MPXS3010VMM150 - PXS30 Dual-Core 150MHz MCU, 1MB Flash, 257-LFBGA | NXP
料号： MPXS3010VMM150 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.75 | $38.75 |
| 10 | $34.2 | $342.00 |
| 100 | $29.85 | $2,985.00 |
| 500 | $26.5 | $13,250.00 |
| 1,000 | $23.95 | $23,950.00 |
MPXS3010VMM150 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals including timers, ADCs, communication controllers, and GPIO. Within the broader semiconductor hierarchy, an MCU is a sub-category of microprocessors and embedded processors, itself a category of integrated circuits (ICs). The PXS30 family sits inside NXP's chassis and safety MCU portfolio, designed to deliver deterministic real-time performance for ASIL-rated applications.
Key features of the MPXS3010VMM150 include dual e200z7d cores running up to 150 MHz, 1 MB of on-chip flash for application code, 256 KB of SRAM for data and stack operations, and an integrated peripheral set targeted at automotive networks (CAN, LIN, FlexRay) and motor-control PWM. The 257-LFBGA package provides a compact 14x14 mm footprint while exposing the full set of address, data, and peripheral pins required for high-throughput signal processing.
Technically, the PXS30 architecture leverages a superscalar e200z7d core with branch prediction and DSP extensions, supporting single-precision floating point and signal-processing instructions required for sensor fusion and control loops. The on-chip flash controller and ECC-protected SRAM improve functional safety, while the multi-channel timer and ADC subsystem allows direct interface with resolver, encoder, and current-sensing front ends.
Typical applications include automotive chassis control, electric power steering, electronic stability control, airbag systems, and other ASIL-rated safety microcontrollers. The combination of dual-core lockstep capability, large flash, and automotive-qualified peripherals makes it well suited to chassis domain controllers and integrated vehicle dynamics modules.
When designing with this part, allocate sufficient PCB area for the 14x14 mm BGA and follow NXP's recommended reflow and decoupling guidelines for fine-pitch BGAs, including microvia stack-ups and matched-length impedance routing for high-speed signals. Plan for boot, debug, and JTAG access during layout to avoid respins.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternative MCUs from the same PXS30 family, and practical design notes not collected on any single manufacturer or distributor page.
直接替换替代料： MPXS3010VMM150 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPXS3010VMM150 （相同外形与封装尺寸） ——差异在于 Core Architecture, Package / Case.
快速对比工具——选择替代料号进行并排对比：
MPXS3020VMM150
✅ 直接替换📋 参考替代料（不在目录中）
MPXS3030VMM150
✅ 直接替换📋 参考替代料（不在目录中）
MPXS3010VMM150R
✅ 直接替换📋 参考替代料（不在目录中）
SPC5674KAVMM2R
✅ 直接替换📋 参考替代料（不在目录中）
SPC5675KFAVMM2R
✅ 直接替换📋 参考替代料（不在目录中）
SPC5645SF1VVU
✅ 直接替换✓ 有现货
$27.1 / 个
查看数据手册 →MPXS3010VMM150 最大额定值与电气特性
| Core Architecture | Power Architecture e200z7d (dual-core) |
| Number of Cores | 2 |
| Core Bit Width | 32-bit |
| Maximum CPU Clock | 150 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| RAM Size | 256 KB (256K x 8) |
| Oscillator Type | External (per datasheet) |
| 封装 / 外壳 | 257-LFBGA (14x14 mm) |
| 安装类型 | Surface Mount |
| Terminal Form | BALL (BGA) |
| Number of Terminals | 257 |
| Package Code | LFBGA |
| Temperature Grade | INDUSTRIAL |
| Series | PXS30 |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
MPXS3010VMM150 lfbga 引脚配置指南
MPXS3010VMM150（lfbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPXS3010VMM150.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPXS3010VMM150 适用于 6 应用s: Automotive Chassis Domain Controller, Electric Power Steering (EPS) Controller, Electronic Stability Control (ESC) Module, Airbag and Restraint Control Unit, Battery Management System (BMS) Master Controller, Industrial Servo Drive Controller.
