Microchip Technology

PIC32MX230F256D-V/ML - 32-Bit MCU 256KB Flash USB 44-VQFN | Microchip

料号: PIC32MX230F256D-V/ML ✓ 量产中
有现货 1-3 个工作日内发货
2.3 V to 3.6 V Vdss 0.5 mA/MHz (typical) Id VQFN-44 (8x8 mm) with exposed pad Package 50 MHz (83 DMIPS) Speed 256 KB Memory
低至 $4.05 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-01
批量定价
数量 单价 小计
1 $6.95 $6.95
10 $6.18 $61.80
100 $5.32 $532.00
500 $4.66 $2,330.00
1,000 $4.05 $4,050.00
ℹ️ 所有价格均以 USD 计价

PIC32MX230F256D-V/ML 概述

The Microchip Technology PIC32MX230F256D-V/ML is a 32-bit MIPS M4K RISC microcontroller with 256 KB Flash and 16 KB SRAM, packaged in a 44-pin VQFN (8x8 mm) with exposed thermal pad. The device runs at up to 50 MHz / 83 DMIPS while consuming a low 0.5 mA/MHz typical active current and includes two I2S or SPI interfaces, USB 2.0 full-speed device/host/OTG, a 10-bit ADC, three analog comparators, CTMU, RTCC, Parallel Master Port (PMP) for graphics, and Peripheral Pin Select (PPS) for flexible remapping. The -V suffix denotes the automotive (AEC-Q100) temperature grade and the /ML suffix denotes the 44-VQFN package.

Background: A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, Flash program memory, SRAM data memory, and a wide range of analog and digital peripherals into one package, targeting embedded systems that need more compute than 8/16-bit MCUs. The PIC32MX1XX/2XX 28/36/44-pin family sits in the lower-flash tier of Microchip's PIC32 line, optimized for cost-sensitive USB, audio, and graphics applications.

Key features include 50 MHz / 83 DMIPS performance from the MIPS32 M4K core, 256 KB single-cycle Flash, 16 KB SRAM, two I2S/SPI modules for codec and serial communication, PPS for flexible pin assignment, PMP for graphics interfaces, USB 2.0 full-speed device/host/OTG, mTouch capacitive touch support via CTMU, 1 ns high-resolution time measurement, RTCC for real-time clock, and on-chip debugging via 2-wire programming.

The architecture combines a Harvard-style 5-stage pipeline with single-cycle Flash access and a 4-channel DMA controller, optimizing for predictable real-time response in USB, audio, and graphics code paths. Integrated PLLs, internal 8 MHz oscillator, and dual oscillator pins allow flexible system clocking while keeping BOM cost low.

Typical applications include USB audio (USB headset, USB speakerphone, USB microphone), low-cost graphics HMI, capacitive touch key panels (mTouch), industrial control and sensor hubs, automotive body electronics (AEC-Q100 grade), and consumer appliances that need USB connectivity.

A key design tip: PPS allows most digital peripherals to be remapped to multiple I/O pins, simplifying PCB layout but requiring careful review of the pin assignment table in the datasheet to avoid function conflicts.

This page synthesizes distributor pricing, AEC-Q100 drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for selecting and sourcing the PIC32MX230F256D-V/ML.

直接替换替代料: PIC32MX230F256D-V/ML ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: PIC32MX230F256D-V/ML (相同外形与封装尺寸) ——差异在于 ADC, Package, Operating Temperature, Timers, USB.

Microchip Technology
ADC: 10-bit, 1 Msps, up to 28 channels
Package: 44-pin QFN with EP (ML)
Timers: 5 x 16-bit / 2 x 32-bit
Microchip Technology
ADC: 10-bit, 1 MSPS, up to 13 channels
Package: 44-QFN (8x8 mm, 0.65 mm pitch)
Operating Temperature: -40C to +105C
Microchip Technology
ADC: 10-bit, up to 1.1 Msps
Package: 28-pin QFN (ML) 6x6 mm with EP
Operating Temperature: -40C to +125C (automotive Grade 1)
Microchip Technology
ADC: 10-bit, up to 13 channels, 1 Msps
Package: 44-pin QFN (8x8 mm) with exposed pad
Operating Temperature: -40 C to +85 C (Industrial, 'I')
Microchip Technology
ADC: 10-bit, up to 1 Msps
Package: 44-pin TQFP (10x10 mm)
Operating Temperature: -40 C to +85 C (Industrial)
Microchip Technology
ADC: 10-bit, up to 28 channels, 1 Msps
Package: 44-QFN (8x8 mm) with exposed pad
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
ADC: 10-bit, up to 13 channels
Package: 44-VQFN (8x8 mm) Exposed Pad

