PIC32MM0016GPL036-I/M2 - 32-Bit MCU, 16KB Flash, 36-SQFN | Microchip
料号： PIC32MM0016GPL036-I/M2 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.55 | $25.50 |
| 100 | $2.2 | $220.00 |
| 500 | $1.92 | $960.00 |
| 1,000 | $1.65 | $1,650.00 |
PIC32MM0016GPL036-I/M2 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and programmable peripherals onto one silicon die. The PIC32MM GPL line sits inside Microchip's broader PIC32 family and within the wider hierarchy of 32-bit microcontrollers, offering an ARM-free, MIPS-based alternative for low-power applications. The microAptiv UC core provides the standard MIPS32 instruction set plus microMIPS code compression for higher code density.
Key features of the PIC32MM0016GPL036-I/M2 include 16 KB Flash, 4 KB SRAM, 79 CoreMark performance at 25 MHz, integrated peripherals such as ADC, comparators, PWM, I2C, SPI, and UART, and XLP sleep modes that reach down to 500 nA for long battery life. The 36-pin SQFN package gives access to roughly two dozen GPIO pins while keeping PCB footprint under 6x6 mm.
Technically, the part uses the microAptiv UC pipeline with hardware multiply/divide and a tightly coupled peripheral bus, running from a 2.0 V to 3.6 V supply. The Flash endurance is rated for 20K minimum erase/write cycles and SRAM is retained down to 1.8 V typical, supporting RTC backup scenarios. Programming is supported via Microchip's standard ICSP/ICD interface and the MPLAB Harmony ecosystem.
Typical applications include IoT sensor nodes, wearable fitness/health monitors, low-cost remote controls, small home appliances, and consumer devices where the design needs 32-bit performance without Cortex-M pricing. Industrial uses include HMI panels, simple motor control loops, and USB-to-UART bridges when paired with an external transceiver.
When designing with this MCU, mind the 3.6 V absolute maximum VDD and route the exposed pad of the SQFN to a solid ground pour for thermal dissipation. Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of the supply pins.
This page synthesizes distributor stock, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： PIC32MM0016GPL036-I/M2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MM0016GPL036-I/M2 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Core Architecture, Data Memory (SRAM), Program Memory (Flash).
快速对比工具——选择替代料号进行并排对比：
PIC32MM0016GPL036-E/M2
✅ 直接替换✓ 有现货
$0.61 / 个
查看数据手册 →PIC32MM0032GPL036-I/M2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
PIC32MM0064GPL036-I/M2
✅ 直接替换✓ 有现货
$1.65 / 个
查看数据手册 →PIC32MM0016GPL036T-I/M2
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$0.65 / 个
查看数据手册 →PIC32MM0016GPL036-I/M2VAO
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
PIC32MM0016GPL036-I/M2 最大额定值与电气特性
| Core Architecture | MIPS32 microAptiv UC |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Maximum CPU Speed | 25 MHz |
| CoreMark Score | 79 CoreMark at 25 MHz |
| Supply Voltage (VDD) | 2.0 V to 3.6 V |
| 工作温度 | -40C to +85C (Industrial, -I suffix) |
| 封装 | 36-pin SQFN (6x6 mm) |
| Sleep Current (XLP) | 500 nA typical (per family claim) |
| Instruction Set | MIPS32 / microMIPS |
| Programming Interface | ICSP / ICD (4-wire JTAG-like) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Flash Endurance | 20K erase/write cycles minimum |
| Lead-Free | Yes |
PIC32MM0016GPL036-I/M2 引脚配置
| 引脚 1 | RA0 — GPIO/Analog input |
| 引脚 2 | RA1 — GPIO/Analog input |
| 引脚 3 | RA2 — GPIO/Analog input |
| 引脚 4 | RA3 — GPIO/Analog input |
| 引脚 5 | VDD — Supply voltage (2.0 V to 3.6 V) |
| 引脚 6 | VSS — Ground reference |
| 引脚 7 | RB0 — GPIO/Programming pin |
| 引脚 8 | RB1 — GPIO/Programming pin |
| 引脚 9 | RB2 — GPIO |
| 引脚 10 | RB3 — GPIO |
