P1021NSN2DFB557 - QorIQ P1 2-Core 800MHz SoC | NXP | TEPBGA-689
MPN: P1021NSN2DFB557 ✓ ActiveP1021NSN2DFB557 Overview
The QorIQ P1 platform is a next-generation evolution of NXP's PowerQUICC communications processors. Built on high-performance Power Architecture cores, the P1 series balances compute throughput with power efficiency for embedded networking and industrial control. Within the broader power management and processor taxonomy, the P1021 occupies a slot between general-purpose microcontrollers and high-end communications processors, targeting routed and bridged gateways, network-attached industrial systems, and print/imaging controllers.
Key features include 32KB instruction and 32KB data L1 caches per core, a 256KB unified L2 cache with ECC, hardware-accelerated cryptography (SEC 3.3), and an integrated security engine. The part supports -40C to +125C junction temperature and operates from a 1.0V core supply with a 0.95V to 1.05V tolerance. The TEPBGA-689 package uses a 1.00mm ball pitch and exposes a thermal pad for PCB heat dissipation.
Typical applications include multi-protocol industrial gateways (PROFINET, EtherNet/IP, EtherCAT), networked storage controllers, smart-grid concentrators, software-defined networking line cards, and imaging/print engine controllers. The Quicc Engine offloads serial protocol processing, freeing the e500v2 cores for application-layer stacks, while GbE ports enable line-rate switching and routing.
When designing with this part, allocate at least four PCB layers with dedicated ground planes beneath the BGA footprint to control return paths for the DDR3 interface, which can switch at 667 MT/s. Power supply decoupling requires bulk capacitors near each 1.0V core island plus 0402/0201 ceramic decoupling adjacent to every BGA power pin. JTAG, POR, and reset architecture must follow NXP's hardware design checklist in the reference manual to ensure deterministic boot.
Drop-in alternatives for P1021NSN2DFB557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
P1021NSE2DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1021NXE2DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1022NSN2DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1013NSN2DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSN2DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1021NSN2DFB557 Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | QorIQ P1 |
| Core Architecture | Power Architecture e500v2 (dual-core) |
| Maximum Core Frequency | 800 MHz |
| CPU Cores | 2 |
| Bit Width | 32-bit |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Cache (unified) | 256 KB with ECC |
| Core Supply Voltage | 1.0 V (0.95 V to 1.05 V) |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | 2 x 10/100/1000 Mbps (RGMII) |
| PCI Express | PCIe Gen 1 (x1/x2) |
| USB | USB 2.0 (host/device) |
| Serial Communications | TDM, UART, SPI, I2C |
| Acceleration Engine | Quicc Engine (QE) + SEC 3.3 crypto |
| Package | TEPBGA-689 (31 x 31 mm, 1.00 mm pitch) |
| Operating Temperature | 0 C to 125 C (junction) |
| Mounting Type | Surface Mount, BGA |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | RoHS Compliant |
| Lead Free | Yes |
P1021NSN2DFB557 tepbga-689 (31 x 31 mm, 1.00 mm pitch) Pin Configuration Guide
Pin configuration for P1021NSN2DFB557 (tepbga-689 (31 x 31 mm, 1.00 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1021NSN2DFB557.
Refer to the datasheet for full pin configuration.
Typical Applications
P1021NSN2DFB557 is suitable for 7 applications: Industrial PROFINET / EtherNet/IP Gateway, Multi-Protocol Network Bridge/Router, Print and Imaging Engine Controller, Smart Grid Concentrator / Substation Controller, Software-Defined Networking Line Card, Network-Attached Storage Controller, Medical Imaging Capture Subsystem.
Industrial PROFINET / EtherNet/IP Gateway
The P1021NSN2DFB557's dual e500v2 cores at 800 MHz combined with the Quicc Engine (QE) make it a strong fit for industrial PROFINET, EtherNet/IP, and EtherCAT gateway controllers. The QE offloads serial protocol processing so the application cores run PROFINET-RT stacks above 250 us cycle windows, while the dual GbE MACs bridge to plant-floor backbones. Power dissipation is moderate, typically under 5 W, allowing fanless DIN-rail enclosures.
Recommended
Multi-Protocol Network Bridge/Router
In bridged and routed gateway products the P1021NSN2DFB557 handles simultaneous IPv4/IPv6 forwarding, NAT, and IPSec encryption/decryption at line rate thanks to the SEC 3.3 hardware accelerator. Its dual GbE ports eliminate the need for an external switch IC for 2-port SMB/SOHO routers, while TDM and PCIe expose legacy serial and expansion interfaces for backhaul radios. ECC DDR3 support increases MTBF in carrier-class deployments.
Recommended
Print and Imaging Engine Controller
Office multifunction printers and high-speed label printers benefit from the P1021NSN2DFB557's combination of dual 800 MHz cores, USB 2.0 host, and PCIe link to scanner/finisher ASICs. The QE handles legacy parallel data paths, and the integrated SATA via SerDes drives archival storage. With 256 KB L2 ECC cache the part tolerates scan bursts without dropping pages in high-DPI render pipelines.
Recommended
Smart Grid Concentrator / Substation Controller
Smart-grid data concentrators aggregate IEC 61850, DNP3, and Modbus traffic from field IEDs. The P1021NSN2DFB557's rugged 0 to 125 C operating range, ECC memory controller for substation noise immunity, and SEC 3.3 encryption engine satisfy IEC 62351 authentication requirements. Dual GbE ports connect to substation LAN-A and LAN-B per IEC 61850-3, while TDM links legacy teleprotection lines.
