PIC32MX470F512H-120/MR - 120MHz 32-bit MCU 512KB Flash 64-QFN | Microchip
料号： PIC32MX470F512H-120/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.95 | $6.95 |
| 10 | $6.26 | $62.60 |
| 100 | $5.49 | $549.00 |
| 500 | $4.86 | $2,430.00 |
| 1,000 | $4.2 | $4,200.00 |
PIC32MX470F512H-120/MR 概述
A 32-bit microcontroller (MCU) is an embedded processor that combines a CPU core, program memory (Flash), data memory (SRAM), and on-chip peripherals on a single die. PIC32MX MCUs occupy the performance tier above 16-bit PIC24/dsPIC parts and below the higher-end PIC32MZ families, balancing 32-bit throughput, large memory, and rich peripherals at a low BOM cost for connected embedded designs.
Key features of this part include a 120 MHz core with 5-stage pipeline and single-cycle multiply, MIPS16e code compression for up to 40% smaller code size, an integrated 8 MHz internal RC oscillator with PLL, fail-safe clock monitoring, and multiple low-power modes (Idle, Sleep). The 64-QFN (MR) package is pin-compatible with most PIC24/dsPIC 64-pin devices, easing migration. Voltage range is 2.3 V to 3.6 V and operating temperature is -40 C to +105 C.
Architecturally the PIC32MX470F512H uses a Harvard-style bus with separate Flash and SRAM paths, a tightly-coupled DMA controller, and an interrupt controller with five priority levels and up to 256 vectors. The CTMU enables touch sensing and precise time-of-flight measurement with sub-microsecond resolution.
Typical applications include USB audio interfaces, HMI/graphics with TFT LCDs over PMP, motor control, multi-protocol bridges (UART/SPI/I2C), industrial sensors with USB-CDC or USB-HID, and embedded web/HTTP servers. The integrated USB OTG and PMP make this MCU a popular choice for cost-sensitive HMI products.
When designing, ensure the 64-QFN exposed pad is soldered to a sufficiently large ground copper pour for thermal dissipation (typical theta_JA near 28 C/W). Decouple VDD/VUSB with 100 nF + 4.7 uF near the pins and route the 8 MHz crystal traces symmetrically with a guard ground to limit EMI.
直接替换替代料： PIC32MX470F512H-120/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MX470F512H-120/MR （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature Range, Core Architecture, Timers.
快速对比工具——选择替代料号进行并排对比：
PIC32MX470F512H-I/MR
✅ 直接替换✓ 有现货
$5.08 / 个
查看数据手册 →PIC32MX470F512H-V/MR
✅ 直接替换✓ 有现货
$6.74 / 个
查看数据手册 →PIC32MX450F256H-120/MR
✅ 直接替换✓ 有现货
$4.55 / 个
查看数据手册 →PIC32MX450F256HT-120/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.27 / 个
查看数据手册 →PIC32MX440F512HT-80V/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5.25 / 个
查看数据手册 →PIC32MX370F512HT-V/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.61 / 个
查看数据手册 →PIC32MX470F512H-120/MR 最大额定值与电气特性
| Core Architecture | MIPS32 M4K, 32-bit RISC |
| Maximum CPU Speed | 120 MHz (150 DMIPS) |
| Program Flash Memory | 512 KB (512K x 8) |
| Boot Flash | 12 KB |
| SRAM | 128 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| 工作温度范围 | -40 C to +105 C |
| 封装 | 64-pin QFN (MR), 9x9 mm with exposed pad |
| ADC | 10-bit, up to 1 Msps, up to 28 channels |
| Analog Comparators | 2 |
| USB | USB 2.0 Full-Speed OTG controller |
| UART Modules | 6 |
| SPI / I2S Modules | 2 (configurable as SPI or I2S) |
| I2C Modules | 5 |
| Parallel Master Port (PMP) | Yes, for graphics/TFT interfaces |
| DMA Channels | Yes (integrated DMA controller) |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Pin Select (PPS) | Yes |
| Code Compression | MIPS16e, up to 40% smaller code size |
| 安装类型 | Surface Mount (QFN with EP) |
| MSL 等级 | 3 (168 hours) per JEDEC J-STD-020 |
| RoHS 状态 | Compliant |
PIC32MX470F512H-120/MR 引脚配置
| 引脚 1 | RP15/PWM1H/PMD5/RB15 — Remappable peripheral I/O / PWM / PMP data |
| 引脚 2 | VSS — Ground |
| 引脚 3 | VDD — Core supply 2.3-3.6 V |
| 引脚 4 | RP14/PWM1L/PMD4/RB14 — Remappable peripheral I/O / PWM / PMP data |
| 引脚 5 | RP13/PWM2H/PMD3/RB13 — Remappable peripheral I/O / PWM / PMP data |
| 引脚 6 | RP12/PWM2L/PMD2/RB12 — Remappable peripheral I/O / PWM / PMP data |
| 引脚 7 | RP11/PWM3H/PMD1/RB11 — Remappable peripheral I/O / PWM / PMP data |
| 引脚 8 | RP10/PWM3L/PMD0/RB10 — Remappable peripheral I/O / PWM / PMP data |
| 引脚 9 | RP9/PWM4H/PMA7/RB9 — Remappable peripheral I/O / PWM / PMP address |
