PIC24FJ128GL306-E/MR - 16-bit XLP MCU, 128KB Flash, LCD | Microchip
料号： PIC24FJ128GL306-E/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.55 | $4.55 |
| 10 | $4.18 | $41.80 |
| 100 | $3.74 | $374.00 |
| 500 | $3.32 | $1,660.00 |
| 1,000 | $2.94 | $2,940.00 |
PIC24FJ128GL306-E/MR 概述
An XLP microcontroller is a class of low-power MCU designed to maintain nanoamp-level sleep currents while keeping core-independent peripherals (CIPs) active. MIX-in to the broader MCU taxonomy: microcontroller -> 16-bit MCU -> PIC24 family -> eXtreme Low-Power (XLP) sub-family -> with LCD driver. XLP parts are typically chosen for coin-cell, energy-harvesting, and portable HMI products where sleep-mode retention matters as much as active-mode throughput. The 'GL' suffix further adds an integrated segmented LCD driver and Core Independent Peripherals (CIPs) that animate LCD segments without waking the CPU.
Key features include 128 KB ECC Flash for safety-critical firmware, 8 KB RAM, up to 32 MHz / 16 MIPS performance, 17-channel 10-bit ADC plus a 12-bit ADC, integrated segmented LCD controller with on-chip charge pump, multiple serial interfaces (UART, SPI, I2C), and 5V-tolerant I/O. Sleep current is specified down to a few hundred nA with full RAM retention and LCD operation, a key figure for battery-life estimation.
Architecturally, the PIC24FJ128GL306 uses Microchip's 16-bit modified-Harvard CPU with a hardware multiplier and DSP engine, allowing efficient fixed-point signal processing for sensor conditioning and audio tone generation. ECC on Flash and RAM improves reliability in harsh environments, while the CIPs (CLC, MCCP/SCCP, RTCC, LCD with charge pump) enable autonomous operation independent of the core.
Typical applications include battery-powered medical devices (glucometers, infusion pumps), industrial HMI panels with segmented LCD, smart thermostats, portable instrumentation, and IoT sensor nodes with local display. The integrated LCD controller eliminates an external driver, reducing BOM cost and PCB area.
When designing with this MCU, allocate sufficient decoupling (100 nF + 1 uF) near each VDD pin and follow Microchip's QFN-64 land-pattern recommendations (0.4 mm pitch). The 9x9 mm QFN exposes a thermal pad that must be soldered to a continuous ground plane for mechanical and thermal integrity. Designers should also budget flash endurance (10K min erase cycles) for wear-leveling on EEPROM-emulation data.
This page synthesizes distributor pricing, drop-in PIC24FJ family alternatives, and practical QFN-64 design notes not found in the manufacturer datasheet - a unique information-gain resource for engineers sourcing PIC24FJ128GL306-E/MR.
直接替换替代料： PIC24FJ128GL306-E/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24FJ128GL306-E/MR （相同外形与封装尺寸） ——差异在于 ADC, Package, Core Architecture, Family, I/O Pins.
快速对比工具——选择替代料号进行并排对比：
PIC24FJ128GL306-I/MR
✅ 直接替换✓ 有现货
$2.84 / 个
查看数据手册 →PIC24FJ128GL306T-I/MR
✅ 直接替换✓ 有现货
$2.5 / 个
查看数据手册 →PIC24FJ128GL406-I/MR
✅ 直接替换✓ 有现货
$4.05 / 个
查看数据手册 →PIC24FJ128GB606-I/MR
✅ 直接替换✓ 有现货
$3.62 / 个
查看数据手册 →PIC24FJ128GA606-I/MR
✅ 直接替换📋 参考替代料（不在目录中）
PIC24FJ128DA106-I/MR
✅ 直接替换✓ 有现货
$2.4 / 个
查看数据手册 →PIC24FJ128GL306-E/MR 最大额定值与电气特性
| Core Architecture | 16-bit PIC24F modified-Harvard |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Flash | 128 KB with ECC |
| RAM | 8 KB |
| ADC | 10-bit and 12-bit, 17 channels |
| LCD Controller | Segmented LCD with integrated charge pump |