快速对比工具——选择替代料号进行并排对比:

PIC32MX230F256D-50I/ML

✅ 直接替换
Microchip Technology
📦 VQFN-44 (8x8 mm)
MIPS32 M4K 32-bit RISC · 50 MHz (83 DMIPS) · 256 KB (256K x 8) · 64 KB · 2.3 V to 3.6 V · -40 C to +85 C (Industrial, 'I') · 10-bit, up to 13 channels, 1 Msps · USB 2.0 full-speed Device/Host/OTG

✓ 有现货

$3.96 / 个

查看数据手册 →

PIC32MX230F256DT-V/ML

✅ 直接替换
Microchip Technology
📦 VQFN-44 (8x8 mm)
MIPS32 M4K · 32-Bit · 40 MHz · FLASH · 256 KB (256K x 8) · 16 KB · 2.3 V to 3.6 V · -40C to +105C (Automotive Grade 1)

✓ 有现货

$2.96 / 个

查看数据手册 →

PIC32MX230F256DT-I/ML

✅ 直接替换
Microchip Technology
📦 VQFN-44 (8x8 mm)
MIPS32 M4K · 32-Bit Single-Core · 40 MHz · 256 KB (256K x 8) · 16 KB · 2.3 V to 3.6 V · -40C to +85C (Industrial) · 44-QFN (8x8 mm) with exposed pad

✓ 有现货

$3.31 / 个

查看数据手册 →

PIC32MX230F256DT-50I/PT

✅ 直接替换
Microchip Technology
📦 TQFP-44
MIPS32 M4K 32-bit RISC · 50 MHz (83 DMIPS) · 256 KB · 16 KB · USB 2.0 Full-Speed Device/Host/OTG · 10-bit, up to 1 Msps · Up to 35 · Five 16/32-bit

✓ 有现货

$4.41 / 个

查看数据手册 →

PIC32MX170F256D-V/ML

✅ 直接替换
Microchip Technology
📦 VQFN-44 (8x8 mm)
MIPS M4K (32-bit RISC) · 50 MHz / 83 DMIPS · 256 KB · 64 KB · 2.5 V to 3.6 V · 44-pin QFN with EP (ML) · -40C to +105C (V suffix - industrial) · USB 2.0 Full-Speed Device, internal transceiver

✓ 有现货

$2.65 / 个

查看数据手册 →

PIC32MX230F256D-V/ML 最大额定值与电气特性

Core MIPS32 M4K
CPU Architecture 32-bit RISC
Maximum CPU Frequency 50 MHz (83 DMIPS)
Flash Memory 256 KB
SRAM 16 KB
电源电压 2.3 V to 3.6 V
Active Current 0.5 mA/MHz (typical)
工作温度 -40C to +125C (automotive grade -V)
封装 VQFN-44 (8x8 mm) with exposed pad
USB USB 2.0 full-speed device/host/OTG
ADC 10-bit
Analog Comparators 3
CTMU Yes (mTouch capacitive touch)
RTCC Yes (Real-Time Clock Calendar)
PPS Peripheral Pin Select
PMP Parallel Master Port for graphics
I2S/SPI 2 modules
DMA 4 channels
RoHS 状态 Compliant
AEC-Q100 Qualified (-V grade)

