P1021NSN2DFB557 - QorIQ P1 2-Core 800MHz SoC | NXP | TEPBGA-689
料号： P1021NSN2DFB557 ✓ 量产中P1021NSN2DFB557 概述
The QorIQ P1 platform is a next-generation evolution of NXP's PowerQUICC communications processors. Built on high-performance Power Architecture cores, the P1 series balances compute throughput with power efficiency for embedded networking and industrial control. Within the broader power management and processor taxonomy, the P1021 occupies a slot between general-purpose microcontrollers and high-end communications processors, targeting routed and bridged gateways, network-attached industrial systems, and print/imaging controllers.
Key features include 32KB instruction and 32KB data L1 caches per core, a 256KB unified L2 cache with ECC, hardware-accelerated cryptography (SEC 3.3), and an integrated security engine. The part supports -40C to +125C junction temperature and operates from a 1.0V core supply with a 0.95V to 1.05V tolerance. The TEPBGA-689 package uses a 1.00mm ball pitch and exposes a thermal pad for PCB heat dissipation.
Typical applications include multi-protocol industrial gateways (PROFINET, EtherNet/IP, EtherCAT), networked storage controllers, smart-grid concentrators, software-defined networking line cards, and imaging/print engine controllers. The Quicc Engine offloads serial protocol processing, freeing the e500v2 cores for application-layer stacks, while GbE ports enable line-rate switching and routing.
When designing with this part, allocate at least four PCB layers with dedicated ground planes beneath the BGA footprint to control return paths for the DDR3 interface, which can switch at 667 MT/s. Power supply decoupling requires bulk capacitors near each 1.0V core island plus 0402/0201 ceramic decoupling adjacent to every BGA power pin. JTAG, POR, and reset architecture must follow NXP's hardware design checklist in the reference manual to ensure deterministic boot.
直接替换替代料： P1021NSN2DFB557 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
P1021NSE2DFB
✅ 直接替换📋 参考替代料（不在目录中）
P1021NXE2DFB
✅ 直接替换📋 参考替代料（不在目录中）
P1022NSN2DFB
✅ 直接替换📋 参考替代料（不在目录中）
P1013NSN2DFB
✅ 直接替换📋 参考替代料（不在目录中）
P1020NSN2DFB
✅ 直接替换📋 参考替代料（不在目录中）
P1021NSN2DFB557 最大额定值与电气特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | QorIQ P1 |
| Core Architecture | Power Architecture e500v2 (dual-core) |
| Maximum Core Frequency | 800 MHz |
| CPU Cores | 2 |
| Bit Width | 32-bit |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Cache (unified) | 256 KB with ECC |
| Core Supply Voltage | 1.0 V (0.95 V to 1.05 V) |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | 2 x 10/100/1000 Mbps (RGMII) |
| PCI Express | PCIe Gen 1 (x1/x2) |
| USB | USB 2.0 (host/device) |
| Serial Communications | TDM, UART, SPI, I2C |
| Acceleration Engine | Quicc Engine (QE) + SEC 3.3 crypto |
| 封装 | TEPBGA-689 (31 x 31 mm, 1.00 mm pitch) |
| 工作温度 | 0 C to 125 C (junction) |
| 安装类型 | Surface Mount, BGA |
| MSL 等级 | 3 (per JEDEC J-STD-020) |
| RoHS 状态 | RoHS Compliant |
| Lead Free | Yes |
P1021NSN2DFB557 tepbga-689 (31 x 31 mm, 1.00 mm pitch) 引脚配置指南
P1021NSN2DFB557（tepbga-689 (31 x 31 mm, 1.00 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： P1021NSN2DFB557.
请参阅 数据手册 以查看完整引脚配置。
典型应用
P1021NSN2DFB557 适用于 7 应用s: Industrial PROFINET / EtherNet/IP Gateway, Multi-Protocol Network Bridge/Router, Print and Imaging Engine Controller, Smart Grid Concentrator / Substation Controller, Software-Defined Networking Line Card, Network-Attached Storage Controller, Medical Imaging Capture Subsystem.
Industrial PROFINET / EtherNet/IP Gateway
The P1021NSN2DFB557's dual e500v2 cores at 800 MHz combined with the Quicc Engine (QE) make it a strong fit for industrial PROFINET, EtherNet/IP, and EtherCAT gateway controllers. The QE offloads serial protocol processing so the application cores run PROFINET-RT stacks above 250 us cycle windows, while the dual GbE MACs bridge to plant-floor backbones. Power dissipation is moderate, typically under 5 W, allowing fanless DIN-rail enclosures.
推荐
Multi-Protocol Network Bridge/Router
In bridged and routed gateway products the P1021NSN2DFB557 handles simultaneous IPv4/IPv6 forwarding, NAT, and IPSec encryption/decryption at line rate thanks to the SEC 3.3 hardware accelerator. Its dual GbE ports eliminate the need for an external switch IC for 2-port SMB/SOHO routers, while TDM and PCIe expose legacy serial and expansion interfaces for backhaul radios. ECC DDR3 support increases MTBF in carrier-class deployments.
推荐
Print and Imaging Engine Controller
Office multifunction printers and high-speed label printers benefit from the P1021NSN2DFB557's combination of dual 800 MHz cores, USB 2.0 host, and PCIe link to scanner/finisher ASICs. The QE handles legacy parallel data paths, and the integrated SATA via SerDes drives archival storage. With 256 KB L2 ECC cache the part tolerates scan bursts without dropping pages in high-DPI render pipelines.
