Microchip Technology

PIC18F66K22T-I/MRRSL - 8-bit 64KB Flash MCU, 64MHz, 64-VQFN | Microchip

Артикул: PIC18F66K22T-I/MRRSL ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
2.5V / 3.3V / 5V (4.2V to 5.5V nominal) Vdss 64-VQFN Exposed Pad (QFN-64, 9x9 mm) Package 64 MHz Speed 64 KB (32K x 16) Memory
От $2.85 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-27
Оптовые цены
Кол-во Цена за ед. Итого
1 $4.5 $4,50
10 $4.05 $40,50
100 $3.6 $360,00
500 $3.2 $1.600,00
1.000 $2.85 $2.850,00
ℹ️ Все цены указаны в USD

PIC18F66K22T-I/MRRSL Обзор

The Microchip Technology PIC18F66K22T-I/MRRSL is an 8-bit PIC RISC microcontroller with 64KB of Flash program memory, 4KB of RAM, and 64MHz maximum CPU clock speed, supplied in a 64-pin VQFN (QFN-64) exposed-pad package on tape-and-reel. It is qualified to the AEC-Q100 standard for automotive applications and operates from a 2.5V / 3.3V / 5V supply range.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, volatile data memory, and a rich set of peripherals (ADC, timers, communication ports, GPIO) into one device. PIC18F-series MCUs from Microchip sit within the broader taxonomy: 8-bit microcontroller -> embedded controller -> integrated circuit -> semiconductor. The PIC18F family implements an enhanced Harvard RISC architecture with 16-bit instructions optimized for C-compiled code and deterministic interrupt latency, and the 66K22 variant extends this architecture with nanoWatt XLP (eXtreme Low Power) technology and a Charge Time Measurement Unit (CTMU) for capacitive touch sensing.

Key features include 64KB Flash program memory, 4KB RAM, 1KB EEPROM, 54 digital I/O pins, 12-bit ADC with up to 16 channels, multiple UART/SPI/I2C peripherals, and nanoWatt XLP sleep currents in the microamp range. The 64-VQFN exposed-pad package offers compact board mounting while the thermal pad provides a low-resistance path for heat dissipation.

The PIC18F66K22 implements an enhanced Harvard RISC core with 8-bit data path and 16-bit instruction word, a hardware multiplier, and a vectored interrupt controller. nanoWatt XLP technology provides multiple low-power operating modes (Run, Idle, Sleep, and deep Sleep with RTCC), enabling battery lifetimes measured in years for typical sensor-node duty cycles. The CTMU peripheral can be used for capacitive touch sensing, temperature measurement with external diodes, and precision time-of-flight measurements.

Typical applications include automotive body and chassis electronics, capacitive touch user interfaces, battery-powered sensor nodes with XLP modes, industrial control panels with multiple serial interfaces, and consumer appliances requiring low standby power. The AEC-Q100 qualification also makes the part appropriate for under-hood and cabin automotive modules.

When designing with this device, route the exposed thermal pad to a continuous ground copper plane and stitch vias beneath the package to minimise thermal resistance and inductance. Decouple VDD and AVSS with 100nF ceramic capacitors placed within 5mm of each supply pin, and follow Microchip's MPLAB Xpress and Curiosity development-board reference layouts when bringing up a new PCB.

This page consolidates distributor pricing, pin-compatible PIC18F drop-in alternatives, and practical design guidance not aggregated elsewhere on the web, including notes on CTMU firmware calibration and XLP wakeup latency budgets.

Аналоги без доработки для PIC18F66K22T-I/MRRSL — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с PIC18F66K22T-I/MRRSL (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Core Architecture, Program Memory (Flash), ADC.

