PIC24FJ32GP203-I/M5 - 16-bit XLP MCU, 32KB Flash, 36-UQFN | Microchip
料号： PIC24FJ32GP203-I/M5 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.66 | $26.60 |
| 100 | $2.36 | $236.00 |
| 500 | $2.12 | $1,060.00 |
| 1,000 | $1.89 | $1,890.00 |
PIC24FJ32GP203-I/M5 概述
A 16-bit MCU (microcontroller unit) is a single-chip computer integrating a CPU, RAM, Flash program memory, and peripherals on one die. The PIC24F family sits within Microchip's broader product hierarchy: PIC24F -> 16-bit MCU -> MCU -> microcontroller -> embedded processor -> semiconductor. PIC24F parts target ultra-low-power applications with nanoWatt sleep technology that retains data while drawing only hundreds of nA.
Key features include 32 KB ECC Flash (11K x 24 words), 8 KB SRAM, a wide 2.0V to 3.6V operating range, and core-independent peripherals (CIPs) that operate without CPU intervention. The device supports Full Speed USB 2.0 Host/Device/OTG in the broader family and provides multiple serial interfaces including UART, SPI, and I2C. The 16 MIPS performance at 32 MHz provides deterministic execution for real-time control tasks while the XLP architecture minimizes active and sleep current consumption.
The PIC24FJ32GP203-I/M5 uses a 16-bit modified Harvard RISC architecture with a hardware multiply divider and DSP-oriented instructions. CIPs such as timers, capture/compare, and PWM modules offload tasks from the CPU, reducing firmware complexity and power consumption. ECC Flash enhances reliability for safety-sensitive applications by detecting and correcting single-bit errors.
Typical applications include industrial sensor nodes, low-power IoT edge devices, battery-powered portable instruments, USB peripherals, and human-machine interface (HMI) controllers. The industrial temperature range and XLP technology make it well-suited for energy-harvesting and remote-monitoring designs.
When designing with this device, pay attention to the wide supply voltage range and ensure decoupling capacitors are placed close to the VDD pins. The compact 36-UQFN package requires careful PCB layout for thermal dissipation and reliable manufacturing.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, supporting faster design-in and BOM decisions.
直接替换替代料： PIC24FJ32GP203-I/M5 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24FJ32GP203-I/M5 （相同外形与封装尺寸） ——差异在于 Package, ADC, Core Architecture, Operating Temperature, Timers.
快速对比工具——选择替代料号进行并排对比：
PIC24FJ32GP203-I/PT
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
PIC24FJ64GP203-I/M5
✅ 直接替换✓ 有现货
$2.45 / 个
查看数据手册 →PIC24FJ32GP202-I/SS
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.62 / 个
查看数据手册 →PIC24FJ32GB002-I/SS
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.21 / 个
查看数据手册 →PIC24FJ32GA102-I/SO
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1.85 / 个
查看数据手册 →PIC24FJ32GP203-I/M5 最大额定值与电气特性
| Core Architecture | PIC24F (16-bit RISC, modified Harvard) |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 32 KB (11K x 24) with ECC |
| Data Memory (SRAM) | 8 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| Supply Voltage (typical) | 3.3 V |
| 工作温度范围 | -40 C to +85 C (Industrial) |
| 封装 | 36-pin UQFN (5x5 mm) |
| 安装类型 | Surface Mount |
| Communication Interfaces | UART, SPI, I2C |
| Low-Power Technology | XLP (eXtreme Low-Power), nanoWatt |
| USB Support | Full Speed USB 2.0 Host/Device/OTG (family feature) |
| RoHS 状态 | Compliant |
PIC24FJ32GP203-I/M5 36-pin uqfn (5x5 mm) 引脚配置指南
PIC24FJ32GP203-I/M5（36-pin uqfn (5x5 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC24FJ32GP203-I/M5.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC24FJ32GP203-I/M5 适用于 6 应用s: Battery-Powered IoT Sensor Node, Industrial Sensor and Control Module, USB Human Interface Device (HID), Portable Medical Monitoring Device, Home Automation and Smart Home Hub, Automotive Body Electronics (Non-Safety).
Battery-Powered IoT Sensor Node
The PIC24FJ32GP203-I/M5's XLP nanoWatt technology with sleep current in the hundreds of nA makes it ideal for battery-powered IoT sensor nodes that must run for years on a coin cell. Its 32 KB ECC Flash supports OTA update stacks and sensor-fusion firmware, while 8 KB SRAM buffers BLE/Zigbee data. The 2.0V-3.6V range allows direct connection to single-cell Li-ion or 2x AA batteries without a boost regulator. CIPs handle ADC sampling and PWM autonomously, waking the CPU only when threshold events occur. Estimated: at 1% duty cycle and 3V supply, average current draw remains under 50 uA for multi-year battery life.
推荐
Industrial Sensor and Control Module
The PIC24FJ32GP203-I/M5 suits industrial sensor modules with its -40C to +85C operating range and robust CIP mix. The 16 MIPS performance at 32 MHz executes PID control loops and Modbus RTU stacks with deterministic timing. UART, SPI, and I2C interfaces connect to analog front ends, digital sensors, and isolated communication transceivers. ECC Flash prevents single-bit corruption in electrically noisy factory environments. The 36-pin UQFN footprint reduces PCB area for compact DIN-rail modules. Compared to discrete MCU + external EEPROM designs, integrated Flash with ECC reduces BOM cost and failure surface.
