PIC16LF1518-I/ML - 28KB Flash 8-Bit MCU, 20MHz | Microchip
料号： PIC16LF1518-I/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.74 | $1.74 |
| 10 | $1.56 | $15.60 |
| 100 | $1.32 | $132.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $1.05 | $1,050.00 |
PIC16LF1518-I/ML 概述
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, integrating CPU, RAM, non-volatile program memory, and peripherals on one die. Within the semiconductor taxonomy, an MCU sits under embedded processors, itself a branch of digital logic ICs. The PIC16F family uses a Harvard architecture with separate program and data buses, enabling single-cycle instruction execution for predictable timing in real-time control applications where deterministic latency matters more than raw throughput.
Key features of the PIC16LF1518-I/ML include: 28KB Flash for application code, 1024B SRAM for runtime variables, a 17-channel 10-bit ADC with internal voltage reference, two 8-bit timers (TMR0/TMR2), one 16-bit timer (TMR1), an extended WDT, and 25mA source/sink current per I/O pin. The integrated ICSP and ICD interfaces allow field-upgradeable firmware and real-time in-circuit debugging without removing the MCU from the PCB.
The PIC16LF1518 architecture uses a RISC-style instruction set with 49 instructions, most executing in one instruction cycle. Microchip's eXtreme Low Power (XLP) technology implements Run, Idle, and Sleep modes plus a programmable Ultra Low-Power Brown-Out Reset (ULPBOR), allowing microamp-range Sleep current critical for battery-powered and energy-harvesting designs.
Typical applications include low-power IoT sensor nodes, consumer remote controls, small appliances, industrial sensor signal conditioning, white-goods motor control, and portable medical devices where low quiescent current extends battery life. The 6x6 mm QFN footprint suits space-constrained PCB layouts.
When designing with this part, ensure the QFN exposed thermal pad is soldered to a sufficient copper pour for both thermal dissipation and mechanical reliability. Place a 100nF decoupling capacitor adjacent to the VDD pin and reserve the ICSP/ICD pins for programming/debug access even if unused in production.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the PIC16LF1518-I/ML beyond what is in the manufacturer datasheet alone, including cross-brand pin-compatible equivalents and trade-off guidance for low-power embedded MCU selection.
直接替换替代料： PIC16LF1518-I/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC16LF1518-I/ML （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Program Memory (Flash), Timers.
快速对比工具——选择替代料号进行并排对比：
PIC16F1518-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF1517-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC16LF1519-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F27K40-E/SS
✅ 直接替换✓ 有现货
$1.65 / 个
查看数据手册 →PIC16F1704-I/ST
✅ 直接替换✓ 有现货
$0.62 / 个
查看数据手册 →PIC16LF1518-I/ML 最大额定值与电气特性
| Family | PIC® XLP™ 16F |
| Core | 8-bit PIC |
| Core Architecture | Harvard (RISC) |
| Instruction Set | 49 instructions, mostly single-cycle |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data Memory (SRAM) | 1024 bytes |
| Maximum Clock Speed | 20 MHz |
| Supply Voltage (Vdd) | 1.8 V to 3.6 V |
| ADC | 10-bit, up to 17 channels |
| Timers | TMR0 (8-bit), TMR1 (16-bit), TMR2 (8-bit) |
| Communication Peripherals | 1x MSSP (SPI/I²C), 1x EUSART |
| CCP Modules | 2 |
| I/O Pins | 25 mA source/sink per pin |
| Watchdog Timer | Extended WDT |
| Low-Power Technology | XLP™ (eXtreme Low Power) |
| Brown-Out Reset | Programmable ULPBOR |
| Programming/Debug | ICSP + ICD (no debug header required) |
| 封装 | 28-QFN (6x6 mm) with exposed thermal pad |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +85C (Industrial) |
| RoHS 状态 | Compliant |
PIC16LF1518-I/ML 引脚配置
| 引脚 1 | RA5 — Digital I/O / analog input |
| 引脚 2 | RA4 — Digital I/O / analog input |
| 引脚 3 | RA3 — Digital I/O / analog input / MCLR |
| 引脚 4 | RA2 — Digital I/O / analog input |
| 引脚 5 | RA1 — Digital I/O / analog input / ICSPCLK |
| 引脚 6 | RA0 — Digital I/O / analog input / ICSPDAT |
| 引脚 7 | Vss — Ground reference |
| 引脚 8 | RA7 — Digital I/O / oscillator input |
| 引脚 9 | RA6 — Digital I/O / oscillator output |
| 引脚 10 | RC0 — Digital I/O / analog input |
