PIC18F26K83-I/ML - 8-Bit 64MHz 64KB Flash MCU w/ CAN | Microchip
料号： PIC18F26K83-I/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.3 | $4.30 |
| 10 | $3.87 | $38.70 |
| 100 | $3.45 | $345.00 |
| 500 | $3.05 | $1,525.00 |
| 1,000 | $2.65 | $2,650.00 |
| 3,000 | $2.19 | $6,570.00 |
PIC18F26K83-I/ML 概述
A microcontroller (MCU) is a single-chip computer containing a CPU, memory (Flash/RAM), and programmable peripherals that engineers configure to read sensors, drive actuators, and exchange data via serial busses. PIC18 MCUs use a modified Harvard architecture optimized for deterministic real-time control, and the K-series extends that line with enhanced peripherals like ADC2, DMA, and CIP (Core Independent Peripherals). Within Microchip's 8-bit portfolio, the PIC18F26K83 sits in the K83 sub-family that combines an MSSP-based CAN module, 12-bit differential ADC, and XLP battery-friendly sleep currents below 100 nA.
Key features of the PIC18F26K83-I/ML include 64 KB self-programmable Flash (32K x 16 words), 4 KB SRAM, 1 KB EEPROM, four 16-bit timers, two I2C, two SPI, four UART, and a CAN 2.0B module. ADC2 automates oversampling, averaging, and threshold comparison without CPU intervention, freeing cycles for higher-level control loops. The device also includes a Peripheral Pin Select (PPS) engine that remaps most digital peripherals to any I/O pin, simplifying PCB routing on dense boards.
Designed for industrial-grade reliability, the PIC18F26K83-I/ML supports -40C to +85C operation, watch timers, windowed WDT, and CRC/SCAN memory integrity checking. The 28-QFN exposed pad provides a low theta_JA footprint suitable for compact industrial modules and energy-meter PCBs that previously required larger SSOP packages. Internal DMA moves data between peripherals and RAM without CPU load, enabling efficient noise-filter pipelines and high-speed UART/CAN traffic.
Typical applications include industrial CAN node controls (sensor hubs, motor pre-drivers, building automation), touch-sensing human-machine interfaces using CVD, automotive body and accessory ECUs, e-metering, and battery-powered IoT sensor nodes. Designers benefit from MPLAB X IDE, MCC pin/clock code generators, and the PIC18F26K83 Plug-In Module (MA180037) for rapid prototyping on Microchip development boards.
When selecting this part, consider that the 28-QFN variant (-I/ML, industrial -40 to +85C) is drop-in compatible with the 28-SSOP (-I/SS) and 28-SOIC (-I/SO) variants, but PCB re-layout is required to migrate between QFN and leaded packages. Designers migrating from the older PIC18F25K80 gain ADC resolution (12-bit vs 10-bit), CAN-FD capability, DMA, and CIP peripherals with software-level compatibility through the XC8 toolchain.
This page synthesizes distributor pricing, drop-in alternatives sourced from Microchip's K80/K42 families, design notes covering ADC2 configuration and CAN bus termination, and an AEO-optimized FAQ tailored to engineers evaluating this MCU for new designs or replacement of legacy K80 silicon.
直接替换替代料： PIC18F26K83-I/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18F26K83-I/ML （相同外形与封装尺寸） ——差异在于 ADC, Package, Program Memory (Flash), Operating Temperature, Communication Peripherals.
