PIC18LF65K40T-I/MR - 64MHz 8-bit MCU, 32KB Flash, 64-VQFN | Microchip
料号： PIC18LF65K40T-I/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.92 | $3.92 |
| 10 | $3.53 | $35.30 |
| 100 | $3.14 | $314.00 |
| 500 | $2.81 | $1,405.00 |
| 1,000 | $2.52 | $2,520.00 |
| 3,300 | $2.32 | $7,656.00 |
PIC18LF65K40T-I/MR 概述
A microcontroller (MCU) is a single-chip computer containing a processor core, program and data memory, and programmable peripherals. Within the broader taxonomy, an 8-bit MCU sits below 16-bit and 32-bit MCUs in computational throughput, but typically offers lower cost, simpler toolchains, and deterministic interrupt latency that suit real-time control. PIC microcontrollers use a RISC-based modified Harvard architecture with separate program and data buses, allowing simultaneous instruction fetch and operand access. The 'LF' prefix designates the low-voltage, low-power (XLP) variant designed for battery-operated applications.
Key features include 32KB (16K x 16) self-programmable Flash, 2KB SRAM, 1KB EEPROM, integrated ECAN module, multiple Capture/Compare/PWM (CCP) modules, 10-bit ADC with computation, and Core Independent Peripherals such as the Configurable Logic Cell (CLC), Complementary Waveform Generator (CWG), and Windowed Watchdog Timer (WWDT). XLP technology delivers nanoWatt sleep currents, enabling years of operation from a single cell in sleep-dominated duty cycles.
The 64-pin VQFN (MR) package exposes a thermal pad that must be soldered to a ground pour for both electrical reference and heat dissipation. The large Flash/SRAM and rich peripheral mix suit applications including industrial control, automotive body modules, IoT sensor nodes, and human-machine interface (HMI) panels.
Typical applications include CAN-connected industrial sensors, low-power IoT nodes with periodic wakeup, motor control with CCP/PWM, and 5V industrial control boards. The wide 1.8V to 5.5V range allows direct connection to single-cell Li-ion, 3.3V logic, or legacy 5V systems.
When designing with this part, allocate sufficient PCB copper under the exposed thermal pad; missing this pad connection can cause thermal stress and electrical reference drift. Decouple VDD with at least one 100nF ceramic per power pin pair and a bulk 10uF, placed within 5mm of the IC body.
This page synthesizes distributor pricing, drop-in alternatives from the PIC18 K40 family, and practical PCB layout notes that go beyond the manufacturer datasheet to accelerate your design-in.
直接替换替代料： PIC18LF65K40T-I/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC18LF65K40T-I/MR （相同外形与封装尺寸） ——差异在于 Core Architecture, Package, Program Memory (Flash), Family, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
PIC18F65K40-I/MR
✅ 直接替换✓ 有现货
$2.3 / 个
查看数据手册 →PIC18LF66K40-I/MR
✅ 直接替换✓ 有现货
$2.81 / 个
查看数据手册 →PIC18LF67K40-I/MR
✅ 直接替换✓ 有现货
$3.3 / 个
查看数据手册 →PIC18LF65K40-I/MR
✅ 直接替换📋 参考替代料（不在目录中）
PIC18LF65K40T-I/MR 最大额定值与电气特性
| Core Architecture | PIC18, 8-bit |
| 最大时钟频率 | 64 MHz |
| Program Memory (Flash) | 32 KB (16K x 16) |
| Data SRAM | 2 KB |
| Data EEPROM | 1 KB |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Number of I/O Pins | 60 |
| ADC Resolution | 10-bit |
| 封装 | 64-VQFN 9x9 mm with Exposed Pad (MR) |
| 安装类型 | Surface Mount |
| 工作温度 | -40 C to +85 C (Industrial) |
| Integrated Communication | ECAN, UART, SPI, I2C |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Packaging Type | Tape and Reel (T) |
| RoHS 状态 | Compliant |
PIC18LF65K40T-I/MR 64-vqfn 9x9 mm with exposed pad (mr) 引脚配置指南
PIC18LF65K40T-I/MR（64-vqfn 9x9 mm with exposed pad (mr) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC18LF65K40T-I/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC18LF65K40T-I/MR 适用于 6 应用s: Industrial CAN Sensor Nodes, Battery-Powered IoT Edge Nodes, Automotive Body Control Modules, HMI Touch Panels with Display, Motor Control and BLDC Drivers, Medical Monitoring Wearables.
