MPC860SRCZQ50D4 - PowerQUICC 50MHz MPU, 357-PBGA | NXP
料号： MPC860SRCZQ50D4 ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78.2 | $782.00 |
| 100 | $72.5 | $7,250.00 |
| 500 | $68 | $34,000.00 |
| 1,000 | $64.5 | $64,500.00 |
MPC860SRCZQ50D4 概述
A PowerQUICC (PowerPC QUICC) processor is a family of integrated communications microprocessors originally developed by Freescale (formerly Motorola Semiconductor) and now part of NXP Semiconductors. It combines a PowerPC embedded processor core with the QUICC engine, a dedicated RISC-based communications processor module. The architecture sits in the broader hierarchy of microprocessor (MPU) -> embedded MPU -> integrated communications processor -> system-on-chip class device, designed to handle multiple serial channels and networking stacks without burdening the main CPU.
Key features of the MPC860SRCZQ50D4 include a 32-bit single-issue core, on-chip 4KB instruction cache and 4KB data cache, integrated CPM (Communications Processor Module) supporting multiple SCCs and SMCs, and 3.3V I/O supply with 5V-tolerant inputs. The wide 32-bit external bus, integrated memory controller (UPM/GLBIO), and integrated peripheral set reduce system BOM cost for routers, bridges, and ISDN terminal adapters. The 357-PBGA (25x25 mm) package provides high pin density while supporting commercial and industrial temperature grades within the MPC860 family.
Architecturally, the device pairs the PowerPC core with the CPM via an internal bus, allowing offloading of serial protocol processing. This dual-processor partitioning is what gave PowerQUICC its longevity in networking gear; the CPM handles HDLC, UART, transparent, and bisync framing, leaving the core free for routing and control-plane software.
Typical applications include ISDN terminal adapters, xDSL modems, low-end routers, industrial control with serial aggregation, and legacy telecom equipment. The wide integration makes it attractive for compact designs requiring multiple serial ports without external UARTs.
When designing with the MPC860SRCZQ50D4, verify that your firmware uses the correct CPM microcode revision, and confirm DDR/SDRAM timing closure with the integrated memory controller. Note that this part is in NXP's discontinuance program, so long-life industrial designs should qualify replacements or stockpile now.
This page synthesizes distributor availability, drop-in alternatives, and design notes not found in the manufacturer datasheet alone, helping engineers rapidly assess whether the MPC860SRCZQ50D4 fits legacy designs or whether a modern replacement should be evaluated.
直接替换替代料： MPC860SRCZQ50D4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC860SRCZQ50D4 （相同外形与封装尺寸） ——差异在于 RoHS Status, Core Architecture, Operating Temperature, Package, Process Technology.
快速对比工具——选择替代料号进行并排对比：
MPC860SRVR50D4
✅ 直接替换📋 参考替代料（不在目录中）
MPC860TZQ50D4
✅ 直接替换📋 参考替代料（不在目录中）
MPC860DTCZQ50D4
✅ 直接替换📋 参考替代料（不在目录中）
MPC860PVR80D4
✅ 直接替换📋 参考替代料（不在目录中）
MPC860DTVR50D4
✅ 直接替换✓ 有现货
$59.8 / 个
查看数据手册 →MPC860SRCZQ50D4 最大额定值与电气特性
| Processor Family | MPC8xx PowerQUICC |
| Core Architecture | PowerPC 32-bit |
| Core Count | 1 |
| Operating Frequency | 50 MHz |
| Process Technology | 0.32 µm CMOS |
| 电源电压 | 3.3 V |
| 封装 | 357-PBGA (25x25 mm) |
| 安装类型 | Surface Mount |
| Instruction Cache | 4 KB |
| Data Cache | 4 KB |
| Integrated CPM | Yes (QUICC engine, multiple SCCs/SMCs) |
| External Bus Width | 32-bit |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 状态 | RoHS status per datasheet |
| 生命周期状态 | Discontinuance / Last Time Buy per NXP PCN |
MPC860SRCZQ50D4 357-pbga (25x25 mm) 引脚配置指南
MPC860SRCZQ50D4（357-pbga (25x25 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC860SRCZQ50D4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC860SRCZQ50D4 适用于 6 应用s: ISDN Terminal Adapter, Low-End Router / Bridge, xDSL Modem / CPE, Industrial Serial Aggregation Gateway, Legacy Telecom Control Board, Embedded Networking Reference Platform.