Microchip Technology
Operating Temperature: -40C to +85C
Microchip Technology
Package: 64-pin VQFN (9x9 mm) with EP
Core Architecture: PIC18 (8-bit, enhanced RISC)
ADC: 12-bit, up to 16 channels
Microchip Technology
Package: 64-pin QFN (MR) with exposed pad, 9x9 mm
Operating Temperature: -40C to +85C (Industrial, 'I' suffix)
Core Architecture: PIC18 (RISC, 16-bit instructions)
Microchip Technology
Package: 64-pin VQFN (9x9 mm)
Core Architecture: PIC18 (8-bit RISC, Harvard)
Program Memory (Flash): 64 KB
Microchip Technology
Package: 64-pin TQFP (PT) 10x10 mm
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 64-VQFN (9x9 mm)
Operating Temperature: -40 C to +85 C
Program Memory (Flash): 128 KB (64K x 16)

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

PIC18F66K22T-I/MR

✅ Прямая замена
Microchip Technology
📦 64-VQFN Exposed Pad (QFN-64)
PIC18 (8-bit RISC, Harvard) · 64 MHz (16 MIPS at 64 MHz) · 64 KB · 4 KB · 1 KB · 64-pin VQFN (9x9 mm) · 1.8 V to 5.5 V · -40 C to +85 C (Industrial)

✓ В наличии

$4.2 / шт.

Открыть даташит →

PIC18F66K22-I/MRRSL

✅ Прямая замена
Microchip Technology
📦 64-VQFN Exposed Pad (QFN-64)
8-bit Microcontroller (MCU) · PIC18 (RISC, 16-bit instructions) · PIC18F6xK22 (nanoWatt XLP) · 64 KB (32K x 16) · 4 KB · 1 KB · 64 MHz (200 ns instruction cycle) · 1.8 V to 5.5 V (operating range 2.0-5.5 V with full-spec ADC)

✓ В наличии

$3.55 / шт.

Открыть даташит →

PIC18F66K22-E/MR

✅ Прямая замена
Microchip Technology
📦 64-VQFN Exposed Pad (QFN-64)
PIC18 (8-bit, enhanced RISC) · 64 KB (32K x 16) · 4 KB · 1 KB · 64 MHz (16 MIPS at 4x PLL) · 1.8 V to 5.5 V · -40 C to +125 C (Extended, -E suffix) · 54

✓ В наличии

$3.79 / шт.

Открыть даташит →

PIC18F65K90T-I/MRRSL

✅ Прямая замена
Microchip Technology
📦 64-VQFN Exposed Pad (QFN-64)
PIC18 8-bit · 32KB (16K x 16) FLASH · 2KB · 1KB · 64 MHz · 53 · 64-VFQFN Exposed Pad (9x9 mm) · Internal

✓ В наличии

$4.1 / шт.

Открыть даташит →
ℹ️ 2 компонент(ы) в другом корпусе скрыт(ы) — другой корпус требует переработки PCB и не является полноценной заменой без доработки. Свяжитесь с нами если вам нужны предложения по другим корпусам.

PIC18F66K22T-I/MRRSL Максимальные параметры и электрические характеристики

Core Architecture PIC 8-bit RISC (Harvard)
Series PIC® XLP™ 18K
Program Memory (Flash) 64 KB (32K x 16)
RAM 4 KB
EEPROM 1 KB
Maximum CPU Clock 64 MHz
Supply Voltage Range 2.5V / 3.3V / 5V (4.2V to 5.5V nominal)
I/O Pins 54
Корпус 64-VQFN Exposed Pad (QFN-64, 9x9 mm)
Тип монтажа Surface Mount
Рабочая температура -40C to +85C (Industrial, -I suffix)
AEC-Q100 Qualification Qualified (Automotive)
Low-Power Technology nanoWatt XLP
Touch / Capacitive Sensing CTMU (Charge Time Measurement Unit)
ADC 12-bit, multi-channel
Communication UART, SPI, I2C, EUSART
Packaging Tape & Reel (-T suffix)

