PIC24F08KA101-E/SS - 16-Bit 32MHz XLP Microcontroller | Microchip
부품 번호: PIC24F08KA101-E/SS ✓ 활성PIC24F08KA101-E/SS 개요
드롭인 대체품: PIC24F08KA101-E/SS — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24F08KA101-E/SS (동일 폼 팩터 및 풋프린트) — 차이점: I/O Pins, Package.
PIC24F08KA101-I/SS
✅ 드롭인가격 문의
데이터시트 보기 →PIC24F08KA101-E/SS 최대 정격 & 전기적 특성
| Architecture | 16-bit PIC microcontroller |
| Program Memory | 8 KB flash (2.75K x 24) |
| RAM | 1.5 KB (1.5K x 8) |
| Maximum CPU Frequency | 32 MHz |
| I/O Pins | 18 |
| 패키지 | 20-pin SSOP |
| 실장 유형 | Surface mount |
| Oscillator | Internal |
| Low-Power Technology | XLP eXtreme Low Power |
| Deep-Sleep Features | DSBOR, DSWDT, RTCC |
| Serial EEPROM | 512 bytes |
| ADC | 1 ADC |
| Packaging | Tube |
| Manufacturer | Microchip Technology |
PIC24F08KA101-E/SS 20-pin ssop 핀 구성 가이드
PIC24F08KA101-E/SS(20-pin ssop 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC24F08KA101-E/SS.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC24F08KA101-E/SS 적합 용도: 6 애플리케이션s: Battery-powered Sensor Node, Portable Environmental Monitor, Industrial Control Module, Low-Power Data Logger, Smart Home Sensor Interface, Compact Power-Supply Controller.
Battery-powered Sensor Node
PIC24F08KA101-E/SS fits compact battery-operated sensor nodes because its XLP design targets low active and sleep consumption, while the 16-bit processor provides more control capability than an 8-bit MCU. The 8 KB flash memory stores application firmware, 1.5 KB RAM supports short acquisition and processing buffers, and 18 I/O pins connect sensors and indicators. Firmware can use DSBOR, DSWDT, and RTCC to coordinate low-power states and reliable wake-up behavior. The principal design trade-off is that actual battery life depends on duty cycle, sensor current, active processor time, and the external regulator, so developers should measure the complete load profile rather than relying on MCU current alone.
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Portable Environmental Monitor
The PIC24F08KA101-E/SS is appropriate for portable temperature, humidity, and environmental monitoring products because it combines 32 MHz processing, one ADC, 18 I/O pins, and XLP low-power features in a 20-pin SSOP. The MCU can sample sensors, perform threshold decisions, and store state in flash while spending much of its operating life in a low-power mode. The 16-bit architecture improves arithmetic efficiency for compensation and filtering, while DSBOR and DSWDT support safer behavior during low-battery conditions. Product teams must still verify the ADC accuracy and voltage range required by their sensors and should account for the current drawn by the sensor, regulator, status indicator, and communication module.
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Industrial Control Module
PIC24F08KA101-E/SS can serve as the control core in a compact industrial module requiring deterministic peripheral handling and low standby consumption. Its 32 MHz maximum operating speed and 16-bit architecture support responsive control tasks, while 18 I/O pins provide interfaces for sensors, digital inputs, indicators, and actuators. The XLP feature set helps modules reduce power during idle periods, especially in distributed equipment where continuous mains connectivity is undesirable. Temperature-grade selection is critical: the verified I/SS comparison reaches 125°C, whereas the E/SO comparison reaches 85°C. Engineers should confirm the exact E/SS limits and use isolation, surge protection, and suitable industrial connectors where the environment requires them.
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Low-Power Data Logger
PIC24F08KA101-E/SS is well suited to a low-power data logger because 8 KB flash provides embedded firmware storage, 1.5 KB RAM can hold acquisition buffers, and the XLP architecture supports duty-cycled operation. The 18 available I/O pins can accommodate an I2C or SPI sensor, a serial memory interface, a real-time-clock connection, and a status indicator, subject to the device's verified peripheral assignments. DSWDT supports supervised recovery from unexpected stalls, while DSBOR assists controlled behavior as the supply declines. For reliable records, firmware should timestamp events and commit data in a way that respects flash endurance. The exact write timing, retention, and cycle characteristics must be taken from the Microchip datasheet.
