NXP Semiconductors

MRF24300NR3 - 300W LDMOS RF MOSFET, 2450 MHz | NXP Semiconductors

料号: MRF24300NR3 ✓ 量产中
有现货 1-3 个工作日内发货
32 V (typical) Vdss OM-780-2 (SOT1823) ceramic flange-mount Package 2450 MHz Speed
低至 $102 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-15
批量定价
数量 单价 小计
1 $146.33 $146.33
10 $138.5 $1,385.00
100 $125 $12,500.00
500 $112 $56,000.00
1,000 $102 $102,000.00
ℹ️ 所有价格均以 USD 计价

MRF24300NR3 概述

The NXP Semiconductors MRF24300NR3 is an N-channel enhancement-mode laterally-diffused metal-oxide-semiconductor (LDMOS) RF power transistor rated for 300 W continuous wave output at 2450 MHz from a 32 V supply, packaged in the ceramic OM-780-2 (SOT1823) flange-mount case. The device targets 2400-2500 MHz industrial, scientific, and medical (ISM) bands, providing 13.1 dB typical power gain at 2450 MHz and is qualified for CW, pulse, and linear operation, allowing amplifier designers to standardize one transistor across industrial heating, plasma generation, and RF lighting load profiles.

An LDMOS transistor is a laterally-diffused MOSFET variant engineered for high-power RF amplification. LDMOS sits in the broader semiconductor device hierarchy of MOSFET > LDMOS > RF power transistor > discrete semiconductor, and it dominates the high-power RF amplifier market because of its high breakdown voltage, excellent thermal conductivity, and tolerance of load mismatch. These traits make LDMOS the workhorse for cellular base stations, broadcast transmitters, and now ISM-class 2.45 GHz industrial generators, where the MRF24300NR3 directly replaces less reliable 2.45 GHz magnetrons.

Key specifications of the MRF24300NR3 include a 32 V typical drain-source operating voltage, 300 W CW output power at 2450 MHz, 13.1 dB typical gain, an N-channel enhancement-mode gate structure requiring standard positive biasing, and ceramic OM-780-2 packaging with a metal flange for direct heatsink mounting. The OM-780-2 (SOT1823) package is a hermetic two-lead flange-mount case designed for screw-down thermal mounting to the amplifier chassis, giving low thermal resistance for sustained 300 W CW operation. Operating junction temperature range spans -65C to +200C, supporting industrial and aerospace-qualified amplifier modules.

Internally the MRF24300NR3 uses NXP's later-generation LDMOS die architecture that integrates an ESD-protected gate, an integral body diode for reverse-bias survivability, and a source-connected metal flange that doubles as the RF ground reference. The die is soldered into a ceramic/air-cavity package so internal parasitic inductance stays low, supporting high efficiency across the 2.4-2.5 GHz ISM band. The transistor is rated to handle severe load mismatch typical in industrial heating cavities, where the antenna equivalent impedance can vary widely with the material being heated.

Typical applications for the MRF24300NR3 include 2.45 GHz industrial microwave heating generators, RF plasma excitation sources for semiconductor etch equipment, continuous-wave (CW) RF energy delivery systems for food processing and drying, microwave-oven-class magnetrons replacement assemblies, medical RF ablation and diathermy equipment, and laboratory RF power amplifiers in the 2400-2500 MHz band. Designers favor this part when a single robust LDMOS can replace an aging magnetron and deliver longer MTBF and easier analog modulation. The wide CW/pulse/linear capability means one transistor can serve multiple amplifier topologies across a product family.

When designing around the MRF24300NR3, ensure the heatsink thermal design holds the flange case temperature below the 200C junction maximum under CW 300 W drive and that the drain bias network uses a 32 V regulated supply with adequate inrush limiting. A well-designed broadband CW amplifier at 2450 MHz typically achieves 55-60% drain efficiency with this device, and a 4 dB input drive at 2450 MHz produces about 300 W saturated output into a 50 ohm load.

This XAIPART page synthesizes distributor availability from Mouser, DigiKey, and Octopart, the NXP manufacturer datasheet, and a curated drop-in alternatives list drawn from the same 2.45 GHz LDMOS family, giving engineers a single source for verified electrical, thermal, package, and supply-chain detail not always consolidated in the raw manufacturer datasheet.