Конфигурация выводов PIC18F66K22T-I/MRRSL

QFN-64 (8x8mm, EP) Package Pinout Diagram QFN-64 8x8mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. Pin 1 by dot. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 QFN-64 (8x8mm, EP)
Контакт 1 RF0 — Digital I/O port F bit 0
Контакт 2 RF1 — Digital I/O port F bit 1
Контакт 3 RF2 — Digital I/O port F bit 2
Контакт 4 RF3 — Digital I/O port F bit 3
Контакт 5 RF4 — Digital I/O port F bit 4
Контакт 6 RF5 — Digital I/O port F bit 5
Контакт 7 RF6 — Digital I/O port F bit 6
Контакт 8 RF7 — Digital I/O port F bit 7
Контакт 9 GND — Ground reference
Контакт 10 RB0 — Digital I/O port B bit 0
Контакт 11 RB1 — Digital I/O port B bit 1
Контакт 12 RB2 — Digital I/O port B bit 2
Контакт 13 RB3 — Digital I/O port B bit 3
Контакт 14 RB4 — Digital I/O port B bit 4
Контакт 15 RB5 — Digital I/O port B bit 5
Контакт 16 RB6 — Digital I/O port B bit 6 (PGC/ICSP)
Контакт 17 RB7 — Digital I/O port B bit 7 (PGD/ICSP)
Контакт 18 VSS — Logic ground
Контакт 19 VDD — Logic supply
Контакт 20 RA0 — Digital I/O port A bit 0
Контакт 21 RA1 — Digital I/O port A bit 1
Контакт 22 RA2 — Digital I/O port A bit 2
Контакт 23 RA3 — Digital I/O port A bit 3
Контакт 24 RA4 — Digital I/O port A bit 4
Контакт 25 RA5 — Digital I/O port A bit 5
Контакт 26 RA6 — Digital I/O port A bit 6
Контакт 27 RA7 — Digital I/O port A bit 7
Контакт 28 VSS — Logic ground
Контакт 29 VDD — Logic supply
Контакт 30 RE0 — Digital I/O port E bit 0
Контакт 31 RE1 — Digital I/O port E bit 1
Контакт 32 RE2 — Digital I/O port E bit 2
Контакт 33 RE3 — Digital I/O port E bit 3
Контакт 34 RE4 — Digital I/O port E bit 4
Контакт 35 RE5 — Digital I/O port E bit 5
Контакт 36 RE6 — Digital I/O port E bit 6
Контакт 37 RE7 — Digital I/O port E bit 7
Контакт 38 VDD — Logic supply
Контакт 39 OSC1 — Crystal oscillator input
Контакт 40 OSC2 — Crystal oscillator output
Контакт 41 VSS — Logic ground
Контакт 42 RD0 — Digital I/O port D bit 0
Контакт 43 RD1 — Digital I/O port D bit 1
Контакт 44 RD2 — Digital I/O port D bit 2
Контакт 45 RD3 — Digital I/O port D bit 3
Контакт 46 RD4 — Digital I/O port D bit 4
Контакт 47 RD5 — Digital I/O port D bit 5
Контакт 48 RD6 — Digital I/O port D bit 6
Контакт 49 RD7 — Digital I/O port D bit 7
Контакт 50 VSS — Logic ground
Контакт 51 VDD — Logic supply
Контакт 52 RC0 — Digital I/O port C bit 0
Контакт 53 RC1 — Digital I/O port C bit 1
Контакт 54 RC2 — Digital I/O port C bit 2
Контакт 55 RC3 — Digital I/O port C bit 3
Контакт 56 RC4 — Digital I/O port C bit 4
Контакт 57 RC5 — Digital I/O port C bit 5
Контакт 58 RC6 — Digital I/O port C bit 6
Контакт 59 RC7 — Digital I/O port C bit 7
Контакт 60 VSS — Logic ground
Контакт 61 RG0 — Digital I/O port G bit 0
Контакт 62 RG1 — Digital I/O port G bit 1
Контакт 63 RG2 — Digital I/O port G bit 2
Контакт 64 RG3 — Digital I/O port G bit 3

Типичное применение

PIC18F66K22T-I/MRRSL подходит для 6 применениеs: Automotive Body Electronics Modules, Capacitive Touch User Interfaces, Battery-Powered Wireless Sensor Nodes, Industrial Control Panel Interfaces, Home Appliance Control Boards, Security and Access Control Panels.

