P5010NXE1TNB - QorIQ 64-Bit Power Arch SoC 2.0GHz | NXP
料号： P5010NXE1TNB ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $532.96 | $532.96 |
| 10 | $515 | $5,150.00 |
| 100 | $478 | $47,800.00 |
| 500 | $442 | $221,000.00 |
| 1,000 | $410 | $410,000.00 |
P5010NXE1TNB 概述
A microprocessor (MPU) is an integrated circuit that executes instructions fetched from memory and serves as the central processing unit of an embedded system. Within the MPU taxonomy, the P5010 belongs to the Power Architecture e5500 family, which in turn fits into the broader categories of embedded processor -> application-specific SoC -> communications processor. This hierarchy matters because QorIQ SoCs target networking, telecom, and industrial infrastructure rather than general-purpose PCs.
Key features of the P5010NXE1TNB include 64-bit Power Architecture e5500 processing at 2.0 GHz with out-of-order execution, integrated DDR3/DDR3L memory controller with ECC support, multiple high-speed serial interfaces (PCIe, SRIO, GbE), hardware-accelerated cryptography via SEC, and an extended operating temperature range of -40C to +105C. The -NXE1 suffix specifically denotes the extended-temperature grade with encryption enabled, while the TNB suffix indicates a specific speed/revision stepping per NXP ordering information.
Architecturally, the e5500 core combines dual-issue out-of-order pipelines with a high-bandwidth CoreNet coherency fabric, allowing tight integration with companion QorIQ chips for symmetric multiprocessing. Compared with the dual-core P5020, the P5010 is the single-core variant with lower power dissipation at the cost of throughput in heavily multi-threaded workloads.
Typical applications for the P5010NXE1TNB include wired and wireless base station controllers, industrial routers and gateways, network-attached storage (NAS), telecom edge platforms, and secure communications appliances. Engineers select this part when extended-temperature operation, integrated hardware security, and the QorIQ ecosystem (Linux BSP, CodeWarrior tools) are required in a single SoC.
When designing with the P5010NXE1TNB, plan the PCB layout around the 37.5 mm FCPBGA substrate first - a 6+ layer board with HDI microvias is typically required. Pay close attention to DDR3 trace matching, SerDes reference clock jitter, and thermal dissipation: even at single-core the SoC can dissipate in the high single-digit watts under sustained load, demanding a solid ground/power plane strategy.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： P5010NXE1TNB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： P5010NXE1TNB （相同外形与封装尺寸） ——差异在于 Core Architecture, Memory Controller, Mounting Type, Package, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
P5020NXE1TNB
✅ 直接替换✓ 有现货
$285 / 个
查看数据手册 →P5010NSN1TNB
✅ 直接替换✓ 有现货
$295.75 / 个
查看数据手册 →P5010NXE1NQB
✅ 直接替换📋 参考替代料（不在目录中）
P5010NXN1TNB
✅ 直接替换✓ 有现货
$296.54 / 个
查看数据手册 →P5010NXE1TNB 最大额定值与电气特性
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P5 |
| Core Architecture | PowerPC e5500 (64-bit) |
| Number of Cores | 1 |
| Operating Frequency | 2.0 GHz |
| Memory Controller | DDR3 / DDR3L with ECC |
| Serial Interfaces | PCIe, SRIO, GbE |
| Hardware Acceleration | SEC (cryptography) |
| 工作温度 | -40 to +105 C |
| 封装 | 1295-FCPBGA (37.5 x 37.5 mm) |
| 安装类型 | Surface Mount (BGA) |
| Moisture Sensitivity Level | 3 |
| Terminal Form | Ball |
| Number of Terminals | 1295 |
| Package Code | HBGA (FCBGA) |
P5010NXE1TNB hbga (fcbga) 引脚配置指南
P5010NXE1TNB（hbga (fcbga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： P5010NXE1TNB.
请参阅 数据手册 以查看完整引脚配置。
典型应用
P5010NXE1TNB 适用于 6 应用s: Wireless Base Station Controllers, Industrial Routers and Gateways, Network-Attached Storage (NAS), Telecom Edge Platforms, Secure Communications Appliances, Single-Board Computing Platforms.
Wireless Base Station Controllers
The P5010NXE1TNB's -40C to +105C extended-temperature rating and 64-bit Power Architecture e5500 core make it ideal for outdoor base station controllers and small-cell baseband processing. Its integrated DDR3 with ECC, multiple GbE interfaces, and PCIe lanes handle backhaul traffic to the core network, while SEC acceleration secures IPsec tunnels. The single-core variant balances cost and performance for distributed radio heads that do not require multi-core scaling.
推荐
Industrial Routers and Gateways
Industrial routers benefit from the P5010NXE1TNB's combination of GbE, PCIe, and SRIO interfaces plus its ruggedized temperature range. The SoC handles routing protocol processing, VPN tunnel establishment, and firewall packet inspection while drawing moderate power. Hardware-accelerated SEC delivers line-rate IPsec throughput, freeing the e5500 core for routing table lookups and management functions.