推荐
Smart Grid Concentrator / Substation Controller
Smart-grid data concentrators aggregate IEC 61850, DNP3, and Modbus traffic from field IEDs. The P1021NSN2DFB557's rugged 0 to 125 C operating range, ECC memory controller for substation noise immunity, and SEC 3.3 encryption engine satisfy IEC 62351 authentication requirements. Dual GbE ports connect to substation LAN-A and LAN-B per IEC 61850-3, while TDM links legacy teleprotection lines.
推荐
Software-Defined Networking Line Card
SDN edge and aggregation line cards use the P1021NSN2DFB557 as a control-plane CPU plus data-plane enforcer for OpenFlow and OVSDB messages. The 800 MHz core runs northbound agents while the QE front-ends legacy serial interfaces. PCIe links the SoC to merchant switch ASICs (QorIQ datapath acceleration); the TEPBGA-689 footprint fits ATCA-style fabric cards with adequate thermal headroom.
推荐
Network-Attached Storage Controller
Small/medium-business NAS appliances from 4 to 12 bays are served by the P1021NSN2DFB557's PCIe x2 lanes, SATA controllers, and dual GbE with link aggregation. The SEC 3.3 engine accelerates AES-NI-equivalent operations for encrypted volume RAID rebuilds. DDR3 ECC protects against bit rot in ZFS/Btrfs deployments, and the 0 to 70 C commercial temperature grade suffices for rack-mounted chassis.
推荐
Medical Imaging Capture Subsystem
Medical imaging sub-systems (endoscopy, ultrasound beamformer hooks, patient monitoring gateways) leverage the P1021NSN2DFB557's dual-core throughput and PCIe to FPGAs handling image pipeline processing. The SEC engine supports HIPAA-compliant encryption for image transport, and DDR3 ECC eliminates memory-induced artifacts in long-running sessions. Industrial temp grade supports field-deployed units.
推荐
推荐产品汇总
工程参考数据： P1021NSN2DFB557 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | P1021NSE2DFB | P1021NXE2DFB | P1022NSN2DFB |
|---|---|---|---|---|
| Package | TEPBGA-689 (31x31) | TEPBGA-689 (31x31) - same | TEPBGA-689 (31x31) - same | TEPBGA-689 (31x31) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Dual-core e500v2 | Dual-core e500v2 | Dual-core e500v2 | Single-core e500v2 |
| Max Core Frequency | 800 MHz | 533/667 MHz | 800 MHz | 667 MHz |
| L2 Cache | 256 KB ECC | 256 KB ECC | 256 KB ECC | 64 KB |
| Core Voltage | 1.0 V (0.95-1.05 V) | 1.0 V | 1.0 V | 1.0 V |
| Gigabit Ethernet | 2 x RGMII | 2 x RGMII | 2 x RGMII | 2 x RGMII |
| PCIe | Gen 1 x1/x2 | Gen 1 x1/x2 | Gen 1 x1/x2 | Gen 1 x1/x2 |
| Temperature Grade | 0 to 125 C (junction) | 0 to 125 C | -40 to 125 C (industrial) | 0 to 125 C |
关键差异点
- 800 MHz dual-core in same TEPBGA-689 as 533 MHz variants （对比 P1021NSE2DFB)
- Industrial temperature grade option available （对比 P1021NXE2DFB)
- 256 KB L2 cache with ECC （对比 P1022NSN2DFB)
- Dual-core throughput （对比 P1013NSN2DFB)
设计说明
Estimated: At Vcore=1.0V with both cores active at 800 MHz and 100% QE utilization, the P1021NSN2DFB557 draws approximately 4-6 W. The TEPBGA-689 exposed pad requires a thermal-via array (typically 4x4 to 6x6 0.3 mm vias with 1 oz copper plating) connecting to an interior copper pour. For sealed enclosures without forced airflow, design a 1 C/W or better heatsink to keep junction temperature below 110 C at ambient +60 C.
Allocate at least four PCB layers with a dedicated ground plane beneath the BGA footprint. The DDR3 interface switches up to 667 MT/s and is highly sensitive to reference-plane discontinuity - route DQ/DQS/MDQS pairs as 100 ohm differential with no more than two vias. Match lengths within 25 mil for byte lanes, and 50 mil across the entire 32-bit bus. Decoupling: place one 0402 100nF X7R per BGA power pin, plus bulk 10uF 0805 near each 1.0V island.
Follow the NXP P1021 Hardware Design Checklist for power sequencing: Vcore must come up before I/O rails, all rails must rise monotonically within 20 ms of the 1.0V core, and POR must deassert only after both 1.0V and 1.5V DDR3 supplies are stable. Use the TPS65251 or TPS51200 as the DDR3 VTT termination generator; VTT must track VDDQ within 50 mV under all load steps. Soft-start ramp rate should not exceed 25 mV/us.
Route GbE RGMII pairs with 100 ohm differential impedance and length-matching within 50 mil (center-to-center) of CLK-to-DATA pairs. RGMII skew between TX/RX paths must be designed for the 2 ns source-synchronous clock; NXP's reference layout uses 4-inch maximum length. Place magnetics and RJ45 within 1 inch of the PHY-side pins; do not split reference planes under the magnetics footprint.
Estimated: PCIe Gen 1 AC-coupling caps (75 nF to 200 nF 0402 X7R) must be on the SoC side of the link. Match TX-RX pairs within 5 mil differential; total skew across 8-bit lanes must be under 30 ps. For USB 2.0, route the 90 ohm differential pair over a continuous ground reference with no splits; place the 15 K pull-up on D+ only after the PHY exits reset.
合规信息
RoHS and REACH compliant per NXP/Freescale product page and DigiKey listing. MSL 3 per JEDEC J-STD-020. AEC-Q100 not qualified - select P1021 automotive variants for vehicle applications. Halogen-free and lead-free reflow to 260 C peak per JESD22-A111.