| 引脚 11 | RB4 — GPIO/SDA |
| 引脚 12 | RB5 — GPIO/SCL |
| 引脚 13 | RB6 — GPIO/PGC (ICD clock) |
| 引脚 14 | RB7 — GPIO/PGD (ICD data) |
| 引脚 15 | RB8 — GPIO |
| 引脚 16 | RB9 — GPIO |
| 引脚 17 | RB10 — GPIO |
| 引脚 18 | RB11 — GPIO |
| 引脚 19 | RB12 — GPIO |
| 引脚 20 | RB13 — GPIO |
| 引脚 21 | RB14 — GPIO |
| 引脚 22 | RB15 — GPIO |
| 引脚 23 | RC0 — GPIO |
| 引脚 24 | RC1 — GPIO |
| 引脚 25 | RC2 — GPIO |
| 引脚 26 | RC3 — GPIO |
| 引脚 27 | RC4 — GPIO |
| 引脚 28 | RC5 — GPIO |
| 引脚 29 | RC6 — GPIO |
| 引脚 30 | RC7 — GPIO |
| 引脚 31 | RC8 — GPIO |
| 引脚 32 | RC9 — GPIO |
| 引脚 33 | MCLR — Master clear reset (active low) |
| 引脚 34 | OSC1 — Crystal oscillator input |
| 引脚 35 | OSC2 — Crystal oscillator output |
| 引脚 36 | AVDD — Analog supply voltage |
| 引脚 EP | EP — Exposed thermal pad - connect to ground |
典型应用
PIC32MM0016GPL036-I/M2 适用于 6 应用s: IoT Sensor Nodes, Wearable Health and Fitness Devices, Low-Cost Remote Controls, Small Home Appliances, Consumer HMI Panels, USB-to-UART Bridge Modules.
IoT Sensor Nodes
The PIC32MM0016GPL036-I/M2's 500 nA XLP sleep current and 25 MHz microAptiv UC core make it ideal for battery-powered IoT sensor nodes that spend most of their life in deep sleep. With 16 KB Flash for small RTOS or bare-metal firmware and 4 KB SRAM for sensor buffering, it fits temperature, humidity, occupancy, and air-quality nodes. The 36-SQFN (6x6 mm) footprint is small enough for coin-cell sensor tags, and the integrated ADC plus I2C/SPI peripherals connect directly to digital sensors. Pair with a sub-GHz or BLE radio module for typical wireless IoT deployments.
推荐
Wearable Health and Fitness Devices
The PIC32MM0016GPL036-I/M2 suits wearable fitness bands and health patches where every microwatt counts. The 2.0 V to 3.6 V supply works directly from a single-cell Li-ion or Li-poly battery, and the 500 nA sleep current extends battery life to weeks or months between charges. The microAptiv UC core at 25 MHz runs BLE stack prep, heart-rate algorithms, and step counting in real time. The 36-SQFN footprint fits wristbands, and the ADC plus comparators interface with optical heart-rate and motion sensors.
推荐
Low-Cost Remote Controls
The PIC32MM0016GPL036-I/M2 delivers ample MIPS for IR/RF remote control encoding while keeping BOM cost under $3 at volume. The 16 KB Flash stores dozens of device code tables, the 4 KB SRAM buffers key-scan debouncing, and the microAptiv UC core handles RC5, NEC, SIRC, or proprietary protocols without taxing CPU. The PWM peripherals drive IR LEDs directly, and the 2.0 V to 3.6 V supply supports two AAA cells. The 36-SQFN package fits slim handheld enclosures.
推荐
Small Home Appliances
The PIC32MM0016GPL036-I/M2 fits small home appliances such as coffee makers, blenders, humidifiers, and air purifiers that need 32-bit control without Cortex-M pricing. The microAptiv UC core at 25 MHz runs PID loops for motor speed, temperature regulation, and humidity control. Integrated PWM outputs drive TRIACs or FETs for heating elements and pumps. The ADC reads thermistors, water-level sensors, and motor current. Industrial temperature grade ensures reliable operation in warm appliance interiors.
推荐
Consumer HMI Panels
The PIC32MM0016GPL036-I/M2 powers low-cost human-machine interface panels such as thermostats, security keypads, and simple appliance displays. The microAptiv UC core at 25 MHz drives character LCDs or small graphical OLEDs, scans key matrices, and runs menu state machines. The 16 KB Flash supports multi-language UI strings, and 4 KB SRAM handles display buffers. The 36-SQFN footprint is small enough for wall-mounted thermostats, and the integrated I2C/SPI/UART interfaces connect to displays, capacitive touch controllers, and Wi-Fi modules.
