MSC8156VT1000B - SC3850 Six-Core DSP 1GHz | NXP FCBGA-783
料号： MSC8156VT1000B ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $210.3 | $210.30 |
| 10 | $199.5 | $1,995.00 |
| 100 | $188.15 | $18,815.00 |
| 500 | $175.2 | $87,600.00 |
| 1,000 | $162.4 | $162,400.00 |
MSC8156VT1000B 概述
A digital signal processor (DSP) is a specialized microprocessor whose datapath, registers, and instruction set are optimized for real-time numeric computation on continuous sample streams such as audio, baseband I/Q, and video. In a system hierarchy, the MSC8156VT1000B sits below FPGAs/ASICs and above general-purpose microcontrollers: it occupies the niche where deterministic, low-latency per-sample math must run at line rate without burdening a host CPU. The StarCore SC3850 family used in this part is a VLIW-style architecture with hardware accelerators, distinguishing it from conventional scalar DSP cores.
Key features include six SC3850 cores each running at 1 GHz, a multi-channel DMA engine, integrated memory controllers for DDR2/DDR3, three 1x/4x SerDes lanes (up to 5 Gbps each), two SGMII-capable Ethernet MACs, four TDM/JESD-style serial interfaces, and a 32-bit PCI Express endpoint. Per-core 16 KB L1 instruction/data caches and a shared 512 KB L2 cache support deterministic code and data locality.
The MSC8156 uses a 45 nm CMOS process with multiple on-chip voltage domains separated by independent power rails for core, platform, SerDes, and DDR I/O. This partitioning lets a system designer run the DSP cores at one voltage and frequency while keeping serial links at their optimal bias - critical for power-constrained baseband shelves. A built-in thermal diode with a dedicated ATD (analog-to-digital) interface allows platform thermal management.
Typical applications include LTE and WCDMA baseband channel cards, multi-channel voice/media gateways, radar and electronic-warfare pre-processors, and high-density test and measurement front-ends. In all of these, the six-core aggregate throughput replaces several discrete DSPs and reduces board area.
When designing with this part, allocate four layers of the PCB to the FCBGA-783 break-out, follow the NXP reference design for DDR2/DDR3 fly-by topology, and verify that the SC3850 boot mode straps (RCW, Reset Configuration Word) match the chosen serial protocol. Use the SmartDSP OS or a bare-metal build with the supplied CodeWarrior toolchain for initial bring-up.
This page synthesizes distributor pricing, FCBGA-compatible alternatives, and practical board-design notes that are not always obvious from the manufacturer datasheet alone.
直接替换替代料： MSC8156VT1000B ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MSC8156VT1000B （相同外形与封装尺寸） ——差异在于 Package.
快速对比工具——选择替代料号进行并排对比：
MSC8156VT800B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8156VT1200B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8156VT1500B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8154VT1000B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8152VT1000B
✅ 直接替换📋 参考替代料（不在目录中）
MSC8156VT1000B 规格参数
| Architecture | StarCore SC3850 (six-core) |
| Core Count | 6 |
| Core Clock Frequency | 1 GHz |
| Aggregate DSP Performance | 48 GMAC/s (6 x 1 GHz x 8 MACs/cycle) |
| Instruction Set | StarCore SC3850 VLIW DSP |
| L1 Cache (per core) | 16 KB instruction + 16 KB data |
| L2 Cache (shared) | 512 KB |
| Memory Controller | DDR2/DDR3 with ECC |
| Serial Interfaces | 3x SerDes (up to 5 Gbps), 4x TDM/HSSI |
| Ethernet | 2x SGMII MAC |
| PCI Express | 1x PCIe endpoint (x1/x4) |
| 封装 | 783-ball FCBGA |
| Process Technology | 45 nm CMOS |
| 工作温度 | -40C to +105C (industrial) |
| Boot Interface | SPI, NOR flash, RCW-driven |
| On-chip Thermal Sensor | Yes (ATD interface) |
MSC8156VT1000B 783-ball fcbga 引脚配置指南
MSC8156VT1000B（783-ball fcbga 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： MSC8156VT1000B.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MSC8156VT1000B 适用于 6 应用s: LTE Baseband Channel Card, Multi-Channel Voice/Media Gateway, Radar and Electronic Warfare Pre-processor, Multi-Carrier Wireless Infrastructure, Test and Measurement Front-End, Medical Imaging Pre-Processor.
