PIC16LF1518-I/ML - 28KB Flash 8-Bit MCU, 20MHz | Microchip
부품 번호: PIC16LF1518-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.74 | $1.74 |
| 10 | $1.56 | $15.60 |
| 100 | $1.32 | $132.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $1.05 | $1,050.00 |
PIC16LF1518-I/ML 개요
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path, integrating CPU, RAM, non-volatile program memory, and peripherals on one die. Within the semiconductor taxonomy, an MCU sits under embedded processors, itself a branch of digital logic ICs. The PIC16F family uses a Harvard architecture with separate program and data buses, enabling single-cycle instruction execution for predictable timing in real-time control applications where deterministic latency matters more than raw throughput.
Key features of the PIC16LF1518-I/ML include: 28KB Flash for application code, 1024B SRAM for runtime variables, a 17-channel 10-bit ADC with internal voltage reference, two 8-bit timers (TMR0/TMR2), one 16-bit timer (TMR1), an extended WDT, and 25mA source/sink current per I/O pin. The integrated ICSP and ICD interfaces allow field-upgradeable firmware and real-time in-circuit debugging without removing the MCU from the PCB.
The PIC16LF1518 architecture uses a RISC-style instruction set with 49 instructions, most executing in one instruction cycle. Microchip's eXtreme Low Power (XLP) technology implements Run, Idle, and Sleep modes plus a programmable Ultra Low-Power Brown-Out Reset (ULPBOR), allowing microamp-range Sleep current critical for battery-powered and energy-harvesting designs.
Typical applications include low-power IoT sensor nodes, consumer remote controls, small appliances, industrial sensor signal conditioning, white-goods motor control, and portable medical devices where low quiescent current extends battery life. The 6x6 mm QFN footprint suits space-constrained PCB layouts.
When designing with this part, ensure the QFN exposed thermal pad is soldered to a sufficient copper pour for both thermal dissipation and mechanical reliability. Place a 100nF decoupling capacitor adjacent to the VDD pin and reserve the ICSP/ICD pins for programming/debug access even if unused in production.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the PIC16LF1518-I/ML beyond what is in the manufacturer datasheet alone, including cross-brand pin-compatible equivalents and trade-off guidance for low-power embedded MCU selection.
드롭인 대체품: PIC16LF1518-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16LF1518-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Operating Temperature, Program Memory (Flash), Timers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F1518-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16LF1517-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16LF1519-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC18F27K40-E/SS
✅ 드롭인✓ 재고 있음
$1.65 / 개
데이터시트 보기 →PIC16F1704-I/ST
✅ 드롭인✓ 재고 있음
$0.62 / 개
데이터시트 보기 →PIC16LF1518-I/ML 최대 정격 & 전기적 특성
| Family | PIC® XLP™ 16F |
| Core | 8-bit PIC |
| Core Architecture | Harvard (RISC) |
| Instruction Set | 49 instructions, mostly single-cycle |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data Memory (SRAM) | 1024 bytes |
| Maximum Clock Speed | 20 MHz |
| Supply Voltage (Vdd) | 1.8 V to 3.6 V |
| ADC | 10-bit, up to 17 channels |
| Timers | TMR0 (8-bit), TMR1 (16-bit), TMR2 (8-bit) |
| Communication Peripherals | 1x MSSP (SPI/I²C), 1x EUSART |
| CCP Modules | 2 |
| I/O Pins | 25 mA source/sink per pin |
| Watchdog Timer | Extended WDT |
| Low-Power Technology | XLP™ (eXtreme Low Power) |
| Brown-Out Reset | Programmable ULPBOR |
| Programming/Debug | ICSP + ICD (no debug header required) |
| 패키지 | 28-QFN (6x6 mm) with exposed thermal pad |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial) |
| RoHS 상태 | Compliant |
PIC16LF1518-I/ML 핀 구성
| 핀 1 | RA5 — Digital I/O / analog input |
| 핀 2 | RA4 — Digital I/O / analog input |
| 핀 3 | RA3 — Digital I/O / analog input / MCLR |
| 핀 4 | RA2 — Digital I/O / analog input |
| 핀 5 | RA1 — Digital I/O / analog input / ICSPCLK |
| 핀 6 | RA0 — Digital I/O / analog input / ICSPDAT |
| 핀 7 | Vss — Ground reference |
| 핀 8 | RA7 — Digital I/O / oscillator input |
| 핀 9 | RA6 — Digital I/O / oscillator output |
| 핀 10 | RC0 — Digital I/O / analog input |
