PIC24FJ64GP202-E/ML - 16-bit 64KB Flash USB MCU | Microchip
料号： PIC24FJ64GP202-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.84 | $3.84 |
| 10 | $3.49 | $34.90 |
| 100 | $3.05 | $305.00 |
| 500 | $2.72 | $1,360.00 |
| 1,000 | $2.45 | $2,450.00 |
PIC24FJ64GP202-E/ML 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and programmable I/O peripherals into one package. The PIC24 family uses a modified Harvard 16-bit architecture with a 24-bit instruction word, sitting hierarchically between 8-bit PIC MCUs and 32-bit ARM Cortex-M parts - well suited to mixed-signal embedded designs that need USB connectivity, low power, and moderate computational throughput.
Key features include 64KB ECC Flash for robust code storage, 8KB RAM, hardware crypto engine, Real-Time Clock and Calendar (RTCC), multiple capture/compare/PWM modules, 12-bit ADC, and configurable logic cells. The XLP technology delivers sleep currents in the hundreds of nanoamps while retaining RAM and full CPU state, enabling years of battery life on coin-cell powered designs.
The part's peripheral set includes Full-Speed USB 2.0 with on-the-go and host support, I2C, SPI, UART, and parallel master port (PMP), giving designers flexibility for HMI, sensor aggregation, and connectivity products. The 28-pin QFN-28 (6x6 mm, ML) package balances pin count with small footprint, supporting both development and space-constrained production layouts.
Typical applications include USB peripherals, wearable health monitors, low-power IoT sensor nodes, HMI touch panels, and industrial data loggers. The E-temp grade -40C to +125C operation makes it suitable for outdoor, automotive cabin, and industrial environments. Pair with the MCP2200 USB-to-UART bridge or PICkit 4 programmer for development.
When designing with this part, ensure USB DP/DM traces are 90 ohm differential and routed within 4 mm of each other. The VUSB pin requires a local 1uF decoupling cap. The MCP2221A provides a low-cost USB-serial bridge for host CDC designs. Do not exceed 3.6V on any digital I/O pin.
直接替换替代料： PIC24FJ64GP202-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24FJ64GP202-E/ML （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Program Memory (Flash), USB.
快速对比工具——选择替代料号进行并排对比：
PIC24FJ64GP202T-I/ML
✅ 直接替换✓ 有现货
$2.3 / 个
查看数据手册 →PIC24FJ64GP202-I/ML
✅ 直接替换✓ 有现货
$2.42 / 个
查看数据手册 →PIC24FJ64GB002-I/ML
✅ 直接替换📋 参考替代料（不在目录中）
PIC24FJ64GA002-I/ML
✅ 直接替换✓ 有现货
$2.45 / 个
查看数据手册 →PIC24FJ64GB002-E/SS
✅ 直接替换📋 参考替代料（不在目录中）
PIC24FJ64GP202-E/ML 最大额定值与电气特性
| Family | PIC24FJ |
| Series | GP2/GU2 |
| Core Architecture | 16-bit modified Harvard |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 64 KB ECC Flash |
| RAM | 8 KB |
| Operating Voltage | 2.0 V to 3.6 V |
| 工作温度 | -40C to +125C (E-temp) |
| 封装 | QFN-28 (6x6 mm, ML) |
| USB | Full-Speed USB 2.0 Host/Device/OTG |
| ADC | 12-bit |
| Sleep Current (XLP) | Hundreds of nA (with retention) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| 无卤 | Yes |
PIC24FJ64GP202-E/ML 引脚配置
| 引脚 1 | RA0 — GPIO/AN0/OC1 |
| 引脚 2 | RA1 — GPIO/AN1/OC2 |
| 引脚 3 | RA2 — GPIO/AN2/OC3 |
| 引脚 4 | RA3 — GPIO/AN3/OC4 |
| 引脚 5 | VDD — Supply voltage |
| 引脚 6 | VSS — Ground |
| 引脚 7 | RA4 — GPIO/AN4 |
| 引脚 8 | RA5 — GPIO/AN5 |
| 引脚 9 | RA6 — GPIO/OSC2 |
| 引脚 10 | RA7 — GPIO/OSC1 |
| 引脚 11 | RB0 — GPIO/AN8/PMP |
| 引脚 12 | RB1 — GPIO/AN9/PMP |
| 引脚 13 | RB2 — GPIO/AN10/PMP |
| 引脚 14 | RB3 — GPIO/AN11/PMP |
| 引脚 15 | VBUS — USB VBUS detect |
| 引脚 16 | D- — USB D- data line |
| 引脚 17 | D+ — USB D+ data line |
| 引脚 18 | VUSB — USB 3.3V regulator output |
| 引脚 19 | VSS — Ground |
| 引脚 20 | VDD — Supply voltage |
| 引脚 21 | RB4 — GPIO/AN12/PMP |
| 引脚 22 | RB5 — GPIO/AN13/PMP |
| 引脚 23 | RB6 — GPIO/PGD |
| 引脚 24 | RB7 — GPIO/PGC |
| 引脚 25 | RC0 — GPIO/UART1 RX |
| 引脚 26 | RC1 — GPIO/UART1 TX |
| 引脚 27 | RC2 — GPIO/I2C1 SCL |
| 引脚 28 | RC3 — GPIO/I2C1 SDA |
典型应用
PIC24FJ64GP202-E/ML 适用于 6 应用s: USB HID Peripheral (Mouse/Keyboard/Gamepad), Wearable Health Monitor, Industrial USB Data Logger, Low-Power IoT Sensor Node, HMI Touch Panel Controller, Smart Home Edge Device.