PIC32MX230F256D-V/ML 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 SDA3/RA5 — I2C3 SDA or GPIO RA5
引脚 2 RPB5/RB5 — Remappable I/O RB5
引脚 3 VREF-/CVREF-/RA9 — ADC VREF- or GPIO RA9
引脚 4 VREF+/CVREF+/RA10 — ADC VREF+ or GPIO RA10
引脚 5 RB6/PGEC1 — GPIO RB6 / ICSP clock
引脚 6 RB7/PGED1 — GPIO RB7 / ICSP data
引脚 7 RC0 — GPIO RC0
引脚 8 RC1 — GPIO RC1
引脚 9 RC2 — GPIO RC2
引脚 10 VSS — Ground
引脚 11 VDD — Positive supply (2.3-3.6 V)
引脚 12 RB8 — GPIO RB8
引脚 13 RB9 — GPIO RB9
引脚 14 RB10 — GPIO RB10
引脚 15 RB11 — GPIO RB11
引脚 16 VSS — Ground
引脚 17 VDD — Positive supply (2.3-3.6 V)
引脚 18 RB12 — GPIO RB12
引脚 19 RB13 — GPIO RB13
引脚 20 RB14 — GPIO RB14
引脚 21 RB15 — GPIO RB15
引脚 22 RD0 — GPIO RD0
引脚 23 RD1 — GPIO RD1
引脚 24 RD2 — GPIO RD2
引脚 25 RD3 — GPIO RD3
引脚 26 RD4 — GPIO RD4
引脚 27 RD5 — GPIO RD5
引脚 28 RD6 — GPIO RD6
引脚 29 RD7 — GPIO RD7
引脚 30 RC3 — GPIO RC3
引脚 31 RC4/SDI2 — GPIO RC4 / SPI2 SDI
引脚 32 RC5/SDO2 — GPIO RC5 / SPI2 SDO
引脚 33 RC6/SCK2 — GPIO RC6 / SPI2 SCK
引脚 34 RC7/SS2 — GPIO RC7 / SPI2 SS
引脚 35 RC8 — GPIO RC8
引脚 36 RC9 — GPIO RC9
引脚 37 VUSB — USB 3.3V internal regulator output
引脚 38 D+/RB3 — USB D+ or GPIO RB3
引脚 39 D-/RB2 — USB D- or GPIO RB2
引脚 40 RB4 — GPIO RB4
引脚 41 RA0 — GPIO RA0
引脚 42 RA1 — GPIO RA1
引脚 43 OSC1/CLKI/RC12 — Crystal oscillator input or GPIO RC12
引脚 44 OSC2/CLKO/RC13 — Crystal oscillator output or GPIO RC13

典型应用

PIC32MX230F256D-V/ML 适用于 6 应用s: USB Audio Headsets and Speakerphones, Capacitive Touch Key Panels (mTouch), Low-Cost Graphics HMI, Automotive Body Electronics, Industrial Sensor Hubs, Consumer Appliance USB Connectivity.

🎧

USB Audio Headsets and Speakerphones

The PIC32MX230F256D-V/ML is well suited for USB audio peripherals like headsets and speakerphones because it integrates a USB 2.0 full-speed device/host/OTG controller alongside two I2S or SPI modules that interface directly to audio codecs. The 50 MHz MIPS M4K core running at 0.5 mA/MHz typical active current, 256 KB Flash, and 16 KB SRAM are sufficient to host a USB Audio Class 1.0 stack and a lightweight RTOS for codec control. The AEC-Q100 -V grade rating of -40C to +125C also allows this design pattern to be reused inside automotive cabin microphone or hands-free modules without hardware changes, while the exposed thermal pad on the VQFN-44 package provides enough thermal headroom at typical headset power levels.

🧩

Capacitive Touch Key Panels (mTouch)

The PIC32MX230F256D-V/ML is a strong fit for mTouch capacitive touch buttons and sliders thanks to the integrated CTMU (Charge Time Measurement Unit), which provides high-resolution 1 ns time measurement for charge-based touch sensing. The 10-bit ADC and three analog comparators can be reused for additional sensor channels beyond the CTMU, allowing mixed touch and analog sensing on the same MCU. PPS allows the touch sensor I/O to be routed to almost any pin, simplifying routing of dense keypad layouts. With 256 KB Flash and 16 KB SRAM, designers can implement complete touch UI state machines plus a host-side USB or UART link to an appliance controller, all in one AEC-Q100 qualified device.

