PIC24F32KA302-E/ML - 32KB Flash XLP 16-bit MCU 28-QFN | Microchip
MPN: PIC24F32KA302-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.73 | $4.73 |
| 10 | $4.27 | $42.70 |
| 100 | $3.85 | $385.00 |
| 500 | $3.42 | $1,710.00 |
| 1,000 | $2.98 | $2,980.00 |
PIC24F32KA302-E/ML Overview
A microcontroller (MCU) is a compact integrated circuit containing a processor core, program and data memory, and programmable peripherals. The PIC24F family is built on a 16-bit modified Harvard RISC architecture optimized for low-power embedded control. Within Microchip's XLP lineup, the PIC24F32KA302 is positioned for battery-powered and energy-harvesting applications where quiescent current, deep-sleep retention, and fast wake-up determine battery lifetime.
Key features of this part include eXtreme Low Power technology with deep-sleep current below 1 uA, a Real-Time Clock Calendar (RTCC) that runs in Deep Sleep, dedicated Deep Sleep Brown-Out Reset (DSBOR) and Deep Sleep Watchdog Timer (DSWDT) blocks, and integrated USB 2.0 full-speed device support on selected variants. The CTMU enables capacitive touch sensing for buttons, sliders, and proximity detection without an external touch controller, reducing BOM cost and PCB area in human-interface designs.
The architecture combines a 16-bit data path with a 24-bit instruction word, providing deterministic execution and C-compiler efficiency. A peripheral pin-select (PPS) mapper allows digital peripherals to be remapped to a wide choice of I/O pins, simplifying PCB routing. The 12-bit ADC supports both single-ended and differential conversions, and the comparators can wake the core from sleep, making the device suitable for sensor-driven interrupt architectures.
Typical applications include portable medical devices, wearable fitness bands, IoT sensor nodes, capacitive touch user interfaces, smart thermostats, USB peripherals, and battery-backed industrial sensor transmitters. The CTMU and XLP deep-sleep modes make it a strong fit when average current budget is the primary design constraint.
When designing with this device, pay attention to the maximum 32MHz core clock and the resulting 16 MIPS throughput; peripheral clocking derives from the same source. For capacitive touch applications, follow the CTMU layout guidelines from the datasheet and provide a guard trace around the touch electrodes to suppress moisture false triggers.
This page synthesizes distributor pricing, drop-in PIC24F family alternatives, and practical design notes that go beyond the manufacturer datasheet.
Drop-in alternatives for PIC24F32KA302-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F32KA302-E/ML (same form factor and footprint) — differing in Core Architecture, Package, ADC, Operating Temperature, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24F32KA302-I/ML
✅ Drop-In✓ In Stock
$3.2 / Unit
View Datasheet →PIC24FV32KA302-E/ML
✅ Drop-In✓ In Stock
$2.65 / Unit
View Datasheet →PIC24F32KA301-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F16KA302-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24F32KA302-E/ML Maximum Ratings & Electrical Characteristics
| Product Family | PIC24F XLP |
| Core Architecture | PIC24F 16-bit RISC (modified Harvard) |
| Maximum CPU Frequency | 32 MHz |
| MIPS Performance | 16 MIPS |
| Program Flash Memory | 32 KB (11K x 24) |
| Data SRAM | 2 KB |
| Data EEPROM | 512 bytes |
| Operating Voltage Range | 1.8 V to 5.5 V |
| ADC | 12-bit, up to 13 channels |
| Comparators | 3 |
| PWM Channels | 3 |
| Timers | 7 |
| Special Features | CTMU, RTCC in Deep Sleep, DSBOR, DSWDT |
| Operating Temperature Range | -40 C to +125 C (E = Extended) |
| Package | 28-pin QFN (6x6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC24F32KA302-E/ML Pin Configuration
| Pin 1 | RA0 — Analog/digital I/O, CTMU input |
| Pin 2 | RA1 — Analog/digital I/O, CTMU input |
| Pin 3 | RA2 — Analog/digital I/O, CTMU input |
| Pin 4 | RA3 — Analog/digital I/O, CTMU input |
| Pin 5 | VDD — Positive power supply |
| Pin 6 | VSS — Ground reference |
| Pin 7 | RA4 — Analog/digital I/O, CTMU input |
| Pin 8 | RA5 — Analog/digital I/O, CTMU input |
| Pin 9 | RA6 — Analog/digital I/O, CTMU input |
| Pin 10 | RA7 — Analog/digital I/O, CTMU input |
| Pin 11 | RB0 — Digital I/O, programmable pull-up |
| Pin 12 | RB1 — Digital I/O, programmable pull-up |
| Pin 13 | RB2 — Digital I/O, programmable pull-up |
| Pin 14 | RB3 — Digital I/O, programmable pull-up |
| Pin 15 | RB4 — Digital I/O, programmable pull-up |
| Pin 16 | RB5 — Digital I/O, programmable pull-up |
| Pin 17 | RB6 — Digital I/O, ICSPCLK |
| Pin 18 | RB7 — Digital I/O, ICSPDAT |
| Pin 19 | RC0 — Digital I/O, oscillator input |
| Pin 20 | RC1 — Digital I/O, oscillator output |
| Pin 21 | RC2 — Digital I/O |
| Pin 22 | RC3 — Digital I/O |
| Pin 23 | RC4 — Digital I/O |
| Pin 24 | RC5 — Digital I/O |
| Pin 25 | RC6 — Digital I/O |
| Pin 26 | RC7 — Digital I/O |
| Pin 27 | VDD — Positive power supply |
| Pin 28 | VSS — Ground reference / exposed pad |
Typical Applications
PIC24F32KA302-E/ML is suitable for 7 applications: Portable Medical Devices, Wearable Fitness Bands, IoT Sensor Nodes, Capacitive Touch User Interfaces, Smart Thermostats, USB Peripherals, Battery-Backed Industrial Sensor Transmitters.
