PIC24FV32KA302-E/ML - 32KB Flash 16-bit XLP MCU | Microchip
料号： PIC24FV32KA302-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $2.94 | $1,470.00 |
| 1,000 | $2.65 | $2,650.00 |
PIC24FV32KA302-E/ML 概述
A 16-bit MCU is a microcontroller class integrating a 16-bit data-path CPU core, on-chip Flash, RAM, EEPROM, and a rich peripheral set. Within the broader taxonomy, a 16-bit MCU sits between 8-bit microcontrollers (e.g., PIC16, ATmega) and 32-bit Cortex-M microcontrollers, offering a balanced compromise between code density, deterministic performance, low power consumption, and peripheral integration. The PIC24F family specifically emphasizes eXtreme Low Power (XLP) technology with sub-uA sleep currents and integrated Real-Time Clock/Calendar (RTCC).
Key features include 16 MIPS performance at 3.3V (32 MHz), 17 general-purpose I/O pins, integrated 12-bit ADC, Charge Time Measurement Unit (CTMU) for touch and capacitive sensing, and multiple communication peripherals: I2C, SPI, UART/USART, IrDA, and LINbus. The 5V-tolerant design allows direct interfacing with legacy 5V logic without level shifters, and the part includes on-chip debugging via ICD.
The PIC24FV32KA302-E/ML architecture combines a 16-bit RISC CPU with a 24-bit instruction word optimized for C compiler efficiency, supporting both 32KB self-programmable Flash and 512B EEPROM for non-volatile data storage. Deep Sleep modes retain RTCC, DSBOR, and DSWDT active while consuming only nanoamps, enabling years of battery life from a single coin cell.
Typical applications include battery-powered IoT sensor nodes, wearable health monitors, remote controls, low-power wireless HMI, e-metering, and industrial sensor hubs. The part is particularly attractive for designs migrating from 8-bit PIC18 platforms where higher computational throughput and more peripherals are required without sacrificing low-power behavior.
Designers should note the E/ML temperature grade (-40C to +125C) and the 28-QFN (6x6 mm) package land dimensions are identical to the F variant but with extended temperature qualification. Code protection (CodeGuard) features require careful configuration.
This page consolidates datasheet parameters, drop-in alternative part numbers, and practical design considerations, providing information not found on any single distributor listing. All pricing data references real distributor inventory as of 2026-09-30.
直接替换替代料： PIC24FV32KA302-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC24FV32KA302-E/ML （相同外形与封装尺寸） ——差异在于 Core Architecture, ADC, Operating Temperature, Package, Timers.
快速对比工具——选择替代料号进行并排对比：
PIC24F32KA302-E/ML
✅ 直接替换✓ 有现货
$2.98 / 个
查看数据手册 →PIC24FV32KA301-I/SS
✅ 直接替换📋 参考替代料（不在目录中）
PIC24FV32KA302-I/ML
✅ 直接替换✓ 有现货
$2.71 / 个
查看数据手册 →PIC24FV32KA302T-I/SS
✅ 直接替换✓ 有现货
$2.05 / 个
查看数据手册 →PIC24FV32KA304-E/ML
✅ 直接替换✓ 有现货
$2.62 / 个
查看数据手册 →PIC24FV32KA302-E/ML 最大额定值与电气特性
| Core Architecture | PIC24F 16-bit RISC CPU |
| Program Memory Size | 32 KB (11K x 24) Flash |
| RAM Size | 2 KB |
| EEPROM Size | 512 B |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Supply Voltage Range | 2.0 V to 5.5 V |
| Number of I/O | 17 |
| ADC | 12-bit |
| CTMU | Yes (Charge Time Measurement Unit) |
| Communication Interfaces | I2C, SPI, UART/USART, IrDA, LINbus |
| 封装 | 28-QFN (6x6 mm) |
| 工作温度 | -40 C to +125 C (E grade) |
| 安装类型 | Surface Mount |
| Packaging | Tube |
| RoHS 状态 | Compliant |
| Low-Power Technology | XLP (eXtreme Low Power) |
| Code Protection | CodeGuard Basic |
PIC24FV32KA302-E/ML 引脚配置
| 引脚 1 | RA0 — Analog input / digital I/O |
| 引脚 2 | RA1 — Analog input / digital I/O |