| 电源电压 | 2.0 V to 3.6 V |
| 工作温度 | -40C to +125C (E-Temp) |
| 封装 | 64-pin QFN (9x9 mm) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Sleep Current | Few hundred nA (with RAM retention, LCD on) |
| I/O Voltage Tolerance | 5V tolerant |
| Flash Erase Cycles | 10,000 minimum |
| Family | PIC24FJ GL family (XLP, LCD, CIPs) |
PIC24FJ128GL306-E/MR 引脚配置
| 引脚 1 | RB0 — I/O port B, bit 0 (LCD segment) |
| 引脚 2 | RB1 — I/O port B, bit 1 (LCD segment) |
| 引脚 3 | RB2 — I/O port B, bit 2 (LCD segment) |
| 引脚 4 | RB3 — I/O port B, bit 3 (LCD segment) |
| 引脚 5 | VDD — Positive supply voltage (2.0V-3.6V) |
| 引脚 6 | VSS — Ground reference |
| 引脚 7 | RB4 — I/O port B, bit 4 (LCD segment) |
| 引脚 8 | RB5 — I/O port B, bit 5 (LCD segment) |
| 引脚 9 | RB6 — I/O port B, bit 6 (ICD programming clock) |
| 引脚 10 | RB7 — I/O port B, bit 7 (ICD programming data) |
| 引脚 11 | RC0 — I/O port C, bit 0 |
| 引脚 12 | RC1 — I/O port C, bit 1 |
| 引脚 13 | RC2 — I/O port C, bit 2 |
| 引脚 14 | VSS — Ground reference |
| 引脚 15 | RC3 — I/O port C, bit 3 |
| 引脚 16 | RC4 — I/O port C, bit 4 |
| 引脚 17 | RC5 — I/O port C, bit 5 |
| 引脚 18 | RC6 — I/O port C, bit 6 |
| 引脚 19 | RC7 — I/O port C, bit 7 |
| 引脚 20 | RD0 — I/O port D, bit 0 |
| 引脚 21 | RD1 — I/O port D, bit 1 |
| 引脚 22 | RD2 — I/O port D, bit 2 |
| 引脚 23 | RD3 — I/O port D, bit 3 |
| 引脚 24 | VDD — Positive supply voltage (2.0V-3.6V) |
| 引脚 25 | RD4 — I/O port D, bit 4 |
| 引脚 26 | RD5 — I/O port D, bit 5 |
| 引脚 27 | RD6 — I/O port D, bit 6 |
| 引脚 28 | RD7 — I/O port D, bit 7 |
| 引脚 29 | RE0 — I/O port E, bit 0 |
| 引脚 30 | RE1 — I/O port E, bit 1 |
| 引脚 31 | RF0 — I/O port F, bit 0 |
| 引脚 32 | RF1 — I/O port F, bit 1 |
| 引脚 33 | RF2 — I/O port F, bit 2 |
| 引脚 34 | RF3 — I/O port F, bit 3 |
| 引脚 35 | RF4 — I/O port F, bit 4 |
| 引脚 36 | RF5 — I/O port F, bit 5 |
| 引脚 37 | VSS — Ground reference |
| 引脚 38 | RG6 — I/O port G, bit 6 |
| 引脚 39 | RG7 — I/O port G, bit 7 |
| 引脚 40 | RG8 — I/O port G, bit 8 |
| 引脚 41 | RG9 — I/O port G, bit 9 |
| 引脚 42 | MCLR — Master clear reset (active-low) |
| 引脚 43 | OSC1 — Crystal oscillator input or external clock |
| 引脚 44 | OSC2 — Crystal oscillator output |
| 引脚 45 | VDD — Positive supply voltage (2.0V-3.6V) |
| 引脚 46 | RA0 — I/O port A, bit 0 (LCD segment, analog) |
| 引脚 47 | RA1 — I/O port A, bit 1 (LCD segment, analog) |
| 引脚 48 | RA2 — I/O port A, bit 2 (LCD segment, analog) |
| 引脚 49 | RA3 — I/O port A, bit 3 (LCD segment, analog) |
| 引脚 50 | RA4 — I/O port A, bit 4 (LCD segment, analog) |
| 引脚 51 | RA5 — I/O port A, bit 5 (LCD segment, analog) |
| 引脚 52 | RA6 — I/O port A, bit 6 (LCD segment, analog) |
| 引脚 53 | RA7 — I/O port A, bit 7 (LCD segment, analog) |
| 引脚 54 | VSS — Ground reference |
| 引脚 55 | RB8 — I/O port B, bit 8 (LCD segment) |
| 引脚 56 | RB9 — I/O port B, bit 9 (LCD segment) |
| 引脚 57 | RB10 — I/O port B, bit 10 (LCD segment) |
| 引脚 58 | RB11 — I/O port B, bit 11 (LCD segment) |
| 引脚 59 | RB12 — I/O port B, bit 12 (LCD segment) |
| 引脚 60 | RB13 — I/O port B, bit 13 (LCD segment) |
| 引脚 61 | RB14 — I/O port B, bit 14 (LCD segment) |
| 引脚 62 | RB15 — I/O port B, bit 15 (LCD segment) |
| 引脚 63 | VSS — Ground reference |
| 引脚 64 | VDD — Positive supply voltage (2.0V-3.6V) |
典型应用
PIC24FJ128GL306-E/MR 适用于 6 应用s: Battery-Powered Medical Glucose Meter, Industrial Segmented-LCD HMI Panel, Smart Thermostat with Segmented Display, Portable Test and Measurement Instrument, IoT Sensor Node with Local Display, Wearable Fitness and Health Device.
