PIC18F13K22-E/SO - 8-Bit 48MHz 8KB Flash MCU | Microchip
料号： PIC18F13K22-E/SO ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.84 | $2.84 |
| 10 | $2.55 | $25.50 |
| 100 | $2.1 | $210.00 |
| 500 | $1.74 | $870.00 |
| 1,000 | $1.52 | $1,520.00 |
PIC18F13K22-E/SO 概述
An 8-bit microcontroller (MCU) is a small, self-contained computing system on a single integrated circuit that combines an 8-bit CPU core, non-volatile program memory (Flash), volatile data memory (RAM), non-volatile user data (EEPROM), and a rich set of on-chip peripherals such as timers, communication interfaces, and analog-to-digital converters. The PIC18 architecture belongs to the modified Harvard RISC family designed for C-compiler efficiency, and XLP variants extend the operating range into ultra-low-power territory typical of battery applications. PIC microcontrollers sit within the broader hierarchy: 8-bit MCU -> microcontroller -> embedded controller -> semiconductor IC.
Key features include an extended operating voltage range of 1.8 V to 5.5 V (per the datasheet's wide VDD spec), four 8-bit timers plus one 16-bit timer, an enhanced 10-bit ADC, and support for I²C, SPI, and EUSART (including RS-485) peripherals. The "-E" temperature grade extends to -40 °C to +125 °C operation, and the SOIC-20 footprint makes the part easy to hand-solder or reflow. Internal oscillator options, including a 16 MHz HFINTOSC with ±1% accuracy, allow BOM-cost reduction.
Typical applications include low-power remote sensor nodes, IoT edge devices, USB-less consumer peripherals, motor and lighting control subsystems, and battery-backed industrial instrumentation. Its small footprint, low sleep current, and XLP architecture make it especially suitable when standby power matters more than raw throughput.
Designers should note that code for PIC18F14K22 / PIC18F15K22 siblings is generally source-compatible because the 1XK22 family shares peripheral mapping, easing migration across pin counts. This page synthesizes pricing, drop-in equivalents, and field notes beyond the standard datasheet.
直接替换替代料： PIC18F13K22-E/SO ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18F13K22-E/SO （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Core Architecture, Timers, ADC.
快速对比工具——选择替代料号进行并排对比：
PIC18F13K22-I/SO
✅ 直接替换✓ 有现货
$1.49 / 个
查看数据手册 →PIC18F14K22-I/SO
✅ 直接替换✓ 有现货
$1.52 / 个
查看数据手册 →PIC18F15K22-I/SO
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F13K22-E/P
✅ 直接替换✓ 有现货
$1.05 / 个
查看数据手册 →PIC18F13K22-E/ML
✅ 直接替换✓ 有现货
$1.34 / 个
查看数据手册 →PIC18F13K22-E/SO 最大额定值与电气特性
| Family | PIC® XLP™ 18K (PIC18F1XK22) |
| Core | PIC 8-bit RISC (C-compiler optimized) |
| Core Size | 8-bit |
| Max CPU Frequency | 48 MHz (16 MIPS) |
| Program Memory | 8 KB (4K x 16) Flash |
| RAM | 256 bytes |
| EEPROM | 256 bytes |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| I/O Pins | 16 |
| ADC | 10-bit, multi-channel |
| Timers | 4 x 8-bit + 1 x 16-bit |
| Communication | I²C, SPI, EUSART (RS-485) |
| 工作温度 | -40 °C to +125 °C (E grade) |
| 封装 | 20-pin SOIC (SO), 7.50 mm body |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
PIC18F13K22-E/SO 引脚配置
| 引脚 1 | RA3/AN3/VREF+/C1IN+/SS1 — Digital I/O / analog input / positive voltage reference / comparator input / SPI slave select |
| 引脚 2 | RA4/AN4/C2OUT/T0CKI/SRQ — Digital I/O / analog input / comparator output / Timer0 clock / SR latch Q output |
| 引脚 3 | RA5/MCLR/VPP/AN5 — Digital I/O / master clear (reset, active low) / ICSP programming voltage / analog input |
| 引脚 4 | RA6/OSC2/CLKO/AN6 — Digital I/O / oscillator output / clock output / analog input |