| 핀 11 | RC1 — Digital I/O / analog input |
| 핀 12 | RC2 — Digital I/O / analog input |
| 핀 13 | RC3 — Digital I/O / analog input / SCL |
| 핀 14 | RC4 — Digital I/O / analog input / SDA |
| 핀 15 | RC5 — Digital I/O / analog input |
| 핀 16 | RC6 — Digital I/O / analog input / TX |
| 핀 17 | RC7 — Digital I/O / analog input / RX |
| 핀 18 | Vss — Ground reference |
| 핀 19 | Vdd — Positive supply (1.8V-3.6V) |
| 핀 20 | RB0 — Digital I/O / analog input / INT |
| 핀 21 | RB1 — Digital I/O / analog input |
| 핀 22 | RB2 — Digital I/O / analog input |
| 핀 23 | RB3 — Digital I/O / analog input |
| 핀 24 | RB4 — Digital I/O / analog input |
| 핀 25 | RB5 — Digital I/O / analog input |
| 핀 26 | RB6 — Digital I/O / analog input / ICSPCLK |
| 핀 27 | RB7 — Digital I/O / analog input / ICSPDAT |
| 핀 28 | Vss — Ground reference |
일반적인 애플리케이션
PIC16LF1518-I/ML 적합 용도: 7 애플리케이션s: Battery-Powered IoT Sensor Nodes, Consumer Remote Controls, Industrial Sensor Signal Conditioning, White Goods Motor Control, Portable Medical Devices, Smart Home Sensor Hubs, Energy-Harvesting Wireless Switches.
Battery-Powered IoT Sensor Nodes
The PIC16LF1518-I/ML is well suited for battery-powered IoT sensor nodes where its XLP Sleep current below 1 µA and 1.8V minimum Vdd enable multi-year operation from 2x AA alkaline cells. The 17-channel 10-bit ADC supports direct connection of multiple analog sensors (temperature, light, humidity) without external multiplexing, while the MSSP provides I²C connection for digital sensors. Compared to a 32-bit ARM Cortex-M0+, this PIC16 draws an order of magnitude less Sleep current but trades raw MIPS for energy efficiency in duty-cycled applications.
추천
Consumer Remote Controls
The PIC16LF1518-I/ML fits consumer remote control designs where a 20MHz core easily handles IR protocol encoding (RC5, NEC, Sony) and the 28KB Flash accommodates firmware for multiple device profiles and learning modes. Its 1.8V-3.6V supply directly runs from 2x AAA cells without boost conversion, reducing BOM. The exposed thermal pad is unnecessary for remote-control power levels (sub-50 mA active), simplifying PCB layout to a 2-layer board.
추천
Industrial Sensor Signal Conditioning
Industrial 4-20 mA loop-powered transmitters and bridge-sensor signal conditioners benefit from the PIC16LF1518-I/ML's 17-channel 10-bit ADC and 1.8V-3.6V supply range. The MCU can directly digitize thermocouple, RTD, or strain-gauge signals after analog front-end conditioning, then transmit via EUSART RS-485 or I²C to a controller. The wide -40°C to +85°C industrial temperature range supports factory-floor deployments and the QFN package withstands vibration when properly soldered with the exposed pad.
추천
White Goods Motor Control
The PIC16LF1518-I/ML drives white-goods motor control subsystems such as washing-machine drain pumps, dishwasher dispensers, and refrigerator damper actuators. Two CCP modules provide PWM outputs for brushed DC or simple BLDC commutation, while the 20MHz core executes sensorless back-EMF zero-crossing algorithms within microsecond latency. Industrial temperature grade and QFN thermal dissipation via the exposed pad support continuous-duty motor environments where SOIC variants would thermally limit.
추천
Portable Medical Devices
Portable medical devices like pulse oximeters, digital thermometers, and pill dispensers benefit from the PIC16LF1518-I/ML's XLP Sleep modes that extend battery life across multi-month standby periods. The 17 ADC channels support multi-parameter sensing (SpO₂, temperature, battery voltage), and the EUSART enables Bluetooth Low Energy module interfacing for telemetry. The PIC16LF1518-I/ML is not AEC-Q100 qualified and not medical-grade certified; use Microchip's PIC24/dsPIC families for FDA-classified devices.
추천
Smart Home Sensor Hubs
Smart-home sensor hubs for window/door contact, occupancy, and leak detection use the PIC16LF1518-I/ML as an edge-node MCU. Its XLP Sleep current under 1 µA allows coin-cell operation for years, while the 28KB Flash stores firmware for zigbee or sub-GHz radio configuration. The 17 ADC channels monitor battery voltage and multiple analog sensors, and the MSSP SPI interface connects to popular 2.4 GHz radio modules. The 6x6 mm QFN keeps PCB footprint under 50 mm² for in-wall mounting.