📺

Low-Cost Graphics HMI

The PIC32MX230F256D-V/ML is appropriate for low-cost graphical human-machine interfaces through the integrated PMP (Parallel Master Port), which can directly drive small TFT displays and character LCDs without an external graphics controller. The 50 MHz MIPS core and 4-channel DMA allow smooth framebuffer updates even with graphics libraries like MLA, while the 256 KB Flash holds complete UI assets. The -40C to +125C automotive temperature range also makes the part usable in industrial HMI panels where automotive-grade AEC-Q100 qualification is a plus. The VQFN-44 8x8 mm footprint keeps PCB size minimal for compact appliance or industrial front-panel designs.

🚗

Automotive Body Electronics

The PIC32MX230F256D-V/ML fits automotive body electronics modules including climate control panels, mirror controllers, and seat modules thanks to the AEC-Q100 qualification implied by the -V suffix and the -40C to +125C operating temperature range. The USB 2.0 full-speed OTG controller simplifies diagnostic interface implementation, while the CTMU enables capacitive touch keys for solid-state switch panels. The 0.5 mA/MHz active current and integrated RTCC support low-power standby modes critical to automotive quiescent current budgets. Designers migrating from 16-bit PIC MCUs get a 32-bit MIPS core plus USB at comparable cost and footprint.

🏭

Industrial Sensor Hubs

The PIC32MX230F256D-V/ML is suitable for industrial sensor hubs that aggregate sensor data over USB or serial and forward it to a host controller. The two I2S/SPI modules can run as SPI masters to multiple sensors concurrently, while the 4-channel DMA offloads high-throughput sensor reads. The 10-bit ADC and three comparators handle mixed analog and digital sensor types, and the RTCC provides timestamped data logging. AEC-Q100 qualification is overkill for general industrial use, but it provides extra reliability margin and supports harsher factory environments where -40C to +125C temperature range is needed.

🔧

Consumer Appliance USB Connectivity

The PIC32MX230F256D-V/ML fits consumer appliances such as smart kitchen devices and HVAC controllers that need USB connectivity for firmware updates, debug, or data export. The USB 2.0 full-speed OTG controller handles both device and host roles, supporting USB sticks and serial-to-USB bridges. The 256 KB Flash and 16 KB SRAM are enough for an RTOS plus appliance UI logic, while PMP supports a small display for user interaction. PPS remapping simplifies the PCB layout of appliances where connector placement forces awkward pin assignments, allowing designers to reassign peripheral pins late in the design without re-spinning the board.