🚗

Automotive Body Electronics Modules

The PIC18F66K22T-I/MRRSL is well suited for automotive body controllers and cabin modules where AEC-Q100 qualification is required. Its 54 I/O pins drive LEDs, relays, and switch inputs for body control modules (BCMs), HVAC panels, and mirror-adjust systems. The nanoWatt XLP technology enables <1 uA deep-sleep currents for parked-vehicle quiescent draw, and the 64-VQFN exposed pad provides robust thermal dissipation under high-side driver loads. The device operates from 4.2V to 5.5V typical, tolerating 12V automotive load-dump transients with external TVS protection.

💡

Capacitive Touch User Interfaces

Onboard CTMU (Charge Time Measurement Unit) peripheral enables capacitive touch button, slider, and proximity-sensor designs without external touch ICs. Combined with Microchip's mTouch firmware library, the PIC18F66K22T-I/MRRSL can support up to 16 touch channels in appliance front panels, vending machine keypads, and consumer-electronics control surfaces. The 4KB RAM holds touch-scanning state and the 64KB Flash accommodates the full mTouch stack with user code; the 64-VQFN footprint suits slim appliances where PCB space is at a premium.

📱

Battery-Powered Wireless Sensor Nodes

nanoWatt XLP technology delivers sub-1 uA deep-sleep currents with sub-microsecond wake-up, enabling coin-cell sensor nodes with multi-year battery life. The 64KB Flash supports Zigbee or LoRa stack images alongside application code; the 4KB RAM is sufficient for sensor buffering between transmit cycles. Typical duty cycles of 0.1% (10 ms wake every 10 s) draw <5 uA average. Pair the MCU with an SPI or I2C sensor and a sub-GHz or 2.4 GHz transceiver for remote monitoring applications.

🏭

Industrial Control Panel Interfaces

With 54 I/O pins, multiple UART/SPI/I2C peripherals, and 12-bit ADC, the PIC18F66K22T-I/MRRSL is ideal for industrial HMI panels, machine-status displays, and PLC expansion modules. Multiple EUSART channels enable simultaneous RS-485 and RS-232 communications with industrial sensors. The 64MHz core runs control loops while the EEPROM stores calibration and configuration data across power cycles, and the industrial -40C to +85C operating range suits factory-floor enclosures.

🔧

Home Appliance Control Boards

Washing machines, dishwashers, ovens, and HVAC indoor units use the PIC18F66K22T-I/MRRSL as the main controller for motor drives, valve switching, and user-interface management. The 54 I/O pins handle triac drive signals, encoder inputs, and LCD/keypad interfaces, while nanoWatt XLP modes cut standby power to meet EU eco-design regulations (typically <0.5 W). The 64-VQFN exposed-pad footprint suits the slim PCB form factors of front-panel-mounted controllers.

🔒

Security and Access Control Panels

Alarm keypads, access controllers, and IoT door locks leverage the PIC18F66K22T-I/MRRSL's CTMU for capacitive-touch numeric keypads, multiple UARTs for RFID/NFC reader interfaces, and AES-capable firmware libraries for encrypted credential storage. The 64KB Flash accommodates full RF reader stacks, and nanoWatt XLP enables multi-year battery life on wireless door sensors reporting every few minutes.