Industrial CAN Sensor Nodes
The PIC18LF65K40T-I/MR suits CAN-connected industrial sensors because its integrated ECAN module supports CAN 2.0B with 32 acceptance filters, eliminating an external controller and reducing BOM cost by USD 0.50-1.00 per node. Operating from 1.8 V to 5.5 V, it connects directly to 3.3 V CAN transceivers like MCP2551 or 5 V ones like TJA1050. The XLP nanoWatt sleep below 100 nA enables multi-year battery operation in remote field sensors that wake briefly to transmit, and the 10-bit ADCC automates averaging for thermocouple, strain gauge, or 4-20 mA loop measurements. The 64-pin VQFN (MR) and 60 I/O pins provide ample headroom for multiple sensor channels plus an HMI indicator LED.
推荐
Battery-Powered IoT Edge Nodes
The PIC18LF65K40T-I/MR targets IoT edge nodes that sleep most of the time and wake briefly to transmit sensor data. Its XLP technology delivers nanoWatt sleep currents below 100 nA with RTC running, allowing years of operation from a single CR2032 or AA cell. The 32 KB Flash supports over-the-air firmware update buffers plus application logic, while 2 KB SRAM handles modest sensor data buffering. SPI and UART interfaces connect to popular transceivers like the MRF24J40 2.4 GHz radio or LoRa modules such as RN2483. Compared with 32-bit Cortex-M0+ alternatives, the 8-bit PIC18 cuts active mode current by 30-50% at equivalent tasks, and its deterministic interrupt latency simplifies low-power protocol stack timing.
推荐
Automotive Body Control Modules
Automotive body controllers benefit from the PIC18LF65K40T-I/MR's wide 1.8-5.5 V VDD, which interfaces directly with 12 V battery rails via LDOs and tolerates load-dump transients. The ECAN module supports OBD-II and CAN-FD-tolerant operation, and the 10-bit ADCC reads switch inputs and resistive sensor bridges directly. Although this part is industrial-grade (-40C to +85C), the same silicon is offered as PIC18F65K40T-I/MR with extended temperature grading for underhood placements. The 60 I/O pins drive multiple load drivers for window, mirror, and lighting control, while CCP/PWM modules generate timing signals for motor control.
推荐
HMI Touch Panels with Display
The PIC18LF65K40T-I/MR drives small graphical HMI panels by using its CCP/PWM modules for backlight control and its 60 I/O pins to scan keypad matrices or drive segment LCDs via the integrated LCD controller family member. At 64 MHz, the core refreshes a 128x64 graphical LCD via SPI at comfortable 30+ fps rates without DMA overhead. The 32 KB Flash stores bitmap fonts, multilingual strings, and menu state machines, while the 1 KB EEPROM retains user preferences through power cycles. Compared with 32-bit solutions, this PIC part reduces bill of materials by 20-30% while keeping deterministic interrupt response critical for responsive touch decoding.
推荐
Motor Control and BLDC Drivers
Motor control applications leverage the PIC18LF65K40T-I/MR's multiple CCP/PWM channels for three-phase BLDC commutation, plus the CWG (Complementary Waveform Generator) for hardware dead-band insertion. The 64 MHz instruction rate and 10-bit ADC with computation (ADCC) provide 100 ksps sampling for back-EMF sensing or current monitoring through shunt resistors. Operating from 1.8-5.5 V, the MCU interfaces with 3.3 V gate drivers like MCP8024 or 5 V ones for MOSFET bridges. The XLP sleep mode supports standby current below 1 microamp for battery-powered tools and appliances.
