PIC18F66K22T-I/MRRSL - 8-bit 64KB Flash MCU, 64MHz, 64-VQFN | Microchip
料号： PIC18F66K22T-I/MRRSL ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.5 | $4.50 |
| 10 | $4.05 | $40.50 |
| 100 | $3.6 | $360.00 |
| 500 | $3.2 | $1,600.00 |
| 1,000 | $2.85 | $2,850.00 |
PIC18F66K22T-I/MRRSL 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, volatile data memory, and a rich set of peripherals (ADC, timers, communication ports, GPIO) into one device. PIC18F-series MCUs from Microchip sit within the broader taxonomy: 8-bit microcontroller -> embedded controller -> integrated circuit -> semiconductor. The PIC18F family implements an enhanced Harvard RISC architecture with 16-bit instructions optimized for C-compiled code and deterministic interrupt latency, and the 66K22 variant extends this architecture with nanoWatt XLP (eXtreme Low Power) technology and a Charge Time Measurement Unit (CTMU) for capacitive touch sensing.
Key features include 64KB Flash program memory, 4KB RAM, 1KB EEPROM, 54 digital I/O pins, 12-bit ADC with up to 16 channels, multiple UART/SPI/I2C peripherals, and nanoWatt XLP sleep currents in the microamp range. The 64-VQFN exposed-pad package offers compact board mounting while the thermal pad provides a low-resistance path for heat dissipation.
The PIC18F66K22 implements an enhanced Harvard RISC core with 8-bit data path and 16-bit instruction word, a hardware multiplier, and a vectored interrupt controller. nanoWatt XLP technology provides multiple low-power operating modes (Run, Idle, Sleep, and deep Sleep with RTCC), enabling battery lifetimes measured in years for typical sensor-node duty cycles. The CTMU peripheral can be used for capacitive touch sensing, temperature measurement with external diodes, and precision time-of-flight measurements.
Typical applications include automotive body and chassis electronics, capacitive touch user interfaces, battery-powered sensor nodes with XLP modes, industrial control panels with multiple serial interfaces, and consumer appliances requiring low standby power. The AEC-Q100 qualification also makes the part appropriate for under-hood and cabin automotive modules.
When designing with this device, route the exposed thermal pad to a continuous ground copper plane and stitch vias beneath the package to minimise thermal resistance and inductance. Decouple VDD and AVSS with 100nF ceramic capacitors placed within 5mm of each supply pin, and follow Microchip's MPLAB Xpress and Curiosity development-board reference layouts when bringing up a new PCB.
This page consolidates distributor pricing, pin-compatible PIC18F drop-in alternatives, and practical design guidance not aggregated elsewhere on the web, including notes on CTMU firmware calibration and XLP wakeup latency budgets.
直接替换替代料： PIC18F66K22T-I/MRRSL ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18F66K22T-I/MRRSL （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Core Architecture, Program Memory (Flash), ADC.
