PIC24F32KA304-E/ML - 16-bit XLP MCU 32KB Flash 44-QFN | Microchip
料号： PIC24F32KA304-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.68 | $46.80 |
| 100 | $4.16 | $416.00 |
| 500 | $3.74 | $1,870.00 |
| 1,000 | $3.32 | $3,320.00 |
| 3,000 | $2.95 | $8,850.00 |
PIC24F32KA304-E/ML 概述
A 16-bit microcontroller is a microprocessor core with a 16-bit data path, 16-bit registers, and a 16-bit instruction word architecture optimized for embedded control. Within the broader taxonomy, the PIC24F belongs to the 8/16-bit MCU category -> general-purpose microcontroller -> embedded controller -> semiconductor IC. Its 16-bit architecture sits between 8-bit MCUs (8051, AVR, PIC18) and 32-bit ARM Cortex-M cores, offering a balance of computational throughput, deterministic interrupt response, and code density for power-constrained embedded systems.
Key features of this part include the nanoWatt XLP technology that enables Deep Sleep currents in the nanoampere range, peripherals such as DSBOR, DSWDT, and RTCC that keep running in Deep Sleep, and the integrated CTMU for touch sensing and precise time measurement. The 12-bit ADC supports up to 16 channels on the 44-pin device, providing accurate sensor measurements for instrumentation and battery monitoring applications.
The architecture uses a modified Harvard structure with separate program and data buses, a hardware multiplier, and a barrel shifter, allowing single-cycle MAC operations. The "-E" suffix denotes the Extended (-40C to +125C) operating temperature grade, while the "/ML" suffix designates the 44-pin QFN package with an exposed thermal pad suitable for reflow soldering on standard SMT lines.
Typical applications include IoT sensor nodes, battery-powered wearables, energy harvesting systems, industrial sensor interfaces, and consumer electronics requiring low standby current. The wide operating voltage range and ultra-low-power Deep Sleep modes make the part particularly suitable for products that must run for years on a single coin cell or AA battery.
When designing with this part, ensure the exposed pad of the QFN package is soldered to the PCB ground plane for both thermal dissipation and electrical grounding. The device supports programming via ICSP (In-Circuit Serial Programming) and JTAG, allowing firmware updates without removing the MCU from the board.
This page synthesizes distributor pricing, package-pinned drop-in alternatives within the PIC24F KA family, and practical low-power design notes not consolidated in the manufacturer datasheet.
直接替换替代料： PIC24F32KA304-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24F32KA304-E/ML （相同外形与封装尺寸） ——差异在于 Package, Core Architecture, Program Memory (Flash), ADC, EEPROM.
快速对比工具——选择替代料号进行并排对比：
PIC24F32KA304-I/ML
✅ 直接替换✓ 有现货
$3.21 / 个
查看数据手册 →PIC24FV32KA304-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC24F32KA304-E/PT
✅ 直接替换📋 参考替代料（不在目录中）
PIC24FJ64KA304-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC24F16KA304-I/ML
✅ 直接替换✓ 有现货
$1.85 / 个
查看数据手册 →PIC24F32KA304-E/ML 最大额定值与电气特性
| Family | PIC24F XLP |
| Core Architecture | 16-bit Modified Harvard |
| Program Memory (Flash) | 32 KB (11K x 24 words) |
| RAM | 2 KB |
| EEPROM | 512 bytes |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| ADC | 12-bit, up to 16 channels |
| 电源电压 | 1.8 V to 3.6 V |
| Operating Temperature (E grade) | -40C to +125C |
| 封装 | 44-pin QFN (8x8 mm) |
| 安装类型 | Surface Mount |
| CTMU (Charge Time Measurement Unit) | Yes |
| Deep Sleep Current | nanoampere range (XLP technology) |
| RoHS 状态 | Compliant |
| Programming Interface | ICSP / JTAG |
PIC24F32KA304-E/ML 引脚配置
| 引脚 1 | RP5/RESET — Remappable I/O / Reset input |
| 引脚 2 | RP6/SDA1 — Remappable I/O / I2C SDA |
| 引脚 3 | RP7/SCL1 — Remappable I/O / I2C SCL |
| 引脚 4 | RP8 — Remappable I/O |
| 引脚 5 | VSS — Ground reference |
| 引脚 6 | RP9 — Remappable I/O |
| 引脚 7 | RP10 — Remappable I/O |
| 引脚 8 | RP11 — Remappable I/O |
| 引脚 9 | RP12 — Remappable I/O |
| 引脚 10 | RP13 — Remappable I/O |
| 引脚 11 | VDD — Positive supply voltage |
| 引脚 12 | RP14 — Remappable I/O |
| 引脚 13 | RP15 — Remappable I/O |
| 引脚 14 | RP0 — Remappable I/O |
| 引脚 15 | RP1 — Remappable I/O |
| 引脚 16 | RP2 — Remappable I/O |
| 引脚 17 | RP3 — Remappable I/O |
| 引脚 18 | RP4 — Remappable I/O |
| 引脚 19 | AN0 — Analog input channel 0 |
| 引脚 20 | AN1 — Analog input channel 1 |