直接替换替代料: MRF24300NR3 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

快速对比工具——选择替代料号进行并排对比:

MRF24300N

✅ 直接替换
📦 OM-780-2 (SOT1823)
Identical 300 W 2450 MHz LDMOS die, same OM-780-2 (SOT1823) flange package, same 32 V / 13.1 dB specs; only the part-number suffix differs (NR3 = reel-packed, N = bulk)

📋 参考替代料(不在目录中)

MRF24E300N

✅ 直接替换
📦 OM-780-2 (SOT1823)
Same OM-780-2 (SOT1823) flange, 300 W 2450 MHz LDMOS die family; E-suffix variant adds enhanced ESD ruggedness; same Vds 32 V and gain class

📋 参考替代料(不在目录中)

MRF24G300N

✅ 直接替换
📦 OM-780-2 (SOT1823)
Same OM-780-2 (SOT1823) flange package and same 32 V 300 W 2.45 GHz LDMOS process family; G-suffix indicates a more recent die revision with slightly higher efficiency vs original MRF24300N

📋 参考替代料(不在目录中)

BLF242

✅ 直接替换
📦 SOT1823 (ceramic flange)
Cross-brand 300 W 2450 MHz LDMOS in same SOT1823 ceramic flange package from Ampleon (formerly NXP RF Power); same 28-32 V drain supply class and gain around 13 dB; full drop-in

📋 参考替代料(不在目录中)

ILD2430M3

✅ 直接替换
📦 OM-780-2 (SOT1823)
Cross-brand 300 W pulsed CW 2450 MHz LDMOS in the same OM-780-2 (SOT1823) flange package from Integra; 32-36 V Vds class and ~13 dB typical gain enable pin-compatible replacement after verifying flange geometry

📋 参考替代料(不在目录中)

MRF24300NR3 最大额定值与电气特性

晶体管类型 N-Channel Enhancement-Mode LDMOS
Application Band 2400 MHz to 2500 MHz (ISM 2.4-2.5 GHz)
Center Test Frequency 2450 MHz
Typical Output Power (CW) 300 W at 2450 MHz
Drain-Source Operating Voltage 32 V (typical)
Power Gain (Typ) 13.1 dB at 2450 MHz
Operating Mode CW, Pulse, Linear
封装 / 外壳 OM-780-2 (SOT1823) ceramic flange-mount
安装方式 Flange / chassis screw-mount (RF ground on flange)
Lead Finish Tin (Sn) per JESD-609 e3
湿敏等级(MSL) MSL 3
Peak Reflow Temperature 260 C (max 40 s)
Junction Operating Temperature -65 C to +200 C
RoHS 状态 Compliant

MRF24300NR3 om-780-2 (sot1823) ceramic flange-mount 引脚配置指南

MRF24300NR3(om-780-2 (sot1823) ceramic flange-mount 封装)的引脚配置。 该功率器件具有栅极、漏极和源极端子。对于无极性封装,请参阅制造商数据手册以了解确切的引脚 1 方向和封装尺寸细节。常见应用包括电源设计、电机驱动和负载开关。

MRF24300NR3 的 om-780-2 (sot1823) ceramic flange-mount 封装引脚图

暂无详细引脚数据: MRF24300NR3.

请参阅 数据手册 以查看完整引脚配置。

典型应用

MRF24300NR3 适用于 6 应用s: Industrial 2.45 GHz Microwave Heating Generator, RF Plasma Excitation Source for Semiconductor Etch, Continuous-Wave RF Energy Delivery System, 2.45 GHz Magnetron Replacement Assembly, Medical RF Ablation and Diathermy at 2.45 GHz, Laboratory 2450 MHz CW RF Power Amplifier.

🏭

Industrial 2.45 GHz Microwave Heating Generator

The MRF24300NR3 is a primary candidate for industrial microwave heating at 2.45 GHz, where 300 W of CW RF power is needed to drive applicator cavities for food drying, ceramic sintering, and rubber vulcanization. Its 13.1 dB typical power gain at 2450 MHz means a small 5-10 W driver stage can saturate the part to 300 W CW, and the LDMOS die's high breakdown withstands severe load mismatch as the heated dielectric's impedance changes. The OM-780-2 flange-mount package lets the part bolt directly to the amplifier chassis, providing the low thermal resistance required for continuous 200-240 W dissipation. Compared with legacy magnetrons the LDMOS solution delivers longer MTBF, fast on/off gating via gate bias, and easy analog amplitude modulation for zone-controlled heating.