推荐
Network-Attached Storage (NAS)
In NAS controllers, the P5010NXE1TNB provides enough single-thread performance for file system metadata operations, RAID management, and iSCSI/NFS protocol handling. The DDR3 controller with ECC protects against silent data corruption, while PCIe expansion connects to SATA/SAS host bus adapters or NVMe drives. SEC acceleration protects encrypted volumes and secures SMB3/AES traffic between the NAS and clients.
推荐
Telecom Edge Platforms
Telecom edge platforms and SD-WAN appliances use the P5010NXE1TNB as a control-plane and security coprocessor. The combination of GbE, PCIe, and SRIO allows multiple network interfaces and accelerator cards to be attached, while hardware SEC handles site-to-site IPsec at line rate. Extended-temperature operation supports both indoor and outdoor edge cabinets deployed across the cellular network.
推荐
Secure Communications Appliances
Hardware-accelerated SEC on the P5010NXE1TNB accelerates AES, RSA, and ECC operations for VPN concentrators and encrypted communication gateways. Combined with the e5500 core running Linux, the SoC handles management plane, key exchange, and tunnel establishment while the SEC block sustains cryptographic throughput. Extended-temperature support allows deployment in roadside, rail-side, or industrial cabinets.
推荐
Single-Board Computing Platforms
Embedded SBCs and VPX boards use the P5010NXE1TNB as the primary SoC on carrier-grade blades. The FCPBGA-1295 package is suited for the 6U or 3U VPX form factor, with PCIe and SRIO enabling backplane connectivity to neighboring compute and I/O cards. The extended temperature grade suits avionics, defense, and railway applications where commercial processors fail environmental qualification tests.
推荐
推荐产品汇总
工程参考数据： P5010NXE1TNB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | P5020NXE1TNB | P5010NSN1TNB | P5010NXE1NQB | P5010NXN1TNB |
|---|---|---|---|---|---|
| Package | 1295-FCPBGA (37.5x37.5) | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Number of Cores | 1 | 2 | 1 | 1 | 1 |
| Operating Frequency | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz | 2.0 GHz |
| Operating Temperature | -40 to +105 C (extended) | -40 to +105 C (extended) | 0 to +105 C (commercial) | -40 to +105 C (extended) | -40 to +105 C (extended) |
| Hardware Encryption (SEC) | Enabled | Enabled | Enabled | Enabled | Disabled |
| Memory Controller | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC |
| Serial Interfaces | PCIe, SRIO, GbE | PCIe, SRIO, GbE | PCIe, SRIO, GbE | PCIe, SRIO, GbE | PCIe, SRIO, GbE |
关键差异点
- Single-core lower power vs dual-core at same package （对比 P5020NXE1TNB)
- Encryption-enabled at extended temperature （对比 P5010NSN1TNB)
- SEC-enabled vs SEC-disabled （对比 P5010NXN1TNB)
- Tray-friendly QorIQ in a mature family （对比 T2080NXE8TNB)
设计说明
Estimated: the 1295-FCPBGA package at 37.5 x 37.5 mm has a ball pitch of approximately 1.0 mm, demanding an 8+ layer PCB with HDI microvia-in-pad technology for breakout routing. Use NXP's substrate layout guidelines for the FCPBGA-1295 and ensure controlled-impedance routing (typically 50 ohm single-ended, 100 ohm differential) on PCIe, SRIO, and DDR3 traces. Ground and power planes must be solid under the SoC footprint to provide low-impedance return paths.
Estimated: even a single-core P5010 at 2.0 GHz can dissipate 8-12 W sustained under networking workloads, depending on SerDes utilization and SEC load. A heat spreader or forced-air cooling is required in most deployment scenarios. Thermal design must keep junction temperature below 105 C (the upper operating limit); consult NXP's thermal model documents for the specific FCPBGA-1295 substrate theta_JA. Plan a heatsink mounting strategy that does not induce mechanical stress on the BGA.
PCIe and SRIO SerDes lanes require strict length matching within tight tolerances (typically within 5 mil on intra-pair and 10 mil on inter-pair). Reference clock jitter must stay below the SerDes specification; a high-quality clock generator is mandatory. DDR3 routing must follow the fly-by topology with VTT termination, and address/command lines should be routed on inner layers with reference planes to minimize crosstalk. NXP's hardware specifications document provides detailed routing guidelines.
Do not confuse the 'NXE' (extended-temperature, encryption enabled) with 'NXN' (extended-temperature, encryption disabled) - the latter ships with the SEC block disabled in fuses and cannot be retrofitted. Verify the temperature grade matches your deployment environment before ordering: P5010NSN is commercial-grade and will fail in outdoor installations. Always use the official NXP DDR3 calibration procedure during board bring-up; do not rely on auto-calibration alone for ECC initialization.
合规信息
RoHS, REACH, lead-free, and halogen-free status are not explicitly stated in the verified web data; AEC-Q100 is not applicable to communications SoCs in this class. NXP publishes a product-compliance certificate per part number through its support portal; engineers should consult the certificate-of-conformance document for the specific manufacturing lot.