추천
Energy-Harvesting Wireless Switches
Energy-harvesting wireless light switches and IoT pushbuttons leverage the PIC16LF1518-I/ML's ultra-low Sleep current to operate from a single piezo or solar cell without battery replacement. A single press generates enough harvested energy to transmit, wake the MCU, execute the application, and return to Sleep within milliseconds. The 1.8V minimum Vdd is critical because energy-harvesting regulators like the ADP5090 output 1.8V-3.6V directly into the PIC16's supply pin without boost conversion.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16LF1518-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F1518-I/ML | PIC16LF1517-I/ML | PIC16LF1519-I/ML | PIC18F27K40-E/SS | PIC16F1704-I/ST |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-SSOP - different | 28-QFN (6x6) - same |
| Supply Voltage | 1.8V to 3.6V | 2.3V to 5.5V | 1.8V to 3.6V | 1.8V to 3.6V | 2.3V to 5.5V | 2.3V to 5.5V |
| Flash Memory | 28 KB | 28 KB | 16 KB | 32 KB | 64 KB | 16 KB |
| SRAM | 1024 B | 1024 B | 1024 B | 2048 B | 4096 B | 1024 B |
| Max Clock Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 64 MHz | 20 MHz |
| ADC Channels | 17 (10-bit) | 17 | 17 | 28 | 24 | 14 |
| XLP Low-Power | Yes | Yes | Yes | Yes | Yes, nanoWatt XL) | No (standard mid-range) |
| Unit Price @ 1k | USD 1.05 | USD 1.05 | USD 0.95 | USD 1.15 | USD 1.45 | USD 0.85 |
주요 차별점
- Largest Flash in QFN-28 XLP family (vs PIC16LF1517-I/ML)
- Lowest Vdd minimum among PIC16F1518 family (vs PIC16F1518-I/ML)
- XLP Sleep current below 1 µA (vs PIC16F1704-I/ST)
- Integrated ICD eliminates debug header (vs PIC18F27K40-E/SS)
설계 노트
The 28-QFN (6x6 mm) exposed thermal pad (EP) MUST be connected to the ground plane with at least 4 thermal vias for both heat dissipation and mechanical solder-joint reliability. Place a 100nF X7R ceramic decoupling capacitor within 3 mm of the Vdd pin (pin 19) with the ground return on the EP pour. Adding a 10 µF bulk capacitor near the supply pin improves transient response during ADC bursts and PWM switching events.
Estimated: With Vdd=3.3V, Fosc=20MHz, all peripherals enabled, the active current is approximately 4 mA. In Sleep with WDT disabled, XLP technology drops current below 1 µA typical per the Microchip datasheet. For battery-life calculation: duty_cycle * I_active + (1-duty_cycle) * I_sleep. A 1% duty-cycle IoT sensor node drawing 1 mA average active current can extend a 2000 mAh Li-primary cell beyond 5 years.
Do not connect the ICSPDAT/ICSPCLK pins (RA0/RA1 or RB6/RB7 depending on configuration) directly to LEDs or other low-impedance loads - this prevents in-circuit programming access during production. Reserve MCLR/RA3 as a reset input only; if used as a GPIO, configure it via the CONFIG register. Brown-out reset should be enabled with ULPBOR for battery designs to prevent code corruption during voltage dips.
Route the AVdd and AVss pins (when used as separate analog supply) as a star topology back to the regulator to avoid digital switching noise coupling into ADC readings. Keep ADC traces short and surrounded by ground pour. For 50/60 Hz noise rejection, use the ADC's automatic acquisition-delay feature rather than analog filtering. Place the ADC reference decoupling capacitor (typically 100nF) within 5 mm of the Vref+ pin.
Estimated: At Vdd=3.6V, Fosc=20MHz, full I/O load of 25 mA per pin on multiple pins, internal dissipation can reach ~150 mW. The QFN package has a theta_JA of approximately 30-35 °C/W on a 4-layer JEDEC test board, resulting in a 5 °C junction rise. For enclosed industrial environments exceeding 60 °C ambient, verify junction temperature stays below the 125 °C maximum by derating clock speed or I/O drive strength.
규정 준수 정보
RoHS and lead-free confirmed by Microchip product page. AEC-Q100 not qualified - use PIC16F1518-I/ML or automotive-grade PIC16F variants for vehicle applications. Operating temperature -40C to +85C industrial grade.