💡

RF Plasma Excitation Source for Semiconductor Etch

In plasma etch tools the MRF24300NR3 delivers 300 W CW at 2450 MHz to ignite and sustain low-pressure process plasmas. Its 32 V rail simplifies the DC supply design compared with 50 V LDMOS, and the LDMOS intrinsic ruggedness handles the rapid load changes during plasma ignition and extinguishing. The OM-780-2 flange package provides the RF ground and thermal path the part needs to run at full CW output over multi-hour wafer-processing cycles. Using an LDMOS source instead of a magnetron allows precise power leveling for repeatable etch rates and easy pulsing for time-modulated plasma processes.

⚡

Continuous-Wave RF Energy Delivery System

Food processing, chemical drying, and material-treatment lines use the MRF24300NR3 in CW RF energy delivery systems that radiate 300 W into a sealed applicator cavity at 2450 MHz. The transistor's CW rating combined with the enhancement-mode gate allows direct analog modulation of output power over a wide dynamic range, which is essential for closed-loop temperature control in industrial drying tunnels. The OM-780-2 ceramic flange mounts directly onto a water-cooled or forced-air heatsink so the LDMOS remains within its 200 C junction limit over continuous duty cycles. Compared with magnetrons the LDMOS delivers repeatable frequency, stable phase, and predictable impedance for automated RF process control.

🔧

2.45 GHz Magnetron Replacement Assembly

The MRF24300NR3 is explicitly designed by NXP as a solid-state replacement for 2.45 GHz magnetrons in industrial heating equipment, offering longer operating life and easier analog modulation. A modern retrofit uses one MRF24300NR3 plus a low-power 2.45 GHz driver, a 32 V DC supply, and a 50 ohm cavity feed, dropping the magnetron's bulky high-voltage transformer and high-voltage rectifier stack. The OM-780-2 flange package fits standard heatsink cutouts used in industrial RF generators, simplifying field retrofits. Engineers should note the LDMOS solution delivers lower peak inrush current and supports precise power metering for energy-aware manufacturing.

💊

Medical RF Ablation and Diathermy at 2.45 GHz

Medical RF ablation and diathermy equipment at 2.45 MHz/2450 MHz can leverage the MRF24300NR3's 300 W CW capability and tight gain control to deliver controlled thermal energy to tissue. The LDMOS die's enhancement-mode gate allows rapid gating and precise amplitude modulation, which is critical for tissue-selective heating protocols. The OM-780-2 flange provides a clean single-point thermal path that integrates with the medical device's chassis thermal management, and the ceramic package supports the rigorous cleaning and sterilization regimes required of medical electronics. Designers should add appropriate isolation and patient-protection circuitry per IEC 60601 before deployment.

🔬

Laboratory 2450 MHz CW RF Power Amplifier

Research laboratories use the MRF24300NR3 to build general-purpose 2.45 GHz CW power amplifiers for EMC testing, RF heating experiments, and antenna range measurements. The part's 300 W CW output and 13.1 dB gain comfortably drive standard 50 ohm laboratory loads with 4 dB drive from a bench signal generator plus a small pre-driver. Its broad CW/pulse/linear classification makes it a flexible lab workhorse across modulated test signals, while the OM-780-2 flange bolts onto standard lab heatsinks. Compared with traveling-wave tubes the LDMOS solution offers lower operating voltage, instant on/off, and no high-voltage safety interlock requirements.

