MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP
料号： MSC8157ESVT1000A ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $211.93 | $211.93 |
| 10 | $195.5 | $1,955.00 |
| 100 | $178.2 | $17,820.00 |
| 250 | $165.4 | $41,350.00 |
| 500 | $152.8 | $76,400.00 |
MSC8157ESVT1000A 概述
A digital signal processor (DSP) is a specialized microprocessor optimized for numeric-intensive signal processing workloads where multiply-accumulate (MAC) operations dominate. DSPs sit in the broader hierarchy of microcontrollers and microprocessors, but are distinguished by Harvard architecture, SIMD capability, deterministic interrupt latency, and dedicated MAC units. The MSC8157 belongs to the multi-core DSP class, where multiple SC3850 cores operate in parallel to deliver aggregate throughput for wireless baseband, media processing, and high-speed packet inspection.
Key features of the MSC8157ESVT1000A include six SC3850 cores running at 1 GHz (1000 MIPS per core, 6000 MIPS aggregate), 32 KB L1 I-cache and 32 KB L1 data cache per core, multi-channel DDR memory controller, Serial RapidIO, SGMII Ethernet, PCI Express, and security/packet acceleration hardware. The 783-ball FCBGA package is lead-free and uses a 1.0 mm ball pitch, with operating temperature range of 0C to 105C for the industrial grade (the "ES" suffix indicates the specific speed/temperature bin).
The architecture uses a coherent crossbar switch to interconnect the six cores with shared L2 memory and the system bus, enabling efficient task distribution in a heterogeneous SMP DSP environment. The integrated security engine and high-speed serial interfaces (Serial RapidIO, SGMII) make the device well suited to telecom infrastructure requiring both signal processing and line-rate packet handling.
Typical applications include 3G/4G wireless baseband processing, media gateway transcoding, deep packet inspection (DPI) engines, software-defined radio (SDR) platforms, and high-performance industrial imaging. The multi-core SC3850 design allows concurrent baseband, modem, and protocol-stack processing on a single die.
When designing with this device, allocate adequate PCB area for the 29x29 mm FCBGA land pattern and follow NXP's flip-chip BGA routing rules for the DDR and Serial RapidIO interfaces. Decoupling must follow the reference design exactly; the part is sensitive to power-rail noise on the core and SerDes supplies.
直接替换替代料： MSC8157ESVT1000A ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MSC8157ESVT1000A （相同外形与封装尺寸） ——差异在于 Operating Temperature, Mounting Type, Type, Memory Controller, Package.
快速对比工具——选择替代料号进行并排对比：
MSC8157ETVT1000A
✅ 直接替换✓ 有现货
$190.89 / 个
查看数据手册 →MSC8157ESVT800A
✅ 直接替换📋 参考替代料（不在目录中）
MSC8157TVT1000A
✅ 直接替换✓ 有现货
$171 / 个
查看数据手册 →MSC8156ESVT1000B
✅ 直接替换✓ 有现货
$138 / 个
查看数据手册 →MSC8156ESAG1000B
✅ 直接替换✓ 有现货
$112 / 个
查看数据手册 →MSC8156TVT1000B
✅ 直接替换✓ 有现货
$182.3 / 个
查看数据手册 →MSC8157ESVT1000A 规格参数
| Product Type | Multi-core Digital Signal Processor (DSP) |
| DSP Core Architecture | StarCore SC3850 (Six cores) |
| Core Clock Speed | 1 GHz |
| Performance | 1000 MIPS per core / 6000 MIPS aggregate |
| 数据总线宽度 | 32-Bit / 64-Bit |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| Package Type | FCBGA-783 (Flip-Chip BGA, 29x29 mm) |
| Pin/Ball Count | 783 |
| 电源电压 | 1.0 V core (typical) |
| 工作温度 | 0C to +105C |
| Process Technology | CMOS |
| 安装类型 | Surface Mount (FCBGA) |
| Lead-Free / RoHS | Yes (lead-free) |
| High-Speed Interfaces | Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART |
| Memory Controller | Multi-channel DDR SDRAM controller |
| 生命周期状态 | Obsolete (stock available from authorized distributors) |
MSC8157ESVT1000A fcbga-783 (flip-chip bga, 29x29 mm) 引脚配置指南
MSC8157ESVT1000A（fcbga-783 (flip-chip bga, 29x29 mm) 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： MSC8157ESVT1000A.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MSC8157ESVT1000A 适用于 6 应用s: 3G/4G Wireless Baseband Processing, Media Gateway Transcoding, Deep Packet Inspection (DPI), Software Defined Radio (SDR), Industrial Imaging and Machine Vision, Telecom Test & Measurement.
