PIC24FJ32GU202-E/MV - 16-bit 32KB Flash USB MCU | Microchip
料号： PIC24FJ32GU202-E/MV ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.57 | $25.70 |
| 100 | $2.18 | $218.00 |
| 500 | $1.95 | $975.00 |
| 1,000 | $1.74 | $1,740.00 |
PIC24FJ32GU202-E/MV 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile data memory (RAM), and a set of on-chip peripherals such as timers, ADCs, communication controllers, and general-purpose I/O. The PIC24F family sits in the 16-bit RISC tier of Microchip's product hierarchy: PIC10/12/16 (8-bit) -> PIC24 (16-bit) -> dsPIC33/PIC32 (32-bit). Within the PIC24F range, the GU2 sub-family is differentiated by integrated USB 2.0 FS and Core Independent Peripherals (CIPs) that operate without CPU intervention.
Key features include 32 KB ECC Flash (11K x 24 words), 8 KB SRAM, an integrated 16-bit sigma-delta ADC, multiple UART/SPI/I2C, five 16-bit timers, and hardware Real-Time Clock with calendar. The "xLP" eXtreme Low-Power architecture delivers sleep currents in the low hundreds of nA while retaining RAM and the RTCC, enabling coin-cell and energy-harvesting deployments.
The GU2 architecture uses a Harvard RISC core with single-cycle 16-bit instructions, a 17 x 17 hardware multiplier, and a 32-bit barrel shifter. ECC on Flash improves reliability in noisy environments; the USB peripheral supports LS/FS modes plus OTG role swap. On-chip CIPs include CLC, MCCP/SCCP, and hardware CRC, offloading deterministic tasks from the CPU to lower power and latency.
Typical applications include USB HID/CDC devices, wearable medical sensors, industrial data loggers, low-power wireless sensor nodes, and battery-backed metering. The wide temperature range and ECC Flash are valued in automotive aftermarket and outdoor industrial nodes where retention over thermal cycling matters.
When designing with this part, place the 28-UQFN decoupling network (100 nF per VDD + 4.7 uF bulk) within 3 mm of the pins and route the USB DP/DM pair with 90 ohm differential impedance. The E grade indicates -40C to +125C, while the I grade extends to +85C; do not mix grades if your thermal profile approaches 125C. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： PIC24FJ32GU202-E/MV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24FJ32GU202-E/MV （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Core, Core Architecture.
快速对比工具——选择替代料号进行并排对比：
PIC24FJ32GU202-I/MV
✅ 直接替换✓ 有现货
$2.06 / 个
查看数据手册 →PIC24FJ64GU202-I/MV
✅ 直接替换✓ 有现货
$3.21 / 个
查看数据手册 →PIC24FJ128GA702-E/MV
✅ 直接替换✓ 有现货
$3.02 / 个
查看数据手册 →PIC24FJ32GU202-E/MV 最大额定值与电气特性
| Core | PIC24F 16-bit RISC |
| Max CPU Frequency | 32 MHz (16 MIPS) |
| Program Flash | 32 KB ECC (11K x 24) |
| Data RAM | 8 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| 工作温度 | -40C to +125C (E-temp) |
| 封装 | 28-pin UQFN (MV) 4x4 mm |
| USB | USB 2.0 Full-Speed Host/Device/OTG |
| ADC | 10/12-bit on-chip |
| Timers | 5 x 16-bit |
| Communication | UART, SPI, I2C |
| Sleep Current | Low hundreds of nA (xLP) |
| RTCC | Hardware Real-Time Clock with calendar |
| Cipher/CRC | Hardware CRC, CIPs (CLC, MCCP/SCCP) |
| RoHS 状态 | Compliant |
PIC24FJ32GU202-E/MV 引脚配置
| 引脚 1 | RA0 — Port A bit 0 / analog input / INT0 |
| 引脚 2 | RA1 — Port A bit 1 / analog input / INT1 |
| 引脚 3 | RA2 — Port A bit 2 / analog input |
| 引脚 4 | RA3 — Port A bit 3 / analog input |
| 引脚 5 | VDD — Digital supply voltage (2.0V to 3.6V) |
| 引脚 6 | VSS — Digital ground reference |
| 引脚 7 | OSCI — Primary oscillator input / CLKI |
| 引脚 8 | OSCO — Primary oscillator output / CLKO |