LTE Baseband Channel Card
The MSC8156VT1000B's six SC3850 cores at 1 GHz deliver up to 48 GMAC/s of aggregate baseband throughput, which is sufficient to process several LTE carriers (downlink and uplink) simultaneously on a single chip. In a typical system the part sits between the RF frontend and the host processor, running physical-layer tasks such as turbo decoding, FFT/iFFT, and channel estimation. Its DDR2/DDR3 controller with ECC handles the high-bandwidth sample buffers needed for 20 MHz LTE channels, while the x4 PCIe endpoint streams processed data to the host. Compared with an FPGA + DSP split, this single-chip approach reduces board area by roughly half. Engineers building small-cell eNodeBs often pick this part because the SmartDSP OS exposes pre-built LTE physical-layer libraries. Power consumption scales with workload, so disabling unused cores via the RCW can lower idle draw.
推荐
Multi-Channel Voice/Media Gateway
Six independent SC3850 cores let the MSC8156VT1000B compress/decompress more than a thousand G.729 or G.723 voice channels per chip, replacing a discrete DSP farm in legacy TDM-to-IP media gateways. Engineers typically route the four TDM interfaces on this part directly to E1/T1 framer chips, while the two SGMII Ethernet MACs handle RTP packet flow. Built-in echo cancellation and tone-detection firmware is available through the SmartDSP OS, simplifying software development. The deterministic L1 cache latency matters for sustained 125-microsecond TDM frames, where jitter translates to voice-quality impairment. Compared with a discrete DSP array, the six-core single-chip solution cuts BOM cost and reduces cage fan count by merging thermal envelopes.
推荐
Radar and Electronic Warfare Pre-processor
The 48 GMAC/s arithmetic throughput of the MSC8156VT1000B makes it suitable as a pre-processor stage in defense and surveillance systems, where raw ADC streams must be filtered, FFT'd and pulse-compressed in real time before being handed to a CPCI/VPX host controller. The three SerDes lanes (up to 5 Gbps each) are commonly used to ingest high-speed ADC data from FPGA mezzanines; the on-chip DDR controller with ECC stabilizes working memory for large FFT windows. The -40C to +105C temperature rating, the integrated thermal diode, and the FCBGA's solder-joint reliability make this part popular in rugged VPX applications. Compared with general-purpose CPUs, the StarCore VLIW pipeline keeps per-sample deterministic latency, which is critical for synchronous beamforming and constant-false-alarm-rate (CFAR) detection.
推荐
Multi-Carrier Wireless Infrastructure
Beyond LTE, the MSC8156VT1000B can handle multi-standard wireless processing including WCDMA, WiMAX and 3G fallback in a single carrier-class shelf. Each SC3850 core runs an independent physical-layer instance, simplifying task partitioning across carriers. The 1 GHz clock frequency offers the 16-bit MAC headroom needed for the 3.84 Mcps chip rate of WCDMA while leaving cycles for inner receiver functions. NXP's SmartDSP OS provides pre-integrated WCDMA and LTE L1 libraries that bind cleanly to the DDR2/DDR3 buffer pool. Compared with a farm of single-core DSPs, the integrated platform cuts PCB area, lowers power per channel, and reduces the number of ATD thermal sensors needed in a chassis.
推荐
Test and Measurement Front-End
Instruments such as real-time spectrum analyzers, channel emulators, and protocol conformance testers can use the MSC8156VT1000B to run 400 MHz to 5 GHz DSP pipelines without off-loading to a host. The dual SGMII Ethernet MACs allow streaming of pre-processed captures to a recording or display back-end, while the PCIe endpoint supports direct DMA into a CPU card. Six cores enable parallel execution of separate measurement paths - signal vs reference, multi-port S-parameter decomposition, or simultaneous multi-standard protocol conformance. With 16 KB L1 per core and a 512 KB shared L2 cache, deterministic sample handling is preserved across long acquisitions. Compared with discrete DSPs, the integrated solution shortens the development cycle by consolidating peripheral glue logic.