推荐产品汇总

PCM2704C USB audio DAC with I2S-compatible interface 用于: USB Audio Headsets and Speakerphones SGTL5000 I2S audio codec with integrated headphone amp 用于: USB Audio Headsets and Speakerphones PIC32MX170F256D-V/ML Microchip Technology 用于: Capacitive Touch Key Panels (mTouch) CAP1206 Companion capacitive touch controller for expanded channels 用于: Capacitive Touch Key Panels (mTouch) SSD1963 Solomon Systech 用于: Low-Cost Graphics HMI ST7565R Monochrome graphic LCD controller for low-power HMI 用于: Low-Cost Graphics HMI MCP2515 External CAN controller for body network connectivity 用于: Automotive Body Electronics ATA6561 CAN transceiver for automotive network physical layer 用于: Automotive Body Electronics MCP9700 Analog temperature sensor for ADC input 用于: Industrial Sensor Hubs ADXL345 SPI/3-axis accelerometer for motion sensing 用于: Industrial Sensor Hubs FT232HL FTDI 用于: Consumer Appliance USB Connectivity W25Q64JVSSIQ External SPI Flash for firmware storage 用于: Consumer Appliance USB Connectivity
What is the core architecture of PIC32MX230F256D-V/ML?
The PIC32MX230F256D-V/ML uses the MIPS32 M4K 32-bit RISC core running at up to 50 MHz / 83 DMIPS. According to the Microchip PIC32MX1XX/2XX 28/36/44-pin family datasheet (DS60001168L), the M4K core provides a 5-stage pipeline, single-cycle Flash access, and hardware multiply/divide, making it well-suited for USB, audio, and graphics code paths that need deterministic real-time performance in embedded applications.
What is the operating temperature range of PIC32MX230F256D-V/ML?
The PIC32MX230F256D-V/ML operates from -40C to +125C, matching the -V (automotive) temperature grade. According to the Microchip PIC32MX1XX/2XX 28/36/44-pin family datasheet, this wide temperature range plus AEC-Q100 qualification allows the part to be used in automotive under-hood, body, and chassis electronics where consumer-grade (-40C to +85C) parts would fail long-term reliability testing.
Where to buy PIC32MX230F256D-V/ML online?
The PIC32MX230F256D-V/ML is in stock at major distributors including DigiKey (part 5323713) and Mouser, with unit prices starting around $6.95 in single-piece quantities as of 2026-10-02. Authorized distributors such as Arrow, Avnet, and Future Electronics also carry the part for volume orders; Microchip Direct is the official manufacturer channel for production volumes.
What is the lead time for PIC32MX230F256D-V/ML?
Lead time for the PIC32MX230F256D-V/ML is approximately 6-10 weeks when not in distributor stock. As of 2026-10-02, DigiKey shows factory stock with immediate shipment available, while Mouser and Avnet typically carry reel inventory. For production volumes, Microchip Direct provides scheduled backlog delivery through their authorized partner network.
What is the package of PIC32MX230F256D-V/ML?
The PIC32MX230F256D-V/ML ships in a 44-pin VQFN (also called QFN) package measuring 8x8 mm with an exposed thermal pad. According to the Microchip PIC32MX1XX/2XX datasheet, the -ML suffix identifies this specific 44-VQFN package, and the exposed pad must be soldered to the PCB ground plane to meet the 1.0 W thermal dissipation specification and ensure AEC-Q100 thermal reliability.
How much Flash and RAM does PIC32MX230F256D-V/ML have?
The PIC32MX230F256D-V/ML provides 256 KB of single-cycle Flash program memory and 16 KB of SRAM data memory. According to the Microchip PIC32MX1XX/2XX datasheet, the Flash supports self-programming under firmware, and the 16 KB SRAM is enough for typical USB audio stacks, graphics framebuffers, and RTOS workloads used in PIC32 designs.
What is the difference between PIC32MX230F256D-V/ML and PIC32MX230F256D-I/ML?
The PIC32MX230F256D-V/ML is automotive AEC-Q100 qualified and rated -40C to +125C, while the PIC32MX230F256D-I/ML is the industrial grade rated -40C to +85C. Both share the same VQFN-44 (8x8 mm) package footprint and identical peripherals, so the I/ML can be dropped onto a V/ML PCB for non-automotive designs. The V/ML cost is higher due to AEC-Q100 qualification testing.