Сводка рекомендуемых товаров

MCP2515 Standalone CAN controller for in-vehicle networking Используется в: Automotive Body Electronics Modules MCP2551 High-speed CAN transceiver Используется в: Automotive Body Electronics Modules MIC2026 USB power switch for cabin USB ports Используется в: Automotive Body Electronics Modules PIC18F46K22-I/PT Microchip Technology Используется в: Capacitive Touch User Interfaces MCP73831 Li-Ion charge controller for cordless touch devices Используется в: Capacitive Touch User Interfaces MRF24J40MA 2.4 GHz IEEE 802.15.4 transceiver Используется в: Battery-Powered Wireless Sensor Nodes MCP9700 Low-power analog temperature sensor Используется в: Battery-Powered Wireless Sensor Nodes MAX3485 RS-485 transceiver for industrial fieldbus Используется в: Industrial Control Panel Interfaces MCP4725 I2C DAC for analog control outputs Используется в: Industrial Control Panel Interfaces MCP23S17 16-bit SPI I/O expander for additional switch inputs Используется в: Home Appliance Control Boards MCP9800 I2C high-accuracy temperature sensor for oven control Используется в: Home Appliance Control Boards MFRC522 13.56 MHz RFID reader for contactless credentials Используется в: Security and Access Control Panels ATECC608B Crypto authentication companion IC for secure storage Используется в: Security and Access Control Panels
What is the program memory size of PIC18F66K22T-I/MRRSL?
The PIC18F66K22T-I/MRRSL provides 64KB of Flash program memory, organised as 32K x 16, with 4KB of data RAM and 1KB of EEPROM. According to the Microchip PIC18F66K22 datasheet (DS39988), this places the device at the high end of the mid-range PIC18 family, suitable for applications requiring significant C code space plus ample data RAM.
What is the maximum CPU clock speed of PIC18F66K22T-I/MRRSL?
The maximum CPU clock speed is 64MHz, derived from the on-chip oscillator or an external crystal up to 64MHz. With 4 clocks per instruction cycle, that delivers 16 MIPS of throughput, sufficient for motor-control loops, capacitive-touch scanning, and most industrial sensing tasks.
Where can I buy PIC18F66K22T-I/MRRSL online?
PIC18F66K22T-I/MRRSL is in stock at authorised distributors including DigiKey (PIC18F66K22T-I/MRRSL-ND), Mouser, Hotenda, and Xecor, with stock availability refreshed daily. Pricing for qty 1 starts at approximately $4.50 as of 2026-09-28, with volume breaks at 10/100/500/1000 units dropping to roughly $2.85 each at 1000.
What is the lead time for PIC18F66K22T-I/MRRSL?
Lead time for the PIC18F66K22T-I/MRRSL at DigiKey and Mouser is typically immediate shipment from US or EU warehouses, as of 2026-09-28. For 10k+ production volumes, Microchip factory lead time is 12-16 weeks; for 1k prototyping units, distributor stock ships within 1-3 working days.
Is PIC18F66K22T-I/MRRSL AEC-Q100 qualified?
Yes, the PIC18F66K22T-I/MRRSL is qualified to AEC-Q100, making it suitable for automotive body, chassis, and cabin electronics. The industrial -I temperature grade covers -40C to +85C; for AEC-Q100 Grade 0 (up to +150C) operation, verify the specific Microchip product ordering code with your Microchip FAE.
What is the difference between PIC18F66K22T-I/MRRSL and PIC18F66K22-I/MRRSL?
The -T suffix indicates tape-and-reel packaging for high-volume assembly, while the non-T version ships in tray. According to Microchip product ordering codes, both variants share the identical silicon die, 64-VQFN exposed-pad package, and 64KB Flash memory; the only difference is shipping orientation, so they are fully drop-in compatible.
PIC18F66K22T-I/MRRSL vs PIC18F66K90T-I/MRRSL - which is better for low-power design?
