 个
查看数据手册 →MPC860SRZQ66D4
✅ 直接替换✓ 有现货
$128.33 / 个
查看数据手册 →MPC860TCZQ66D4
✅ 直接替换📋 参考替代料（不在目录中）
MPC860ENCVR50D4
✅ 直接替换✓ 有现货
$52.4 / 个
查看数据手册 →MPC860TZQ50D4
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MPC860TZQ66D4 最大额定值与电气特性
| Manufacturer | NXP Semiconductors |
| Part Family | MPC8xx PowerQUICC |
| Core Architecture | PowerPC, 32-bit |
| Core Count | 1 |
| Core Frequency | 66 MHz |
| 电源电压 | 3.3 V |
| 封装 / 外壳 | 357-PBGA (25x25 mm) |
| Packaging | Tray |
| 工作温度 | 0 °C to +70 °C |
| Lead Free Status | Contains Lead |
| RoHS 状态 | RoHS non-compliant (Contains Lead) |
| Communications Module | CPM (QUICC Engine) |
| 安装类型 | Surface Mount |
| 生命周期状态 | End of Life (per NXP) |
| 分类 | Microprocessors - MPU |
MPC860TZQ66D4 357-pbga (25x25 mm) 引脚配置指南
MPC860TZQ66D4（357-pbga (25x25 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC860TZQ66D4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC860TZQ66D4 适用于 6 应用s: Telecom Line Cards, ISDN Routers and Modems, Industrial Serial Gateways, Protocol Converters and Bridges, Legacy Networking Equipment, ATM Switch Edge Cards.
Telecom Line Cards
The MPC860TZQ66D4's integrated QUICC Communications Processor Module (CPM) is purpose-built for telecom line cards handling T1/E1, ISDN PRI/BRI, and HDLC-framed protocols. The 66 MHz PowerPC core runs system management and control-plane tasks while the CPM offloads per-channel protocol handling in hardware, achieving line-rate performance for full-duplex serial channels. The 3.3 V supply keeps per-card power manageable in dense central-office equipment, and the 357-PBGA package fits standard AMC/AdvancedTCA card footprints. Designers pair the MPC860 with external PHYs and T1/E1 line interface units, configuring SCCs and SMCs for the desired channel mix via the CPM's RISC-based serial controller.
推荐
ISDN Routers and Modems
ISDN routers of the late 1990s and early 2000s used the MPC860 family as the central processor. The MPC860TZQ66D4 integrates the BRI/PRI signaling stack via the CPM, an Ethernet MAC for LAN connectivity, and a PowerPC core capable of running lightweight IP routing stacks. The 66 MHz clock is sufficient for ISDN basic-rate aggregation with 4-wire S/T interface, and the 357-PBGA's 1.27 mm pitch matches the multilayer PCB designs typical of consumer premises equipment. Compared to discrete MC68360 designs, the integrated CPM eliminates external protocol chips and reduces BOM cost.
推荐
Industrial Serial Gateways
Industrial gateways converting between serial protocols (RS-232/422/485, Modbus, Profibus) and Ethernet use the MPC860TZQ66D4 to bridge multiple UART channels and Ethernet MAC in a single device. The CPM's multiple SCCs and SMCs handle up to four independent serial channels without CPU intervention, ideal for substation automation, factory-floor protocol converters, and SCADA equipment. The 357-PBGA package operates from 0 °C to +70 °C in commercial-grade enclosures, and the integrated DMA offloads protocol framing from the PowerPC core. Industrial deployments often pair the MPC860 with external galvanic isolation on the serial lines.
推荐
Protocol Converters and Bridges
Multi-protocol bridges connecting legacy serial networks (Frame Relay, X.25, PPP, HDLC) to IP networks relied on the MPC860TZQ66D4's hardware-protocol offload. The CPM runs multiple protocol stacks in parallel on its dedicated RISC engine, freeing the PowerPC core to handle IP routing and management. At 66 MHz, the MPC860 can sustain multiple T1/E1 channels with full HDLC framing alongside a 10 Mbps Ethernet port. The 357-PBGA's high-density footprint suits compact bridge appliances deployed in central offices and customer-premises cabinets. Modern equivalents (PowerQUICC II) offer higher throughput but preserve the same programming model.