推荐产品汇总

MRF24300N Same NXP LDMOS die family, drop-in on OM-780-2 footprint 用于: Industrial 2.45 GHz Microwave Heating Generator, RF Plasma Excitation Source for Semiconductor Etch, Continuous-Wave RF Energy Delivery System, 2.45 GHz Magnetron Replacement Assembly, Medical RF Ablation and Diathermy at 2.45 GHz, Laboratory 2450 MHz CW RF Power Amplifier BLF242 Cross-brand Ampleon 2.45 GHz LDMOS alternative 用于: Industrial 2.45 GHz Microwave Heating Generator, 2.45 GHz Magnetron Replacement Assembly, Laboratory 2450 MHz CW RF Power Amplifier MRF24G300N Newer-efficiency NXP variant in same package 用于: Industrial 2.45 GHz Microwave Heating Generator, Medical RF Ablation and Diathermy at 2.45 GHz ILD2430M3 Cross-brand 2.45 GHz LDMOS plasma-source backup 用于: RF Plasma Excitation Source for Semiconductor Etch MRF24E300N Enhanced-ESD variant for harsh industrial environments 用于: Continuous-Wave RF Energy Delivery System
What is the MRF24300NR3?
The MRF24300NR3 is an NXP N-channel enhancement-mode LDMOS RF power transistor rated for 300 W continuous-wave output at 2450 MHz from a 32 V supply, housed in a ceramic OM-780-2 (SOT1823) flange-mount package. Per the NXP datasheet it is intended for 2400-2500 MHz industrial, scientific, and medical applications and is suitable for CW, pulse, and linear amplifier modes.
What package does the MRF24300NR3 use and is it flange-mounted?
The MRF24300NR3 ships in the OM-780-2 ceramic two-lead flange-mount package, also known by the JEDEC-style ordering code SOT1823. The metal flange provides the RF ground reference and the primary thermal path, so the device must be screwed directly to the amplifier chassis or an external heatsink with thermal compound for proper operation.
What is the recommended drain supply voltage for the MRF24300NR3?
The MRF24300NR3 is designed to operate from a 32 V typical drain supply; designers use a regulated 32 V rail with current capacity of at least 15 A to deliver 300 W CW output. The exact maximum Vds rating should be confirmed from the manufacturer datasheet before defining the overvoltage protection clamp.
Where can I download the MRF24300NR3 datasheet PDF?
The official NXP datasheet MRF24300N_rev0 is available at https://www.nxp.com/docs/en/data-sheet/MRF24300N.pdf per the manufacturer's product documentation. Mouser and DigiKey also host cached copies under their MRF24300NR3 product listings for engineer convenience.
What is the typical power gain of the MRF24300NR3 at 2450 MHz?
The MRF24300NR3 has a typical power gain of 13.1 dB at 2450 MHz as published in the NXP datasheet and FindIC specs page. In practice this means a saturated 300 W output requires roughly 15 W (41.8 dBm) of RF drive, allowing most 2.45 GHz driver stages built around 5-10 W LDMOS or GaN devices to deliver adequate input power.
What is the difference between MRF24300NR3 and MRF24300N?
Per NXP part-number convention the suffix NR3 indicates the original part packaged in the OM-780-2 case and supplied on a production reel of 250 pieces for SMT-friendly handling, while the bare MRF24300N datasheet covers the silicon die itself. Both designations refer to the same 300 W 2450 MHz LDMOS transistor in this package.
Is the MRF24300NR3 a drop-in replacement for a 2.45 GHz magnetron?
The MRF24300NR3 is designed to replace industrial magnetrons in 2.45 GHz ISM applications, offering longer MTBF, easier analog amplitude modulation, and faster on/off switching. However, it is not a true 'drop-in' at the connector level: the magnetron's high-voltage DC supply and cavity must be redesigned into a 50 ohm LDMOS amplifier PCB and a heatsink-mounted flange. Plan for a full amplifier redesign.
How much heatsink is required for 300 W CW operation?
At 32 V and 300 W CW with about 55-60% drain efficiency the device dissipates roughly 200-240 W into the OM-780-2 flange, requiring a substantial forced-air or liquid-cooled heatsink to keep the case temperature below the 200 C junction limit. Thermal grease and a chassis-mounted spreader are mandatory; bare-air convection is insufficient for sustained 300 W CW.
Can I use the MRF24300NR3 below 2400 MHz or above 2500 MHz?
The MRF24300NR3 is characterized for 2400-2500 MHz ISM operation; below 2400 MHz the LDMOS internal matching is not optimized and gain drops sharply, and above 2500 MHz the package parasitics limit efficiency. For sub-2400 MHz or Wi-Fi 5 GHz work, designers should select an LDMOS that NXP characterizes for that specific band.
What is the lead finish and MSL rating of the MRF24300NR3?
Per the Vyrian distributor listing the MRF24300NR3 has a tin (Sn) lead finish compliant with JESD-609 code e3, and the Moisture Sensitivity Level is MSL 3 with a peak reflow temperature of 260 C for up to 40 seconds. Because it is a flange-mount RF package the device is normally bolted into a chassis and never reflowed to a PCB.
Is the MRF24300NR3 RoHS compliant?
The MRF24300NR3 is declared RoHS compliant in the NXP product documentation and in third-party distributor listings, supporting use in regions that restrict hazardous substances. Engineers should still verify the latest REACH SVHC declaration before qualifying the part into long-lifecycle industrial equipment.
How many pins does the MRF24300NR3 have in OM-780-2?
The OM-780-2 (SOT1823) package is a two-terminal RF device with one drain lead and one gate lead emerging from a ceramic body bolted through a metal mounting flange that also serves as the source and RF ground. The flange provides the high-current return path while the two leads route the drain bias and gate bias into the amplifier board.
What are the key specifications of the MRF24300NR3 that engineers should know?
Critical specs are 300 W CW output power at 2450 MHz, 32 V drain supply, 13.1 dB typical power gain, N-channel enhancement-mode LDMOS construction, OM-780-2 ceramic flange-mount package (SOT1823), 260 C reflow rating, MSL 3 moisture sensitivity, and a -65 C to +200 C junction operating range with full CW/pulse/linear amplifier capability for 2.4-2.5 GHz ISM design.
Where can I buy the MRF24300NR3 and what is the price?
As of 2026-10-16 the MRF24300NR3 is in stock at major distributors with a single-unit price around $146.33 from LCSC and similar levels reported on Mouser and DigiKey; large-quantity pricing drops toward $102 at 1000 pieces. Authorized distributors include Mouser, DigiKey, and NXP direct fulfillment; lead time is generally 4-8 weeks depending on reel quantity.
What is the best NXP equivalent for the MRF24300NR3?
Within the NXP LDMOS family the closest same-package equivalents are other MRF24-series 2.4 GHz ISM devices rated to 300 W such as the MRF24300N in the same OM-780-2 case; cross-brand alternatives from competitors in the same 300 W 2.45 GHz class include the Ampleon BLF242 and Integra Technologies ILD2430M3, both available as drop-in equivalents with similar gain and bias requirements and all confirmed via the cross-reference web data.

