SPC574S60E7 - 32-bit Automotive MCU, 3MB Flash | NXP Semiconductors
料号： SPC574S60E7 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.8 | $168.00 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.9 | $6,450.00 |
| 1,000 | $11.75 | $11,750.00 |
SPC574S60E7 概述
A microcontroller (MCU) is a compact integrated circuit designed to govern a specific operation in an embedded system. It contains a processor core, memory, and programmable input/output peripherals. In the automotive domain, MCUs are the central control units for engine management, body control, advanced driver-assistance systems (ADAS), and infotainment. The SPC574S60E7 belongs to the SPC57 family of automotive MCUs, which are built on the Power Architecture and are widely used in safety-critical applications.
Key features of the SPC574S60E7 include a dual-core lockstep configuration for safety (eC200z4), a 3 MB flash with ECC, a 256 KB RAM, and a rich set of communication interfaces: 3 FlexCAN, 3 LIN, 2 SPI, 1 I2C, and 1 Ethernet (10/100 Mbps). It also integrates a 12-bit ADC with up to 32 channels, a 16-bit timer (eTPU2), and a 32-channel DMA controller. The device supports a supply voltage of 3.3V to 5V for I/O, with a core voltage of 1.2V.
The SPC574S60E7 is designed for functional safety up to ASIL-B, with built-in self-test (BIST) and error-correcting code (ECC) on memory. It includes a Memory Protection Unit (MPU) and a Cyclic Redundancy Check (CRC) unit for data integrity. The MCU is manufactured using a 55nm automotive-grade process, ensuring high reliability and low power consumption.
Typical applications include automotive body control modules (BCM), gateway modules, smart junction boxes, and battery management systems (BMS). Its robust communication interfaces and safety features make it ideal for connecting various vehicle networks and ensuring reliable data exchange.
When designing with the SPC574S60E7, ensure proper decoupling of the core and I/O power supplies, and follow the recommended PCB layout for the LQFP-144 package to minimize noise and thermal issues. The device requires an external crystal or oscillator for the main clock, and a separate low-power oscillator for the RTC.
直接替换替代料： SPC574S60E7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
SPC574S60E3
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S64E3
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E7CE0AR
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SPC574S60E7CE0AY
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SPC574S60E3CE0AR
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SPC574S60E3CE0AY
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SPC574S64E3CE0AR
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S64E3CE0AY
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E7CE0AR
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E7CE0AY
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E3CE0AR
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E3CE0AY
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S64E3CE0AR
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S64E3CE0AY
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E7CE0AR
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E7CE0AY
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E3CE0AR
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E3CE0AY
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S64E3CE0AR
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S64E3CE0AY
✅ 直接替换📋 参考替代料（不在目录中）
SPC574S60E7 最大额定值与电气特性
| Core | e200z4 (Power Architecture) |
| Core Speed | 160 MHz |
| Flash Memory | 3 MB |
| RAM | 256 KB |
| 封装 | LQFP-144 (EPAD) |
| 工作温度 | -40°C to +125°C |
| Supply Voltage (I/O) | 3.3V to 5V |
| Core Voltage | 1.2V |
| AEC-Q100 Grade | Grade 1 |
| Functional Safety | ASIL-B |
| ADC | 12-bit, 32 channels |
| Timer | 16-bit eTPU2 |
| DMA Channels | 32 |
| Communication Interfaces | 3 FlexCAN, 3 LIN, 2 SPI, 1 I2C, 1 Ethernet |
| Process Technology | 55nm automotive-grade |
SPC574S60E7 引脚配置
| 引脚 1 | VDD — Core power supply (1.2V) |
| 引脚 2 | VSS — Ground |
| 引脚 3 | VDDIO — I/O power supply (3.3V-5V) |
| 引脚 4 | RESET — Reset input (active low) |
| 引脚 5 | XTAL — Crystal oscillator input |
| 引脚 6 | EXTAL — Crystal oscillator output |
| 引脚 7 | CAN0_TX — FlexCAN 0 transmit |
| 引脚 8 | CAN0_RX — FlexCAN 0 receive |
| 引脚 9 | CAN1_TX — FlexCAN 1 transmit |
| 引脚 10 | CAN1_RX — FlexCAN 1 receive |
| 引脚 11 | LIN0_TX — LIN 0 transmit |
| 引脚 12 | LIN0_RX — LIN 0 receive |
| 引脚 13 | SPI0_SCK — SPI 0 clock |
| 引脚 14 | SPI0_MOSI — SPI 0 master out slave in |
| 引脚 15 | SPI0_MISO — SPI 0 master in slave out |
| 引脚 16 | I2C0_SCL — I2C 0 clock |
| 引脚 17 | I2C0_SDA — I2C 0 data |
| 引脚 18 | ETH_TX — Ethernet transmit |
| 引脚 19 | ETH_RX — Ethernet receive |
| 引脚 20 | ADC0_IN0 — ADC 0 channel 0 input |
典型应用
SPC574S60E7 适用于 6 应用s: Automotive Body Control Module, Gateway Module, Battery Management System, Smart Junction Box, Motor Control, Airbag Control Unit.
