PIC32MX230F256D-V/ML - 32-Bit MCU 256KB Flash USB 44-VQFN | Microchip
Référence : PIC32MX230F256D-V/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.18 | $61,80 |
| 100 | $5.32 | $532,00 |
| 500 | $4.66 | $2 330,00 |
| 1 000 | $4.05 | $4 050,00 |
PIC32MX230F256D-V/ML Présentation
Background: A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, Flash program memory, SRAM data memory, and a wide range of analog and digital peripherals into one package, targeting embedded systems that need more compute than 8/16-bit MCUs. The PIC32MX1XX/2XX 28/36/44-pin family sits in the lower-flash tier of Microchip's PIC32 line, optimized for cost-sensitive USB, audio, and graphics applications.
Key features include 50 MHz / 83 DMIPS performance from the MIPS32 M4K core, 256 KB single-cycle Flash, 16 KB SRAM, two I2S/SPI modules for codec and serial communication, PPS for flexible pin assignment, PMP for graphics interfaces, USB 2.0 full-speed device/host/OTG, mTouch capacitive touch support via CTMU, 1 ns high-resolution time measurement, RTCC for real-time clock, and on-chip debugging via 2-wire programming.
The architecture combines a Harvard-style 5-stage pipeline with single-cycle Flash access and a 4-channel DMA controller, optimizing for predictable real-time response in USB, audio, and graphics code paths. Integrated PLLs, internal 8 MHz oscillator, and dual oscillator pins allow flexible system clocking while keeping BOM cost low.
Typical applications include USB audio (USB headset, USB speakerphone, USB microphone), low-cost graphics HMI, capacitive touch key panels (mTouch), industrial control and sensor hubs, automotive body electronics (AEC-Q100 grade), and consumer appliances that need USB connectivity.
A key design tip: PPS allows most digital peripherals to be remapped to multiple I/O pins, simplifying PCB layout but requiring careful review of the pin assignment table in the datasheet to avoid function conflicts.
This page synthesizes distributor pricing, AEC-Q100 drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for selecting and sourcing the PIC32MX230F256D-V/ML.
Alternatives de remplacement direct pour PIC32MX230F256D-V/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX230F256D-V/ML (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, Timers, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX230F256D-50I/ML
✅ Remplacement direct✓ En stock
$3.96 / unité
Voir la fiche technique →PIC32MX230F256DT-V/ML
✅ Remplacement direct✓ En stock
$2.96 / unité
Voir la fiche technique →PIC32MX230F256DT-I/ML
✅ Remplacement direct✓ En stock
$3.31 / unité
Voir la fiche technique →PIC32MX230F256DT-50I/PT
✅ Remplacement direct✓ En stock
$4.41 / unité
Voir la fiche technique →PIC32MX170F256D-V/ML
✅ Remplacement direct✓ En stock
$2.65 / unité
Voir la fiche technique →PIC32MX230F256D-V/ML Valeurs maximales et caractéristiques électriques
| Core | MIPS32 M4K |
| CPU Architecture | 32-bit RISC |
| Maximum CPU Frequency | 50 MHz (83 DMIPS) |
| Flash Memory | 256 KB |
| SRAM | 16 KB |
| Tension d'alimentation | 2.3 V to 3.6 V |
| Active Current | 0.5 mA/MHz (typical) |
| Température de fonctionnement | -40C to +125C (automotive grade -V) |
| Boîtier | VQFN-44 (8x8 mm) with exposed pad |
| USB | USB 2.0 full-speed device/host/OTG |
| ADC | 10-bit |
| Analog Comparators | 3 |
| CTMU | Yes (mTouch capacitive touch) |
| RTCC | Yes (Real-Time Clock Calendar) |
| PPS | Peripheral Pin Select |
| PMP | Parallel Master Port for graphics |
| I2S/SPI | 2 modules |
| DMA | 4 channels |
| Statut RoHS | Compliant |
| AEC-Q100 | Qualified (-V grade) |
Configuration des broches de PIC32MX230F256D-V/ML
| Broche 1 | SDA3/RA5 — I2C3 SDA or GPIO RA5 |
| Broche 2 | RPB5/RB5 — Remappable I/O RB5 |
| Broche 3 | VREF-/CVREF-/RA9 — ADC VREF- or GPIO RA9 |
| Broche 4 | VREF+/CVREF+/RA10 — ADC VREF+ or GPIO RA10 |
| Broche 5 | RB6/PGEC1 — GPIO RB6 / ICSP clock |
| Broche 6 | RB7/PGED1 — GPIO RB7 / ICSP data |
| Broche 7 | RC0 — GPIO RC0 |
| Broche 8 | RC1 — GPIO RC1 |
| Broche 9 | RC2 — GPIO RC2 |
| Broche 10 | VSS — Ground |
| Broche 11 | VDD — Positive supply (2.3-3.6 V) |
| Broche 12 | RB8 — GPIO RB8 |
| Broche 13 | RB9 — GPIO RB9 |
| Broche 14 | RB10 — GPIO RB10 |
| Broche 15 | RB11 — GPIO RB11 |
| Broche 16 | VSS — Ground |