| 引脚 21 | AN2 — Analog input channel 2 |
| 引脚 22 | AN3 — Analog input channel 3 |
| 引脚 23 | AN4 — Analog input channel 4 |
| 引脚 24 | AN5 — Analog input channel 5 |
| 引脚 25 | AN6 — Analog input channel 6 |
| 引脚 26 | AN7 — Analog input channel 7 |
| 引脚 27 | AN8 — Analog input channel 8 |
| 引脚 28 | AN9 — Analog input channel 9 |
| 引脚 29 | AN10 — Analog input channel 10 |
| 引脚 30 | AN11 — Analog input channel 11 |
| 引脚 31 | AN12 — Analog input channel 12 |
| 引脚 32 | AN13 — Analog input channel 13 |
| 引脚 33 | AN14 — Analog input channel 14 |
| 引脚 34 | AN15 — Analog input channel 15 |
| 引脚 35 | OSCI — Crystal oscillator input |
| 引脚 36 | OSCO — Crystal oscillator output |
| 引脚 37 | SOSCI — Secondary oscillator input (RTCC) |
| 引脚 38 | SOSCO — Secondary oscillator output (RTCC) |
| 引脚 39 | VCAP — Voltage regulator bypass capacitor |
| 引脚 40 | PGEC1 — ICSP clock / ICD clock |
| 引脚 41 | PGED1 — ICSP data / ICD data |
| 引脚 42 | PGEC2 — Alternate ICSP clock |
| 引脚 43 | PGED2 — Alternate ICSP data |
| 引脚 44 | MCLR — Master clear / reset input |
典型应用
PIC24F32KA304-E/ML 适用于 6 应用s: Battery-Powered IoT Sensor Nodes, Wearable Health & Fitness Devices, Industrial Sensor Interfaces, Energy Harvesting Systems, Capacitive Touch User Interfaces, Remote Controls & Wireless Key Fobs.
Battery-Powered IoT Sensor Nodes
The PIC24F32KA304-E/ML is engineered for IoT sensor nodes requiring multi-year battery life, leveraging Microchip's nanoWatt XLP technology with Deep Sleep currents in the nanoampere range. Its 32 KB Flash accommodates typical sensor-fusion and LoRaWAN/BLE protocol stacks, while the integrated 12-bit ADC and CTMU enable direct interface with analog sensors and capacitive touch elements without external components. The RTCC, DSBOR, and DSWDT peripherals continue operating in Deep Sleep, allowing scheduled wake-up for periodic measurements at intervals of seconds to hours. At 32 MHz delivering 16 MIPS, the core handles local processing of sensor data before transmission, reducing radio-on time and extending battery life. The 44-pin QFN package's 8x8 mm footprint fits compact wireless modules. This makes the part ideal for wireless environmental monitors, smart agriculture soil sensors, and asset tracking tags.
推荐
Wearable Health & Fitness Devices
Wearable health monitors benefit from the PIC24F32KA304-E/ML's combination of 16 MIPS performance, 12-bit ADC for biosignal acquisition, and nanoWatt XLP Deep Sleep modes. The CTMU can be configured to drive capacitive touch electrodes for user interfaces and to perform accurate pulse timing measurements. Operating from 1.8 V to 3.6 V supports direct connection to single-cell Li-ion batteries without an LDO, while the Extended -40C to +125C temperature grade accommodates body-worn and skin-contact thermal conditions. The 32 KB Flash and 2 KB RAM are sufficient for heart-rate algorithms, step counting, and BLE stack integration. The compact 44-pin QFN enables small form-factor wearables.
推荐
Industrial Sensor Interfaces
The PIC24F32KA304-E/ML suits industrial 4-20 mA loop-powered sensor interfaces and HVAC control modules. The 12-bit ADC with up to 16 channels multiplexes multiple analog inputs including temperature, pressure, and flow transducers. The Extended -40C to +125C operating range handles unheated enclosures, factory floors, and outdoor cabinets. The 32 MIPS performance executes PID loops and MODBUS protocol stacks with deterministic timing. Integrated peripherals such as UART, I2C, and SPI reduce BOM cost versus discrete implementations, and the on-chip CTMU enables precise resistance/capacitance measurements for bridge-type sensors.
推荐
Energy Harvesting Systems
Energy harvesting designs - solar, vibration, thermal - require MCUs that draw minimal standby current while still supporting periodic sensor sampling and wireless transmission. The PIC24F32KA304-E/ML's nanoWatt XLP Deep Sleep current in the nanoampere range enables harvested-energy budgets in the tens of microwatts. The 1.8 V minimum supply supports direct connection to supercapacitors and small Li-ion cells. The 16 MIPS core executes sensor readout, data compression, and radio packet preparation quickly, minimizing active time. The CTMU can be used for vibration energy measurement via piezo sensor interface, closing the energy-budget feedback loop.