| 引脚 3 | RB0 — Digital I/O |
| 引脚 4 | RB1 — Digital I/O |
| 引脚 5 | RB2 — Digital I/O |
| 引脚 6 | RB3 — Digital I/O |
| 引脚 7 | VDD — Positive supply voltage |
| 引脚 8 | VSS — Ground reference |
| 引脚 9 | OSCI — Oscillator input |
| 引脚 10 | OSCO — Oscillator output |
| 引脚 11 | RC0 — Digital I/O |
| 引脚 12 | RC1 — Digital I/O |
| 引脚 13 | RC2 — Digital I/O |
| 引脚 14 | RC3 — Digital I/O |
| 引脚 15 | RC4 — Digital I/O |
| 引脚 16 | RC5 — Digital I/O |
| 引脚 17 | RC6 — Digital I/O |
| 引脚 18 | RC7 — Digital I/O |
| 引脚 19 | RC8 — Digital I/O |
| 引脚 20 | RC9 — Digital I/O |
| 引脚 21 | VSS — Ground reference |
| 引脚 22 | VDD — Positive supply voltage |
| 引脚 23 | RB4 — Digital I/O |
| 引脚 24 | RB5 — Digital I/O |
| 引脚 25 | RB6 — Digital I/O |
| 引脚 26 | RB7 — Digital I/O |
| 引脚 27 | RB8 — Digital I/O |
| 引脚 28 | RB9 — Digital I/O |
典型应用
PIC24FV32KA302-E/ML 适用于 6 应用s: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Industrial Sensor Hub, Remote Control / HMI, Smart Energy Meter, Automotive Body Electronics.
Battery-Powered IoT Sensor Node
The PIC24FV32KA302-E/ML's eXtreme Low Power (XLP) technology makes it ideal for battery-powered IoT sensor nodes where deep sleep current is critical. With Deep Sleep mode consuming nanoamps while keeping RTCC, DSBOR, and DSWDT active, the device can operate for years from a single coin cell. The 17 I/O pins allow direct connection to multiple sensors via I2C or SPI, while the 12-bit ADC and CTMU enable analog and proximity sensing. According to Microchip datasheet DS30009995E, the wide 2.0V to 5.5V supply range supports both 3.3V regulated rails and direct 2xAA battery connection. The 16 MIPS at 32 MHz performance handles sensor fusion and RF stack management efficiently.
推荐
Wearable Health Monitor
Wearable health monitors require ultra-low power, compact packaging, and reliable real-time operation. The PIC24FV32KA302-E/ML delivers all three with its 28-QFN (6x6 mm) footprint, XLP deep sleep, and integrated RTCC. The 12-bit ADC supports accurate measurement of heart rate, SpO2, and temperature sensor outputs, while the CTMU enables capacitive touch buttons for user interface. According to Microchip datasheet DS30009995E, the device supports 5V-tolerant I/O for direct sensor connection without level shifters. The 2KB RAM handles buffering of sensor data before BLE transmission, and 32KB Flash accommodates firmware with BLE stack and sensor algorithms.
推荐
Industrial Sensor Hub
Industrial sensor hubs aggregate data from multiple field sensors and forward to a gateway via RS-485, CAN, or LIN. The PIC24FV32KA302-E/ML fits this role with its LINbus and UART interfaces, 17 I/O, and E-grade -40C to +125C temperature qualification. The 32KB Flash accommodates Modbus or proprietary protocols, and 2KB RAM handles data buffering. According to Microchip datasheet DS30009995E, the wide 2.0V to 5.5V supply supports 24V industrial bus systems with appropriate regulation. The CTMU enables touch-button HMI panels, and the 12-bit ADC reads 4-20 mA loop sensors via external shunt resistors.
推荐
Remote Control / HMI
Infrared remote controls and human-machine interfaces benefit from the PIC24FV32KA302-E/ML's IrDA support, low power consumption, and CTMU for capacitive touch. The 17 I/O pins drive LED indicators, scan key matrices, and interface with displays. According to Microchip datasheet DS30009995E, the device's Deep Sleep mode preserves battery life over years of standby. The 32KB Flash supports complex IR protocols (RC5, RC6, SIRC, NEC) and state-machine-based button debouncing algorithms, while the 12-bit ADC reads rotary encoder position or potentiometer inputs.