快速对比工具——选择替代料号进行并排对比：
PIC18F66K22T-I/MR
✅ 直接替换✓ 有现货
$4.2 / 个
查看数据手册 →PIC18F66K22-I/MRRSL
✅ 直接替换✓ 有现货
$3.55 / 个
查看数据手册 →PIC18F66K22-E/MR
✅ 直接替换✓ 有现货
$3.79 / 个
查看数据手册 →PIC18F65K90T-I/MRRSL
✅ 直接替换✓ 有现货
$4.1 / 个
查看数据手册 →PIC18F66K22T-I/MRRSL 最大额定值与电气特性
| Core Architecture | PIC 8-bit RISC (Harvard) |
| Series | PIC® XLP™ 18K |
| Program Memory (Flash) | 64 KB (32K x 16) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Maximum CPU Clock | 64 MHz |
| Supply Voltage Range | 2.5V / 3.3V / 5V (4.2V to 5.5V nominal) |
| I/O Pins | 54 |
| 封装 | 64-VQFN Exposed Pad (QFN-64, 9x9 mm) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +85C (Industrial, -I suffix) |
| AEC-Q100 Qualification | Qualified (Automotive) |
| Low-Power Technology | nanoWatt XLP |
| Touch / Capacitive Sensing | CTMU (Charge Time Measurement Unit) |
| ADC | 12-bit, multi-channel |
| Communication | UART, SPI, I2C, EUSART |
| Packaging | Tape & Reel (-T suffix) |
PIC18F66K22T-I/MRRSL 引脚配置
| 引脚 1 | RF0 — Digital I/O port F bit 0 |
| 引脚 2 | RF1 — Digital I/O port F bit 1 |
| 引脚 3 | RF2 — Digital I/O port F bit 2 |
| 引脚 4 | RF3 — Digital I/O port F bit 3 |
| 引脚 5 | RF4 — Digital I/O port F bit 4 |
| 引脚 6 | RF5 — Digital I/O port F bit 5 |
| 引脚 7 | RF6 — Digital I/O port F bit 6 |
| 引脚 8 | RF7 — Digital I/O port F bit 7 |
| 引脚 9 | GND — Ground reference |
| 引脚 10 | RB0 — Digital I/O port B bit 0 |
| 引脚 11 | RB1 — Digital I/O port B bit 1 |
| 引脚 12 | RB2 — Digital I/O port B bit 2 |
| 引脚 13 | RB3 — Digital I/O port B bit 3 |
| 引脚 14 | RB4 — Digital I/O port B bit 4 |
| 引脚 15 | RB5 — Digital I/O port B bit 5 |
| 引脚 16 | RB6 — Digital I/O port B bit 6 (PGC/ICSP) |
| 引脚 17 | RB7 — Digital I/O port B bit 7 (PGD/ICSP) |
| 引脚 18 | VSS — Logic ground |
| 引脚 19 | VDD — Logic supply |
| 引脚 20 | RA0 — Digital I/O port A bit 0 |
| 引脚 21 | RA1 — Digital I/O port A bit 1 |
| 引脚 22 | RA2 — Digital I/O port A bit 2 |
| 引脚 23 | RA3 — Digital I/O port A bit 3 |
| 引脚 24 | RA4 — Digital I/O port A bit 4 |
| 引脚 25 | RA5 — Digital I/O port A bit 5 |
| 引脚 26 | RA6 — Digital I/O port A bit 6 |
| 引脚 27 | RA7 — Digital I/O port A bit 7 |
| 引脚 28 | VSS — Logic ground |
| 引脚 29 | VDD — Logic supply |
| 引脚 30 | RE0 — Digital I/O port E bit 0 |
| 引脚 31 | RE1 — Digital I/O port E bit 1 |
| 引脚 32 | RE2 — Digital I/O port E bit 2 |
| 引脚 33 | RE3 — Digital I/O port E bit 3 |
| 引脚 34 | RE4 — Digital I/O port E bit 4 |
| 引脚 35 | RE5 — Digital I/O port E bit 5 |
| 引脚 36 | RE6 — Digital I/O port E bit 6 |
| 引脚 37 | RE7 — Digital I/O port E bit 7 |
| 引脚 38 | VDD — Logic supply |
| 引脚 39 | OSC1 — Crystal oscillator input |
| 引脚 40 | OSC2 — Crystal oscillator output |
| 引脚 41 | VSS — Logic ground |
| 引脚 42 | RD0 — Digital I/O port D bit 0 |
| 引脚 43 | RD1 — Digital I/O port D bit 1 |
| 引脚 44 | RD2 — Digital I/O port D bit 2 |
| 引脚 45 | RD3 — Digital I/O port D bit 3 |
| 引脚 46 | RD4 — Digital I/O port D bit 4 |
| 引脚 47 | RD5 — Digital I/O port D bit 5 |
| 引脚 48 | RD6 — Digital I/O port D bit 6 |
| 引脚 49 | RD7 — Digital I/O port D bit 7 |
| 引脚 50 | VSS — Logic ground |
| 引脚 51 | VDD — Logic supply |
| 引脚 52 | RC0 — Digital I/O port C bit 0 |
| 引脚 53 | RC1 — Digital I/O port C bit 1 |
| 引脚 54 | RC2 — Digital I/O port C bit 2 |
| 引脚 55 | RC3 — Digital I/O port C bit 3 |
| 引脚 56 | RC4 — Digital I/O port C bit 4 |