What is the best drop-in replacement for PIC32MX230F256D-V/ML?
The best drop-in replacement for the PIC32MX230F256D-V/ML in the same VQFN-44 footprint is the PIC32MX230F256DT-V/ML (Tape & Reel variant of the same die). For lower-cost designs that still need AEC-Q100, the PIC32MX230F128L-V/PF shares the automotive grade but uses a TQFP-64 footprint, so it requires PCB rework and is not a true drop-in. The V/ML remains the lowest-cost true drop-in for existing VQFN-44 designs.
Is PIC32MX230F256D-V/ML RoHS compliant?
Yes, the PIC32MX230F256D-V/ML is RoHS compliant per the Microchip product page, which states compliance with EU Directive 2011/65/EU and subsequent amendments including 2015/863 (RoHS 3) for ten restricted substances. The /ML suffix also indicates lead-free (Pb-free) reflow-compatible terminations meeting JEDEC J-STD-020 MSL3 at 260C peak reflow.
Can PIC32MX230F256D-V/ML run at 50 MHz?
Yes, the PIC32MX230F256D-V/ML runs at up to 50 MHz / 83 DMIPS from a 2.3-3.6 V supply. According to the Microchip PIC32MX1XX/2XX datasheet, the PLL multiplies the internal 8 MHz oscillator or an external crystal up to 50 MHz system clock, while the M4K core executes most instructions in one cycle, delivering 1.66 DMIPS per MHz. This performance is sufficient for USB 2.0 full-speed, I2S audio, and modest graphics framebuffer updates.
Is PIC32MX230F256D-V/ML suitable for USB audio applications?
Yes, the PIC32MX230F256D-V/ML is well-suited for USB audio applications like USB headsets and speakerphones. It integrates a USB 2.0 full-speed device/host/OTG controller plus two I2S/SPI modules that can directly interface to audio codecs. The 50 MHz MIPS core, 16 KB SRAM, and 256 KB Flash are adequate for typical USB Audio Class 1.0 firmware stacks and codec drivers.
Where to download PIC32MX230F256D-V/ML datasheet PDF?
The PIC32MX230F256D-V/ML datasheet PDF can be downloaded from Microchip's official documentation page at the URL: https://ww1.microchip.com/downloads/aemDocuments/documents/MCU32/ProductDocuments/DataSheets/PIC32MX1XX2XX283644-PIN_Datasheet_DS60001168L.pdf. This document covers the entire PIC32MX1XX/2XX 28/36/44-pin family including the -V/ML variant. The Microchip product page at https://www.microchip.com/en-us/product/PIC32MX230F256D also links to errata and family reference manuals.
Where to find PIC32MX230F256D-V/ML pinout?
The PIC32MX230F256D-V/ML pinout is documented in the PIC32MX1XX/2XX 28/36/44-pin family datasheet, section 'Pin Diagrams' - on page covering the VQFN-44 (8x8 mm) package. The 44-VQFN has pins on all four sides plus a central exposed thermal pad (EP) that must be soldered to the PCB ground plane. The XAIPART product page also shows a package diagram SVG with pin numbering.
What is the cheapest Microchip equivalent for PIC32MX230F256D-V/ML?
The cheapest Microchip drop-in equivalent for the PIC32MX230F256D-V/ML is the PIC32MX230F256D-I/ML (industrial grade, same VQFN-44 footprint, identical peripherals), which trades -40C to +125C automotive temp range for a -40C to +85C industrial temp range at lower cost. Both share the same die, so firmware is portable. For even lower cost, the PIC32MX230F064D-V/ML cuts Flash from 256 KB to 64 KB in the same VQFN-44 automotive-grade package, but requires firmware adjustments for the smaller code space.
What are the key specifications of PIC32MX230F256D-V/ML that engineers should know?
The PIC32MX230F256D-V/ML is a 32-bit MIPS M4K microcontroller with 256 KB Flash, 16 KB SRAM, 50 MHz CPU, 2.3-3.6 V supply, USB 2.0 full-speed OTG, two I2S/SPI modules, 10-bit ADC, three comparators, CTMU mTouch, RTCC, PMP graphics, and PPS remapping, all in a 44-VQFN package rated -40C to +125C with AEC-Q100 automotive qualification. According to the Microchip PIC32MX1XX/2XX datasheet, it consumes 0.5 mA/MHz active and integrates a 4-channel DMA, making it a compact, low-cost solution for USB audio, capacitive touch, and graphics interfaces in cost-sensitive embedded designs.