3G/4G Wireless Baseband Processing
The MSC8157ESVT1000A's six SC3850 cores at 1 GHz deliver 6000 MIPS aggregate throughput, ideal for 3G/4G baseband PHY and MAC layer processing where channel decoding, turbo decoding, and FFT/iFFT blocks must execute within strict latency budgets. The device's multi-channel DDR controller and Serial RapidIO interfaces allow direct attachment to baseband cards and RF front-end ASICs. Versus a single-core DSP, the six-core architecture supports parallel channel decoding across multiple carriers on a single die. Placed on the baseband card as the central DSP, it interfaces to RF ICs via Serial RapidIO and to network processors via SGMII, simplifying the system architecture while replacing legacy multi-DSP designs.
推荐
Media Gateway Transcoding
Voice and video transcoding workloads benefit from the MSC8157ESVT1000A's parallel SC3850 cores, which can simultaneously process multiple G.711/G.729 audio streams or H.264 video channels without compromising quality. Each core's SIMD extensions accelerate FFT, DCT, and motion-estimation kernels. The DDR memory controller handles large frame buffers while the PCI Express interface connects to host CPUs. Designers typically partition transcoding tasks across cores with a software scheduler. Trade-off: the DSP's deterministic interrupt response is preferable to a general-purpose CPU for real-time voice, but power consumption is greater than a low-end ARM Cortex-A9 solution at equivalent throughput.
推荐
Deep Packet Inspection (DPI)
The MSC8157ESVT1000A integrates Serial RapidIO and SGMII for line-rate packet handling, plus dedicated pattern-matching accelerators that offload regular-expression matching from the SC3850 cores. At 1 GHz per core, six cores can sustain multi-Gbps DPI throughput for intrusion detection and application-layer filtering. The security engine accelerates AES/SHA offload while the cores handle protocol-state tracking. Unlike a CPU-only DPI solution, the MSC8157ESVT1000A delivers deterministic throughput independent of packet size. The 783-FCBGA package requires careful PCB layout for signal integrity on the high-speed serial links.
推荐
Software Defined Radio (SDR)
The MSC8157ESVT1000A's six cores provide ample headroom for SDR baseband functions including channelization, demodulation, and waveform synthesis across multiple standards (LTE, WiMAX, TETRA). The SC3850 SIMD extensions handle complex I/Q arithmetic efficiently, while the high-speed serial interfaces support digital RF data interfaces (such as CPRI or proprietary LVDS to RF front ends). At 1 GHz core frequency, each core can process multiple LTE resource blocks in real time. Trade-off: for wideband SDR above 100 MHz instantaneous bandwidth, designers may need to pair the MSC8157 with an FPGA for the highest-rate signal processing stages.
推荐
Industrial Imaging and Machine Vision
The MSC8157ESVT1000A handles multi-camera machine vision workloads by dedicating individual SC3850 cores to parallel image pipelines (pre-processing, segmentation, feature extraction). At 6000 MIPS aggregate, the device can sustain VGA-resolution edge detection and object classification at hundreds of frames per second. The DDR controller holds frame buffers, and the Ethernet/SGMII interfaces stream processed metadata to factory PLCs. Industrial-grade 0-105C operation suits factory-floor deployment. Trade-off: the FCBGA-783 package and 1 GHz clock draw significant power, so thermal management with a heatsink or cold-plate is required in sealed enclosures.