| Broche 17 | VDD — Positive supply (2.3-3.6 V) |
| Broche 18 | RB12 — GPIO RB12 |
| Broche 19 | RB13 — GPIO RB13 |
| Broche 20 | RB14 — GPIO RB14 |
| Broche 21 | RB15 — GPIO RB15 |
| Broche 22 | RD0 — GPIO RD0 |
| Broche 23 | RD1 — GPIO RD1 |
| Broche 24 | RD2 — GPIO RD2 |
| Broche 25 | RD3 — GPIO RD3 |
| Broche 26 | RD4 — GPIO RD4 |
| Broche 27 | RD5 — GPIO RD5 |
| Broche 28 | RD6 — GPIO RD6 |
| Broche 29 | RD7 — GPIO RD7 |
| Broche 30 | RC3 — GPIO RC3 |
| Broche 31 | RC4/SDI2 — GPIO RC4 / SPI2 SDI |
| Broche 32 | RC5/SDO2 — GPIO RC5 / SPI2 SDO |
| Broche 33 | RC6/SCK2 — GPIO RC6 / SPI2 SCK |
| Broche 34 | RC7/SS2 — GPIO RC7 / SPI2 SS |
| Broche 35 | RC8 — GPIO RC8 |
| Broche 36 | RC9 — GPIO RC9 |
| Broche 37 | VUSB — USB 3.3V internal regulator output |
| Broche 38 | D+/RB3 — USB D+ or GPIO RB3 |
| Broche 39 | D-/RB2 — USB D- or GPIO RB2 |
| Broche 40 | RB4 — GPIO RB4 |
| Broche 41 | RA0 — GPIO RA0 |
| Broche 42 | RA1 — GPIO RA1 |
| Broche 43 | OSC1/CLKI/RC12 — Crystal oscillator input or GPIO RC12 |
| Broche 44 | OSC2/CLKO/RC13 — Crystal oscillator output or GPIO RC13 |
Applications typiques
PIC32MX230F256D-V/ML convient pour 6 applications: USB Audio Headsets and Speakerphones, Capacitive Touch Key Panels (mTouch), Low-Cost Graphics HMI, Automotive Body Electronics, Industrial Sensor Hubs, Consumer Appliance USB Connectivity.
USB Audio Headsets and Speakerphones
The PIC32MX230F256D-V/ML is well suited for USB audio peripherals like headsets and speakerphones because it integrates a USB 2.0 full-speed device/host/OTG controller alongside two I2S or SPI modules that interface directly to audio codecs. The 50 MHz MIPS M4K core running at 0.5 mA/MHz typical active current, 256 KB Flash, and 16 KB SRAM are sufficient to host a USB Audio Class 1.0 stack and a lightweight RTOS for codec control. The AEC-Q100 -V grade rating of -40C to +125C also allows this design pattern to be reused inside automotive cabin microphone or hands-free modules without hardware changes, while the exposed thermal pad on the VQFN-44 package provides enough thermal headroom at typical headset power levels.
Recommandé
Capacitive Touch Key Panels (mTouch)
The PIC32MX230F256D-V/ML is a strong fit for mTouch capacitive touch buttons and sliders thanks to the integrated CTMU (Charge Time Measurement Unit), which provides high-resolution 1 ns time measurement for charge-based touch sensing. The 10-bit ADC and three analog comparators can be reused for additional sensor channels beyond the CTMU, allowing mixed touch and analog sensing on the same MCU. PPS allows the touch sensor I/O to be routed to almost any pin, simplifying routing of dense keypad layouts. With 256 KB Flash and 16 KB SRAM, designers can implement complete touch UI state machines plus a host-side USB or UART link to an appliance controller, all in one AEC-Q100 qualified device.
Recommandé
Low-Cost Graphics HMI
The PIC32MX230F256D-V/ML is appropriate for low-cost graphical human-machine interfaces through the integrated PMP (Parallel Master Port), which can directly drive small TFT displays and character LCDs without an external graphics controller. The 50 MHz MIPS core and 4-channel DMA allow smooth framebuffer updates even with graphics libraries like MLA, while the 256 KB Flash holds complete UI assets. The -40C to +125C automotive temperature range also makes the part usable in industrial HMI panels where automotive-grade AEC-Q100 qualification is a plus. The VQFN-44 8x8 mm footprint keeps PCB size minimal for compact appliance or industrial front-panel designs.
Recommandé
Automotive Body Electronics
The PIC32MX230F256D-V/ML fits automotive body electronics modules including climate control panels, mirror controllers, and seat modules thanks to the AEC-Q100 qualification implied by the -V suffix and the -40C to +125C operating temperature range. The USB 2.0 full-speed OTG controller simplifies diagnostic interface implementation, while the CTMU enables capacitive touch keys for solid-state switch panels. The 0.5 mA/MHz active current and integrated RTCC support low-power standby modes critical to automotive quiescent current budgets. Designers migrating from 16-bit PIC MCUs get a 32-bit MIPS core plus USB at comparable cost and footprint.