| 引脚 11 | RC1 — Digital I/O / analog input |
| 引脚 12 | RC2 — Digital I/O / analog input |
| 引脚 13 | RC3 — Digital I/O / analog input / SCL |
| 引脚 14 | RC4 — Digital I/O / analog input / SDA |
| 引脚 15 | RC5 — Digital I/O / analog input |
| 引脚 16 | RC6 — Digital I/O / analog input / TX |
| 引脚 17 | RC7 — Digital I/O / analog input / RX |
| 引脚 18 | Vss — Ground reference |
| 引脚 19 | Vdd — Positive supply (1.8V-3.6V) |
| 引脚 20 | RB0 — Digital I/O / analog input / INT |
| 引脚 21 | RB1 — Digital I/O / analog input |
| 引脚 22 | RB2 — Digital I/O / analog input |
| 引脚 23 | RB3 — Digital I/O / analog input |
| 引脚 24 | RB4 — Digital I/O / analog input |
| 引脚 25 | RB5 — Digital I/O / analog input |
| 引脚 26 | RB6 — Digital I/O / analog input / ICSPCLK |
| 引脚 27 | RB7 — Digital I/O / analog input / ICSPDAT |
| 引脚 28 | Vss — Ground reference |
典型应用
PIC16LF1518-I/ML 适用于 7 应用s: Battery-Powered IoT Sensor Nodes, Consumer Remote Controls, Industrial Sensor Signal Conditioning, White Goods Motor Control, Portable Medical Devices, Smart Home Sensor Hubs, Energy-Harvesting Wireless Switches.
Battery-Powered IoT Sensor Nodes
The PIC16LF1518-I/ML is well suited for battery-powered IoT sensor nodes where its XLP Sleep current below 1 µA and 1.8V minimum Vdd enable multi-year operation from 2x AA alkaline cells. The 17-channel 10-bit ADC supports direct connection of multiple analog sensors (temperature, light, humidity) without external multiplexing, while the MSSP provides I²C connection for digital sensors. Compared to a 32-bit ARM Cortex-M0+, this PIC16 draws an order of magnitude less Sleep current but trades raw MIPS for energy efficiency in duty-cycled applications.
推荐
Consumer Remote Controls
The PIC16LF1518-I/ML fits consumer remote control designs where a 20MHz core easily handles IR protocol encoding (RC5, NEC, Sony) and the 28KB Flash accommodates firmware for multiple device profiles and learning modes. Its 1.8V-3.6V supply directly runs from 2x AAA cells without boost conversion, reducing BOM. The exposed thermal pad is unnecessary for remote-control power levels (sub-50 mA active), simplifying PCB layout to a 2-layer board.
推荐
Industrial Sensor Signal Conditioning
Industrial 4-20 mA loop-powered transmitters and bridge-sensor signal conditioners benefit from the PIC16LF1518-I/ML's 17-channel 10-bit ADC and 1.8V-3.6V supply range. The MCU can directly digitize thermocouple, RTD, or strain-gauge signals after analog front-end conditioning, then transmit via EUSART RS-485 or I²C to a controller. The wide -40°C to +85°C industrial temperature range supports factory-floor deployments and the QFN package withstands vibration when properly soldered with the exposed pad.
推荐
White Goods Motor Control
The PIC16LF1518-I/ML drives white-goods motor control subsystems such as washing-machine drain pumps, dishwasher dispensers, and refrigerator damper actuators. Two CCP modules provide PWM outputs for brushed DC or simple BLDC commutation, while the 20MHz core executes sensorless back-EMF zero-crossing algorithms within microsecond latency. Industrial temperature grade and QFN thermal dissipation via the exposed pad support continuous-duty motor environments where SOIC variants would thermally limit.
推荐
Portable Medical Devices
Portable medical devices like pulse oximeters, digital thermometers, and pill dispensers benefit from the PIC16LF1518-I/ML's XLP Sleep modes that extend battery life across multi-month standby periods. The 17 ADC channels support multi-parameter sensing (SpO₂, temperature, battery voltage), and the EUSART enables Bluetooth Low Energy module interfacing for telemetry. The PIC16LF1518-I/ML is not AEC-Q100 qualified and not medical-grade certified; use Microchip's PIC24/dsPIC families for FDA-classified devices.
推荐
Smart Home Sensor Hubs
Smart-home sensor hubs for window/door contact, occupancy, and leak detection use the PIC16LF1518-I/ML as an edge-node MCU. Its XLP Sleep current under 1 µA allows coin-cell operation for years, while the 28KB Flash stores firmware for zigbee or sub-GHz radio configuration. The 17 ADC channels monitor battery voltage and multiple analog sensors, and the MSSP SPI interface connects to popular 2.4 GHz radio modules. The 6x6 mm QFN keeps PCB footprint under 50 mm² for in-wall mounting.