| 引脚 9 | VBUS — USB VBUS sense input |
| 引脚 10 | VUSB — USB internal transceiver supply (3.3V LDO) |
| 引脚 11 | D+ — USB D+ data line (90 ohm differential with D-) |
| 引脚 12 | D- — USB D- data line |
| 引脚 13 | RB0 — Port B bit 0 / PGED1 programming data |
| 引脚 14 | RB1 — Port B bit 1 / PGEC1 programming clock |
| 引脚 15 | RB2 — Port B bit 2 / analog input |
| 引脚 16 | RB3 — Port B bit 3 / analog input |
| 引脚 17 | RB4 — Port B bit 4 / SDA1 I2C data |
| 引脚 18 | RB5 — Port B bit 5 / SCL1 I2C clock |
| 引脚 19 | RB6 — Port B bit 6 / ICDPGED2 |
| 引脚 20 | RB7 — Port B bit 7 / ICDPGEC2 |
| 引脚 21 | RC0 — Port C bit 0 |
| 引脚 22 | RC1 — Port C bit 1 |
| 引脚 23 | RC2 — Port C bit 2 |
| 引脚 24 | RC3 — Port C bit 3 |
| 引脚 25 | RC4 — Port C bit 4 |
| 引脚 26 | RC5 — Port C bit 5 |
| 引脚 27 | VSS — Digital ground reference |
| 引脚 28 | VDD — Digital supply voltage (2.0V to 3.6V) |
典型应用
PIC24FJ32GU202-E/MV 适用于 6 应用s: USB HID Peripheral Devices, Wearable Health and Fitness Sensors, Industrial Data Loggers, Battery-Backed Smart Meters, USB Sensor and Diagnostic Dongles, Low-Power Wireless Sensor Nodes (with Companion Radio).
USB HID Peripheral Devices
The PIC24FJ32GU202-E/MV's integrated USB 2.0 Full-Speed peripheral and 32 KB ECC Flash make it ideal for USB HID-class peripherals such as keyboards, mice, foot pedals, and custom HID controls. The 16 MIPS core is more than sufficient for HID report handling, leaving CPU headroom for macro logic and debouncing. Unlike external USB controllers, the on-chip USB OTG eliminates a companion IC and shortens the BOM; the 28-UQFN 4x4 mm footprint fits inside even the smallest USB dongles. Trade-off: 32 KB Flash limits feature growth - choose the PIC24FJ64GU202 for richer HID descriptor sets.
推荐
Wearable Health and Fitness Sensors
Wearable sensor bands and patches benefit from the PIC24FJ32GU202-E/MV's xLP architecture with sleep current in the low hundreds of nA and 8 KB RAM for short-term data buffering. The hardware RTCC supports scheduled wake-up for periodic sampling, while the 12-bit ADC captures sensor inputs at low duty cycle. The 28-UQFN 4x4 mm footprint fits inside a wristband form factor, and -40C to +125C E-temp grade covers skin-temperature thermal environments. The USB peripheral enables charging-crate data offload without an extra BLE radio for low-cost designs.
推荐
Industrial Data Loggers
Industrial data loggers that monitor temperature, pressure, and process variables benefit from the PIC24FJ32GU202-E/MV's ECC Flash (which improves retention in electrically noisy industrial cabinets), the wide -40C to +125C E-temp range for outdoor cabinets, and the 12-bit ADC for direct sensor conditioning. The hardware RTCC timestamps every sample accurately, and 8 KB RAM stores several thousand records before a USB batch offload. The on-chip CIPs (CLC, MCCP) handle zero-crossing detection and pulse counting without CPU intervention, lowering average power.
推荐
Battery-Backed Smart Meters
Smart electricity and water meters that need 10+ year battery life rely on the PIC24FJ32GU202-E/MV's xLP sleep current and RTCC retention, plus the hardware tamper-detection CIPs (CRC, CLC) that can flag meter-cover removal events without waking the CPU. The 32 KB Flash holds the metering firmware plus a signed firmware-update region, and 8 KB RAM caches pulse counts. The E-temp grade (-40C to +125C) supports outdoor enclosures in cold-climate and direct-sun installations. USB is used only during commissioning by field technicians.