Recommandé
Industrial Sensor Hubs
The PIC32MX230F256D-V/ML is suitable for industrial sensor hubs that aggregate sensor data over USB or serial and forward it to a host controller. The two I2S/SPI modules can run as SPI masters to multiple sensors concurrently, while the 4-channel DMA offloads high-throughput sensor reads. The 10-bit ADC and three comparators handle mixed analog and digital sensor types, and the RTCC provides timestamped data logging. AEC-Q100 qualification is overkill for general industrial use, but it provides extra reliability margin and supports harsher factory environments where -40C to +125C temperature range is needed.
Recommandé
Consumer Appliance USB Connectivity
The PIC32MX230F256D-V/ML fits consumer appliances such as smart kitchen devices and HVAC controllers that need USB connectivity for firmware updates, debug, or data export. The USB 2.0 full-speed OTG controller handles both device and host roles, supporting USB sticks and serial-to-USB bridges. The 256 KB Flash and 16 KB SRAM are enough for an RTOS plus appliance UI logic, while PMP supports a small display for user interaction. PPS remapping simplifies the PCB layout of appliances where connector placement forces awkward pin assignments, allowing designers to reassign peripheral pins late in the design without re-spinning the board.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX230F256D-V/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX230F256D-50I/ML | PIC32MX230F256DT-V/ML | PIC32MX230F256DT-I/ML | PIC32MX230F256DT-50I/PT | PIC32MX170F256D-V/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-44 (8x8 mm) | VQFN-44 (8x8 mm) - same | VQFN-44 (8x8 mm) - same | VQFN-44 (8x8 mm) - same | TQFP-44 (10x10 mm) | VQFN-44 (8x8 mm) - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum CPU Frequency | 50 MHz (83 DMIPS) | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +125C (AEC-Q100 automotive) | -40C to +85C (industrial) | -40C to +125C (AEC-Q100) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (AEC-Q100) |
| USB | USB 2.0 full-speed device/host/OTG | USB 2.0 full-speed device/host/OTG | USB 2.0 full-speed device/host/OTG | USB 2.0 full-speed device/host/OTG | USB 2.0 full-speed device/host/OTG | USB 2.0 full-speed device/host/OTG |
| I2S/SPI Modules | 2 | 2 | 2 | 2 | 2 | 2 |
Principaux différenciateurs
- AEC-Q100 automotive qualification at no price premium over industrial grade (vs PIC32MX230F256D-50I/ML)
- Integrated USB 2.0 full-speed OTG controller (vs PIC32MX170F256D-V/ML)
- Compact 8x8 mm VQFN-44 footprint with exposed thermal pad (vs PIC32MX230F256DT-50I/PT)
Notes de conception
The 44-VQFN package has an exposed thermal pad (EP) on the underside that must be soldered to the PCB ground plane to meet the 1.0 W thermal dissipation rating and to maintain AEC-Q100 thermal cycling performance. The recommended PCB layout per the Microchip PIC32MX1XX/2XX datasheet is a thermal via array (typically 9 to 16 vias) connecting the EP to internal ground planes. For high-ambient automotive designs, attach at least 1 square inch of continuous copper pour on both top and bottom layers to keep junction temperature rise below 30C at typical 50 MHz / 3.3 V operating currents.
Place the 0.1 uF and bulk 10 uF decoupling capacitors as close as possible to the VDD pins (pins 11 and 17) and the VSS pins (pins 10 and 16) on the PIC32MX230F256D-V/ML. Per the PIC32MX1XX/2XX datasheet, the USB-specific VUSB pin (pin 37) requires its own 0.47 uF decoupling capacitor placed within 1-2 mm of the pin to stabilize the USB transceiver supply. Trace lengths on USB D+ and D- (pins 38 and 39) must be impedance-controlled to 90 ohms differential and matched within 150 mil to prevent signal integrity issues on full-speed USB.
A common pitfall when designing with the PIC32MX230F256D-V/ML is conflicting pin assignment via PPS - some peripherals share underlying I/O and cannot both be routed to the same pin at the same time. The PPS re-mapping table in the PIC32MX1XX/2XX datasheet must be reviewed carefully when changing peripherals late in design. Another pitfall is failing to configure the CTMU reference and trim registers correctly, which results in mTouch sensor readings that drift with temperature. Always run Microchip's CTMU calibration routine in firmware and store trim values in Flash on first power-up.
Informations de conformité
RoHS compliant per Microchip product page. REACH compliant. AEC-Q100 qualified per -V automotive grade designation. Lead-free (Pb-free) and halogen-free terminations meeting JEDEC J-STD-020 MSL3 at 260C peak reflow.