| 引脚 5 | RA7/OSC1/CLKI/AN7 — Digital I/O / oscillator input / clock input / analog input |
| 引脚 6 | VSS — Ground reference |
| 引脚 7 | RA0/AN0/C1IN-/ULPWU — Digital I/O / analog input / comparator input / ultra-low-power wake-up |
| 引脚 8 | RA1/AN1/C1IN0-/C2IN0-/VREF- — Digital I/O / analog input / comparator input / negative voltage reference |
| 引脚 9 | RA2/AN2/C2IN+/VREF-/CVREF — Digital I/O / analog input / comparator input / voltage reference / comparator voltage reference output |
| 引脚 10 | RC0/SOSCO/SCLKI — Digital I/O / secondary oscillator output / SOSC clock input |
| 引脚 11 | RC1/SOSCI — Digital I/O / secondary oscillator input |
| 引脚 12 | RC2/AN12/P1D/CCP1 — Digital I/O / analog input / PWM output / capture-compare-PWM 1 |
| 引脚 13 | RC3/AN11/CCP2/P1C — Digital I/O / analog input / capture-compare-PWM 2 / PWM output |
| 引脚 14 | RC4/AN10/C2OUT/SDA1/SDO2 — Digital I/O / analog input / comparator output / I²C data / SPI data out |
| 引脚 15 | RC5/AN9/C1OUT/SCL1/SCK2 — Digital I/O / analog input / comparator output / I²C clock / SPI clock |
| 引脚 16 | RC6/AN8/SS1/TX1/CK1 — Digital I/O / analog input / SPI slave select / EUSART transmit / EUSART clock |
| 引脚 17 | RC7/AN7/SDO1/RX1/DT1 — Digital I/O / analog input / SPI data out / EUSART receive / EUSART data |
| 引脚 18 | VDD — Positive supply voltage (1.8 V to 5.5 V) |
| 引脚 19 | VSS — Ground reference |
| 引脚 20 | RB7/PGD/AN13 — Digital I/O / ICSP data / analog input |
典型应用
PIC18F13K22-E/SO 适用于 6 应用s: Battery-Powered IoT Sensor Nodes, Industrial Control and Sensor Conditioning, Consumer Appliance User Interface, LED Lighting Control Modules, USB-less PC and Gaming Peripherals, Automotive Body and Comfort Modules.
Battery-Powered IoT Sensor Nodes
The PIC18F13K22-E/SO fits battery-powered IoT sensor nodes because its nanoWatt XLP technology delivers sub-µA sleep currents and its 1.8 V to 5.5 V VDD range accepts 1S Li-ion or 2xAA directly. The 256-byte EEPROM is ideal for storing calibration constants, while the 10-bit ADC reads analog sensor outputs without an external front-end. Compared to 32-bit MCUs in this role, the 16 MIPS PIC18 core draws a fraction of the active current, extending battery life by months.
推荐
Industrial Control and Sensor Conditioning
The PIC18F13K22-E/SO works well in industrial control because of its -40 °C to +125 °C extended temperature grade (E suffix), robust 16 I/O pins, and RS-485-capable EUSART for long cable runs. Its 10-bit ADC with internal voltage reference simplifies 4-20 mA loop and thermistor signal conditioning, while 256-byte EEPROM holds persistent setpoints through power cycles. Compared to ASIC solutions, the PIC18 offers field-updatable firmware via ICSP without board removal.
推荐
Consumer Appliance User Interface
The PIC18F13K22-E/SO suits consumer appliance user interfaces where modest code size, low cost, and reliable touch/button handling are priorities. Its 16 I/O pins drive segmented LCDs, LED indicators, and rotary encoders without external logic, while the 8 KB Flash accommodates menu logic and EEPROM-backed user preferences. At 1.8 V minimum, the part runs from a single AAA in low-power standby, helping products meet energy-star idle budgets.
推荐
LED Lighting Control Modules
The PIC18F13K22-E/SO is used in LED lighting control modules because its CCP/ECCP peripherals generate high-resolution PWM for dimming and color mixing, while its 16 MIPS core runs DMX or DALI protocol stacks. With 1.8 V to 5.5 V operation it interfaces directly with buck-driver analog feedback, eliminating level shifters. The 256-byte EEPROM stores fade curves and addressable light IDs across power cycles.
