PIC18LF65K40T-I/MR - 64MHz 8-bit MCU, 32KB Flash, 64-VQFN | Microchip
部品番号: PIC18LF65K40T-I/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.92 | $3.92 |
| 10 | $3.53 | $35.30 |
| 100 | $3.14 | $314.00 |
| 500 | $2.81 | $1,405.00 |
| 1,000 | $2.52 | $2,520.00 |
| 3,300 | $2.32 | $7,656.00 |
PIC18LF65K40T-I/MR 概要
A microcontroller (MCU) is a single-chip computer containing a processor core, program and data memory, and programmable peripherals. Within the broader taxonomy, an 8-bit MCU sits below 16-bit and 32-bit MCUs in computational throughput, but typically offers lower cost, simpler toolchains, and deterministic interrupt latency that suit real-time control. PIC microcontrollers use a RISC-based modified Harvard architecture with separate program and data buses, allowing simultaneous instruction fetch and operand access. The 'LF' prefix designates the low-voltage, low-power (XLP) variant designed for battery-operated applications.
Key features include 32KB (16K x 16) self-programmable Flash, 2KB SRAM, 1KB EEPROM, integrated ECAN module, multiple Capture/Compare/PWM (CCP) modules, 10-bit ADC with computation, and Core Independent Peripherals such as the Configurable Logic Cell (CLC), Complementary Waveform Generator (CWG), and Windowed Watchdog Timer (WWDT). XLP technology delivers nanoWatt sleep currents, enabling years of operation from a single cell in sleep-dominated duty cycles.
The 64-pin VQFN (MR) package exposes a thermal pad that must be soldered to a ground pour for both electrical reference and heat dissipation. The large Flash/SRAM and rich peripheral mix suit applications including industrial control, automotive body modules, IoT sensor nodes, and human-machine interface (HMI) panels.
Typical applications include CAN-connected industrial sensors, low-power IoT nodes with periodic wakeup, motor control with CCP/PWM, and 5V industrial control boards. The wide 1.8V to 5.5V range allows direct connection to single-cell Li-ion, 3.3V logic, or legacy 5V systems.
When designing with this part, allocate sufficient PCB copper under the exposed thermal pad; missing this pad connection can cause thermal stress and electrical reference drift. Decouple VDD with at least one 100nF ceramic per power pin pair and a bulk 10uF, placed within 5mm of the IC body.
This page synthesizes distributor pricing, drop-in alternatives from the PIC18 K40 family, and practical PCB layout notes that go beyond the manufacturer datasheet to accelerate your design-in.
ドロップイン代替品: PIC18LF65K40T-I/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC18LF65K40T-I/MR （同一形状・フットプリント） — 相違点: Core Architecture, Package, Program Memory (Flash), Family, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
PIC18F65K40-I/MR
✅ ドロップイン✓ 在庫あり
$2.3 / 個
データシートを見る →PIC18LF66K40-I/MR
✅ ドロップイン✓ 在庫あり
$2.81 / 個
データシートを見る →PIC18LF67K40-I/MR
✅ ドロップイン✓ 在庫あり
$3.3 / 個
データシートを見る →PIC18LF65K40-I/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC18LF65K40T-I/MR 最大定格＆電気的特性
| Core Architecture | PIC18, 8-bit |
| 最大クロック周波数 | 64 MHz |
| Program Memory (Flash) | 32 KB (16K x 16) |
| Data SRAM | 2 KB |
| Data EEPROM | 1 KB |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Number of I/O Pins | 60 |
| ADC Resolution | 10-bit |
| パッケージ | 64-VQFN 9x9 mm with Exposed Pad (MR) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 C to +85 C (Industrial) |
| Integrated Communication | ECAN, UART, SPI, I2C |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Packaging Type | Tape and Reel (T) |
| RoHS ステータス | Compliant |
PIC18LF65K40T-I/MR 64-vqfn 9x9 mm with exposed pad (mr) ピン配置ガイド
PIC18LF65K40T-I/MR (64-vqfn 9x9 mm with exposed pad (mr) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: PIC18LF65K40T-I/MR.