Portable Medical Devices
The PIC24F32KA302-E/ML fits portable medical devices such as glucose meters, pulse oximeters, and compact patient monitors because of its eXtreme Low Power (XLP) technology with sub-1 uA deep-sleep current and integrated RTCC running in Deep Sleep. The 32KB Flash supports application code plus a USB device stack for data upload to a host PC, while the 12-bit ADC with up to 13 channels handles multiple analog sensor inputs simultaneously. Compared to a Cortex-M0 alternative, the PIC24F32KA302's deterministic interrupt latency and 16 MIPS throughput ensure timely sensor sampling. The 28-QFN (6x6 mm) package suits handheld enclosures with limited PCB space.
Recommended
Wearable Fitness Bands
For wearable fitness bands, the PIC24F32KA302-E/ML delivers 16 MIPS at 32MHz while still drawing less than 1 uA in deep sleep, directly extending coin-cell runtime. Its 12-bit ADC with 13 channels reads battery voltage, motion sensor outputs, and skin-contact electrodes through the CTMU for capacitive button sensing. The integrated RTCC enables real-time clock for sleep tracking without waking the core. Its 28-QFN (6x6 mm) footprint and lead-free RoHS compliance suit IP-rated wearable enclosures where PCB area is severely constrained.
Recommended
IoT Sensor Nodes
In battery-powered IoT sensor nodes (smart agriculture, environmental monitoring, smart metering), the PIC24F32KA302-E/ML's XLP modes allow years of operation on a single set of AA cells. The CTMU and 12-bit ADC enable capacitive soil moisture or water level sensing directly. DSBOR and DSWDT blocks operate during deep sleep, ensuring brown-out and watchdog protection even when the core is fully halted. With 32KB Flash and 2KB SRAM, the part fits LoRaWAN or Sub-GHz stack plus application logic. Compared to discrete MCU+ADC designs, integration reduces BOM and PCB area significantly.
Recommended
Capacitive Touch User Interfaces
For appliances and industrial HMIs with capacitive touch panels, the PIC24F32KA302-E/ML integrates the CTMU (Charge Time Measurement Unit) directly, eliminating the need for an external touch controller. Sub-picofarad resolution supports buttons, sliders, and scroll wheels behind 3 mm of glass or acrylic. The 12-bit ADC converts CTMU charge times, while three comparators provide fast response for proximity detection. Compared to a touch IC plus host MCU architecture, this single-chip approach cuts BOM cost by 30-50% and simplifies the firmware stack on a single 16 MIPS core.
Recommended
Smart Thermostats
Smart thermostats benefit from the PIC24F32KA302-E/ML's 32KB Flash for HVAC control algorithms plus capacitive touch, 12-bit ADC for NTC thermistor temperature measurement, and three comparators for hardware over-temperature protection that runs even in sleep. The RTCC in Deep Sleep maintains the wall-clock schedule without waking the core, and USB full-speed device support enables Wi-Fi module firmware updates through a PC. Compared to an ARM Cortex-M0 plus external RTC chip, the integrated design reduces standby current and PCB footprint.