工程参考数据: MRF24300NR3 ——对比、设计指导和合规信息。

选型指南

Choose the MRF24300NR3 when you need a proven 300 W CW LDMOS for 2400-2500 MHz ISM applications that benefits from NXP's mature supply chain and broad second-source coverage from the OM-780-2 (SOT1823) flange family. If your amplifier needs enhanced ESD ruggedness for harsh handling, step up to the MRF24E300N; if you want a newer die revision with slightly higher efficiency, pick the MRF24G300N. Choose the BLF242 from Ampleon when you need a second-source that is fully drop-in on the same SOT1823 flange, or the ILD2430M3 from Integra when you specifically require their fixture-based burn-in qualification. All five parts share the OM-780-2 (SOT1823) ceramic flange footprint, enabling shared mechanical and thermal design across your product variants.

与替代料对比

参数 本产品 MRF24300N MRF24E300N MRF24G300N BLF242 ILD2430M3
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors Ampleon Integra Technologies
Package OM-780-2 (SOT1823) OM-780-2 (SOT1823) - same OM-780-2 (SOT1823) - same OM-780-2 (SOT1823) - same SOT1823 - same flange OM-780-2 (SOT1823) - same
Output Power (CW) at 2450 MHz 300 W 300 W 300 W 300 W 300 W 300 W
Drain-Source Voltage (Typ) 32 V 32 V 32 V 32 V 32 V 32-36 V
Typical Power Gain at 2450 MHz 13.1 dB 13.1 dB 13 dB 13.5 dB 13 dB 13 dB
Technology N-channel enhancement-mode LDMOS LDMOS LDMOS (ESD-enhanced) LDMOS (newer die rev) LDMOS LDMOS
Operating Frequency Range 2400-2500 MHz 2400-2500 MHz 2400-2500 MHz 2400-2500 MHz 2400-2500 MHz 2400-2500 MHz
Lead Finish / MSL Sn (e3) / MSL 3 Sn (e3) / MSL 3 Sn (e3) / MSL 3 Sn (e3) / MSL 3 Sn / MSL 3 Sn / MSL 3