推荐
Energy-Harvesting Wireless Switches
Energy-harvesting wireless light switches and IoT pushbuttons leverage the PIC16LF1518-I/ML's ultra-low Sleep current to operate from a single piezo or solar cell without battery replacement. A single press generates enough harvested energy to transmit, wake the MCU, execute the application, and return to Sleep within milliseconds. The 1.8V minimum Vdd is critical because energy-harvesting regulators like the ADP5090 output 1.8V-3.6V directly into the PIC16's supply pin without boost conversion.
推荐
推荐产品汇总
工程参考数据： PIC16LF1518-I/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC16F1518-I/ML | PIC16LF1517-I/ML | PIC16LF1519-I/ML | PIC18F27K40-E/SS | PIC16F1704-I/ST |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-SSOP - different | 28-QFN (6x6) - same |
| Supply Voltage | 1.8V to 3.6V | 2.3V to 5.5V | 1.8V to 3.6V | 1.8V to 3.6V | 2.3V to 5.5V | 2.3V to 5.5V |
| Flash Memory | 28 KB | 28 KB | 16 KB | 32 KB | 64 KB | 16 KB |
| SRAM | 1024 B | 1024 B | 1024 B | 2048 B | 4096 B | 1024 B |
| Max Clock Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 64 MHz | 20 MHz |
| ADC Channels | 17 (10-bit) | 17 | 17 | 28 | 24 | 14 |
| XLP Low-Power | Yes | Yes | Yes | Yes | Yes, nanoWatt XL) | No (standard mid-range) |
| Unit Price @ 1k | USD 1.05 | USD 1.05 | USD 0.95 | USD 1.15 | USD 1.45 | USD 0.85 |
关键差异点
- Largest Flash in QFN-28 XLP family （对比 PIC16LF1517-I/ML)
- Lowest Vdd minimum among PIC16F1518 family （对比 PIC16F1518-I/ML)
- XLP Sleep current below 1 µA （对比 PIC16F1704-I/ST)
- Integrated ICD eliminates debug header （对比 PIC18F27K40-E/SS)
设计说明
The 28-QFN (6x6 mm) exposed thermal pad (EP) MUST be connected to the ground plane with at least 4 thermal vias for both heat dissipation and mechanical solder-joint reliability. Place a 100nF X7R ceramic decoupling capacitor within 3 mm of the Vdd pin (pin 19) with the ground return on the EP pour. Adding a 10 µF bulk capacitor near the supply pin improves transient response during ADC bursts and PWM switching events.
Estimated: With Vdd=3.3V, Fosc=20MHz, all peripherals enabled, the active current is approximately 4 mA. In Sleep with WDT disabled, XLP technology drops current below 1 µA typical per the Microchip datasheet. For battery-life calculation: duty_cycle * I_active + (1-duty_cycle) * I_sleep. A 1% duty-cycle IoT sensor node drawing 1 mA average active current can extend a 2000 mAh Li-primary cell beyond 5 years.
Do not connect the ICSPDAT/ICSPCLK pins (RA0/RA1 or RB6/RB7 depending on configuration) directly to LEDs or other low-impedance loads - this prevents in-circuit programming access during production. Reserve MCLR/RA3 as a reset input only; if used as a GPIO, configure it via the CONFIG register. Brown-out reset should be enabled with ULPBOR for battery designs to prevent code corruption during voltage dips.
Route the AVdd and AVss pins (when used as separate analog supply) as a star topology back to the regulator to avoid digital switching noise coupling into ADC readings. Keep ADC traces short and surrounded by ground pour. For 50/60 Hz noise rejection, use the ADC's automatic acquisition-delay feature rather than analog filtering. Place the ADC reference decoupling capacitor (typically 100nF) within 5 mm of the Vref+ pin.
Estimated: At Vdd=3.6V, Fosc=20MHz, full I/O load of 25 mA per pin on multiple pins, internal dissipation can reach ~150 mW. The QFN package has a theta_JA of approximately 30-35 °C/W on a 4-layer JEDEC test board, resulting in a 5 °C junction rise. For enclosed industrial environments exceeding 60 °C ambient, verify junction temperature stays below the 125 °C maximum by derating clock speed or I/O drive strength.
合规信息
RoHS and lead-free confirmed by Microchip product page. AEC-Q100 not qualified - use PIC16F1518-I/ML or automotive-grade PIC16F variants for vehicle applications. Operating temperature -40C to +85C industrial grade.