Recommended
USB Peripherals
For USB peripherals such as HID controllers, USB-to-UART bridges, and PC accessories, the PIC24F32KA302-E/ML integrates USB 2.0 full-speed device support on the silicon, avoiding external PHY chips. The 32KB Flash fits USB class driver stacks and application code, while 2KB of SRAM handles USB endpoint buffers and protocol state. The 12-bit ADC with 13 channels supports analog monitoring features such as cable voltage sensing. Compared to a discrete FTDI bridge plus MCU architecture, this single-chip solution reduces cost and PCB area significantly.
Recommended
Battery-Backed Industrial Sensor Transmitters
Industrial 4-20 mA or wireless sensor transmitters running from a 3.6V lithium battery benefit from the PIC24F32KA302-E/ML's wide 1.8-5.5V supply and ultra-low deep-sleep current. The 12-bit ADC digitizes bridge sensors or 4-20 mA loop measurements, three comparators provide hardware alarms that can wake the core, and the RTCC handles scheduling without intervention. The -E extended temperature range of -40C to +125C supports outdoor and process industry deployments. Compared to discrete analog front-end plus MCU designs, integration improves reliability and lowers total BOM cost by 25-40%.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F32KA302-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F32KA302-I/ML | PIC24FV32KA302-E/ML | PIC24F32KA301-I/ML | PIC24F16KA302-E/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Flash Memory | 32 KB | 32 KB | 32 KB | 16 KB (-50%) | 16 KB (-50%) |
| SRAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| EEPROM | 512 B | 512 B | 512 B | 0 B (none) | 0 B (none) |
| Temperature Grade | Extended -40C to +125C (-E) | Industrial -40C to +85C (-I) | Extended -40C to +125C (-E) | Industrial -40C to +85C (-I) | Extended -40C to +125C (-E) |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V (extended 5V I/O) | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| CTMU Touch Sensing | Yes | Yes | Yes | Yes | Yes |
| USB 2.0 FS Device | Yes (silicon dependent) | Yes | Yes | Yes | Yes |
Key Differentiators
- eXtreme Low Power (XLP) technology with sub-1 uA deep sleep (vs PIC24F32KA301-I/ML)
- Integrated CTMU for capacitive touch (vs PIC24F16KA302-E/ML)
- On-chip RTCC operating in Deep Sleep (vs PIC24FV32KA302-E/ML)
- Extended temperature range (-40C to +125C) on the -E ordering code (vs PIC24F32KA302-I/ML)
Design Notes
Estimated: At VDD = 3.3V and core frequency 32MHz with all peripherals active, the PIC24F32KA302 draws roughly 8 mA; in Deep Sleep with RTCC running, the part drops below 1 uA. To extend battery life, use the DSBOR to hold reset in Deep Sleep rather than the regular BOR, and gate any external sensors with a high-side load switch controlled by an I/O pin. Use the PIC24F's idle and sleep modes aggressively; wake on comparator or ADC interrupt rather than polling.
For the 28-QFN (6x6 mm) package, solder the exposed thermal pad to a continuous ground copper pour of at least 1 square inch to meet the datasheet thermal resistance figures and improve electrical grounding. Place the 0.1 uF VDD decoupling capacitor within 3 mm of the VDD pins (5 and 27) with a short, wide trace; add a bulk 1-10 uF tantalum or ceramic cap at the package supply entry. Keep the ICSP pins (RB6/RB7) accessible or routed to an in-circuit programming header.
Do not exceed 5.5V on any I/O pin even though the core runs from an internal 1.8V LDO. When using the CTMU for capacitive touch, ensure firmware updates the baseline regularly to compensate for temperature and humidity drift. For USB designs, add the mandatory 0.1 uF decoupling on VBUS and ensure the D+/D- traces are 90 ohm differential matched and short. The Peripheral Pin Select (PPS) mapper must be configured before the mapped peripheral is enabled, or the peripheral will not function.
Estimated: The 28-QFN package has a theta_JA of approximately 31 C/W on a standard 4-layer JEDEC test board. At maximum active current of 8 mA at 3.3V (26.4 mW dissipation), the junction rises less than 1 C above ambient, so no heatsink is required. In enclosed industrial enclosures with limited airflow, derate the ambient temperature by 10-15 C below the datasheet maximum to ensure long-term reliability.
Route the analog ADC inputs (RAx pins) away from digital switching traces to minimize coupled noise. Provide a separate analog ground island connected to the main ground at a single point near the MCU's VSS pins. For CTMU capacitive touch electrodes, surround each touch pad with a grounded guard trace and use equal-length, equal-width traces to all electrodes. Place a series ferrite bead on the supply rail feeding analog-only sections to suppress digital switching noise.
Compliance Information
RoHS and lead-free compliance per Microchip product page. Industrial -40C to +125C extended grade available; not AEC-Q100 qualified (automotive).