推荐
Legacy Networking Equipment
The MPC860 family powered an entire generation of mid-range routers, WAN access multiplexers, and remote-access servers. The MPC860TZQ66D4 specifically targets 66 MHz designs requiring Ethernet plus one or two T1/E1 WAN ports. Existing deployed equipment with this part is still in service today in many enterprise and carrier networks, sustaining the EOL aftermarket through Rochester Electronics and authorized distributors. Repair and refurbishment of these systems drives ongoing demand. The 357-PBGA package is mechanically robust for long-life telecom deployments when properly thermal-managed via the die-side thermal pad.
推荐
ATM Switch Edge Cards
ATM (Asynchronous Transfer Mode) edge cards used in carrier infrastructure relied on the MPC860's hardware AAL segmentation and reassembly via the CPM. The MPC860TZQ66D4 at 66 MHz handles DS3/E3 ATM PHY interfaces with full SAR offload, leaving the PowerPC core free for signalling and management. While ATM has largely been superseded by MPLS and Carrier Ethernet in modern networks, legacy ATM switches still rely on MPC860-based edge cards. The 357-PBGA's 25x25 mm footprint suits the compact edge-card form factors of carrier infrastructure. Repair and spare-parts demand drives ongoing EOL supply.
推荐
推荐产品汇总
工程参考数据： MPC860TZQ66D4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC860PCZQ66D4 | MPC860DPZQ66D4 | MPC860SRZQ66D4 | MPC860TCZQ66D4 | MPC860ENCVR50D4 | MPC860TZQ50D4 |
|---|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 50 MHz (-24%) | 50 MHz (-24%) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (industrial) | 0 °C to +70 °C |
| Core Count | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL | EOL |
| RoHS Compliance | Non-compliant (Contains Lead) | Non-compliant | Non-compliant | Non-compliant | Non-compliant | Non-compliant | Non-compliant |
| CPM (Communications Module) | Yes (QUICC engine) | Yes (standard mapping) | Yes (dual-port) | Yes (serial/reduced) | Yes (telecom config) | Yes (industrial) | Yes (standard) |
关键差异点
- Integrated CPM for hardware protocol offload （对比 MPC860ENCVR50D4)
- 66 MHz mid-range grade （对比 MPC860TCZQ66D4)
- Commercial temperature grade （对比 MPC860ENCVR50D4)
设计说明
The 357-PBGA package dissipates up to ~1.5 W typical and 2.5 W maximum at 66 MHz. The die-side thermal pad must be soldered to a thermal via array in the inner PCB layers to maintain junction temperature within specifications. Without proper thermal management, junction temperature can exceed the 95 °C commercial limit. Estimated: at 1.5 W dissipation with a properly designed 4x4 via array under the thermal pad, theta_JA drops from ~30 C/W (no thermal pad soldered) to ~10 C/W, keeping junction rise to 15 °C above 70 °C ambient.
The 357-PBGA uses a 1.27 mm ball pitch requiring a 6-layer (or more) PCB stack-up for fan-out routing. Inner layers must use a fine-line process (0.1 mm trace/space minimum). Use a 0.8 mm via-pad with 0.3 mm drill for microvia escape on the top layer. Match impedance on Ethernet, T1/E1, and memory buses using the manufacturer's reference stack-up. Decoupling: 100 nF X7R + 10 µF tantalum per VCC rail cluster, placed within 5 mm of the BGA balls.
Power-sequencing is critical: the 3.3 V core supply must reach stable regulation before the 3.3 V I/O supply. Reverse sequencing can cause latch-up and permanent damage. The reset pin must be held low for at least 4 clock cycles after both rails stabilize. The MPC860 hardware specifications datasheet Section 5 documents the complete power-on reset sequence. Designers should also avoid hot-insertion of the BGA - the part is not designed for live insertion.
The MPC860's parallel bus and memory interface must be routed with controlled impedance (typically 50 Ω single-ended). Use matched-length routing on clocks (CLK_OUT) within 1 mm across all loads. The Ethernet MII/RMII signals and T1/E1 serial channels should be routed as 50 Ω differential pairs with 100 Ω differential impedance, keeping ground reference continuous. Source-series termination on the clock outputs prevents overshoot. Use IBIS models for simulation - NXP publishes them for the MPC860 family.
合规信息
Per the digchip datasheet entry, this part 'Contains Lead' and is RoHS non-compliant. AEC-Q100 not applicable for telecom/industrial MPU. REACH and halogen-free status not stated in available data. For RoHS-compliant builds, evaluate MPC860 RoHS-compliant ('G' suffix) variants or migrate to PowerQUICC II.