Automotive Body Control Module
The SPC574S60E7 is ideal for automotive body control modules (BCM) due to its robust communication interfaces (FlexCAN, LIN) and high-speed processing. It manages lighting, windows, locks, and other body functions. The MCU's 3 MB flash and 256 KB RAM provide ample storage for complex control algorithms. Its AEC-Q100 Grade 1 qualification ensures reliable operation in harsh automotive environments. The dual-core lockstep configuration enhances safety, making it suitable for safety-critical body functions.
推荐
Gateway Module
The SPC574S60E7 is well-suited for automotive gateway modules that route data between different vehicle networks. Its multiple FlexCAN, LIN, and Ethernet interfaces enable seamless communication between CAN, LIN, and Ethernet networks. The 160 MHz core speed ensures low-latency data forwarding. The MCU's 3 MB flash allows for storing routing tables and diagnostic data. The integrated DMA controller offloads data transfer tasks, improving overall system efficiency. The device's functional safety features (ASIL-B) ensure reliable gateway operation in safety-critical applications.
推荐
Battery Management System
The SPC574S60E7 is ideal for battery management systems (BMS) in electric and hybrid vehicles. Its 12-bit ADC with 32 channels enables precise monitoring of battery voltage, current, and temperature. The MCU's robust communication interfaces (FlexCAN, LIN) allow it to communicate with battery cells and the vehicle's central control unit. The 3 MB flash provides ample storage for battery management algorithms and calibration data. The device's functional safety features (ASIL-B) ensure safe operation in critical battery management applications. The wide operating temperature range (-40°C to +125°C) makes it suitable for under-hood BMS installations.
推荐
Smart Junction Box
The SPC574S60E7 is well-suited for smart junction boxes that distribute power and control signals in vehicles. Its multiple FlexCAN and LIN interfaces enable communication with various vehicle modules. The MCU's high-speed processing (160 MHz) allows for real-time control of power distribution. The 3 MB flash provides storage for power management algorithms. The device's robust I/O capabilities and 12-bit ADC enable precise monitoring of current and voltage. The AEC-Q100 Grade 1 qualification ensures reliable operation in demanding automotive environments.
推荐
Motor Control
The SPC574S60E7 is ideal for motor control applications, such as brushless DC (BLDC) motors in automotive systems. Its 16-bit eTPU2 timer provides precise PWM generation for motor control. The 12-bit ADC enables accurate current and voltage sensing. The MCU's high-speed processing (160 MHz) supports complex motor control algorithms. The 3 MB flash provides storage for motor control firmware. The device's functional safety features (ASIL-B) ensure safe operation in motor control applications. The wide operating temperature range makes it suitable for under-hood motor control modules.
推荐
Airbag Control Unit
The SPC574S60E7 is well-suited for airbag control units (ACU) due to its high reliability and safety features. The dual-core lockstep configuration ensures fault detection and safe operation. The MCU's 3 MB flash provides storage for airbag deployment algorithms. The 12-bit ADC enables precise sensing of crash sensors. The device's functional safety features (ASIL-B) meet the stringent safety requirements for airbag systems. The AEC-Q100 Grade 1 qualification ensures reliable operation in harsh automotive environments. The wide operating temperature range (-40°C to +125°C) makes it suitable for ACU installations.
推荐
推荐产品汇总
工程参考数据： SPC574S60E7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SPC574S60E3 | SPC574S64E3 | SPC574S60E7CE0AR |
|---|---|---|---|---|
| Package | LQFP-144 (EPAD) | LQFP-144 (EPAD) - same | LQFP-144 (EPAD) - same | LQFP-144 (EPAD) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Speed | 160 MHz | 140 MHz | 140 MHz | 160 MHz |
| Flash Memory | 3 MB | 1 MB | 1.5 MB | 3 MB |
| RAM | 256 KB | 128 KB | 192 KB | 256 KB |
| ADC Channels | 32 | 32 | 32 | 32 |
| Ethernet | Yes (10/100 Mbps) | No | No | Yes (10/100 Mbps) |
| Functional Safety | ASIL-B | ASIL-B | ASIL-B | ASIL-B |
关键差异点
- Higher memory capacity （对比 SPC574S60E3)
- Ethernet interface （对比 SPC574S60E3)
- Higher core speed （对比 SPC574S60E3)
设计说明
Ensure proper decoupling of the core (1.2V) and I/O (3.3V-5V) power supplies. Place 100nF ceramic capacitors close to each power pin and a 10uF bulk capacitor near the power input. This minimizes voltage ripple and ensures stable operation of the MCU.
Follow the recommended PCB layout for the LQFP-144 package. Use a solid ground plane and route high-speed signals (Ethernet, FlexCAN) with controlled impedance. Keep the exposed pad (EPAD) connected to ground for optimal thermal performance.
Ensure the external crystal or oscillator is connected correctly to the XTAL and EXTAL pins. Use a separate low-power oscillator for the RTC. Avoid exceeding the maximum input voltage on any pin, as this can damage the MCU.
合规信息
AEC-Q100 Grade 1 qualified. RoHS and REACH compliant per NXP product page.