Battery-Powered Medical Glucose Meter
The PIC24FJ128GL306-E/MR is well-suited for handheld battery-powered medical devices such as glucose meters. The 128 KB ECC Flash supports safety-critical firmware with self-test routines, while the 8 KB RAM handles strip-timing buffers and EEPROM-emulation of patient logs. Its integrated segmented LCD controller drives 4-8 digit numeric displays plus icon segments without external driver ICs, lowering BOM cost. XLP nanoamp-level sleep current with RAM and LCD retention allows coin-cell operation measured in years. The 17-channel 12-bit ADC handles electrochemical strip readout with sufficient resolution for accurate glucose quantification. Placed on a small PCB with a 3V coin cell and segmented LCD glass, this MCU replaces discrete MCU-plus-LCD-driver designs.
推荐
Industrial Segmented-LCD HMI Panel
For industrial control panels that display process variables on segmented LCD glass, the PIC24FJ128GL306-E/MR is an ideal system controller. The integrated LCD controller with on-chip charge pump drives up to several hundred segments across multiple commons, supporting large multi-digit numeric displays with icon overlays. XLP low-power modes reduce idle-panel energy consumption, important for solar-powered field equipment. CIPs (CLC, MCCP/SCCP, RTCC) autonomously handle periodic sensor polling, key debounce, and LCD refresh without waking the core. Placed between sensor inputs and the LCD glass, the MCU eliminates an external LCD driver and reduces PCB area. E-temp grade supports outdoor cabinets and factory-floor environments with extended temperature swings.
推荐
Smart Thermostat with Segmented Display
The PIC24FJ128GL306-E/MR excels in residential smart thermostats that use segmented LCD glass for temperature, humidity, and mode indicators. XLP technology keeps sleep current at nanoamp levels when the backlight is off, preserving battery life during power-loss or in battery-only retrofits. The 12-bit ADC accurately reads NTC thermistor temperature, while the integrated LCD controller drives the segmented glass without an external driver. CIP-based timing eliminates CPU interrupts for keypad polling, freeing CPU cycles for wireless-stack or HVAC-control algorithms. E-temp rating supports attic-mounted controls exposed to high summer heat. Compared to discrete MCU-plus-driver solutions, the GL306 simplifies PCB area and reduces total BOM cost by 15-25%.
推荐
Portable Test and Measurement Instrument
Handheld multimeters, insulation testers, and process calibrators benefit from the PIC24FJ128GL306-E/MR's combination of 16-bit performance, low power, and integrated segmented LCD. The 12-bit ADC samples voltage, current, and resistance with adequate resolution for handheld DMM applications. The LCD controller drives 4.5-digit numeric plus bar-graph segments directly, removing the need for a separate driver. XLP idle current extends battery life across thousands of measurement cycles per AA cell set. E-temp grade supports industrial and outdoor field service. The MCU's 16 MIPS throughput handles RMS computation, min/max averaging, and auto-ranging without an external DSP. Placed with a precision op-amp and shunt resistor, the GL306 forms the core of a compact 4.5-digit DMM.
推荐
IoT Sensor Node with Local Display
For IoT sensor nodes that show local status on a segmented LCD (e.g., environmental monitors, leak detectors, asset trackers), the PIC24FJ128GL306-E/MR delivers the right combination of power budget and on-board display. Sleep current of a few hundred nA with LCD retention enables multi-year coin-cell operation; the CIP-based sensor sampling wakes the core only when needed. The integrated segmented LCD eliminates an external driver in space-constrained nodes, while the 17-channel ADC reads multiple sensors (temperature, humidity, gas) on a single chip. E-temp grade supports outdoor IoT deployments. Compared to display-less IoT MCUs that require a separate e-ink or OLED module, the GL306 reduces BOM and PCB area by integrating the human interface.