推荐
Medical Imaging Pre-Processor
The MSC8156VT1000B can pre-process raw data from ultrasound transducer arrays, MRI receiver coils, or CT detector banks before downstream image reconstruction. Per-sample pipeline latency from the SC3850 cores is well suited to real-time ultrasound beamforming, where adjacent channels must be summed at sub-microsecond determinism. The DDR2/DDR3 controller with ECC preserves data integrity critical for diagnostic-grade imaging, while the integrated thermal diode is essential for medical enclosure cooling. Six cores allow concurrent pipelines - one for Doppler, one for B-mode, one for harmonic imaging - without task scheduling contention. Compared with FPGA-only pipelines, the DSP offers a C-language development path, shortening time-to-prototype for medical OEM teams.
推荐
推荐产品汇总
工程参考数据： MSC8156VT1000B ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MSC8156VT800B | MSC8156VT1200B | MSC8156VT1500B | MSC8154VT1000B | MSC8152VT1000B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | FCBGA-783 | FCBGA-783 (same) | FCBGA-783 (same) | FCBGA-783 (same) | FCBGA-783 (same) | FCBGA-783 (same) |
| Core Architecture | SC3850 (six-core) | SC3850 (six-core) | SC3850 (six-core) | SC3850 (six-core) | SC3850 (four-core) | SC3850 (two-core) |
| Core Clock | 1 GHz | 800 MHz | 1200 MHz | 1500 MHz | 1 GHz | 1 GHz |
| Aggregate Throughput | 48 GMAC/s | 38.4 GMAC/s (-20%) | 57.6 GMAC/s (+20%) | 72 GMAC/s (+50%) | 32 GMAC/s (-33%) | 16 GMAC/s (-67%) |
| L2 Cache | 512 KB shared | 512 KB shared | 512 KB shared | 512 KB shared | 512 KB shared | 512 KB shared |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| SerDes Lanes | 3x (up to 5 Gbps) | 3x (up to 5 Gbps) | 3x (up to 5 Gbps) | 3x (up to 5 Gbps) | 3x (up to 5 Gbps) | 3x (up to 5 Gbps) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Six-core processing at 1 GHz per core （对比 MSC8154VT1000B)
- Higher throughput grade available in same package （对比 MSC8156VT1200B)
- Lower-cost speed grade available in same package （对比 MSC8156VT800B)
设计说明
The 783-ball FCBGA package demands an HDI PCB stack-up with microvias. NXP's reference design uses 8 to 10 layers with paired microvia stacks to escape the inner rows. Maintain a continuous reference plane under the BGA to control the impedance of the DDR3 fly-by traces and avoid plane splits across the die shadow. Allow at least 25 mm of matched-length routing room between the DSP and DDR3 SODIMM/SRAM devices.
Estimated: at full 1 GHz load on all six cores at 1.0 V core voltage, the MSC8156VT1000B dissipates approximately 8 to 10 W. The 783-ball FCBGA package has a published theta_JA that requires a chassis-level thermal design with at least 300 LFM airflow or a small heatsink at typical system altitudes. Use the on-chip ATD (analog-to-digital thermal) interface to monitor junction temperature in real time; values above 105C require throttling.
Do not confuse the MSC8156VT1000B part number decoder: the trailing '1000B' refers to the 1 GHz speed grade, not the core count. Also note that despite six SC3850 cores, parts in this family can come in two, four, and six-core configurations within the same 783-ball FCBGA. Confirm the full part number with the device identification register (DEVID) on the RCW payload before issuing a firmware release.
DDR3 memory must be laid out with fly-by topology rather than T-branch to stay within the MSC8156VT1000B's published signal-integrity budget. Series-termination resistors on the DDR3 address/command signals are optional depending on the length and clock rate. Use NXP's DDR3 IBIS model to simulate your stack-up before committing to a PCB fab.
合规信息
Compliance data for MSC8156VT1000B is not present in the verified web data; RoHS and lead-free status should be confirmed against the manufacturer datasheet before assembly. The AEC-Q100 standard is not applicable to this DSP as it is not aimed at automotive ECUs.