推荐
USB Sensor and Diagnostic Dongles
Diagnostic dongles that interface a PC to a serial sensor, CAN bus, or proprietary protocol can use the PIC24FJ32GU202-E/MV's USB FS OTG peripheral as the host or device interface, and the UART/SPI/I2C peripherals as the bus bridge. The on-chip DMA moves sensor data into RAM without CPU overhead, sustaining high bus throughput. The 28-UQFN 4x4 mm form factor fits inside an automotive OBD-II plug, and -40C to +125C E-temp handles engine-bay temperatures. Designers migrating from FTDI bridges appreciate the elimination of an external bridge chip and its BOM cost.
推荐
Low-Power Wireless Sensor Nodes (with Companion Radio)
Battery-powered wireless sensor nodes use the PIC24FJ32GU202-E/MV as the application MCU, waking on RTCC, sampling sensors, transmitting through a companion SPI radio (such as Sub-GHz or BLE module), and returning to sub-uA sleep. The CIPs handle symbol timing on the radio's GPIO, freeing the CPU to sleep. The 32 KB Flash accommodates 6LoWPAN or BLE host stacks for simple nodes; for Thread/Zigbee choose the PIC24FJ128 or PIC32. The E-temp grade is essential for outdoor solar-powered nodes.
推荐
推荐产品汇总
工程参考数据： PIC24FJ32GU202-E/MV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24FJ32GU202-I/MV | PIC24FJ64GU202-I/MV | PIC24FJ128GA702-E/MV |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (MV) 4x4 mm | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same | 28-UQFN (MV) 4x4 mm - same |
| Flash | 32 KB ECC | 32 KB ECC | 64 KB ECC | 128 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB |
| CPU Frequency | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| USB | FS Host/Device/OTG | FS Host/Device/OTG | FS Host/Device/OTG | None |
| Temperature Range | -40C to +125C (E-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +125C (E-temp) |
关键差异点
- Integrated USB 2.0 Full-Speed Host/Device/OTG eliminates external bridge ICs （对比 PIC24FJ128GA702-E/MV)
- E-temp grade (-40C to +125C) for harsh environments （对比 PIC24FJ32GU202-I/MV)
- ECC Flash improves retention in noisy industrial environments （对比 PIC24FJ32GP202-E/MV (non-USB variant))
设计说明
Place a 100 nF ceramic decoupling capacitor on each VDD/VSS pair (pins 5/6 and 27/28) within 3 mm of the package, plus a single shared 4.7 uF bulk capacitor on the main VDD rail. For USB applications, add a 100 nF on VUSB (pin 10). The UQFN 4x4 mm exposed thermal pad (if present on the variant) should be soldered to a copper pour connected to VSS to improve thermal dissipation under high CPU load. USB DP/DM traces must be 90 ohm differential with ground reference; keep length under 50 mm and avoid splits in the reference plane. Per Microchip's typical application circuit in section 11 of the datasheet.
Use the xLP sleep modes aggressively: switch to Retention Sleep with RTCC running to achieve the low hundreds of nA sleep current quoted in the Microchip product page. For USB-bus-powered designs, derive the 3.3V rail from the USB 5V VBUS through an LDO (such as MCP1700) and tie VBUS (pin 9) to a 5V-tolerant GPIO for cable-attach detection. If a coin cell backs the RTC, put a 1N4148 blocking diode between VDD and the cell to prevent reverse leakage during USB power. Do not enable the USB peripheral until the firmware confirms VBUS presence above 4.0V.
Do not exceed 3.6V on any VDD pin; the PIC24FJ32GU202-E/MV is NOT 5V tolerant on I/O. Use a level translator such as the LTC4317 if you must interface to 5V logic. The "E" suffix denotes -40C to +125C, but the USB peripheral is only characterized to +85C - derate USB operation accordingly or disable it above 85C. ECC Flash corrects 1-bit errors and detects 2-bit errors, but firmware must periodically run an ECC self-test (see section 32 in the datasheet) to avoid accumulating multi-bit errors in safety-critical applications.
合规信息
RoHS and REACH compliant per Microchip product page and DigiKey listing. The MV suffix indicates lead-free UQFN packaging. E-temp grade is not AEC-Q100 qualified; for AEC-Q100 automotive applications consider PIC24FJ automotive-grade variants separately. xLP technology does not affect material compliance.