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Smart Home Sensor Interface
PIC24F08KA101-E/SS can act as a dedicated low-power interface between analog sensors and a home or building network. The one ADC supports analog measurement, the 18 I/O pins provide sensor and communication connections, and the 16-bit core can perform filtering and threshold logic before forwarding compact data. XLP operation is valuable in battery-powered nodes because the MCU can remain asleep between updates, reducing the load compared with a continuously active general-purpose processor. A practical implementation should define the communication duty cycle, isolate noisy actuators from sensitive measurement traces, and ensure the external regulator remains efficient at light loads. Network protocol support and exact peripheral multiplexing must be verified against the datasheet before board release.
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Compact Power-Supply Controller
PIC24F08KA101-E/SS can manage a compact power subsystem by monitoring inputs, sequencing rails, controlling indicators, and coordinating fault responses. Its 16-bit architecture and 32 MHz maximum speed provide ample control throughput, while 18 I/O pins can support digital monitoring, enable signals, and status outputs. Low-power XLP modes are useful when the managed system spends long intervals inactive. The MCU should not be treated as a replacement for dedicated analog protection or power-conversion circuitry; instead, it can supervise external converters and react to measured conditions. Engineers must verify ADC input limits, switching-pin behavior, and the available timing functions in the selected package, then provide suitable input filtering and protection on field-connected nodes.
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추천 제품 요약
엔지니어링 참조 데이터: PIC24F08KA101-E/SS — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24F08KA101-I/SS |
|---|---|---|
| Package | 20-pin SSOP | 20-pin SSOP |
| Brand | Microchip Technology | Microchip Technology |
| Architecture | 16-bit PIC microcontroller | 16-bit PIC microcontroller |
| Program Memory | 8 KB flash (2.75K x 24) | 8 KB flash (2.75K x 24) |
| RAM | 1.5 KB (1.5K x 8) | 1.5 KB (1.5K x 8) |
| Maximum CPU Frequency | 32 MHz | 32 MHz |
| I/O Pins | 18 | 18 |
| ADC Count | 1 ADC | 1 ADC |
| Low-Power Features | XLP, DSBOR, DSWDT, RTCC | PIC XLP family device |
주요 차별점
- Higher-grade temperature option in the verified replacement (vs PIC24F08KA101-E/SS)
- Pin-compatible family configuration (vs PIC24F08KA101-I/SS)
- Low-power system integration (vs PIC24F08KA101-I/SS)
설계 노트
Estimate the complete power budget rather than the PIC24F08KA101-E/SS current alone. Include the sensor, regulator quiescent current, communications activity, indicator drive, and leakage paths. Then use the verified XLP, DSBOR, DSWDT, and RTCC features to define the sleep and wake-up strategy. Do not publish a battery-runtime claim until it has been measured with the intended firmware, supply voltage, temperature, and accessory load.
Place the MCU, decoupling capacitors, oscillator components, and programming or debug connections according to the official Microchip pin configuration and layout guidance. Keep analog sensor traces away from switching nodes and high-current paths, and provide a low-impedance ground reference for the ADC. The supplied excerpts do not include the complete pin table or exposed-pad connection details, so verify those points in the manufacturer datasheet before fabrication.
Do not substitute PIC24F08KA101-I/SS solely because the package matches. The verified comparison shows a temperature-grade distinction, and the E/SS device's exact operating limits were not included in the source excerpts. Confirm supply voltage, maximum frequency, ADC limits, temperature range, pin multiplexing, and programming configuration for the exact suffix before approving a drop-in replacement.
The SSOP footprint has closely spaced leads, so inspect the land pattern against the official package drawing rather than relying on a generic SSOP footprint. Verify lead pitch, pin-1 orientation, solder-mask clearance, and the handling of any thermal or exposed pad. Use a qualified assembly process and inspect joints with adequate magnification because incorrect lead alignment can cause intermittent or permanent failures.
규정 준수 정보
The supplied verified excerpts do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than assuming compliance. The -E ordering suffix is identified as a temperature-grade designation, but no specific automotive qualification was provided.
