P1022NSN2EFB - QorIQ Dual-Core e500v2 MPU 1.055GHz | NXP
料号： P1022NSN2EFB ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $74.2 | $742.00 |
| 100 | $68.9 | $6,890.00 |
| 500 | $62.4 | $31,200.00 |
| 1,000 | $55.8 | $55,800.00 |
P1022NSN2EFB 概述
A microprocessor is an integrated circuit that fetches, decodes, and executes instructions of a stored program; in embedded systems it typically combines one or more CPU cores with on-chip peripherals to form a complete application processor or SoC. The QorIQ P1 series from NXP sits in the hierarchy: embedded MPU -> communications processor -> Power Architecture SoC -> QorIQ platform -> NXP networking portfolio, succeeding the legacy PowerQUICC III family and targeting mid-range routers, switches, and industrial control.
Key features include 1.055 GHz core frequency, dual e500v2 cores with MMU and double-precision FPU, hardware ECC for DDR2/DDR3 memory, integrated SEC (security engine), four 10/100/1000 Ethernet MACs, two PCIe controllers, USB 2.0 host/device, SD/MMC, SPI, I2C, UART, and an LCD controller supporting up to 1280x1024 resolution. Industrial temperature range is 0C to 105C per the trailing "EFB" speed-grade code, and the device operates from 1.5V/1.8V/2.5V/3.3V supplies.
The architecture combines out-of-order dual-issue cores with the DPAA-style peripheral set and a high-bandwidth interconnect that sustains multi-Gbps packet throughput while running control-plane software. The hardware security block accelerates IPsec, SSL/TLS, and bulk crypto, offloading the cores for data-plane tasks.
Typical applications include industrial Ethernet routers, fanless industrial gateways, smart-grid concentrators, factory-automation controllers, networked printers, defense radios, and embedded vision systems. Drop-in deployment is enabled because the device ships in the only 689-pin TEPBGA package used across the P1022/P1013 family, allowing PCB reuse when moving between speed grades and core counts.
When designing with this MPU, pay close attention to DDR3 trace length matching, the SEC engine firmware dependencies, and the thermal envelope: at full 1.055 GHz dual-core load with 1.5V core, the device can dissipate several watts, so a 4-layer minimum PCB with a ground flood under the BGA is required.
This page consolidates distributor pricing, same-package drop-in alternatives across the QorIQ P1 family (P1013 single-core variant and P1022 speed grades), and application-level guidance not found in the standalone manufacturer datasheet.
直接替换替代料： P1022NSN2EFB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： P1022NSN2EFB （相同外形与封装尺寸） ——差异在于 Ethernet, Memory Controller, Security Engine, USB, LCD Controller.
快速对比工具——选择替代料号进行并排对比：
P1013NSE2EFB
✅ 直接替换✓ 有现货
$68.4 / 个
查看数据手册 →P1022NSE2EFB
✅ 直接替换📋 参考替代料（不在目录中）
P1013NSN2HFB
✅ 直接替换📋 参考替代料（不在目录中）
P1022NSE2HFB
✅ 直接替换✓ 有现货
$75 / 个
查看数据手册 →P1022NSN2EFB 最大额定值与电气特性
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P1 |
| Processor Type | PowerPC e500v2 MPU |
| Core Count | 2 (Dual-core) |
| Core Architecture | 32-bit Power Architecture |
| Maximum Core Frequency | 1.055 GHz |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | 2x 10/100/1000 MAC (RGMII) |
| PCIe | 2x PCIe controllers |
| USB | USB 2.0 host/device |
| LCD Controller | Yes (up to 1280x1024) |
| Security Engine | SEC (IPsec, SSL/TLS, 3DES, AES) |
| 电源电压 | 1.5V (core) / 1.8V / 2.5V / 3.3V |
| 工作温度 | 0C to 105C |
| 封装 | 689-TEPBGA II (31x31 mm) |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
| Lead Free | Yes |
P1022NSN2EFB 689-tepbga ii (31x31 mm) 引脚配置指南
P1022NSN2EFB（689-tepbga ii (31x31 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： P1022NSN2EFB.
请参阅 数据手册 以查看完整引脚配置。
典型应用
P1022NSN2EFB 适用于 6 应用s: Industrial Ethernet Router, Industrial Gateway / IoT Edge Controller, Network-Attached Storage (NAS) Controller, Smart Meter Concentrator / Substation Controller, Networked Printer / MFP Controller, Defense / Rugged Communications Radio.
Industrial Ethernet Router
The P1022NSN2EFB is well-suited to industrial Ethernet routers and cellular gateways. Its dual 10/100/1000 MACs with RGMII directly connect to PHY or SFP transceivers for two WAN/LAN ports, while the SEC engine offloads IPsec/SSL to maintain line-rate throughput. The 0C-105C operating range and hardware ECC memory controller support fanless enclosures in factory floors, substations, and outdoor cabinets. Typical routing software (Linux iproute2, VyOS, or VxWorks networking stack) runs comfortably on the dual 1.055 GHz e500v2 cores, sustaining gigabit packet processing for SMB and SCADA networks.
推荐
Industrial Gateway / IoT Edge Controller
For IIoT gateways and edge controllers, the P1022NSN2EFB provides a rugged processing platform combining dual-core compute, deterministic real-time response, and multi-protocol connectivity. The USB 2.0 host connects to Wi-Fi/4G modules, the two PCIe lanes attach to Wi-Fi 6 or 5G modems, and the LCD controller drives a local HMI display up to 1280x1024. With operating temperature 0C to 105C and hardware ECC memory, it tolerates harsh factory environments while running edge-analytics workloads in containerized or bare-metal deployments using NXP's QorIQ SDK.
