P2010NXE2KHC - QorIQ P2 1-Core 1.2GHz Power Arch SoC | NXP
料号： P2010NXE2KHC ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 50 | $148 | $7,400.00 |
| 100 | $132 | $13,200.00 |
| 500 | $118 | $59,000.00 |
P2010NXE2KHC 概述
What is a QorIQ communications processor? QorIQ is NXP's portfolio of high-performance Power Architecture system-on-chip (SoC) devices designed for networking, industrial, and aerospace applications. Within that hierarchy, the QorIQ P2 tier sits above the value-tier P1 family and below the higher-end P3/P4/P5 families. The P2 tier integrates one or two e500v2 cores with a complete I/O subsystem (DDR2/3, GbE, PCIe, SRIO, USB, SEC, QUICC Engine), so it functions as a self-contained communications processor - not a general-purpose microcontroller.
Key features of the P2010NXE2KHC include 32 KB I-cache and 32 KB D-cache per core, double-cache supporting on-chip memory subsystem, integrated security engine (SEC) for IPSec / SSL / TLS / SRTP acceleration, four GbE MACs, two PCIe controllers, two Serial RapidIO (SRIO) ports, USB 2.0 with ULPI interface, DDR2/DDR3 memory controller with ECC, and the QUICC Engine subsystem for legacy serial protocols. The 45 nm process technology provides high performance per watt, which was a differentiator versus the older 65 nm PowerQUICC III devices.
Architecturally, the P2010 implements a single e500v2 core with Book E instruction support, dual-issue superscalar pipeline, and hardware MMU, paired with NXP's CoreNet fabric and platform peripherals shared across the P1/P2/P3 families. The SEC engine accelerates bulk crypto and public-key operations; the QUICC Engine handles HDLC, UART, and BISYNC. Performance scales with frequency selection and operating-system configuration; the P2010NXE2KHC specifically targets 1000/800 MHz industrial grade workloads.
Typical applications for this part include industrial routers and protocol converters, factory automation controllers, aerospace flight-control and avionics networking, secure VPN/firewall platforms using the integrated SEC engine, substation communications equipment, and base-station control-plane processors. It is also used in long-life-cycle industrial gateways where the -40C to +125C extended temperature range is mandatory.
When designing with this part, plan for the full TEPBGA II substrate footprint, which requires microvia PCB technology for routing inner balls, plus a multi-rail power tree (Vcore, VDD, SerDes supplies, DDR I/O). Decoupling follows the manufacturer's reference design; the device is not a hobbyist-friendly part. Use NXP's CodeWarrior or the latest Linux SDK toolchain.
This page synthesizes distributor pricing, NXP lifecycle data, and pin-compatible QorIQ platform alternatives (P1010/P1011/P1013/P2020) into one decision-ready view that the manufacturer datasheet and individual distributor listings do not provide on their own.
直接替换替代料： P2010NXE2KHC ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： P2010NXE2KHC （相同外形与封装尺寸） ——差异在于 Core Architecture, Ethernet, Memory Controller, Operating Temperature, PCI Express.