快速对比工具——选择替代料号进行并排对比：
PIC18F26K83T-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC18F26K83-E/ML
✅ 直接替换✓ 有现货
$1.8 / 个
查看数据手册 →PIC18F25K83-I/MX
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1.97 / 个
查看数据手册 →PIC18F26K83-I/ML 最大额定值与电气特性
| Family | PIC18F26K83 (PIC XLP 18K) |
| Core | 8-bit PIC18, modified Harvard |
| Program Memory (Flash) | 64 KB (32K x 16 words) |
| SRAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz |
| 电源电压 | 2.3 V to 5.5 V |
| I/O Pins | 24 |
| ADC | 12-bit with Computation (ADC2), up to 24 channels |
| Timers | 4 x 16-bit / 2 x 8-bit |
| Communication | 2x I2C, 2x SPI, 4x UART, 1x CAN 2.0B |
| DMA Channels | Yes (peripheral-to-RAM) |
| Peripheral Pin Select (PPS) | Yes |
| 工作温度 | -40C to +85C (Industrial) |
| 封装 | 28-QFN (6x6 mm) with exposed pad |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Functional Safety | Yes (FuSa features) |
PIC18F26K83-I/ML 引脚配置
| 引脚 1 | VSS — Ground reference |
| 引脚 2 | RA0/ANA0 — PORTA bit 0 / analog input AN0 |
| 引脚 3 | RA1/ANA1 — PORTA bit 1 / analog input AN1 |
| 引脚 4 | RA2/ANA2 — PORTA bit 2 / analog input AN2 |
| 引脚 5 | RA3/ANA3/VREF+ — PORTA bit 3 / analog input AN3 / voltage reference plus |
| 引脚 6 | RA4/ANA4/T0CKI — PORTA bit 4 / analog input AN4 / Timer0 clock input |
| 引脚 7 | RA5/ANA5 — PORTA bit 5 / analog input AN5 |
| 引脚 8 | RA6/ANA6 — PORTA bit 6 / analog input AN6 |
| 引脚 9 | RA7/ANA7 — PORTA bit 7 / analog input AN7 |
| 引脚 10 | VSS — Ground reference (digital) |
| 引脚 11 | VDD — Positive supply voltage 2.3V-5.5V |
| 引脚 12 | RB0/ANB0 — PORTB bit 0 / analog input B0 |
| 引脚 13 | RB1/ANB1 — PORTB bit 1 / analog input B1 |
| 引脚 14 | RB2/ANB2 — PORTB bit 2 / analog input B2 |
| 引脚 15 | RB3/ANB3 — PORTB bit 3 / analog input B3 |
| 引脚 16 | RB4/ANB4 — PORTB bit 4 / analog input B4 |
| 引脚 17 | RB5/ANB5 — PORTB bit 5 / analog input B5 |
| 引脚 18 | RB6/ICSPCLK — PORTB bit 6 / ICSP clock |
| 引脚 19 | RB7/ICSPDAT — PORTB bit 7 / ICSP data |
| 引脚 20 | VSS — Ground reference (digital) |
| 引脚 21 | VDD — Positive supply voltage 2.3V-5.5V |
| 引脚 22 | RC0 — PORTC bit 0 (CCP/SPI/I2C via PPS) |
| 引脚 23 | RC1 — PORTC bit 1 (CCP/SPI/I2C via PPS) |
| 引脚 24 | RC2 — PORTC bit 2 (CCP/SPI/I2C via PPS) |
| 引脚 25 | RC3 — PORTC bit 3 (SCL/SPI via PPS) |
| 引脚 26 | RC4 — PORTC bit 4 (SDA/SPI via PPS) |
| 引脚 27 | RC5 — PORTC bit 5 |
| 引脚 28 | RC6 — PORTC bit 6 (TX/CAN TX via PPS) |
典型应用
PIC18F26K83-I/ML 适用于 6 应用s: Industrial CAN Sensor Node, Capacitive Touch HMI Panel, Building Automation Controller, Automotive Body Control Accessory ECU, Smart Energy Meter / Sub-GHz Data Logger, IoT Sensor / Wearable Edge Node.
Industrial CAN Sensor Node
The PIC18F26K83-I/ML fits industrial CAN sensor nodes because its integrated CAN 2.0B controller supports bit rates up to 1 Mbit/s for CANopen/DeviceNet slaves, while the -40 to +85C industrial grade handles factory floor environments. Designers place the QFN on a sensor PCB and run a CANopen stack from the 64 KB Flash, leaving 4 KB RAM for process-data buffering and CIP peripherals for deterministic cyclic messaging. Compared with a discrete CAN transceiver plus external MCU, this integration cuts BOM cost roughly 30 percent and shrinks PCB area significantly.
推荐
Capacitive Touch HMI Panel
The PIC18F26K83-I/ML is well suited for capacitive touch HMI panels because ADC2 hardware automates Capacitive Voltage Divider (CVD) scanning of 12+ buttons without CPU intervention, reducing firmware complexity and scan latency below 1 ms. DMA channels move raw ADC samples into RAM for hardware averaging and threshold comparison, freeing CPU time for the user interface. The exposed QFN pad enables slim panel designs, while XLP sleep currents below 100 nA support battery-powered remote controls for HVAC and appliance user interfaces.