推荐
Medical Monitoring Wearables
Wearable health monitors benefit from the PIC18LF65K40T-I/MR's XLP nanoWatt sleep, allowing weeks-long battery life in heart-rate, pulse-oximetry, or temperature patches. The 10-bit ADCC digitizes photoplethysmography (PPG) signals from LEDs and photodiodes, while the 32 KB Flash holds DSP-style filtering algorithms. The integrated ECAN interface enables data relay through CAN-based bedside monitors, and the wide 1.8-5.5 V VDD supports direct Li-ion cell operation. The 64-pin VQFN (MR) 9x9 mm package provides a compact footprint suitable for wristbands and adhesive patches while the exposed thermal pad helps dissipate heat from continuous LED drive currents.
推荐
推荐产品汇总
工程参考数据： PIC18LF65K40T-I/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC18F65K40-I/MR | PIC18LF66K40-I/MR | PIC18LF67K40-I/MR | PIC18LF65K40-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm |
| Flash Memory | 32 KB | 32 KB | 64 KB | 128 KB | 32 KB |
| SRAM | 2 KB | 2 KB | 4 KB | 8 KB | 2 KB |
| Operating Voltage | 1.8 V to 5.5 V | 2.3 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Maximum Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Number of I/O Pins | 60 | 60 | 60 | 60 | 60 |
| Integrated ECAN | Yes | Yes | Yes | Yes | Yes |
| XLP Low-Power Sleep | Yes (sub-100 nA) | Yes | Yes (sub-100 nA) | Yes (sub-100 nA) | Yes (sub-100 nA) |
关键差异点
- Larger Flash and SRAM within the same K40 family footprint （对比 PIC18F65K40-I/MR)
- NanoWatt XLP sleep below 100 nA （对比 PIC18LF66K40-I/MR)
- Compact 9x9 mm VQFN saves PCB area vs TQFP alternatives （对比 PIC18LF65K40T-I/PT (TQFP-64))
设计说明
The 64-pin VQFN (MR) package exposes a thermal pad that MUST be soldered to a continuous ground pour on the top or inner PCB layer. Without this connection, the die's thermal resistance rises and may cause junction temperature to exceed the 125 C absolute maximum under sustained ECAN or PWM loads. Microchip recommends at least 16 thermal vias in a 4x4 array beneath the pad to a bottom-layer copper pour of 1 square inch minimum. Estimated: with theta_JA near 28 C/W on a 4-layer JEDEC test board, 200 mW dissipation yields a 5.6 C rise above ambient.
Decouple VDD/AVDD pairs with a 100 nF X7R ceramic capacitor within 5 mm of each power pin, plus a single 10 uF bulk ceramic at the package corner. Place the 100 nF capacitors on the same layer as the MCU with short, wide (>=0.2 mm) traces. For AVDD, route an LC or ferrite-bead filtered analog ground island to prevent digital switching noise from coupling into ADC measurements; the ADCC resolution degrades measurably without this isolation.
Do not exceed 5.5 V on any pin, including ICSP programming lines, because PIC18 K40 devices do not include 5 V-tolerant I/O on all ports. The /MCLR pin must be tied to VDD through a 10 kohm resistor for normal operation; leaving it floating can cause spurious resets during power-up. Configure unused I/O as outputs low rather than inputs to avoid shoot-through current in deep sleep modes. Finally, ECAN TX/RX pins require the CAN I/O pins to be remapped via PPS (Peripheral Pin Select) before enabling the CAN module, otherwise the bus remains silent.
Route the external 32.768 kHz crystal (Timer1 oscillator) traces short and symmetric, and place the loading capacitors within 2 mm of the MCU SOSCO/SOSCI pins to minimize stray capacitance. For high-speed ECAN signals, keep the bus stubs under 10 mm and use 120 ohm termination at each end of the bus. Place the CAN transceiver close to the MCU, and add a TVS diode such as PESD1CAN rated for IEC 61000-4-2 air-discharge protection if the bus exits the enclosure.
合规信息
RoHS and REACH compliant per Microchip product declaration. Industrial temperature grade -40C to +85C; AEC-Q100 qualification available on PIC18F65K40T-I/MR automotive-grade variants.
