PIC24F08KA101-E/SS - 16-Bit 32MHz XLP Microcontroller | Microchip
料号： PIC24F08KA101-E/SS ✓ 量产中PIC24F08KA101-E/SS 概述
直接替换替代料： PIC24F08KA101-E/SS ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24F08KA101-E/SS （相同外形与封装尺寸） ——差异在于 I/O Pins, Package.
PIC24F08KA101-I/SS
✅ 直接替换联系询价
查看数据手册 →PIC24F08KA101-E/SS 最大额定值与电气特性
| Architecture | 16-bit PIC microcontroller |
| Program Memory | 8 KB flash (2.75K x 24) |
| RAM | 1.5 KB (1.5K x 8) |
| Maximum CPU Frequency | 32 MHz |
| I/O Pins | 18 |
| 封装 | 20-pin SSOP |
| 安装类型 | Surface mount |
| Oscillator | Internal |
| Low-Power Technology | XLP eXtreme Low Power |
| Deep-Sleep Features | DSBOR, DSWDT, RTCC |
| Serial EEPROM | 512 bytes |
| ADC | 1 ADC |
| Packaging | Tube |
| Manufacturer | Microchip Technology |
PIC24F08KA101-E/SS 20-pin ssop 引脚配置指南
PIC24F08KA101-E/SS（20-pin ssop 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC24F08KA101-E/SS.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC24F08KA101-E/SS 适用于 6 应用s: Battery-powered Sensor Node, Portable Environmental Monitor, Industrial Control Module, Low-Power Data Logger, Smart Home Sensor Interface, Compact Power-Supply Controller.
Battery-powered Sensor Node
PIC24F08KA101-E/SS fits compact battery-operated sensor nodes because its XLP design targets low active and sleep consumption, while the 16-bit processor provides more control capability than an 8-bit MCU. The 8 KB flash memory stores application firmware, 1.5 KB RAM supports short acquisition and processing buffers, and 18 I/O pins connect sensors and indicators. Firmware can use DSBOR, DSWDT, and RTCC to coordinate low-power states and reliable wake-up behavior. The principal design trade-off is that actual battery life depends on duty cycle, sensor current, active processor time, and the external regulator, so developers should measure the complete load profile rather than relying on MCU current alone.
推荐
Portable Environmental Monitor
The PIC24F08KA101-E/SS is appropriate for portable temperature, humidity, and environmental monitoring products because it combines 32 MHz processing, one ADC, 18 I/O pins, and XLP low-power features in a 20-pin SSOP. The MCU can sample sensors, perform threshold decisions, and store state in flash while spending much of its operating life in a low-power mode. The 16-bit architecture improves arithmetic efficiency for compensation and filtering, while DSBOR and DSWDT support safer behavior during low-battery conditions. Product teams must still verify the ADC accuracy and voltage range required by their sensors and should account for the current drawn by the sensor, regulator, status indicator, and communication module.
推荐
Industrial Control Module
PIC24F08KA101-E/SS can serve as the control core in a compact industrial module requiring deterministic peripheral handling and low standby consumption. Its 32 MHz maximum operating speed and 16-bit architecture support responsive control tasks, while 18 I/O pins provide interfaces for sensors, digital inputs, indicators, and actuators. The XLP feature set helps modules reduce power during idle periods, especially in distributed equipment where continuous mains connectivity is undesirable. Temperature-grade selection is critical: the verified I/SS comparison reaches 125°C, whereas the E/SO comparison reaches 85°C. Engineers should confirm the exact E/SS limits and use isolation, surge protection, and suitable industrial connectors where the environment requires them.
推荐
Low-Power Data Logger
PIC24F08KA101-E/SS is well suited to a low-power data logger because 8 KB flash provides embedded firmware storage, 1.5 KB RAM can hold acquisition buffers, and the XLP architecture supports duty-cycled operation. The 18 available I/O pins can accommodate an I2C or SPI sensor, a serial memory interface, a real-time-clock connection, and a status indicator, subject to the device's verified peripheral assignments. DSWDT supports supervised recovery from unexpected stalls, while DSBOR assists controlled behavior as the supply declines. For reliable records, firmware should timestamp events and commit data in a way that respects flash endurance. The exact write timing, retention, and cycle characteristics must be taken from the Microchip datasheet.