工程参考数据: PIC32MX230F256D-V/ML ——对比、设计指导和合规信息。

选型指南

Choose PIC32MX230F256D-V/ML when you need a 32-bit MIPS MCU with USB 2.0 full-speed OTG, AEC-Q100 automotive qualification, and the compact 44-VQFN (8x8 mm) footprint for designs spanning both automotive and industrial temperature ranges. For pure industrial designs where AEC-Q100 is not required, choose PIC32MX230F256D-50I/ML or PIC32MX230F256DT-I/ML (Tape & Reel) to save cost. Choose PIC32MX230F256DT-V/ML when you need the automotive -V grade in volume production Tape & Reel packaging. For lower-cost designs that still need AEC-Q100, PIC32MX230F256D-50I/ML (industrial) can replace the V/ML if the -40C to +85C temperature range is acceptable. For designs that need a larger TQFP footprint for hand prototyping, the PIC32MX230F256DT-50I/PT is a drop-in alternative with 256 KB Flash, 50 MHz CPU, but industrial temperature grade. For PIC32MX170 family variants with same 256 KB Flash and AEC-Q100 grade but different peripheral mix, PIC32MX170F256D-V/ML offers pin compatibility but different peripheral set.

与替代料对比

参数 本产品 PIC32MX230F256D-50I/ML PIC32MX230F256DT-V/ML PIC32MX230F256DT-I/ML PIC32MX230F256DT-50I/PT PIC32MX170F256D-V/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package VQFN-44 (8x8 mm) VQFN-44 (8x8 mm) - same VQFN-44 (8x8 mm) - same VQFN-44 (8x8 mm) - same TQFP-44 (10x10 mm) VQFN-44 (8x8 mm) - same
Core MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit MIPS32 M4K 32-bit
Maximum CPU Frequency 50 MHz (83 DMIPS) 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz
Flash Memory 256 KB 256 KB 256 KB 256 KB 256 KB 256 KB
SRAM 16 KB 16 KB 16 KB 16 KB 16 KB 16 KB
Operating Temperature -40C to +125C (AEC-Q100 automotive) -40C to +85C (industrial) -40C to +125C (AEC-Q100) -40C to +85C (industrial) -40C to +85C (industrial) -40C to +125C (AEC-Q100)
USB USB 2.0 full-speed device/host/OTG USB 2.0 full-speed device/host/OTG USB 2.0 full-speed device/host/OTG USB 2.0 full-speed device/host/OTG USB 2.0 full-speed device/host/OTG USB 2.0 full-speed device/host/OTG
I2S/SPI Modules 2 2 2 2 2 2

关键差异点

  • AEC-Q100 automotive qualification at no price premium over industrial grade (对比 PIC32MX230F256D-50I/ML)
  • Integrated USB 2.0 full-speed OTG controller (对比 PIC32MX170F256D-V/ML)
  • Compact 8x8 mm VQFN-44 footprint with exposed thermal pad (对比 PIC32MX230F256DT-50I/PT)

设计说明

The 44-VQFN package has an exposed thermal pad (EP) on the underside that must be soldered to the PCB ground plane to meet the 1.0 W thermal dissipation rating and to maintain AEC-Q100 thermal cycling performance. The recommended PCB layout per the Microchip PIC32MX1XX/2XX datasheet is a thermal via array (typically 9 to 16 vias) connecting the EP to internal ground planes. For high-ambient automotive designs, attach at least 1 square inch of continuous copper pour on both top and bottom layers to keep junction temperature rise below 30C at typical 50 MHz / 3.3 V operating currents.

Place the 0.1 uF and bulk 10 uF decoupling capacitors as close as possible to the VDD pins (pins 11 and 17) and the VSS pins (pins 10 and 16) on the PIC32MX230F256D-V/ML. Per the PIC32MX1XX/2XX datasheet, the USB-specific VUSB pin (pin 37) requires its own 0.47 uF decoupling capacitor placed within 1-2 mm of the pin to stabilize the USB transceiver supply. Trace lengths on USB D+ and D- (pins 38 and 39) must be impedance-controlled to 90 ohms differential and matched within 150 mil to prevent signal integrity issues on full-speed USB.

A common pitfall when designing with the PIC32MX230F256D-V/ML is conflicting pin assignment via PPS - some peripherals share underlying I/O and cannot both be routed to the same pin at the same time. The PPS re-mapping table in the PIC32MX1XX/2XX datasheet must be reviewed carefully when changing peripherals late in design. Another pitfall is failing to configure the CTMU reference and trim registers correctly, which results in mTouch sensor readings that drift with temperature. Always run Microchip's CTMU calibration routine in firmware and store trim values in Flash on first power-up.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS compliant per Microchip product page. REACH compliant. AEC-Q100 qualified per -V automotive grade designation. Lead-free (Pb-free) and halogen-free terminations meeting JEDEC J-STD-020 MSL3 at 260C peak reflow.

数据核验日期: 2026-10-02 ——数据由 XAIPART 元器件工程团队核验和整理

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