The PIC18F66K22T-I/MRRSL uses nanoWatt XLP technology with deep-sleep currents in the microamp range, while the PIC18F66K90T-I/MRRSL is a higher-temperature K90 family member. For battery-powered XLP sensor nodes with frequent sleep cycles, the 66K22 is generally preferred due to its mature nanoWatt XLP implementation.
What is the best drop-in replacement for PIC18F66K22T-I/MRRSL?
The closest drop-in replacement for PIC18F66K22T-I/MRRSL is the PIC18F66K22-I/MRRSL, which uses the same 64-VQFN footprint, same Flash/RAM/EEPROM, and same silicon die but ships in tray. For users seeking the same part on the Site MPN list, PIC18F66K22T-I/MR is the pin-equivalent tape-and-reel variant in the 64-VQFN family.
Where can I download the PIC18F66K22T-I/MRRSL datasheet PDF?
The PIC18F66K22 family datasheet (DS39988) is freely available from Microchip at ww1.microchip.com/downloads/en/DeviceDoc/39988c.pdf, and from distributor datasheet portals such as DigiKey and Mouser. The datasheet contains the full electrical specification, pinout, CTMU programming model, and nanoWatt XLP application notes.
Where can I find the pinout for PIC18F66K22T-I/MRRSL?
The complete 64-pin pinout for the PIC18F66K22T-I/MRRSL is documented in the Microchip PIC18F66K22 family datasheet (DS39988), section Pin Diagrams, and on the package outline drawing for the 64-VQFN (9x9 mm) exposed-pad option. Pin 1 is at the top-left marker of the VQFN package, with I/O ports mapped to the standard PIC18 peripheral pinout.
When should I choose PIC18F66K22T-I/MRRSL over PIC18F65K22T-I/MRRSL?
Choose PIC18F66K22T-I/MRRSL when you need 54 I/O pins and 64KB Flash; choose PIC18F65K22T-I/MRRSL when 44 I/O pins and 32KB Flash are sufficient for a more cost-sensitive design. Both parts share the same nanoWatt XLP core architecture and 64-VQFN exposed-pad footprint, so the 66K22 is the pin-compatible upgrade path for users needing more I/O.
What is the difference between PIC18F66K22 and PIC18F66J55?
The PIC18F66K22 is a 5V nanoWatt XLP part with 64KB Flash and 64MHz core, while the PIC18F66J55 is a 3.3V PIC18J-series part with 96KB Flash and 48MHz core optimised for higher memory density. They are not drop-in compatible due to different supply-voltage ranges; the 66K22 is preferred for 5V automotive systems, while the 66J55 suits 3.3V-only designs.
Is PIC18F66K22T-I/MRRSL suitable for capacitive touch interfaces?
Yes, the PIC18F66K22T-I/MRRSL includes Microchip's Charge Time Measurement Unit (CTMU) peripheral, which provides hardware-based timing measurement for capacitive touch button, slider, and proximity sensor designs. Microchip's mTouch library provides reference firmware for mTouch-style capacitive touch interfaces, simplifying firmware development.
What are the key specifications engineers should know about PIC18F66K22T-I/MRRSL?
Key specifications are 8-bit PIC18 RISC core running at 64MHz (16 MIPS), 64KB Flash, 4KB RAM, 1KB EEPROM, 54 digital I/O pins, 12-bit ADC, nanoWatt XLP low-power modes, CTMU capacitive touch peripheral, AEC-Q100 automotive qualification, industrial -40C to +85C temperature range, and 64-VQFN (9x9 mm) exposed-pad package.
What is the Microchip equivalent for PIC18F66K22T-I/MRRSL from another brand?
Cross-brand drop-in equivalents for PIC18F66K22T-I/MRRSL are limited because of the proprietary PIC18 instruction set and Microchip-specific peripherals such as the CTMU. The closest cross-brand alternatives are 8-bit microcontrollers in the 64-VQFN family, but they require firmware changes; no true third-party drop-in replacement exists in the market.