推荐
Smart Home Sensor Interface
PIC24F08KA101-E/SS can act as a dedicated low-power interface between analog sensors and a home or building network. The one ADC supports analog measurement, the 18 I/O pins provide sensor and communication connections, and the 16-bit core can perform filtering and threshold logic before forwarding compact data. XLP operation is valuable in battery-powered nodes because the MCU can remain asleep between updates, reducing the load compared with a continuously active general-purpose processor. A practical implementation should define the communication duty cycle, isolate noisy actuators from sensitive measurement traces, and ensure the external regulator remains efficient at light loads. Network protocol support and exact peripheral multiplexing must be verified against the datasheet before board release.
推荐
Compact Power-Supply Controller
PIC24F08KA101-E/SS can manage a compact power subsystem by monitoring inputs, sequencing rails, controlling indicators, and coordinating fault responses. Its 16-bit architecture and 32 MHz maximum speed provide ample control throughput, while 18 I/O pins can support digital monitoring, enable signals, and status outputs. Low-power XLP modes are useful when the managed system spends long intervals inactive. The MCU should not be treated as a replacement for dedicated analog protection or power-conversion circuitry; instead, it can supervise external converters and react to measured conditions. Engineers must verify ADC input limits, switching-pin behavior, and the available timing functions in the selected package, then provide suitable input filtering and protection on field-connected nodes.
推荐
推荐产品汇总
工程参考数据： PIC24F08KA101-E/SS ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24F08KA101-I/SS |
|---|---|---|
| Package | 20-pin SSOP | 20-pin SSOP |
| Brand | Microchip Technology | Microchip Technology |
| Architecture | 16-bit PIC microcontroller | 16-bit PIC microcontroller |
| Program Memory | 8 KB flash (2.75K x 24) | 8 KB flash (2.75K x 24) |
| RAM | 1.5 KB (1.5K x 8) | 1.5 KB (1.5K x 8) |
| Maximum CPU Frequency | 32 MHz | 32 MHz |
| I/O Pins | 18 | 18 |
| ADC Count | 1 ADC | 1 ADC |
| Low-Power Features | XLP, DSBOR, DSWDT, RTCC | PIC XLP family device |
关键差异点
- Higher-grade temperature option in the verified replacement （对比 PIC24F08KA101-E/SS)
- Pin-compatible family configuration （对比 PIC24F08KA101-I/SS)
- Low-power system integration （对比 PIC24F08KA101-I/SS)
设计说明
Estimate the complete power budget rather than the PIC24F08KA101-E/SS current alone. Include the sensor, regulator quiescent current, communications activity, indicator drive, and leakage paths. Then use the verified XLP, DSBOR, DSWDT, and RTCC features to define the sleep and wake-up strategy. Do not publish a battery-runtime claim until it has been measured with the intended firmware, supply voltage, temperature, and accessory load.
Place the MCU, decoupling capacitors, oscillator components, and programming or debug connections according to the official Microchip pin configuration and layout guidance. Keep analog sensor traces away from switching nodes and high-current paths, and provide a low-impedance ground reference for the ADC. The supplied excerpts do not include the complete pin table or exposed-pad connection details, so verify those points in the manufacturer datasheet before fabrication.
Do not substitute PIC24F08KA101-I/SS solely because the package matches. The verified comparison shows a temperature-grade distinction, and the E/SS device's exact operating limits were not included in the source excerpts. Confirm supply voltage, maximum frequency, ADC limits, temperature range, pin multiplexing, and programming configuration for the exact suffix before approving a drop-in replacement.
The SSOP footprint has closely spaced leads, so inspect the land pattern against the official package drawing rather than relying on a generic SSOP footprint. Verify lead pitch, pin-1 orientation, solder-mask clearance, and the handling of any thermal or exposed pad. Use a qualified assembly process and inspect joints with adequate magnification because incorrect lead alignment can cause intermittent or permanent failures.
合规信息
The supplied verified excerpts do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than assuming compliance. The -E ordering suffix is identified as a temperature-grade designation, but no specific automotive qualification was provided.