詳細は データシート をご参照ください。
主な用途
PIC18LF65K40T-I/MR の用途: 6 件s: Industrial CAN Sensor Nodes, Battery-Powered IoT Edge Nodes, Automotive Body Control Modules, HMI Touch Panels with Display, Motor Control and BLDC Drivers, Medical Monitoring Wearables.
Industrial CAN Sensor Nodes
The PIC18LF65K40T-I/MR suits CAN-connected industrial sensors because its integrated ECAN module supports CAN 2.0B with 32 acceptance filters, eliminating an external controller and reducing BOM cost by USD 0.50-1.00 per node. Operating from 1.8 V to 5.5 V, it connects directly to 3.3 V CAN transceivers like MCP2551 or 5 V ones like TJA1050. The XLP nanoWatt sleep below 100 nA enables multi-year battery operation in remote field sensors that wake briefly to transmit, and the 10-bit ADCC automates averaging for thermocouple, strain gauge, or 4-20 mA loop measurements. The 64-pin VQFN (MR) and 60 I/O pins provide ample headroom for multiple sensor channels plus an HMI indicator LED.
おすすめ
Battery-Powered IoT Edge Nodes
The PIC18LF65K40T-I/MR targets IoT edge nodes that sleep most of the time and wake briefly to transmit sensor data. Its XLP technology delivers nanoWatt sleep currents below 100 nA with RTC running, allowing years of operation from a single CR2032 or AA cell. The 32 KB Flash supports over-the-air firmware update buffers plus application logic, while 2 KB SRAM handles modest sensor data buffering. SPI and UART interfaces connect to popular transceivers like the MRF24J40 2.4 GHz radio or LoRa modules such as RN2483. Compared with 32-bit Cortex-M0+ alternatives, the 8-bit PIC18 cuts active mode current by 30-50% at equivalent tasks, and its deterministic interrupt latency simplifies low-power protocol stack timing.
おすすめ
Automotive Body Control Modules
Automotive body controllers benefit from the PIC18LF65K40T-I/MR's wide 1.8-5.5 V VDD, which interfaces directly with 12 V battery rails via LDOs and tolerates load-dump transients. The ECAN module supports OBD-II and CAN-FD-tolerant operation, and the 10-bit ADCC reads switch inputs and resistive sensor bridges directly. Although this part is industrial-grade (-40C to +85C), the same silicon is offered as PIC18F65K40T-I/MR with extended temperature grading for underhood placements. The 60 I/O pins drive multiple load drivers for window, mirror, and lighting control, while CCP/PWM modules generate timing signals for motor control.
おすすめ
HMI Touch Panels with Display
The PIC18LF65K40T-I/MR drives small graphical HMI panels by using its CCP/PWM modules for backlight control and its 60 I/O pins to scan keypad matrices or drive segment LCDs via the integrated LCD controller family member. At 64 MHz, the core refreshes a 128x64 graphical LCD via SPI at comfortable 30+ fps rates without DMA overhead. The 32 KB Flash stores bitmap fonts, multilingual strings, and menu state machines, while the 1 KB EEPROM retains user preferences through power cycles. Compared with 32-bit solutions, this PIC part reduces bill of materials by 20-30% while keeping deterministic interrupt response critical for responsive touch decoding.
おすすめ
Motor Control and BLDC Drivers
Motor control applications leverage the PIC18LF65K40T-I/MR's multiple CCP/PWM channels for three-phase BLDC commutation, plus the CWG (Complementary Waveform Generator) for hardware dead-band insertion. The 64 MHz instruction rate and 10-bit ADC with computation (ADCC) provide 100 ksps sampling for back-EMF sensing or current monitoring through shunt resistors. Operating from 1.8-5.5 V, the MCU interfaces with 3.3 V gate drivers like MCP8024 or 5 V ones for MOSFET bridges. The XLP sleep mode supports standby current below 1 microamp for battery-powered tools and appliances.