Automotive Chassis Domain Controller
The MPXS3010VMM150's dual e200z7d cores at 150 MHz deliver the throughput required to consolidate chassis functions such as suspension, steering, and braking into a single domain ECU. The 1 MB of on-chip flash holds real-time control loops and sensor-fusion code, while the 256 KB of SRAM buffers CAN, FlexRay, and Ethernet messages during peak bus load. NXP's PXS30 family datasheet recommends the device for ASIL-rated chassis controllers, where dual-core lockstep is essential. A heatsink or thermal via array is recommended under the 14x14 mm LFBGA pad to keep junction temperature within the industrial temperature grade. Pairing the MCU with an NXP FS65 family SBC provides voltage supervision, watchdog, and CAN PHY power.
推荐
Electric Power Steering (EPS) Controller
EPS systems demand deterministic motor control loops at sub-millisecond update rates, plus functional-safety compliance. The MPXS3010VMM150's dual e200z7d cores in lockstep mode run the torque-vectoring and steering-angle control algorithms while the secondary core checks computation correctness for ASIL-D headroom. The integrated PWM and ADC peripherals directly interface resolver and current-sensing front ends, eliminating external DSP overhead. With 1 MB flash and 256 KB SRAM, calibration tables and adaptive-assist maps fit on-chip, simplifying firmware updates over CAN FD. NXP's PXS30 reference designs typically show this MCU paired with a three-phase gate driver and a resolver interface chip for the steering motor.
推荐
Electronic Stability Control (ESC) Module
ESC modules read wheel-speed, yaw-rate, and steering-angle sensors, then command hydraulic brake actuators to keep the vehicle stable. The MPXS3010VMM150's dual e200z7d cores support lockstep execution required for ASIL-rated brake control, while the 150 MHz clock speed keeps sensor-fusion latency below the typical 10 ms control loop budget. The 257-LFBGA footprint exposes enough GPIO for parallel PWM channels to drive multiple solenoid valves directly. Designers should allocate PCB area for high-speed signal routing and use the PXS30 family's safety library to streamline ISO 26262 certification. The MCU is commonly paired with a wheel-speed sensor interface and a CAN FD link to the vehicle CAN bus.
推荐
Airbag and Restraint Control Unit
Airbag ECUs must deploy restraints within a few milliseconds of a crash decision, requiring both deterministic response and ASIL-D-grade diagnostics. The MPXS3010VMM150's dual-core lockstep configuration supports redundant computation of crash-severity algorithms while the built-in watchdog and ECC memory protect against soft errors. The 1 MB flash fits deployment logic, accelerometer filtering, and diagnostic routines, and the 256 KB SRAM holds the crash-event recorder buffer. NXP's PXS30 datasheet shows the device supporting the safety peripherals required for restraint ECUs, and reference designs integrate dual-axis accelerometer front ends over SPI. The MC33664I4 isolated transceiver is often used for safe communication to sensor satellites.
推荐
Battery Management System (BMS) Master Controller
In 400 V and 800 V EV battery packs, the BMS master controller balances cells, monitors temperature, and reports state-of-charge to the vehicle network. The MPXS3010VMM150's dual e200z7d cores run the cell-balancing and state-of-charge algorithms in lockstep for safety-critical decisions, while 1 MB of on-chip flash stores characterization data and adaptive models. The 150 MHz clock keeps the coulomb-counting and Kalman filter loops inside the typical 100 ms sample period for hundreds of cells. The 257-LFBGA provides enough GPIO to interface both the daisy-chained battery monitor ICs and the CAN FD link to the VCU. The MC33771B228N2 battery cell controller is a typical companion IC for high-voltage packs.
推荐
Industrial Servo Drive Controller
Although designed for automotive use, the MPXS3010VMM150 also serves in industrial servo drives where ASIL-style safety and deterministic control loops are valued. The dual e200z7d cores execute field-oriented control (FOC) of three-phase motors at the typical 16 kHz PWM rate, while the secondary core handles EtherCAT or PROFINET communication stacks. The 1 MB of flash stores motion profiles, vibration-damping filters, and safety logic, while 256 KB of SRAM holds high-speed current and position data. The 14x14 mm LFBGA fits inside a 50 mm square drive PCB, and the industrial temperature grade supports factory-floor operation. Designers should follow NXP's PCB layout guidelines for fine-pitch BGA to maintain signal integrity.