USB HID Peripheral (Mouse/Keyboard/Gamepad)
The PIC24FJ64GP202-E/ML integrates a Full-Speed USB 2.0 OTG transceiver plus 64 KB ECC Flash and 8 KB RAM, making it ideal for USB HID peripherals such as keyboards, mice, and game controllers. The Microchip USB stack supports HID boot protocol with minimal code overhead, while the XLP sleep current of hundreds of nA extends battery life for wireless dongle designs.
推荐
Wearable Health Monitor
The PIC24FJ64GP202-E/ML's XLP sleep modes with hundreds of nanoamps retention current and 64 KB ECC Flash for application code make it well suited for wearable health monitors such as fitness bands and pulse oximeters. The 12-bit ADC interfaces directly to bio-sensor analog front ends, while the RTCC tracks timestamps without waking the CPU, conserving coin-cell energy over multi-month deployments.
推荐
Industrial USB Data Logger
The PIC24FJ64GP202-E/ML's -40C to +125C extended temperature grade (E-temp) and Full-Speed USB 2.0 device mode enable it to function as an industrial data logger that streams sensor data to a host PC. The 64 KB ECC Flash protects against bit flips in electrically noisy factory environments, while the 8 KB RAM buffers burst-mode acquisition before USB transfer.
推荐
Low-Power IoT Sensor Node
The PIC24FJ64GP202-E/ML serves as the controller core in low-power IoT sensor nodes, where its XLP technology keeps idle current under 1 uA while retaining RAM and peripheral state. The 64 KB Flash stores communication stacks and application firmware, and the integrated RTCC schedules periodic wake-up for sensor readings. It pairs naturally with Microchip's Sub-GHz or Wi-Fi modules for gateway connectivity.
推荐
HMI Touch Panel Controller
The PIC24FJ64GP202-E/ML drives small HMI touch panels via its Parallel Master Port (PMP), supporting TFT displays up to QVGA resolution. The 16 MIPS core delivers smooth menu rendering while the integrated 12-bit ADC reads capacitive touch sensor outputs. Designers can leverage Microchip's mTouch library for capacitive buttons without external hardware.
推荐
Smart Home Edge Device
The PIC24FJ64GP202-E/ML fits smart-home edge controllers such as BLE-USB bridges, Zigbee coordinators, and Z-Wave adapters. Its USB 2.0 OTG supports tethering to a host for firmware update or commissioning, while the XLP core reduces standby power below 1 mA. The 28-QFN footprint simplifies integration into compact wall-plug or tabletop form factors.
推荐
推荐产品汇总
工程参考数据： PIC24FJ64GP202-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24FJ64GP202T-I/ML | PIC24FJ64GP202-I/ML | PIC24FJ64GB002-I/ML |
|---|---|---|---|---|
| Package | QFN-28 (ML, 6x6 mm) | QFN-28 (ML, 6x6 mm) - same | QFN-28 (ML, 6x6 mm) - same | QFN-28 (ML, 6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB ECC | 64 KB ECC | 64 KB ECC | 64 KB ECC |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB |
| USB 2.0 OTG | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | No (lacks USB) |
| Operating Temperature | -40C to +125C (E-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Core Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| XLP Sleep Current | Hundreds of nA | Hundreds of nA | Hundreds of nA | Hundreds of nA |
关键差异点
- Integrated Full-Speed USB 2.0 OTG with on-chip transceiver （对比 PIC24FJ64GB002-I/ML)
- Extended E-temp grade for industrial/automotive-cabin use （对比 PIC24FJ64GP202-I/ML)
- Mature MPLAB X toolchain with extensive CIP libraries （对比 PIC24FJ64GL306-I/PT)
设计说明
Estimated: at VDD = 3.3 V, active core current is roughly 10-15 mA at 32 MHz. The integrated USB transceiver draws an additional 5-10 mA when active in device mode. Place a 1.0 uF ceramic decoupling capacitor within 3 mm of the VUSB pin to suppress USB inrush transients. The XLP sleep modes reduce quiescent current below 1 uA with full RAM retention.
Route USB DP and DM as a 90 ohm differential pair with 4 mm maximum trace spacing, no stubs, and a ground reference plane on the layer below. Keep DP/DM traces under 50 mm total length and isolate them from switching power and high-frequency digital signals. The exposed thermal pad on the QFN-28 (ML) package must be soldered to a ground plane for electrical and thermal performance.
Do not exceed 3.6 V on any digital I/O pin; the PIC24FJ family is not 5 V tolerant. Ensure MCLR is pulled high through a 10 kohm resistor unless external reset control is required. The ICD/PGD/PGC pins (RB6/RB7) must not be loaded with more than 25 pF capacitance during in-circuit programming. The 28-QFN QFN-28 (ML) package requires careful pad geometry to avoid solder wicking under the thermal pad.
合规信息
RoHS and lead-free per Microchip product page. E-temp grade is not AEC-Q100 qualified; for automotive AEC-Q100 select the -VAO suffix variant. REACH and conflict-mineral documentation available from Microchip on request.