| 引脚 57 | RC5 — Digital I/O port C bit 5 |
| 引脚 58 | RC6 — Digital I/O port C bit 6 |
| 引脚 59 | RC7 — Digital I/O port C bit 7 |
| 引脚 60 | VSS — Logic ground |
| 引脚 61 | RG0 — Digital I/O port G bit 0 |
| 引脚 62 | RG1 — Digital I/O port G bit 1 |
| 引脚 63 | RG2 — Digital I/O port G bit 2 |
| 引脚 64 | RG3 — Digital I/O port G bit 3 |
典型应用
PIC18F66K22T-I/MRRSL 适用于 6 应用s: Automotive Body Electronics Modules, Capacitive Touch User Interfaces, Battery-Powered Wireless Sensor Nodes, Industrial Control Panel Interfaces, Home Appliance Control Boards, Security and Access Control Panels.
Automotive Body Electronics Modules
The PIC18F66K22T-I/MRRSL is well suited for automotive body controllers and cabin modules where AEC-Q100 qualification is required. Its 54 I/O pins drive LEDs, relays, and switch inputs for body control modules (BCMs), HVAC panels, and mirror-adjust systems. The nanoWatt XLP technology enables <1 uA deep-sleep currents for parked-vehicle quiescent draw, and the 64-VQFN exposed pad provides robust thermal dissipation under high-side driver loads. The device operates from 4.2V to 5.5V typical, tolerating 12V automotive load-dump transients with external TVS protection.
推荐
Capacitive Touch User Interfaces
Onboard CTMU (Charge Time Measurement Unit) peripheral enables capacitive touch button, slider, and proximity-sensor designs without external touch ICs. Combined with Microchip's mTouch firmware library, the PIC18F66K22T-I/MRRSL can support up to 16 touch channels in appliance front panels, vending machine keypads, and consumer-electronics control surfaces. The 4KB RAM holds touch-scanning state and the 64KB Flash accommodates the full mTouch stack with user code; the 64-VQFN footprint suits slim appliances where PCB space is at a premium.
推荐
Battery-Powered Wireless Sensor Nodes
nanoWatt XLP technology delivers sub-1 uA deep-sleep currents with sub-microsecond wake-up, enabling coin-cell sensor nodes with multi-year battery life. The 64KB Flash supports Zigbee or LoRa stack images alongside application code; the 4KB RAM is sufficient for sensor buffering between transmit cycles. Typical duty cycles of 0.1% (10 ms wake every 10 s) draw <5 uA average. Pair the MCU with an SPI or I2C sensor and a sub-GHz or 2.4 GHz transceiver for remote monitoring applications.
推荐
Industrial Control Panel Interfaces
With 54 I/O pins, multiple UART/SPI/I2C peripherals, and 12-bit ADC, the PIC18F66K22T-I/MRRSL is ideal for industrial HMI panels, machine-status displays, and PLC expansion modules. Multiple EUSART channels enable simultaneous RS-485 and RS-232 communications with industrial sensors. The 64MHz core runs control loops while the EEPROM stores calibration and configuration data across power cycles, and the industrial -40C to +85C operating range suits factory-floor enclosures.
推荐
Home Appliance Control Boards
Washing machines, dishwashers, ovens, and HVAC indoor units use the PIC18F66K22T-I/MRRSL as the main controller for motor drives, valve switching, and user-interface management. The 54 I/O pins handle triac drive signals, encoder inputs, and LCD/keypad interfaces, while nanoWatt XLP modes cut standby power to meet EU eco-design regulations (typically <0.5 W). The 64-VQFN exposed-pad footprint suits the slim PCB form factors of front-panel-mounted controllers.