おすすめ
Medical Monitoring Wearables
Wearable health monitors benefit from the PIC18LF65K40T-I/MR's XLP nanoWatt sleep, allowing weeks-long battery life in heart-rate, pulse-oximetry, or temperature patches. The 10-bit ADCC digitizes photoplethysmography (PPG) signals from LEDs and photodiodes, while the 32 KB Flash holds DSP-style filtering algorithms. The integrated ECAN interface enables data relay through CAN-based bedside monitors, and the wide 1.8-5.5 V VDD supports direct Li-ion cell operation. The 64-pin VQFN (MR) 9x9 mm package provides a compact footprint suitable for wristbands and adhesive patches while the exposed thermal pad helps dissipate heat from continuous LED drive currents.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC18LF65K40T-I/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC18F65K40-I/MR | PIC18LF66K40-I/MR | PIC18LF67K40-I/MR | PIC18LF65K40-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm | 64-VQFN (MR) 9x9 mm |
| Flash Memory | 32 KB | 32 KB | 64 KB | 128 KB | 32 KB |
| SRAM | 2 KB | 2 KB | 4 KB | 8 KB | 2 KB |
| Operating Voltage | 1.8 V to 5.5 V | 2.3 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Maximum Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Number of I/O Pins | 60 | 60 | 60 | 60 | 60 |
| Integrated ECAN | Yes | Yes | Yes | Yes | Yes |
| XLP Low-Power Sleep | Yes (sub-100 nA) | Yes | Yes (sub-100 nA) | Yes (sub-100 nA) | Yes (sub-100 nA) |
主な差別化要因
- Larger Flash and SRAM within the same K40 family footprint （vs PIC18F65K40-I/MR)
- NanoWatt XLP sleep below 100 nA （vs PIC18LF66K40-I/MR)
- Compact 9x9 mm VQFN saves PCB area vs TQFP alternatives （vs PIC18LF65K40T-I/PT (TQFP-64))
設計ノート
The 64-pin VQFN (MR) package exposes a thermal pad that MUST be soldered to a continuous ground pour on the top or inner PCB layer. Without this connection, the die's thermal resistance rises and may cause junction temperature to exceed the 125 C absolute maximum under sustained ECAN or PWM loads. Microchip recommends at least 16 thermal vias in a 4x4 array beneath the pad to a bottom-layer copper pour of 1 square inch minimum. Estimated: with theta_JA near 28 C/W on a 4-layer JEDEC test board, 200 mW dissipation yields a 5.6 C rise above ambient.
Decouple VDD/AVDD pairs with a 100 nF X7R ceramic capacitor within 5 mm of each power pin, plus a single 10 uF bulk ceramic at the package corner. Place the 100 nF capacitors on the same layer as the MCU with short, wide (>=0.2 mm) traces. For AVDD, route an LC or ferrite-bead filtered analog ground island to prevent digital switching noise from coupling into ADC measurements; the ADCC resolution degrades measurably without this isolation.
Do not exceed 5.5 V on any pin, including ICSP programming lines, because PIC18 K40 devices do not include 5 V-tolerant I/O on all ports. The /MCLR pin must be tied to VDD through a 10 kohm resistor for normal operation; leaving it floating can cause spurious resets during power-up. Configure unused I/O as outputs low rather than inputs to avoid shoot-through current in deep sleep modes. Finally, ECAN TX/RX pins require the CAN I/O pins to be remapped via PPS (Peripheral Pin Select) before enabling the CAN module, otherwise the bus remains silent.
Route the external 32.768 kHz crystal (Timer1 oscillator) traces short and symmetric, and place the loading capacitors within 2 mm of the MCU SOSCO/SOSCI pins to minimize stray capacitance. For high-speed ECAN signals, keep the bus stubs under 10 mm and use 120 ohm termination at each end of the bus. Place the CAN transceiver close to the MCU, and add a TVS diode such as PESD1CAN rated for IEC 61000-4-2 air-discharge protection if the bus exits the enclosure.
コンプライアンス情報
RoHS and REACH compliant per Microchip product declaration. Industrial temperature grade -40C to +85C; AEC-Q100 qualification available on PIC18F65K40T-I/MR automotive-grade variants.