Recommended
Software-Defined Networking Line Card
SDN edge and aggregation line cards use the P1021NSN2DFB557 as a control-plane CPU plus data-plane enforcer for OpenFlow and OVSDB messages. The 800 MHz core runs northbound agents while the QE front-ends legacy serial interfaces. PCIe links the SoC to merchant switch ASICs (QorIQ datapath acceleration); the TEPBGA-689 footprint fits ATCA-style fabric cards with adequate thermal headroom.
Recommended
Network-Attached Storage Controller
Small/medium-business NAS appliances from 4 to 12 bays are served by the P1021NSN2DFB557's PCIe x2 lanes, SATA controllers, and dual GbE with link aggregation. The SEC 3.3 engine accelerates AES-NI-equivalent operations for encrypted volume RAID rebuilds. DDR3 ECC protects against bit rot in ZFS/Btrfs deployments, and the 0 to 70 C commercial temperature grade suffices for rack-mounted chassis.
Recommended
Medical Imaging Capture Subsystem
Medical imaging sub-systems (endoscopy, ultrasound beamformer hooks, patient monitoring gateways) leverage the P1021NSN2DFB557's dual-core throughput and PCIe to FPGAs handling image pipeline processing. The SEC engine supports HIPAA-compliant encryption for image transport, and DDR3 ECC eliminates memory-induced artifacts in long-running sessions. Industrial temp grade supports field-deployed units.
Recommended
Recommended Products Summary
Engineering reference data for P1021NSN2DFB557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1021NSE2DFB | P1021NXE2DFB | P1022NSN2DFB |
|---|---|---|---|---|
| Package | TEPBGA-689 (31x31) | TEPBGA-689 (31x31) - same | TEPBGA-689 (31x31) - same | TEPBGA-689 (31x31) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Dual-core e500v2 | Dual-core e500v2 | Dual-core e500v2 | Single-core e500v2 |
| Max Core Frequency | 800 MHz | 533/667 MHz | 800 MHz | 667 MHz |
| L2 Cache | 256 KB ECC | 256 KB ECC | 256 KB ECC | 64 KB |
| Core Voltage | 1.0 V (0.95-1.05 V) | 1.0 V | 1.0 V | 1.0 V |
| Gigabit Ethernet | 2 x RGMII | 2 x RGMII | 2 x RGMII | 2 x RGMII |
| PCIe | Gen 1 x1/x2 | Gen 1 x1/x2 | Gen 1 x1/x2 | Gen 1 x1/x2 |
| Temperature Grade | 0 to 125 C (junction) | 0 to 125 C | -40 to 125 C (industrial) | 0 to 125 C |
Key Differentiators
- 800 MHz dual-core in same TEPBGA-689 as 533 MHz variants (vs P1021NSE2DFB)
- Industrial temperature grade option available (vs P1021NXE2DFB)
- 256 KB L2 cache with ECC (vs P1022NSN2DFB)
- Dual-core throughput (vs P1013NSN2DFB)
Design Notes
Estimated: At Vcore=1.0V with both cores active at 800 MHz and 100% QE utilization, the P1021NSN2DFB557 draws approximately 4-6 W. The TEPBGA-689 exposed pad requires a thermal-via array (typically 4x4 to 6x6 0.3 mm vias with 1 oz copper plating) connecting to an interior copper pour. For sealed enclosures without forced airflow, design a 1 C/W or better heatsink to keep junction temperature below 110 C at ambient +60 C.
Allocate at least four PCB layers with a dedicated ground plane beneath the BGA footprint. The DDR3 interface switches up to 667 MT/s and is highly sensitive to reference-plane discontinuity - route DQ/DQS/MDQS pairs as 100 ohm differential with no more than two vias. Match lengths within 25 mil for byte lanes, and 50 mil across the entire 32-bit bus. Decoupling: place one 0402 100nF X7R per BGA power pin, plus bulk 10uF 0805 near each 1.0V island.
Follow the NXP P1021 Hardware Design Checklist for power sequencing: Vcore must come up before I/O rails, all rails must rise monotonically within 20 ms of the 1.0V core, and POR must deassert only after both 1.0V and 1.5V DDR3 supplies are stable. Use the TPS65251 or TPS51200 as the DDR3 VTT termination generator; VTT must track VDDQ within 50 mV under all load steps. Soft-start ramp rate should not exceed 25 mV/us.
Route GbE RGMII pairs with 100 ohm differential impedance and length-matching within 50 mil (center-to-center) of CLK-to-DATA pairs. RGMII skew between TX/RX paths must be designed for the 2 ns source-synchronous clock; NXP's reference layout uses 4-inch maximum length. Place magnetics and RJ45 within 1 inch of the PHY-side pins; do not split reference planes under the magnetics footprint.
Estimated: PCIe Gen 1 AC-coupling caps (75 nF to 200 nF 0402 X7R) must be on the SoC side of the link. Match TX-RX pairs within 5 mil differential; total skew across 8-bit lanes must be under 30 ps. For USB 2.0, route the 90 ohm differential pair over a continuous ground reference with no splits; place the 15 K pull-up on D+ only after the PHY exits reset.
Compliance Information
RoHS and REACH compliant per NXP/Freescale product page and DigiKey listing. MSL 3 per JEDEC J-STD-020. AEC-Q100 not qualified - select P1021 automotive variants for vehicle applications. Halogen-free and lead-free reflow to 260 C peak per JESD22-A111.