推荐
Telecom Test & Measurement
The MSC8157ESVT1000A's deterministic interrupt response and high MIPS density make it well-suited to telecom test equipment that emulates base stations, generates protocol traffic, or analyzes signaling. The six cores allow concurrent generation of multiple carrier signals for receiver conformance testing. Serial RapidIO interfaces connect to FPGA-based digitizers, while Ethernet interfaces stream results to host software. The 783-FCBGA package and industrial temperature grade suit benchtop and rack-mounted instruments. Trade-off: end-of-life status means new designs should plan for Rochester Electronics or last-time-buy inventory.
推荐
推荐产品汇总
工程参考数据： MSC8157ESVT1000A ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MSC8157ETVT1000A | MSC8157ESVT800A | MSC8157TVT1000A | MSC8156ESVT1000B | MSC8156ESAG1000B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | FCBGA-783 (29x29 mm) | FCBGA-783 (29x29 mm) - same | FCBGA-783 (29x29 mm) - same | FCBGA-783 (29x29 mm) - same | FCBGA-783 (29x29 mm) - same | FCBGA-783 (29x29 mm) - same |
| Core Count | 6 SC3850 cores | 6 SC3850 cores | 6 SC3850 cores | 6 SC3850 cores | 4 SC3850 cores | 4 SC3850 cores |
| Core Clock | 1 GHz | 1 GHz | 800 MHz | 1 GHz | 1 GHz | 1 GHz |
| Aggregate MIPS | 6000 MIPS | 6000 MIPS | 4800 MIPS | 6000 MIPS | 4000 MIPS | 4000 MIPS |
| Encryption/Security | Standard security engine | Enhanced encryption profile | Standard security engine | No encryption feature | Standard security engine | Standard security engine |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Highest aggregate throughput in the MSC815x family （对比 MSC8156ESVT1000B)
- Industrial-grade operating temperature （对比 MSC8157TVT1000A)
- Drop-in compatible with sibling variants in same FCBGA-783 package （对比 MSC8154 family)
设计说明
The 783-ball FCBGA package requires a 1.0 mm ball pitch land pattern with via-in-pad or microvia construction for the inner rows. Route the DDR memory interface (DDR2/DDR2.5) as matched-length pairs (within 25 mils), and isolate the Serial RapidIO and SGMII differential pairs with controlled impedance (100 ohm differential) and matched lengths (within 5 mils). The 29x29 mm footprint demands at least 8 PCB layers with dedicated ground and power planes; reference NXP's MSC8157 reference design for exact stack-up and decoupling recommendations.
Estimated: at 1 GHz core clock and typical workloads, the MSC8157ESVT1000A draws 8-12 W; with theta_JA in the 15-20 C/W range for FCBGA-783 with adequate PCB copper, junction-to-ambient rise is 120-240 C above ambient. At 25C ambient this exceeds the 105C operating limit; therefore a heatsink (15x15 mm or larger) is mandatory for production deployments. Limit continuous core utilization to 60-70% to keep junction temperature in spec at 55C ambient.
The MSC8157ESVT1000A requires multiple supply rails: 1.0 V core, 1.5 V DDR, 2.5 V I/O, 3.3 V peripheral I/O. Use a sequencer (such as the NXP MC34712 or equivalent PMIC) to enforce the proper rail order; failure to sequence can latch-up or damage the device. Decoupling must follow the reference design: at least 20 low-ESR ceramic capacitors (1 uF to 10 uF) directly under the package, plus bulk capacitors at the PCB edge.
Common pitfalls: (1) using lead-free SAC305 solder without proper reflow profile (peak 245C max, time above liquidus 60-90 s); (2) omitting the JTAG test access port for boundary-scan bring-up; (3) ignoring the boot-mode strapping pins (CONFIG[0:7]) that select boot source (NOR flash, NAND, Serial RapidIO, Ethernet) - incorrect strapping leaves the device unbootable; (4) the device is obsolete - plan for last-time-buy or authorized distributor stock; do not use for new high-volume designs.
合规信息
FCBGA-783 package is lead-free per Verified Web Data. AEC-Q100 not applicable for industrial-temp DSP. Halogen-free status not stated in data - left as unknown.
