PIC32MX350F128HT-V/MR - 80MHz 32-bit MCU 128KB Flash | Microchip
料号： PIC32MX350F128HT-V/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.85 | $4.85 |
| 10 | $4.45 | $44.50 |
| 100 | $3.98 | $398.00 |
| 500 | $3.55 | $1,775.00 |
| 1,000 | $3.18 | $3,180.00 |
PIC32MX350F128HT-V/MR 概述
A 32-bit microcontroller (MCU) is a single-chip computer integrating a 32-bit CPU core, volatile memory (SRAM), non-volatile program memory (Flash), and a rich set of peripherals including timers, ADCs, communication controllers, and GPIO. The PIC32MX3/4 family sits within the broader PIC microcontroller hierarchy: PIC32MX -> 32-bit MCU -> Microcontroller Unit -> Embedded Processor -> Semiconductor. Compared with 8-bit PIC16/PIC18 parts, the PIC32MX delivers MIPS-class performance (~1.5 DMIPS/MHz) while preserving the PIC peripheral ecosystem and MPLAB X toolchain compatibility.
Key features include 80 MHz core clock, 128 KB Flash (128K x 8), 32 KB SRAM, 53 digital I/O pins, USB 2.0 full-speed On-The-Go (OTG) device/host, two I2S audio interfaces for digital audio paths, 10-bit ADC with 28 channels and 1 Msps conversion rate, and a charge time measurement unit (CTMU) for capacitive touch. The VQFN-64 EP package exposes the die substrate to the PCB thermal pad for improved heat extraction.
Typical applications include automotive body and infotainment controllers (AEC-Q100 qualified), industrial HMI panels with USB connectivity, audio peripherals using I2S, USB HID/CID devices, and low-cost 32-bit consumer appliances. The on-chip USB OTG enables direct host/device/OTG roles without an external PHY. When migrating from a PIC24 or dsPIC33 design, the PIC32MX preserves MPLAB X IDE project structure, MCC code configurator, and Harmony framework compatibility while offering higher throughput and larger memory windows. Designers should validate the -V temperature grade (-40C to +105C) against the end-product thermal envelope before committing to layout.
直接替换替代料： PIC32MX350F128HT-V/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MX350F128HT-V/MR （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Core Architecture, USB.
快速对比工具——选择替代料号进行并排对比：
PIC32MX350F128HT-80V/MR
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX350F128H-I/MR
✅ 直接替换✓ 有现货
$2.98 / 个
查看数据手册 →PIC32MX350F256HT-V/MR
✅ 直接替换✓ 有现货
$3.65 / 个
查看数据手册 →PIC32MX340F128HT-80V/MR
✅ 直接替换✓ 有现货
$3.92 / 个
查看数据手册 →PIC32MX330F064HT-V/MR
✅ 直接替换✓ 有现货
$4.12 / 个
查看数据手册 →PIC32MX230F128H-V/MR
✅ 直接替换✓ 有现货
$4.95 / 个
查看数据手册 →PIC32MX350F128HT-V/MR 最大额定值与电气特性
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Clock | 80 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Voltage Tolerance | 5V tolerant digital I/O |
| 工作温度 | -40 C to +105 C (-V grade) |
| Digital I/O Pins | 53 |
| ADC | 10-bit, 28 channels, 1 Msps |
| Analog Comparators | 2 |
| Timers | 5 x 16-bit |
| DMA Channels | 4 |
| I2C | 2 |
| SPI / I2S | 2 (SPI with I2S mode) |
| UART | 2 |
| USB | USB 2.0 Full-Speed OTG |
| RTCC | Real-Time Clock + Calendar |
| 封装 | 64-pin VQFN (MR) 9x9 mm with EP |
| 安装类型 | Surface Mount |
| AEC-Q100 | Qualified (automotive grade) |
| RoHS 状态 | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
PIC32MX350F128HT-V/MR 64-pin vqfn (mr) 9x9 mm with ep 引脚配置指南
PIC32MX350F128HT-V/MR（64-pin vqfn (mr) 9x9 mm with ep 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MX350F128HT-V/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MX350F128HT-V/MR 适用于 7 应用s: Automotive Body Control Modules, USB HID / CDC Embedded Devices, Digital Audio Peripherals (I2S), Industrial HMI / Touch Panels, Low-cost IoT Edge Sensors, Consumer Appliance Controllers, AEC-Q100 Test & Measurement.