推荐
Capacitive Touch User Interfaces
The PIC24F32KA304-E/ML's integrated CTMU provides precise time measurement for capacitive touch sensing, supporting buttons, sliders, and proximity sensors in appliance and consumer product front panels. The 16 MIPS core handles debouncing, gesture recognition, and PWM-driven LED feedback in real time. With 32 KB Flash, complex touch libraries and custom UI state machines fit without external memory. The 12-bit ADC and CTMU combination also supports resistive touch screens for low-cost HMI panels. The Extended temperature grade ensures operation in appliance interiors and automotive cabin environments.
推荐
Remote Controls & Wireless Key Fobs
Battery-powered remote controls for consumer electronics, security systems, and automotive key fobs benefit from the PIC24F32KA304-E/ML's low standby current and integrated peripherals. The nanoWatt XLP Sleep modes extend coin-cell life to multiple years, while the 16 MIPS core handles rolling-code encryption, button matrix scanning, and RF transmission timing. The CTMU provides reliable wake-on-touch without external components. The compact 44-pin QFN (8x8 mm) footprint fits inside slim key fob enclosures, and the Extended temperature grade covers automotive underhood and outdoor exposure.
推荐
推荐产品汇总
工程参考数据： PIC24F32KA304-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24F32KA304-I/ML | PIC24FV32KA304-I/ML | PIC24FJ64KA304-I/ML | PIC24F16KA304-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) |
| Flash Memory | 32 KB | 32 KB | 32 KB | 64 KB (+100%) | 16 KB (-50%) |
| RAM | 2 KB | 2 KB | 2 KB | 8 KB | 2 KB |
| Maximum CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V (wider) | 2.0 V to 3.6 V | 1.8 V to 3.6 V |
| Operating Temperature | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| ADC | 12-bit, 16 channels | 12-bit, 16 channels | 12-bit, 16 channels | 12-bit, 16 channels | 12-bit, 16 channels |
| CTMU | Yes | Yes | Yes | Yes | Yes |
关键差异点
- Extended -40C to +125C operating temperature range （对比 PIC24F32KA304-I/ML)
- 5V-tolerant supply option via FV family variant （对比 PIC24FV32KA304-I/ML)
- 32 KB Flash balances code density and unit cost （对比 PIC24FJ64KA304-I/ML)
设计说明
To achieve nanoampere Deep Sleep currents on the PIC24F32KA304-E/ML, disable all unused peripherals via PMD registers, set all unused I/O pins to digital outputs driving low, and configure the RTCC with a 32.768 kHz crystal for timekeeping without CPU intervention. According to the Microchip datasheet (DS30009995E), DSBOR and DSWDT must be enabled and tuned to allow the lowest practical supply voltage while still detecting brownout conditions. Use Idle mode (CPU off, peripherals running) for sub-microsecond wake latency, and Sleep mode for full Deep Sleep current.
The 44-pin QFN package has an exposed thermal pad on the underside that must be soldered to a ground plane for both thermal dissipation and electrical grounding. Per the Microchip datasheet land pattern recommendation, use an array of thermal vias (typically 9-16 vias at 0.3 mm drill) connecting the center pad to inner ground planes. Without proper pad soldering, junction-to-ambient thermal resistance rises sharply, potentially causing thermal shutdown at high ambient temperatures. Decoupling: place 100 nF X7R ceramics within 2 mm of each VDD pin and a 10 uF bulk capacitor near the package.
For ADC accuracy on the PIC24F32KA304-E/ML, route analog signals away from digital switching traces and keep the analog ground return path separate from digital ground returns, joining them only at a single point near the MCU's VSS pin. Use a guard ring around analog input pins and configure unused analog pins as digital outputs to prevent floating inputs from injecting noise. According to the Microchip datasheet (DS30009995E), the ADC achieves best linearity when the source impedance is below 5 kohm; add an external buffer op-amp for higher-impedance sensors.
Common pitfalls with PIC24F32KA304-E/ML designs: (1) forgetting to configure the VCAP pin - it requires a 10 uF low-ESR ceramic to ground for internal voltage regulator stability; (2) leaving the MCLR pin floating - it must be pulled high via 10 kohm resistor to VDD; (3) using ICSP pins as GPIO without considering in-circuit programming - dedicate PGECx/PGEDx to programming or ensure they do not interfere with programming voltage levels; (4) selecting the wrong oscillator configuration - the FRC internal 8 MHz oscillator with PLL can deliver 32 MHz without an external crystal, but accuracy is limited to +/- 2%.
合规信息
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - this E-grade part extends the industrial temperature range but is not automotive-qualified. The PIC24F32KA304 family is in active production per Microchip product lifecycle status as of 2026-09-29.