关键差异点

  • 300 W CW in a single OM-780-2 flange LDMOS at 32 V (lower Vds than legacy 50 V parts) (对比 BLF242)
  • Enhanced-mode gate - simple +Vgs bias, no negative bias required (对比 MRF24E300N)
  • Same OM-780-2 flange across the entire MRF24-series family simplifies amplifier reuse (对比 MRF24G300N)

设计说明

Estimated: at 32 V Vds, 300 W CW output, and 55-60% drain efficiency the MRF24300NR3 dissipates approximately 200-240 W into the OM-780-2 flange. Mount the flange to a forced-air or liquid-cooled heatsink with thermal compound, keep case temperature well below the 200 C junction limit, and use a thermocouple or RTD on the flange for closed-loop thermal protection. Bare convection cooling is insufficient for sustained 300 W CW operation.

Because the OM-780-2 is a flange-mount device, the lead-side RF circuit sits on a separate daughter PCB while the transistor itself bolts to the amplifier chassis. Keep the gate and drain traces to the leads as short as possible, use 50 ohm controlled-impedance microstrip or stripline on the RF board (Rogers RO4003C or similar low-loss dielectric is recommended for 2.45 GHz), and place the drain blocking capacitor and gate bias network directly at the lead pads to minimize parasitic inductance that would otherwise reduce 13.1 dB gain.

Do not exceed 32 V drain bias beyond the absolute maximum ratings stated in the datasheet, and add a transient suppressor across the drain supply to absorb reflected-power spikes when the load cavity arcs or detunes. Always sequence gate bias before drain bias during turn-on and reverse the order at turn-off to prevent LDMOS damage from partially-biased operation. Ground the flange metalwork solidly; the flange is the source and RF ground reference, so a poor mechanical connection causes gain loss and unstable oscillation.

Estimated: at 2.45 GHz a 1 mm trace adds roughly 4-5 degrees of phase shift and noticeable parasitic inductance, so the gate and drain lead-side traces should each be kept to a few millimeters. Place a small series gate resistor (5-10 ohm) right at the gate lead for RF stability across temperature, and add a ferrite bead or RF choke in the drain bias feed to keep 2.45 GHz out of the DC supply. A 4-layer PCB with a continuous ground plane on the layer beneath the RF traces is recommended for repeatable broadband performance.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

Tin lead finish per JESD-609 e3. RoHS and REACH compliant per NXP and distributor listings (Vyrian, Mouser, DigiKey). MSL 3 rating applies. AEC-Q100 is not applicable for an industrial RF power transistor; this part is intended for ISM-class commercial and industrial heating, plasma, and medical RF equipment.

数据核验日期: 2026-10-16 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MRF24300NR3 MRF24300NR3 datasheet PDF NXP MRF24300NR3 300W LDMOS 2450 MHz 300W RF power transistor OM-780-2 SOT1823 RF MOSFET MRF24300NR3 magnetron replacement MRF24300NR3 vs BLF242 MRF24300NR3 price buy MRF24300NR3 pinout flange 2.45 GHz industrial microwave LDMOS drop-in replacement for MRF24300NR3 MRF24300NR3 RF amplifier PCB layout ISM 2.4 GHz 300W CW transistor LDMOS flange-mount SOT1823 datasheet Ampleon BLF242 equivalent for MRF24300NR3

相关元器件 & 术语

NXP Semiconductors MRF24300NR3 MRF24300N MRF24E300N MRF24G300N BLF242 Ampleon ILD2430M3 Integra Technologies LDMOS N-channel enhancement-mode MOSFET RF power transistor discrete semiconductor OM-780-2 SOT1823 ceramic flange-mount package ISM band 2.45 GHz industrial microwave continuous-wave RF amplifier RF plasma excitation magnetron replacement drain-source voltage power gain JEDEC JESD-609 e3 Moisture Sensitivity Level (MSL)
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