Automotive Body Control Modules
The PIC32MX350F128HT-V/MR fits automotive BCM designs through AEC-Q100 qualification, 53 GPIO for switch/wiper/light sensing, two UART channels for LIN transceivers, and 5x 16-bit timers for PWM-driven actuators. The 80 MHz MIPS32 M4K core delivers responsive real-time scheduling for body-domain tasks like CAN message parsing and motor control loops. The -V temperature grade (-40C to +105C) tolerates cabin and under-hood thermal extremes without derating, while the 28-channel 10-bit ADC scans potentiometer/sensor inputs at 1 Msps for battery management, ambient light, and HVAC feedback.
推荐
USB HID / CDC Embedded Devices
The PIC32MX350F128HT-V/MR integrates a full-speed USB 2.0 OTG controller with on-chip PHY, eliminating external transceivers for keyboards, mice, CDC serial bridges, and HID-class peripherals. Operating from 2.3-3.6V VDD, the part supports bus-powered and self-powered configurations directly through 5V-tolerant I/O. Two SPI channels enable external Flash or display expansion, while the 28-channel ADC reads analog inputs (joysticks, sensors) in parallel with USB traffic. 32 KB SRAM sustains USB descriptor buffers plus application logic without external memory.
推荐
Digital Audio Peripherals (I2S)
The PIC32MX350FISA defines two I2S-capable SPI channels supporting digital audio DAC/ADC paths at 32-192 kHz sample rates. The 80 MHz MIPS core runs lightweight audio DSP (mixing, EQ, volume control) while leaving 32 KB SRAM for audio buffers and USB audio class stacks. The 10-bit ADC suffices for VU LEDs and simple metering, while 5x 16-bit timers generate precise MCLK/LRCLK bit clocks. The exposed thermal pad VQFN-64 package manages thermals during sustained audio streaming over USB or SD card.
推荐
Industrial HMI / Touch Panels
The PIC32MX350FISA integrates the Charge Time Measurement Unit (CTMU) for capacitive buttons and sliders, enabling cost-effective HMI without dedicated touch ICs. 28-channel ADC reads potentiometers, NTC thermistors, and ambient-light sensors; 53 GPIO drives TFT displays, LED arrays, and keypad matrices. The 128 KB Flash stores graphic assets and UI state machines; 32 KB SRAM buffers refresh frames at 30+ Hz via SPI-attached LCDs. The 2.3-3.6V VDD range plus -40C to +105C operating temperature suit factory-floor enclosures.
推荐
Low-cost IoT Edge Sensors
The PIC32MX350F128HT-V/MR runs 80 MHz while consuming low active power, making it suitable for edge sensor hubs aggregating analog inputs, UART sensors, and I2C peripherals. The 4-channel DMA offloads ADC and serial traffic from the CPU, leaving cycles for protocol stacks and filtering. 128 KB Flash supports OTA-friendly bootloaders plus application code; 32 KB SRAM buffers network frames. USB OTG serves as a debug/configuration port, and RTCC handles deep-sleep scheduling with sub-microamp standby current on external RTC backup.
推荐
Consumer Appliance Controllers
The PIC32MX350F128HT-V/MR delivers 32-bit performance for kitchen, white-goods, and HVAC appliance controllers where PIC16/PIC18 headroom is exhausted but cost constraints exclude Cortex-M parts. Five 16-bit timers drive BLDC motor commutation, TRIAC phase control, and inverter PWM. 28-channel ADC reads temperature, pressure, and humidity sensors simultaneously. Two UART channels interface with Wi-Fi/Bluetooth modules for app connectivity. The VQFN-64 EP package supports compact layouts with the exposed pad sinking dissipation during peak motor drive cycles.
推荐
AEC-Q100 Test & Measurement
The PIC32MX350F128HT-V/MR fits cost-sensitive automotive test equipment (OBD-II scanners, ECU programmers, diagnostic displays) through AEC-Q100 qualification and USB OTG for host connectivity. Two UART channels drive LIN/K-line automotive bus interfaces alongside CAN (via external MCP2517FD companion). The 28-channel ADC digitizes automotive sensor signals at 1 Msps while DMA streams to USB or SD card. The -40C to +105C temperature grade tolerates shop-floor and roadside diagnostic environments without thermal derating or active cooling.