推荐
USB-to-UART Bridge Modules
The PIC32MM0016GPL036-I/M2 serves as the host MCU in low-cost USB-to-UART bridge modules that replace discontinued CP2102-class parts. The microAptiv UC core at 25 MHz handles USB CDC enumeration and UART data forwarding with low latency, while 16 KB Flash stores USB stack and class drivers. The 4 KB SRAM buffers bulk transfers. The 2.0 V to 3.6 V supply is compatible with USB-powered designs through an on-board 3.3 V LDO. The 36-SQFN package keeps the module footprint under 1 square centimeter.
推荐
推荐产品汇总
工程参考数据： PIC32MM0016GPL036-I/M2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MM0016GPL036-E/M2 | PIC32MM0032GPL036-I/M2 | PIC32MM0064GPL036-I/M2 | PIC32MM0016GPL036T-I/M2 |
|---|---|---|---|---|---|
| Package | 36-SQFN (6x6 mm) | 36-SQFN (6x6 mm) - same | 36-SQFN (6x6 mm) - same | 36-SQFN (6x6 mm) - same | 36-SQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same brand | Microchip Technology - same brand | Microchip Technology - same brand | Microchip Technology - same brand |
| Flash Memory | 16 KB | 16 KB - identical | 32 KB | 64 KB | 16 KB - identical |
| SRAM | 4 KB | 4 KB - identical | 4 KB - identical | 8 KB | 4 KB - identical |
| Maximum CPU Speed | 25 MHz | 25 MHz - identical | 25 MHz - identical | 25 MHz - identical | 25 MHz - identical |
| Core Architecture | MIPS32 microAptiv UC | MIPS32 microAptiv UC - identical | MIPS32 microAptiv UC - identical | MIPS32 microAptiv UC - identical | MIPS32 microAptiv UC - identical |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Supply Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V - identical | 2.0 V to 3.6 V - identical | 2.0 V to 3.6 V - identical | 2.0 V to 3.6 V - identical |
关键差异点
- Lower-cost variant of PIC32MM0064GPL036 family with same footprint （对比 PIC32MM0064GPL036-I/M2)
- Extended temperature variant available in same footprint （对比 PIC32MM0016GPL036-E/M2)
- Higher Flash options in same 36-SQFN pinout （对比 PIC32MM0032GPL036-I/M2)
设计说明
The PIC32MM0016GPL036-I/M2 operates from 2.0 V to 3.6 V. Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of the supply pin, plus a bulk 1 uF to 10 uF tantalum or ceramic capacitor on the same rail. For battery applications using a single-cell Li-ion (3.0 V to 4.2 V), add an LDO such as MCP1700 to drop to 3.3 V. The XLP sleep modes draw as low as 500 nA per Microchip family claims, but verify on bench because actual sleep current depends on enabled peripherals and wake-up sources.
The 36-SQFN package has an exposed thermal pad (pin EP) that must be soldered to a ground pour of at least 25 mm² to meet the datasheet thermal ratings. Without the EP soldered, junction-to-ambient thermal resistance (theta_JA) rises sharply and the device may overheat at full 25 MHz CPU load with peripherals enabled. Use at least 4 thermal vias in the EP pad connecting top copper to inner/bottom ground planes. For continuous heavy computation, derate ambient temperature by 5C to 10C below the 85C industrial maximum.
Place the 100 nF decoupling capacitor directly between VDD (pin 5) and VSS (pin 6) using short traces to minimize parasitic inductance. Keep the crystal or external clock traces to OSC1/OSC2 short and surrounded by ground pour to avoid coupling digital switching noise into the oscillator. Route analog signals (AVDD, analog GPIO) away from high-speed digital lines such as PWM outputs and clock traces. Avoid running noisy signals under the device to prevent injected crosstalk into sensitive ADC channels.
Do not exceed 3.6 V on VDD - even brief over-voltage transients can damage the on-chip voltage regulator. Always include a 10 kohm pull-up resistor on MCLR to ensure clean reset behavior; floating MCLR can cause unpredictable resets. When using the ADC, allow sufficient acquisition time by selecting an appropriate ADC clock divider in your firmware, or readings will be inaccurate. Finally, ensure the ICSP/ICD programming pins (PGC/PGD) are not loaded with heavy capacitance that prevents in-circuit debugging.
合规信息
RoHS and REACH compliant per Microchip product page. Industrial temperature grade -I (not AEC-Q100). For automotive AEC-Q100 qualified parts in this family, look at PIC32MM automotive variants.