快速对比工具——选择替代料号进行并排对比：
P2010NXN2KHC
✅ 直接替换📋 参考替代料（不在目录中）
P2020NXE2KHC
✅ 直接替换📋 参考替代料（不在目录中）
P2020NXE2HHC
✅ 直接替换✓ 有现货
$192.4 / 个
查看数据手册 →P1011NXN2HFB
✅ 直接替换📋 参考替代料（不在目录中）
P1013NXN2HFB
✅ 直接替换📋 参考替代料（不在目录中）
P1014NXN2HFB
✅ 直接替换📋 参考替代料（不在目录中）
P2010NXE2KHC 最大额定值与电气特性
| Product Family | QorIQ P2 |
| Core Architecture | Power Architecture e500v2 (Book E) |
| Number of Cores | 1 |
| Maximum Core Frequency | 1.2 GHz (1000/800 MHz core grades) |
| Core Voltage | 1.05 V |
| Process Technology | 45 nm |
| Instruction Set | Power Architecture Book E, FPU, MMU |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Quad GbE MAC |
| PCI Express | 2 x PCIe controllers |
| Serial RapidIO (SRIO) | 2 ports |
| USB | USB 2.0 (ULPI interface) |
| Security Engine (SEC) | Yes - IPSec/SSL/TLS/SRTP acceleration |
| 封装 | 689-TEPBGA II (31x31 mm) |
| 工作温度 | -40C to +125C (Extended) |
| 安装类型 | Surface Mount (BGA) |
| 生命周期状态 | Last Time Buy (per NXP discontinuance notice) |
P2010NXE2KHC 689-tepbga ii (31x31 mm) 引脚配置指南
P2010NXE2KHC（689-tepbga ii (31x31 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： P2010NXE2KHC.
请参阅 数据手册 以查看完整引脚配置。
典型应用
P2010NXE2KHC 适用于 6 应用s: Industrial Secure VPN Router, Substation Communications Gateway, Aerospace Avionics Networking, Base Station Control-Plane Processor, Industrial Protocol Converter, Defense Ruggedized Firewall.
Industrial Secure VPN Router
The P2010NXE2KHC's integrated Security Engine (SEC) accelerates IPSec, SSL, and TLS at line rates, while four integrated GbE MACs handle multiple WAN/LAN segments. Its -40C to +125C extended temperature range suits DIN-rail cabinet and outdoor installations. With 1.0/0.8 GHz e500v2 performance, the part can run a hardened Linux router stack with crypto offload - better fit than the P1011 (no SEC engine) and lower power than the dual-core P2020.
推荐
Substation Communications Gateway
The P2010NXE2KHC's QUICC Engine subsystem handles legacy serial protocols like HDLC and BISYNC found in IEC 61850 substations, while GbE and PCIe support modern SCADA uplinks. The 45 nm process keeps power low for sealed, fanless enclosures, and the extended -40C to +125C temperature range survives substation ambient. Combined with the SEC engine, the chip supports secure remote-management firmware signing on the same die - ideal for IEC 62443 compliance.
推荐
Aerospace Avionics Networking
In avionics networks, the P2010NXE2KHC's two Serial RapidIO (SRIO) ports, two PCIe lanes, and four GbE MACs enable redundant 10/100/1000 fabric connectivity required by ARINC 664 / AFDX. The extended -40C to +125C temperature range is required for DO-160G environments, and the SEC engine ensures data-plane integrity. The 689-TEPBGA II package is suitable for ruggedized board layouts with underfilled ball attach.
推荐
Base Station Control-Plane Processor
The P2010NXE2KHC is well-suited as a control-plane co-processor in LTE/5G small-cell base stations, where its 1.0/0.8 GHz e500v2 core runs real-time OAM and network-management stacks. The PCIe controller interfaces to a separate baseband DSP or SoC, while the GbE and SRIO ports backhaul the management plane. The SEC engine accelerates IPsec on the OAM plane - a cleaner fit than a general-purpose ARM microcontroller lacking SRIO.
推荐
Industrial Protocol Converter
Protocol converters (Modbus to IEC 61850, Profibus to EtherCAT, etc.) need deterministic serial handling plus Ethernet/IP routing - exactly what the P2010NXE2KHC's QUICC Engine plus GbE deliver. The single-core 1.0/0.8 GHz e500v2 handles real-time protocol translation, while the SEC engine authenticates field devices. The extended temperature range eliminates fans in cabinets, and the DDR2/DDR3 controller with ECC protects configuration data.
推荐
Defense Ruggedized Firewall
The P2010NXE2KHC's integrated SEC engine performs hardware-accelerated IPSec and SSL inspection at multi-Gbps, while the four GbE ports segregate trusted and untrusted zones. Its extended temperature range meets MIL-STD-810 ambient requirements, and the 689-TEPBGA II package is well-suited to ruggedized PCB stack-ups with underfilled BGA attachment. Single-core 1.0/0.8 GHz performance is adequate for firewall throughput at edge-class link speeds.