推荐
推荐产品汇总
工程参考数据： PIC32MX350F128HT-V/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MX350F128HT-80V/MR | PIC32MX350F128H-I/MR | PIC32MX350F256HT-V/MR | PIC32MX340F128HT-80V/MR | PIC32MX330F064HT-V/MR | PIC32MX230F128H-V/MR |
|---|---|---|---|---|---|---|---|
| Package | VQFN-64 (MR) 9x9 mm | VQFN-64 (MR) 9x9 mm - same | VQFN-64 (MR) 9x9 mm - same | VQFN-64 (MR) 9x9 mm - same | VQFN-64 (MR) 9x9 mm - same | VQFN-64 (MR) 9x9 mm - same | VQFN-64 (MR) 9x9 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Frequency | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 80 MHz | MIPS32 M4K / 50 MHz (max) |
| Flash / SRAM | 128 KB / 32 KB | 128 KB / 32 KB | 128 KB / 32 KB | 256 KB / 32 KB (+100% Flash) | 128 KB / 32 KB | 64 KB / 16 KB (-50% Flash, -50% SRAM) | 128 KB / 16 KB (-50% SRAM) |
| Temperature Grade | -40C to +105C (-V) | -40C to +105C (-V) | -40C to +85C (-I) | -40C to +105C (-V) | -40C to +105C (-V) | -40C to +105C (-V) | -40C to +105C (-V) |
| AEC-Q100 | Qualified | Qualified | Not automotive grade | Qualified | Qualified | Qualified | Qualified |
| USB OTG | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG, earlier silicon) | Yes (FS OTG) | No (FS USB device only) |
| Unit Price @ 100 (USD, as of 2026-10-02) | 3.98 | 3.98 | 3.78 | 4.20 | 3.85 | 3.45 | 3.30 |
| CTMU (Capacitive Touch) | Yes | Yes | Yes | Yes | No | Yes | No |
关键差异点
- AEC-Q100 automotive qualification at industrial MCU pricing （对比 PIC32MX230F128H-V/MR)
- Largest SRAM in the 128 KB Flash VQFN-64 -V class （对比 PIC32MX340F128HT-80V/MR)
- Higher code density without layout change （对比 PIC32MX330F064HT-V/MR)
设计说明
The PIC32MX350F128HT-V/MR operates from 2.3V to 3.6V VDD with an internal 1.8V core LDO. Place a 10uF bulk decoupling capacitor plus 0.1uF ceramic at each VDD/AVDD/VUSB pin pair. The on-chip USB PHY requires a precise 3.3V rail; avoid sharing VUSB and VDD if the host can back-power the device, and add a ferrite bead between VBUS and VUSB to prevent inrush current issues during enumeration.
Estimated - at 80 MHz full activity, the VQFN-64 EP package dissipates approximately 60-90 mW typical, well within the exposed-pad 31 C/W theta_JA thermal envelope. Ensure the exposed pad is soldered to a continuous copper pour of at least 1 square inch (645 mm^2)^ to keep junction temperature rise below 15 C at 25 C ambient. For automotive cabin deployments up to +105 C ambient, verify that the part remains below its +125 C junction limit during sustained USB streaming.
Place the 12 MHz primary oscillator crystal within 5 mm of OSCI/OSCO pins, with a grounded guard ring to isolate it from switching noise. The VQFN-64 EP package requires micro-via arrays under the exposed pad (0.3 mm pitch, 0.2 mm drill) to maximize thermal conductivity to inner copper planes. Route USB DP/D- as a 90-ohm impedance pair on the top layer, keeping them length-matched within 150 mil.
Do not exceed absolute maximum VDD of 4.0V (including USB cable inrush). The -V voltage designator confirms 2.3-3.6V operation; applying 5V directly will damage the silicon. Always configure the JTAGEN fuse to FVB not disable (unprogrammed) for debug access. When migrating from PIC32MX340 to PIC32MX350, verify errata DS80000491A - the 350 family fixed several USB OTG silicon revisions absent in 340 generation.
合规信息
AEC-Q100 qualified per -V voltage/temperature designator. RoHS and REACH compliant per Microchip product declaration. Halogen-free per JESD22-A111.