推荐
Network-Attached Storage (NAS) Controller
The P1022NSN2EFB can serve as the main processor in small-form-factor NAS appliances for SMB markets. The dual Gigabit Ethernet ports enable link aggregation to the home/SMB network, while SATA ports (via PCIe-SATA bridge) attach multiple 3.5-inch HDDs. The 1.055 GHz dual-core CPU and hardware SEC engine accelerate software RAID parity calculations and SMB/NFS protocol encryption overhead, delivering usable throughput for 2-bay to 4-bay RAID-5 systems at gigabit speeds. The DDR3 ECC controller protects bit-rot in long-term archival workloads.
推荐
Smart Meter Concentrator / Substation Controller
Smart-meter data concentrators and distribution automation units benefit from the P1022NSN2EFB's industrial temperature support and hardware security. The dual-core e500v2 architecture handles parallel processing of metering data streams (DLMS/COSEM, IEC 61850) and the SEC engine accelerates MAC authentication for grid security. Multiple UART/SPI/I2C buses connect to metrology front-ends and down-line PLC modems, while the LCD controller drives the local operator panel. The 689-TEPBGA II package and 0C-105C temperature support meet IEC 61850-3 environmental requirements for substation deployments.
推荐
Networked Printer / MFP Controller
Multifunction printer (MFP) controllers benefit from the P1022NSN2EFB's dual-core architecture: one core handles the networking/IP stack (TCP/IP, LPD, IPP, SMB) while the other drives the print engine and scanner control. The two Gigabit Ethernet ports enable daisy-chain network topologies common in office deployments, and the USB 2.0 host connects to Wi-Fi modules, NFC readers, or external storage. The LCD controller directly drives the front-panel display up to 1280x1024, eliminating the need for a separate graphics controller ASIC in mid-range office MFPs.
推荐
Defense / Rugged Communications Radio
Ruggedized tactical radios and military mesh-network nodes leverage the P1022NSN2EFB's hardware SEC engine, wide temperature range, and Power Architecture determinism. The SEC engine accelerates AES-256 and SHA-256 for LINK-16 / tactical-radio encryption, while the dual 1.055 GHz e500v2 cores sustain real-time software-defined-radio (SDR) baseband processing at modest bandwidths. ECC-protected DDR3 is essential for field reliability where single-event upsets are a concern. Package compatibility with P1013 single-core enables a common PCB across 1-core and 2-core radio variants.
推荐
推荐产品汇总
工程参考数据： P1022NSN2EFB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | P1013NSE2EFB | P1022NSE2EFB | P1013NSN2HFB | P1022NSE2HFB |
|---|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 (dual-core e500v2) | 1 (single-core e500v2) | 2 (dual-core e500v2) | 1 (single-core e500v2) | 2 (dual-core e500v2) |
| Core Frequency | 1.055 GHz | 1.055 GHz | 1.055 GHz | 600 MHz typical | 1.055 GHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Operating Temperature | 0C to 105C (EFB grade) | 0C to 105C (EFB grade) | 0C to 105C (EFB grade) | Extended (HFB grade) | Extended (HFB grade) |
| Gigabit Ethernet | 2x 10/100/1000 MAC | 2x 10/100/1000 MAC | 2x 10/100/1000 MAC | 2x 10/100/1000 MAC | 2x 10/100/1000 MAC |
| PCIe Lanes | 2x PCIe | 2x PCIe | 2x PCIe | 2x PCIe | 2x PCIe |
| Lifecycle Status | Last Time Buy (EOL) | Active or EOL per NXP PCN | Active or EOL per NXP PCN | Active or EOL per NXP PCN | Active or EOL per NXP PCN |
关键差异点
- Dual-core e500v2 at 1.055 GHz with hardware SEC engine （对比 P1013NSE2EFB)
- Industrial temperature range 0C to 105C （对比 P1022NSE2HFB)
- DDR2/DDR3 controller with ECC on all addresses （对比 P1013 family)
设计说明
Estimated: At 1.5V core supply and full 1.055 GHz dual-core load with all peripherals enabled, power dissipation typically reaches 3-5W. A 4-layer PCB with continuous copper flood under the 689-TEPBGA II land pattern and at least 25x25 mm of top-layer copper is required to keep junction temperature below 105C. Above 70C ambient, forced airflow or heatsink attachment is recommended.
The DDR3 data, address, and control traces must be length-matched within 25 mil across all 8/16-bit lanes. Differential clocks must be routed as 100-ohm differential pairs. Use 4.7k-10k pull-ups on I2C and 33 ohm series terminators on high-speed RGMII/PCIe lines. The 689-TEPBGA II requires microvia or via-in-pad PCB technology for the inner balls - standard 8-mil drills do not fit.
Do not confuse the EFB (0C-105C, standard industrial) speed-grade with the HFB (extended temperature) variant - they appear identical in datasheets but the HFB die revision has different thermal derating curves. Also, the SEC crypto engine requires NXP-distributed firmware blobs that cannot be redistributed as source; license them through NXP directly, not third parties.
Place the DDR3 memory chips within 25mm of the BGA to minimize reflection and skew. Decouple the 1.5V core supply with 10x 22uF ceramic caps + 1x 470uF bulk cap located directly under the package. Keep analog ground (for Ethernet PHY) separated from digital ground with a single-point stitch near the BGA substrate.
合规信息
RoHS compliant per distributor data. AEC-Q100 is not applicable - this is not an automotive-qualified part. Halogen-free status not explicitly stated in retrieved data.