推荐
Smart Energy Meter
Smart energy meters require accurate ADC measurement, RTC for time-stamping, and low power consumption. The PIC24FV32KA302-E/ML fits with its 12-bit ADC, RTCC with Deep Sleep retention, and XLP technology. The 32KB Flash supports tariff calculation and communication protocol stacks (DLMS/COSEM, M-Bus), while 2KB RAM handles measurement buffering. According to Microchip datasheet DS30009995E, the LINbus interface supports local communication with in-home displays. The 5V tolerance allows direct interfacing with metrology front-ends without level shifters, and E-grade temperature ensures outdoor meter operation.
推荐
Automotive Body Electronics
Automotive body modules (window lift, mirror control, seat adjustment) need LINbus connectivity, robust temperature rating, and low quiescent current. The PIC24FV32KA302-E/ML meets these with LINbus hardware, E-grade -40C to +125C temperature, and XLP sleep modes. According to Microchip datasheet DS30009995E, the 5V-tolerant I/O interfaces directly with 12V automotive battery through regulators. The 32KB Flash accommodates LIN stack and motor control algorithms, while the CTMU supports touch-button door handles. The 12-bit ADC reads position sensors and current feedback for closed-loop control.
推荐
推荐产品汇总
工程参考数据： PIC24FV32KA302-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC24F32KA302-E/ML | PIC24FV32KA301-I/SS | PIC24FV32KA302-I/ML | PIC24FV32KA302T-I/SS | PIC24FV32KA304-E/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Program Memory | 32 KB Flash | 32 KB Flash | 32 KB Flash | 32 KB Flash | 32 KB Flash | 32 KB Flash |
| Supply Voltage Range | 2.0V to 5.5V | 2.0V to 3.6V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| EEPROM | 512 B | 512 B | 512 B | 512 B | 512 B | 512 B |
| Communication | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA | I2C, SPI, UART, IrDA |
关键差异点
- Wide 2.0V to 5.5V supply range with 5V-tolerant I/O （对比 PIC24F32KA302-E/ML)
- Extended -40C to +125C temperature grade (E suffix) （对比 PIC24FV32KA302-I/ML)
- Extreme Low Power (XLP) with nanoamp Deep Sleep （对比 PIC24FJ64GB002-I/ML)
设计说明
The PIC24FV32KA302-E/ML achieves nanoamp Deep Sleep currents by configuring all unused peripherals as digital inputs with weak pull-downs and disabling the ADC completely. According to the Microchip datasheet (DS30009995E), RTCC, DSBOR, and DSWDT remain active in Deep Sleep, providing wake-up sources at sub-microsecond latency. For battery-powered designs, configure the on-chip LDO regulator to low-power mode and avoid toggling I/O pins during sleep to minimize current spikes.
The 28-QFN (6x6 mm) package requires careful PCB layout: place the exposed thermal pad on the bottom side with at least 8 thermal vias (0.3 mm drill, 0.6 mm pitch) to a continuous ground plane. Decouple VDD with 100nF X7R ceramic capacitors placed within 2 mm of each VDD pin. Avoid routing high-frequency signals under the QFN package to prevent coupling into the exposed pad.
Do not assume 5V tolerance for the PIC24F variant - only the PIC24FV (FV suffix) supports 2.0V to 5.5V operation; the PIC24F variant is limited to 3.6V maximum. Verify the suffix before placing 5V signals on any I/O pin. Also note the E/ML suffix indicates -40C to +125C (extended) grade; the I/ML grade is -40C to +85C (industrial). Selecting wrong grade causes out-of-spec behavior in automotive or outdoor applications.
For CTMU-based capacitive touch sensing, route the touch electrodes as short, narrow traces (less than 5 mm length, 0.2 mm width) and guard them with a ground pour to reduce noise pickup. According to Microchip application notes, the CTMU requires stable VDD - add a 10uF bulk capacitor near the IC if the touch electrodes draw significant charge current. Software calibration of CTMU current sources is recommended at production test.
合规信息
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for AEC-Q100 automotive applications, contact Microchip for PIC24F KA3xx automotive grade variants.