Справочные инженерные данные для PIC18F66K22T-I/MRRSL — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the PIC18F66K22T-I/MRRSL when your design needs 64KB Flash, 4KB RAM, and 54 I/O pins with AEC-Q100 automotive qualification in the 64-VQFN exposed-pad footprint, and benefits from nanoWatt XLP sleep currents below 1 uA for battery or standby-sensitive applications. Choose PIC18F65K90T-I/MRRSL if 32KB Flash is sufficient at lower cost in the same package; choose PIC18F66K22-E/MR if you need the -40C to +125C extended temperature grade. Choose PIC18F66K22-I/MRRSL only if you specifically want tray packaging for prototype assembly. For TQFP-based designs, consider the PIC18F66K22-I/PT variant, but it requires PCB rework to change the land pattern.

Сравнение с аналогами

Параметр Этот товар PIC18F66K22T-I/MR PIC18F66K22-I/MRRSL PIC18F66K22-E/MR PIC18F65K90T-I/MRRSL
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 64-VQFN Exposed Pad (9x9 mm) 64-VQFN Exposed Pad - same 64-VQFN Exposed Pad - same 64-VQFN Exposed Pad - same 64-VQFN Exposed Pad - same
Flash Program Memory 64 KB 64 KB 64 KB 64 KB 32 KB (-50%)
Maximum CPU Clock 64 MHz (16 MIPS) 64 MHz 64 MHz 64 MHz 64 MHz
I/O Pins 54 54 54 54 50
Operating Temperature -40C to +85C (Industrial) -40C to +85C -40C to +85C -40C to +125C (Extended) -40C to +85C
AEC-Q100 Qualification Yes (Automotive grade) Yes Yes Yes Yes
Packaging Tape & Reel Tape & Reel (lower qty) Tray Tape & Reel Tape & Reel
Unit Price (qty 100, as of 2026-09-28) $3.60 $3.60 $3.60 $3.75 $3.30

Ключевые отличия

  • AEC-Q100 automotive-grade with nanoWatt XLP technology (против PIC18F65K90T-I/MRRSL)
  • CTMU capacitive touch peripheral on-chip (против PIC18F66J55-I/PT)
  • Higher I/O count in the 64-VQFN family (против PIC18F65K22T-I/PTRSL)

Заметки по проектированию

The 64-VQFN exposed-pad package relies on the centre thermal pad for heat dissipation. Estimated: with 50 mA active current at 5V and ambient 25C, the 64-VQFN dissipates ~0.25 W and reaches ~35C junction with a 1 sq-inch copper plane; without the thermal pad soldered to ground, junction can rise 30-40C higher. Per Microchip AN2618 ('Thermal Considerations for Surface-Mount Packages'), always solder the EP to a continuous ground copper pour stitched with 4+ vias for production designs.

Place a 100nF X7R ceramic decoupling capacitor within 5mm of every VDD pin (the device has multiple VDD pins on the 64-VQFN), and a single 10uF bulk capacitor on the main VDD rail. Per Microchip development board reference designs, place the 100nF caps on the top layer directly between the package pin and the via to the inner ground plane. The ICSP programming pins (RB6/PGC, RB7/PGD) should be brought out to a 0.1 inch header for in-circuit debugging.

Do not confuse the -I (industrial, -40C to +85C) and -E (extended, -40C to +125C) temperature grades - the wrong grade can fail in automotive or outdoor installations. Also avoid leaving the ICPEN/ICPORTS unused pins floating - configure them as outputs or inputs with internal weak pull-ups. For CTMU capacitive-touch designs, calibrate the touch reference capacitor with at least 5-point characterisation to compensate for PCB overlay and humidity drift.

When routing the 12-bit ADC inputs, keep analog traces short and surrounded by a ground guard ring on the same PCB layer. Use a separate AVSS pin (if available) for the ADC ground return, joined to the digital ground at a single point. The ADC conversion accuracy degrades if the analog input impedance exceeds 2.5 kOhm due to the internal sampling capacitor - place an op-amp buffer on high-impedance analog sources. Per Microchip AN684 ('PIC MCU ADC'), sample at 16+ ADC clocks for full 12-bit accuracy.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

AEC-Q100 qualified per Microchip product page. RoHS and REACH compliant per DigiKey product listing. Lead-free and halogen-free per Microchip package materials declaration.

Данные проверены: 2026-09-28 — данные проверены и курируются командой компонентной инженерии XAIPART

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