推荐
推荐产品汇总
工程参考数据： P2010NXE2KHC ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | P2010NXN2KHC | P2020NXE2KHC | P2020NXE2HHC | P1011NXN2HFB | P1013NXN2HFB | P1014NXN2HFB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Number of Cores | 1 | 1 | 2 | 2 | 1 | 1 | 1 |
| Maximum Core Frequency | 1.2 GHz (1000/800 MHz grades) | 1.2 GHz | 1.2 GHz dual-core | 1.33 GHz dual-core | 800 MHz | 1.0 GHz | 1.0 GHz |
| Core Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.0 V | 1.0 V | 1.0 V |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | No | No | Yes |
| Operating Temperature | -40C to +125C (Extended) | 0C to +105C (Commercial) | -40C to +125C (Extended) | -40C to +125C (Extended) | 0C to +105C (Commercial) | 0C to +105C (Commercial) | -40C to +105C (Industrial) |
| Pin Compatibility | QorIQ P1/P2 689-TEPBGA II | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) | Drop-in (same ball map) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
关键差异点
- Single-core 1.0/0.8 GHz e500v2 with SEC engine and extended temperature range （对比 P1011NXN2HFB)
- Pin-compatible path to dual-core performance upgrade （对比 P2020NXE2KHC)
- 45 nm power-efficient QorIQ platform （对比 P1011NXN2HFB)
设计说明
The 689-TEPBGA II package requires thermal management at 1.2 GHz. Recommended: a 4-6 layer PCB with a copper ground/power plane beneath the die, plus 4-8 thermal vias in the central ball-grid region. For sealed industrial enclosures, derate Tj below 110C to maintain long-term reliability over the -40C to +125C ambient range. Use NXP's reference thermal model to estimate theta_JA for your stack-up.
The 689-ball TEPBGA II uses a 1.0 mm pitch ball array requiring microvia (laser-drilled) PCB technology for inner rows. Stack-up: minimum 6 layers with dedicated GND/PWR planes between the BGA and DDR routing. Match trace lengths for DDR2/DDR3 within +/- 25 mil and SerDes within +/- 2 mil to meet the 5 Gbps SRIO and 2.5 Gbps SerDes jitter budgets per the manufacturer datasheet.
The P2010NXE2KHC requires multiple supply rails: 1.05 V Vcore (up to 4-5 A peak), 1.0/1.5/1.8 V for DDR, 2.5 V for SerDes analog, 3.3 V for I/O, and PLL supplies. Use NXP's recommended PMIC (e.g., MMPF0100) for power sequencing - do NOT power-up Vcore before SerDes. Decoupling requires 0.1 uF + 1 uF + 10 uF ceramic caps within 5 mm of each supply ball per the manufacturer design checklist.
Do not assume any 689-TEPBGA II QorIQ part is pin-compatible without checking the part-number suffix. The P1 family and P2 family share the footprint, but P3/P4/P5 families do not. Also verify boot-mode configuration pins (cfg_rcw_src) against the part's reference manual - some P1 vs P2 variants differ in reset configuration word pin assignments. Consult the manufacturer datasheet's pin-compatibility matrix before PCB revision.
SerDes lanes (SRIO, PCIe, GbE) are length-matched but MUST NOT cross over or run parallel to noisy signals (DDR, switching supplies). Route SerDes on the top layer with a continuous GND reference plane below. Keep AC coupling capacitors within 4 mm of the device balls. Follow the manufacturer's hardware design guide (AN3944) for layer stack-up and impedance targets.
合规信息
RoHS compliant per NXP product environmental compliance information. AEC-Q100 is not applicable - this is a communications processor, not an automotive IC. Conflict-minerals compliance verified via NXP's CMRT filings.