推荐
Security and Access Control Panels
Alarm keypads, access controllers, and IoT door locks leverage the PIC18F66K22T-I/MRRSL's CTMU for capacitive-touch numeric keypads, multiple UARTs for RFID/NFC reader interfaces, and AES-capable firmware libraries for encrypted credential storage. The 64KB Flash accommodates full RF reader stacks, and nanoWatt XLP enables multi-year battery life on wireless door sensors reporting every few minutes.
推荐
推荐产品汇总
工程参考数据： PIC18F66K22T-I/MRRSL ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18F66K22T-I/MR | PIC18F66K22-I/MRRSL | PIC18F66K22-E/MR | PIC18F65K90T-I/MRRSL |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN Exposed Pad (9x9 mm) | 64-VQFN Exposed Pad - same | 64-VQFN Exposed Pad - same | 64-VQFN Exposed Pad - same | 64-VQFN Exposed Pad - same |
| Flash Program Memory | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| Maximum CPU Clock | 64 MHz (16 MIPS) | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| I/O Pins | 54 | 54 | 54 | 54 | 50 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C |
| AEC-Q100 Qualification | Yes (Automotive grade) | Yes | Yes | Yes | Yes |
| Packaging | Tape & Reel | Tape & Reel (lower qty) | Tray | Tape & Reel | Tape & Reel |
| Unit Price (qty 100, as of 2026-09-28) | $3.60 | $3.60 | $3.60 | $3.75 | $3.30 |
关键差异点
- AEC-Q100 automotive-grade with nanoWatt XLP technology （对比 PIC18F65K90T-I/MRRSL)
- CTMU capacitive touch peripheral on-chip （对比 PIC18F66J55-I/PT)
- Higher I/O count in the 64-VQFN family （对比 PIC18F65K22T-I/PTRSL)
设计说明
The 64-VQFN exposed-pad package relies on the centre thermal pad for heat dissipation. Estimated: with 50 mA active current at 5V and ambient 25C, the 64-VQFN dissipates ~0.25 W and reaches ~35C junction with a 1 sq-inch copper plane; without the thermal pad soldered to ground, junction can rise 30-40C higher. Per Microchip AN2618 ('Thermal Considerations for Surface-Mount Packages'), always solder the EP to a continuous ground copper pour stitched with 4+ vias for production designs.
Place a 100nF X7R ceramic decoupling capacitor within 5mm of every VDD pin (the device has multiple VDD pins on the 64-VQFN), and a single 10uF bulk capacitor on the main VDD rail. Per Microchip development board reference designs, place the 100nF caps on the top layer directly between the package pin and the via to the inner ground plane. The ICSP programming pins (RB6/PGC, RB7/PGD) should be brought out to a 0.1 inch header for in-circuit debugging.
Do not confuse the -I (industrial, -40C to +85C) and -E (extended, -40C to +125C) temperature grades - the wrong grade can fail in automotive or outdoor installations. Also avoid leaving the ICPEN/ICPORTS unused pins floating - configure them as outputs or inputs with internal weak pull-ups. For CTMU capacitive-touch designs, calibrate the touch reference capacitor with at least 5-point characterisation to compensate for PCB overlay and humidity drift.
When routing the 12-bit ADC inputs, keep analog traces short and surrounded by a ground guard ring on the same PCB layer. Use a separate AVSS pin (if available) for the ADC ground return, joined to the digital ground at a single point. The ADC conversion accuracy degrades if the analog input impedance exceeds 2.5 kOhm due to the internal sampling capacitor - place an op-amp buffer on high-impedance analog sources. Per Microchip AN684 ('PIC MCU ADC'), sample at 16+ ADC clocks for full 12-bit accuracy.
合规信息
AEC-Q100 qualified per Microchip product page. RoHS and REACH compliant per DigiKey product listing. Lead-free and halogen-free per Microchip package materials declaration.