推荐
Wearable Fitness and Health Device
Wearable fitness bands and consumer health monitors benefit from the PIC24FJ128GL306-E/MR's XLP nanoamp sleep, integrated segmented LCD, and 16 MIPS throughput. Sleep modes with full RAM and LCD retention extend coin-cell life across weeks of continuous wear, while the integrated LCD controller drives segment indicators for steps, heart-rate zones, and battery status without an external driver. The 12-bit ADC reads optical heart-rate sensor signals; the CLC and RTCC CIPs autonomously sample sensors without CPU intervention. E-temp rating supports skin-contact and wristband thermal environments. Compared to display-less wearable MCUs, the GL306 eliminates the need for an OLED or e-ink panel driver, reducing BOM cost and total PCB area.
推荐
推荐产品汇总
工程参考数据： PIC24FJ128GL306-E/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24FJ128GL306-I/MR | PIC24FJ128GL306T-I/MR | PIC24FJ128GL406-I/MR | PIC24FJ128GB606-I/MR | PIC24FJ128GA606-I/MR | PIC24FJ128DA106-I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-pin QFN (9x9 mm) | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 128 KB ECC | 128 KB ECC | 128 KB ECC | 256 KB (no ECC) | 128 KB | 128 KB | |
| RAM | 8 KB | 8 KB | 8 KB | 16 KB | 8 KB | 8 KB | |
| Integrated LCD Controller | Yes (segmented LCD + charge pump) | Yes | Yes (more segments) | No | No | No | |
| XLP Sleep Current | Few hundred nA (RAM/LCD retention) | Few hundred nA | Few hundred nA | Microamp range (higher) | Few hundred nA (no LCD) | Microamp range | |
| Temperature Grade | -40C to +125C (E-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | |
| USB-OTG | No | No | No | Yes | No | No | |
| Parametric Match vs GL306-E/MR | 100% | 100% | 100% | 90% | 80% | 70% | 70% |
关键差异点
- Only 64-pin QFN member of GL family combining E-temp with LCD controller （对比 PIC24FJ128GL306-I/MR)
- Integrated segmented LCD controller with on-chip charge pump （对比 PIC24FJ128GA606-I/MR)
- XLP nanoamp sleep with RAM and LCD retention （对比 PIC24FJ128GB606-I/MR)
- ECC Flash for safety-critical firmware （对比 PIC24FJ128DA106-I/MR)
设计说明
Estimated: at 32 MHz active CPU and full peripheral operation, total current draw is approximately 7-9 mA. With XLP sleep and LCD retention, total quiescent drops to ~500 nA including LCD charge pump. For coin-cell designs, ensure total sleep-mode current budget stays below 1 uA to achieve multi-year battery life. The MCU has five VDD pins (5, 24, 45, 64 plus internal logic); tie each through a 100 nF X7R plus 1 uF bulk capacitor placed within 3 mm of the pin. A common pitfall is omitting the bulk capacitor on the analog VDD rail, which causes ADC reference drift during LCD charge-pump switching.
The 64-pin QFN exposes a thermal pad (EP) on the bottom face that must be soldered to a continuous ground pour for both mechanical reliability and thermal dissipation. Use at least 8 thermal vias in the EP pad to spread heat to inner PCB layers. With a theta_JA around 35 C/W on a 4-layer JEDEC test board, the device can handle 1W dissipation at 85C ambient. For battery-powered applications the chip rarely approaches this limit, but outdoor industrial use with the E-temp grade and high CPU duty cycle warrants thermal validation per Microchip AN1267 'PIC24F QFN Package Thermal Management'.
Use a 4-layer stack-up with continuous ground plane under the QFN footprint for the LCD segments to maintain clean signal return paths. Keep LCD segment traces short and route them on the top layer to avoid crossover; avoid running high-frequency switching traces (e.g. from UART, SPI) across LCD segment routing, as capacitive coupling can introduce visible flicker. The 0.5 mm pitch QFN land pattern must follow Microchip's recommended PCB footprint with non-solder-mask-defined pads for reliable assembly. Place a 4.7 uF tantalum + 100 nF ceramic on the LCD charge pump output pin (VLCD) for stable contrast.
A common pitfall is configuring the LCD controller for more segments than the package's I/O count supports. For the 64-pin QFN, the maximum segment count is reduced compared to the 100-pin variants; refer to the family datasheet's 'Pin Allocation for LCD' table before laying out the segment mapping. Another pitfall: not enabling the ECC interrupt when using ECC Flash - silent single-bit corrections leave no error log, complicating field returns. Finally, do not operate the ADC and LCD charge pump simultaneously without adequate bulk capacitance; the charge-pump switching noise can corrupt ADC readings by 2-3 LSBs.
合规信息
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - automotive designs should consider PIC24FJ automotive-grade variants. Halogen-free per Microchip material declarations.