推荐
USB-less PC and Gaming Peripherals
The PIC18F13K22-E/SO powers USB-less PC peripherals (keyboards, mice, game controllers with proprietary RF links) because its EUSART and SPI peripherals directly drive nRF24L01 or HC-05 modules at 48 MHz. The 8 KB Flash is enough for HID report parsing, while the small SOIC-20 footprint fits inside thin plastic enclosures. Compared to PD controllers, the PIC18F1XK22 retains enough MIPS for debounced matrix-scanning at 1 kHz.
推荐
Automotive Body and Comfort Modules
The PIC18F13K22-E/SO suits automotive body and comfort subsystems (window lifters, seat controllers, mirror adjusters) thanks to its -40 °C to +125 °C E-grade range and 16 I/O lines for relay and motor drivers. LIN-stack firmware fits in 8 KB Flash, and 256-byte EEPROM retains trim positions. Compared to AEC-Q100-grade parts, the E-grade PIC18F1XK22 offers automotive-temp operation at commodity pricing, though full AEC-Q100 qualification requires a /VAO suffix.
推荐
推荐产品汇总
工程参考数据： PIC18F13K22-E/SO ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18F13K22-I/SO | PIC18F14K22-I/SO | PIC18F15K22-I/SO | PIC18F13K22-E/P | PIC18F13K22-E/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-SOIC (SO) | 20-SOIC (SO) - same | 20-SOIC (SO) - same | 20-SOIC (SO) - same | 20-SOIC (SO) - same family (DIP adapter footprint) | 20-SOIC (SO) - same family (QFN adapter footprint) |
| Program Memory (Flash) | 8 KB | 8 KB | 16 KB | 32 KB | 8 KB | 8 KB |
| RAM | 256 bytes | 256 bytes | 512 bytes | 1.5 KB | 256 bytes | 256 bytes |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Max CPU Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Operating Temperature | -40 to +125 C (E grade) | -40 to +85 C (I grade) | -40 to +85 C (I grade) | -40 to +85 C (I grade) | -40 to +125 C (E grade) | -40 to +125 C (E grade) |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| I/O Pins | 16 | 16 | 16 | 16 | 16 | 16 |
关键差异点
- nanoWatt XLP technology delivers sub-µA sleep currents （对比 PIC18F13K22-I/SO)
- Extended -40 to +125 °C temperature grade （对比 PIC18F14K22-I/SO)
- Compact SOIC-20 footprint fits dense consumer layouts （对比 PIC18F13K22-E/P (DIP-20))
设计说明
The PIC18F13K22-E/SO operates from 1.8 V to 5.5 V with nanoWatt XLP technology, allowing direct battery connection without an external LDO. For sub-µA sleep targets, configure the LFINTOSC at 31 kHz, disable the HFINTOSC, and use IOC (interrupt-on-change) wake-up. Brown-out reset (BOR) and on-chip LVD thresholds are software-selectable to match battery chemistries.
Place a 100 nF decoupling capacitor within 5 mm of the VDD pin (pin 18) and an additional 10 µF bulk capacitor when the part is fed from a long battery cable. Keep the ICSP lines (PGD/RB7 and PGC/RA6) on short, parallel tracks away from switching nodes so production programming is robust even in dense layouts. Use a ground pour under the SOIC-20 package to limit digital switching noise on the analog ADC inputs.
Do not leave MCLR floating when the E grade part is in noisy environments; tie MCLR (pin 3) to VDD through a 10 kΩ pull-up and add a 100 nF cap to VSS for noise immunity. Avoid driving I/O pins above VDD or below VSS even by small amounts, because clamping diodes can forward-bias into the supply and inject latch-up noise. The PIC18F1XK22 datasheet recommends a 1 µF bulk capacitor on VDD for ADC accuracy above 10-bit.
Estimated: SOIC-20 thermal resistance θJA is approximately 80 °C/W on a 1-oz 2-layer 1 sq-in copper pour. At 48 MHz active and 3.3 V VDD, the typical core current is 9 mA, so dissipation is ~30 mW and self-heating is negligible (junction rise < 3 °C). For hot enclosures above 100 °C ambient, derate the part to keep Tj below 150 °C and consider clock-gating peripherals during inactive periods.
合规信息
RoHS and lead-free confirmed via Microchip product page; E temperature grade (-40 to +125 C) supports industrial and automotive comfort zones but is not AEC-Q100 qualified; full automotive qualification requires a /VAO suffix variant.