推荐
USB Human Interface Device (HID)
The PIC24FJ32GP203-I/M5 belongs to the GP2 family with Full Speed USB 2.0 Host/Device/OTG support, making it suitable for USB HID peripherals such as custom keyboards, control surfaces, and measurement instruments. The on-chip USB transceiver eliminates external PHY components; only a USB connector and ESD protection array are needed. 32 KB Flash accommodates USB HID class drivers plus application logic, while 8 KB RAM handles HID report buffers. The 16 MIPS CPU processes HID reports with sub-millisecond latency. Industrial temperature grade supports use in laboratory and factory USB peripherals.
推荐
Portable Medical Monitoring Device
The PIC24FJ32GP203-I/M5 fits portable medical monitoring with its low-power operation and deterministic 16 MIPS throughput. ECG, pulse oximetry, and temperature sensors stream data through the device's ADC and I2C peripherals, with CIPs handling DMA-style transfers. ECC Flash enhances data integrity for stored patient records. The wide 2.0V-3.6V supply supports direct battery connection. Industrial temperature range covers clinical and home-health environments. The small 36-UQFN package suits wrist-worn or pocket-sized form factors where PCB real estate is premium.
推荐
Home Automation and Smart Home Hub
The PIC24FJ32GP203-I/M5 serves as a peripheral controller in smart home hubs, processing sensor inputs and controlling relays, dimmers, and motorized shades. Its UART, SPI, and I2C interfaces connect to wireless modules (Wi-Fi, BLE, Zigbee, LoRa) for cloud connectivity. CIP-driven PWM outputs drive LED strips and motor controls without CPU intervention. XLP sleep modes keep idle power draw below 1 mA when waiting for user input or scheduled events. The 32 KB Flash supports OTA bootloader plus ZCL or Matter protocol stacks. Compared to Wi-Fi-only SoCs, the PIC24F provides better real-time determinism.
推荐
Automotive Body Electronics (Non-Safety)
The PIC24FJ32GP203-I/M5's industrial temperature rating and ECC Flash support non-safety automotive body applications such as interior lighting controllers, seat position memories, and accessory interfaces. The 32 KB Flash stores configurable vehicle options and diagnostics logs. The 16 MIPS CPU processes CAN or LIN communication stacks via UART/SPI peripherals. CIPs handle PWM-driven LED dimming and motor control with deterministic timing. Note: For AEC-Q100 qualified automotive applications, Microchip offers dedicated PIC24F automotive variants; the PIC24FJ32GP203-I/M5 is industrial-grade, not automotive-qualified.
推荐
推荐产品汇总
工程参考数据： PIC24FJ32GP203-I/M5 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24FJ64GP203-I/M5 | PIC24FJ32GP202-I/SS | PIC24FJ32GB002-I/SS | PIC24FJ32GA102-I/SO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 36-pin UQFN (5x5 mm) | 36-pin UQFN (5x5 mm) - same | 28-pin SSOP - different | 28-pin SSOP - different | 28-pin SOIC - different |
| Flash Memory | 32 KB ECC | 64 KB ECC (+100%) | 32 KB (same) | 32 KB | 32 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Low-Power Family | XLP nanoWatt (GP2) | XLP nanoWatt (GP2) | XLP nanoWatt (GP2) | XLP (GB0) | XLP (GA1) |
| USB Support | Full Speed USB 2.0 Host/Device/OTG | Full Speed USB 2.0 Host/Device/OTG | Full Speed USB 2.0 Host/Device/OTG | Full Speed USB 2.0 | No USB |
关键差异点
- Higher Flash density in same package （对比 PIC24FJ64GP203-I/M5)
- Smaller footprint alternative available （对比 PIC24FJ32GP202-I/SS)
- USB OTG support not available in lower-tier GA1 family （对比 PIC24FJ32GA102-I/SO)
设计说明
The PIC24FJ32GP203-I/M5 operates from 2.0 V to 3.6 V. Place a 10 uF bulk capacitor and 0.1 uF decoupling capacitor close to each VDD pin. For USB applications, the device requires 3.3 V regulated supply with low ripple; switch-mode supplies must be filtered to prevent coupling noise into USB signaling. The XLP nanoWatt sleep modes draw hundreds of nA but require all peripherals to be disabled and unused pins configured as outputs low.
The 36-pin UQFN package has a small exposed thermal pad that must be soldered to a PCB thermal land with a via array for heat dissipation. Estimated: at 32 MHz active mode with 3.3 V supply, the device dissipates roughly 30-40 mW. Continuous full-load operation requires adequate copper pour; however, the XLP architecture keeps average power low for most embedded profiles.
Route the 32.768 kHz crystal traces as short and symmetric as possible with a ground guard ring for RTC accuracy. Keep USB D+/D- traces as a 90-ohm differential pair with matched length; place the USB connector ESD protection array within 10 mm of the connector. Avoid routing digital switching signals across analog reference areas to minimize ADC crosstalk. The UQFN land pattern requires NSMD pads with via-in-pad recommended for the thermal pad.
Do not exceed 3.6 V on VDD - the device is not 5 V tolerant. Configure all unused pins as digital outputs low to minimize current draw. The ECC Flash requires periodic bit-error scrubbing during long-life deployments; Microchip's device libraries include ECC diagnostic routines. For USB bootloaders, ensure the bootloader vector is configured correctly in configuration bits to avoid bricking.
合规信息
RoHS compliant per Microchip product documentation. Industrial temperature grade (-40C to +85C). Not AEC-Q100 qualified - select dedicated automotive PIC24F variants for vehicle applications. Halogen-free status not explicitly stated in available data.