推荐
推荐产品汇总
工程参考数据： MPXS3010VMM150 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPXS3020VMM150 | MPXS3030VMM150 | SPC5674KAVMM2R | SPC5675KFAVMM2R | SPC5645SF1VVU |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 257-LFBGA (14x14) | 257-LFBGA (14x14) - same | 257-LFBGA (14x14) - same | 257-MAPBGA - same ball count | 257-MAPBGA - same ball count | 257-LFBGA variant - same family |
| Core Architecture | Dual e200z7d (Power Architecture) | Dual e200z7d (Power Architecture) | Dual e200z7d (Power Architecture) | Single e200 (MPC56xx) | Single e200 (MPC56xx) | Single e200 (MPC56xx) |
| Number of Cores | 2 | 2 | 2 | 1 | 1 | 1 |
| Pin/Ball Count | 257 | 257 | 257 | 257 | 257 | 257 |
| Primary Use Case | Chassis / safety MCU (ASIL-capable) | Chassis / safety MCU | Chassis / safety MCU | Body / chassis controller | Powertrain / chassis controller | Powertrain / body controller |
关键差异点
- Dual-core e200z7d with lockstep capability （对比 SPC5674KAVMM2R)
- 1 MB flash and 256 KB SRAM in PXS30 family （对比 SPC5675KFAVMM2R)
- PXS30 family pin-compatible scalability （对比 MPXS3020VMM150)
设计说明
Estimated: a 257-LFBGA with 14x14 mm body and standard 4-layer JEDEC PCB lands at roughly theta_JA near 25 C/W. Industrial-temperature operation targets a 125 C junction ceiling, so total package dissipation must stay below (125 - 85) / 25 ~= 1.6 W at 85 C ambient. Place a thermal via array under the central ground balls and use inner copper planes as heat spreaders; for sealed enclosures add an aluminum spreader or attach the LFBGA pad to a metal chassis bracket.
Use a microvia-in-pad stack-up for the 257-LFBGA to ensure reliable BGA solder joint formation; NXP's PCB design guidelines recommend 0.4 mm pitch BGA land patterns with non-solder-mask-defined pads. Fan out the inner rows on inner layers to avoid routing congestion, and provide at least two rows of dedicated ground balls around the perimeter for return-current paths. Match high-speed signal lengths (FlexRay, Ethernet, PWM) to within the timing tolerances listed in the PXS30 datasheet.
Do not assume any MPC56xx 257-ball MAPBGA is a drop-in for the PXS30 family - the SPC5674KAVMM2R and SPC5675KFAVMM2R share the ball count but use a different peripheral map and supply rail layout. Always cross-check every ball assignment against the target datasheet before swapping. Also, do not omit the external oscillator reference; the PXS30 needs a stable clock to drive its FMPLL and CAN/FlexRay peripherals. A common mistake is to under-decouple the 1.2 V core rail - place 100 nF ceramic capacitors at every supply ball and bulk 4.7 uF near each supply domain.
Route FlexRay, CAN FD, and Ethernet signals as 100 ohm differential pairs with controlled impedance, keeping stubs below 5 mm and total length matched within the datasheet tolerance. For PWM outputs to gate drivers, add 22 ohm series resistors at the MCU balls to dampen ringing caused by the gate-driver load. Shield high-speed analog signals (resolver excitation, current sense) with a ground guard trace to avoid coupling from switching PWMs.
Estimated: at 150 MHz dual-core full load, expect core current around 200 mA plus I/O and analog; total consumption lands near 500 mA at 1.2 V core and additional current on the 3.3 V and 5 V rails. Use an NXP FS65 family SBC for sequencing, watchdog, and 1.2 V/3.3 V generation - it is the recommended companion for ASIL designs. Add reverse-battery and load-dump protection on the 12 V supply, and bulk-decouple the SBC outputs near the MCU supply balls.
合规信息
RoHS/REACH status not explicitly stated in the verified web data; AEC-Q100 assumed for PXS30 family automotive MCUs per NXP product family classification. Lead-free assumed from BGA terminal finish typical of NXP automotive parts. All other compliance fields marked unknown because the verified web snippets do not provide them.