推荐
Building Automation Controller
The PIC18F26K83-I/ML is ideal for building automation controllers because it combines CAN/RS-485-style UARTs for BACnet or Modbus communications, ADC2 for analog sensor digitization, and XLP sleep modes that draw only microamps in battery-backed HVAC zone sensors. With 64 KB Flash and 4 KB RAM, a single MCU can run the application protocol, process temperature/humidity/CO2 reads, and drive a relay or 0-10 V actuator output. The industrial 85C temperature rating covers plenum enclosures where ambient can rise during summer peaks.
推荐
Automotive Body Control Accessory ECU
The PIC18F26K83-I/ML suits automotive accessory ECUs such as seat controllers, mirror modules, or body controllers because it integrates CAN 2.0B for chassis bus communication plus ADC2 for current/voltage feedback on motor drives. For under-hood or high-temperature cabin environments, the extended-grade PIC18F26K83-E/ML (rated +125C) is the preferred drop-in. With Functional Safety (FuSa) features and 64 KB Flash, it can host AUTOSAR-mappable firmware plus safety diagnostics like windowed WDT and CRC memory scans.
推荐
Smart Energy Meter / Sub-GHz Data Logger
The PIC18F26K83-I/ML handles smart energy metering because its 12-bit ADC2 captures accurate load-current measurements with hardware averaging for noise rejection, while DMA streams samples into RAM at high rates without CPU load. The PIC XLP sleep mode keeps idle consumption below 100 nA, extending battery life in wireless meter modules. The QFN exposed pad provides low thermal resistance, allowing continuous metrology accuracy across the -40 to +85C industrial range required by utility-grade metering specifications.
推荐
IoT Sensor / Wearable Edge Node
The PIC18F26K83-I/ML is well matched to low-power IoT edge nodes because the PIC XLP architecture achieves sleep currents under 100 nA with wake-on-change, allowing months of battery life on coin cells for wearables or environmental sensors. ADC2 with CVD supports both temperature/humidity measurements and capacitive user interfaces, while PPS lets designers remap SPI/I2C pins without PCB changes. The 6x6 mm QFN footprint fits easily inside compact wearables, and 64 KB Flash supports full BLE/Zigbee node stacks plus over-the-air update bootloaders.
推荐
推荐产品汇总
工程参考数据： PIC18F26K83-I/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18F26K83T-I/ML | PIC18F26K83-E/ML | PIC18F25K83-I/MX |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| SRAM | 4 KB | 4 KB | 4 KB | 2 KB (-50%) |
| Max CPU Speed | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| ADC Resolution | 12-bit (ADC2) | 12-bit (ADC2) | 12-bit (ADC2) | 12-bit (ADC2) |
| CAN Module | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Supply Voltage | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V |
关键差异点
- Integrated CAN 2.0B with dedicated hardware （对比 PIC18F25K83-I/MX)
- 12-bit ADC2 with hardware CVD touch sensing （对比 PIC18F25K80T-I/SS)
- Industrial-grade extended temperature variant available （对比 PIC18F26K83T-I/ML)
设计说明
The 28-QFN exposed pad must be soldered to a PCB thermal land with at least 8 thermal vias to the inner ground plane for adequate heat dissipation. A 200mm x 200mm area of solid ground plane brings theta_JA below 30 C/W; a floating or absent thermal pad can cause thermal-shutdown events during high-CPU-load CAN bus bursts.
Add a 0.1 uF ceramic decoupling capacitor as close as possible to each VDD/VSS pin pair (4 each on 28-QFN). A bulk 4.7 uF aluminum-polymer or tantalum capacitor near the MCU handles CAN bus supply transients. Place the 32.768 kHz crystal (if used for RTCC) within 5 mm of SOSC pins to minimize EMI and start-up drift.
Use Peripheral Pin Select (PPS) to remap SPI, I2C, UART, and CAN signals to alternate I/O pins, simplifying PCB routing on dense two-layer boards. Keep CANH/CANL differential traces matched within 0.5 mm and use 120-ohm characteristic impedance; place the termination resistor only at the bus ends, not on stub branches, to avoid reflections above 500 kbit/s.
For capacitive touch (CVD) sensing, dedicate a ground fill island under each touch pad with a 0.5 mm clearance ring to enhance sensitivity. Keep ADC reference voltage traces short and decoupled with 100 nF plus 10 uF capacitors to avoid jitter; route ADC inputs away from PWM and CAN switching signals with 0.4 mm grounded isolation channels.
合规信息
RoHS compliant per Microchip product page; AEC-Q100 grade requires extended E/ML variant.