ISDN Terminal Adapter
The MPC860SRCZQ50D4's integrated CPM (Communications Processor Module) handles HDLC framing for ISDN BRI/U interfaces, offloading protocol processing from the 50 MHz PowerPC core. This dual-engine partitioning lets the core run the terminal adapter's PPP stack while the CPM services the D-channel and B-channels transparently. With 4KB instruction and 4KB data caches and an integrated memory controller, the MPC860SRCZQ50D4 fits an ISDN TA reference design on a single chip, reducing BOM cost versus a discrete CPU-plus-UART approach.
推荐
Low-End Router / Bridge
The MPC860SRCZQ50D4 is a classic choice for low-end SOHO routers and bridges because the CPM handles Ethernet and HDLC framing while the core runs the routing/forwarding logic. At 50 MHz with a 32-bit external bus, the device delivers sufficient throughput for sub-10 Mbps WAN links. The integrated memory controller (UPM/GLBIO) supports DRAM and Flash directly, removing the need for an external memory chip in many designs.
推荐
xDSL Modem / CPE
In xDSL customer-premises equipment, the MPC860SRCZQ50D4's CPM serial channels can drive the DSL framer interface while the core runs the PPPoE/ATM stack. The 50 MHz core and 32-bit bus are sufficient for downstream rates in the 1-7 Mbps range typical of early ADSL deployments. The 357-PBGA package supports compact CPE form factors.
推荐
Industrial Serial Aggregation Gateway
Industrial gateways that aggregate multiple RS-232/485 links benefit from the MPC860SRCZQ50D4's multiple SCCs and SMCs, each capable of independent UART, HDLC, or transparent operation. The core runs the Modbus/industrial protocol stack while the CPM polls the serial channels. The integrated memory controller and wide 32-bit bus keep external component count low - critical for cost-sensitive industrial designs.
推荐
Legacy Telecom Control Board
The MPC860SRCZQ50D4 is widely deployed in legacy telecom control boards where its CPM handles E1/T1 framer interfaces (via external line interface units) and the core runs the control-plane software. Its longevity and stable toolchain have kept it in service in central-office equipment well past its original product life. Designers maintaining these systems need the MPC860SRCZQ50D4 for spares and repairs.
推荐
Embedded Networking Reference Platform
Engineering teams use the MPC860SRCZQ50D4 as a reference platform for PowerQUICC firmware development, including CPM microcode bring-up, UPM timing tuning, and PowerPC toolchain validation. The 357-PBGA package's standard land pattern and abundant documentation make it a useful training vehicle for engineers learning the MPC8xx architecture.
推荐
推荐产品汇总
工程参考数据： MPC860SRCZQ50D4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC860SRVR50D4 | MPC860TZQ50D4 | MPC860DTCZQ50D4 | MPC860PVR80D4 | MPC860DTVR50D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same | 357-PBGA - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 80 MHz | 50 MHz |
| Core Architecture | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) | PowerPC 32-bit (MPC8xx) |
| Integrated CPM | Yes (multiple SCCs/SMCs) | Yes | Yes | Yes (different CPM config) | Yes | Yes (different CPM config) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| External Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Lifecycle Status | Last Time Buy / Discontinuance | Discontinued - stock only | Discontinued - stock only | Discontinued - stock only | Discontinued - stock only | Discontinued - stock only |
关键差异点
- 50 MHz core with full QUICC CPM （对比 MPC860PVR80D4)
- SR-suffix revision in the MPC860 family （对比 MPC860TZQ50D4)
- Integrated CPM offloads serial protocols （对比 Discrete MPU + external UARTs)
设计说明
The 357-PBGA package has a junction-to-ambient thermal resistance in the 15-20 C/W range with adequate PCB copper. The MPC860SRCZQ50D4 typically dissipates 1-2 W at 50 MHz with 3.3 V supply. Ensure at least 4-layer PCB construction with continuous ground planes beneath the BGA to keep junction temperature within the operating range.
The 357-ball PBGA requires a precisely matched BGA land pattern per the manufacturer's mechanical drawing. Use NSMD (non-solder mask defined) pads for better joint reliability. Route escape traces on inner layers to break out the dense 1.27 mm pitch ball array. Recommend JEDEC J-STD-020 MSL-3 or better handling for the BGA.
Do not assume the 'SR' vs 'T' suffix is interchangeable without verifying against the MPC860 datasheet's device-marking table - these suffixes encode temperature grade and errata revisions. Also, the CPM microcode must match the silicon revision; loading incorrect microcode can hang the CPM silently. Always validate the full part marking against the datasheet before board bring-up.
合规信息
Lead Free Status per datasheet: Contains Lead. RoHS status per distributor listing marked as 'RoHS' but exact compliance level not confirmed in source data - set to unknown. AEC-Q100 not applicable for this communications MPU.