| 引脚 10 | RP8/PWM4L/PMA6/RB8 — Remappable peripheral I/O / PWM / PMP address |
| 引脚 11 | RP7/PWM5H/PMA5/RB7 — Remappable peripheral I/O / PWM / PMP address |
| 引脚 12 | RP6/PWM5L/PMA4/RB6 — Remappable peripheral I/O / PWM / PMP address |
| 引脚 13 | RP5/PMA3/RB5 — Remappable peripheral I/O / PMP address |
| 引脚 14 | RP4/PMA2/RB4 — Remappable peripheral I/O / PMP address |
| 引脚 15 | RP3/PMA1/RB3 — Remappable peripheral I/O / PMP address |
| 引脚 16 | RP2/PMA0/RB2 — Remappable peripheral I/O / PMP address |
| 引脚 17 | RP1/PMCS1/RB1 — Remappable peripheral I/O / PMP chip select |
| 引脚 18 | RP0/PMCS2/RB0 — Remappable peripheral I/O / PMP chip select |
| 引脚 19 | VSS — Ground |
| 引脚 20 | VDD — Core supply 2.3-3.6 V |
| 引脚 21 | RA15 — General purpose I/O |
| 引脚 22 | RA14 — General purpose I/O |
| 引脚 23 | RA13 — General purpose I/O |
| 引脚 24 | RA12 — General purpose I/O |
| 引脚 25 | RA11 — General purpose I/O |
| 引脚 26 | RA10 — General purpose I/O |
| 引脚 27 | RA9 — General purpose I/O |
| 引脚 28 | RA8 — General purpose I/O |
| 引脚 29 | RC15 — General purpose I/O |
| 引脚 30 | RC14 — General purpose I/O |
| 引脚 31 | VSS — Ground |
| 引脚 32 | VDD — Core supply 2.3-3.6 V |
| 引脚 33 | RC13 — General purpose I/O |
| 引脚 34 | RC12 — General purpose I/O |
| 引脚 35 | RC11 — General purpose I/O |
| 引脚 36 | RC10 — General purpose I/O |
| 引脚 37 | RC9 — General purpose I/O |
| 引脚 38 | RC8 — General purpose I/O |
| 引脚 39 | RC7 — General purpose I/O |
| 引脚 40 | RC6 — General purpose I/O |
| 引脚 41 | RC5 — General purpose I/O |
| 引脚 42 | RC4 — General purpose I/O |
| 引脚 43 | VUSB — USB transceiver supply (3.3 V) |
| 引脚 44 | VBUS — USB VBUS detect input |
| 引脚 45 | D- — USB D- data line |
| 引脚 46 | D+ — USB D+ data line |
| 引脚 47 | VSS — Ground |
| 引脚 48 | VDD — Core supply 2.3-3.6 V |
| 引脚 49 | OSC1/CLKI/RC12 — Primary oscillator input / external clock |
| 引脚 50 | OSC2/CLKO/RC15 — Primary oscillator output |
| 引脚 51 | SOSCO/RPC13/T1CK/CN13 — Secondary oscillator output / timer1 clock / change notification |
| 引脚 52 | SOSCI/RPC14/CN14 — Secondary oscillator input / change notification |
| 引脚 53 | RD0 — General purpose I/O |
| 引脚 54 | RD1 — General purpose I/O |
| 引脚 55 | RD2 — General purpose I/O |
| 引脚 56 | RD3 — General purpose I/O |
| 引脚 57 | RD4 — General purpose I/O |
| 引脚 58 | RD5 — General purpose I/O |
| 引脚 59 | RD6 — General purpose I/O |
| 引脚 60 | RD7 — General purpose I/O |
| 引脚 61 | RD8 — General purpose I/O |
| 引脚 62 | RD9 — General purpose I/O |
| 引脚 63 | RD10 — General purpose I/O |
| 引脚 64 | RD11 — General purpose I/O |
| 引脚 65 | EP — Exposed thermal pad - tie to VSS |
典型应用
PIC32MX470F512H-120/MR 适用于 6 应用s: USB Audio Interface / USB DAC, HMI / TFT Graphics Display with PMP, Industrial Sensor Hub with USB-CDC, Motor Control (BLDC / Stepper), Embedded Web Server / IoT Gateway, Capacitive Touch Sensing (CTMU).
USB Audio Interface / USB DAC
The PIC32MX470F512H-120/MR is a strong fit for USB audio interfaces because its integrated USB 2.0 Full-Speed OTG controller eliminates the need for an external bridge chip, and its two I2S/SPI modules connect directly to common DACs such as the PCM5102A or CS4344. With 120 MHz of CPU bandwidth (150 DMIPS) and 128 KB SRAM, the MCU can run USB-CDC or USB-HID class drivers plus a 48 kHz/16-bit audio stream with comfortable margin; USB isochronous endpoints sustain jitter well below audibility. The 512 KB Flash is enough for full USB stack, descriptor tables, and user EQ/firmware. Pair with a 3.3 V LDO and 12 MHz crystal (PLL to 48 MHz USB clock) for a complete BOM at low cost. Recommended companion parts: PCM5102A (DAC), MIC5219 (3.3 V LDO), and PIC32MX USB stack from Microchip Libraries for Applications.
推荐
HMI / TFT Graphics Display with PMP
The PIC32MX470F512H-120/MR's Parallel Master Port (PMP) directly drives 8/16-bit Intel 8080 TFT-LCDs up to QVGA at 30+ fps, while its 512 KB Flash holds a full Microchip Graphics Library image set and 128 KB SRAM holds a framebuffer for small color displays. The 120 MHz MIPS32 M4K core with DMA can refresh the display in the background, leaving CPU headroom for user logic. PPS lets the designer remap PMP pins to avoid routing conflicts, and CTMU enables integrated touch sensing when paired with a 4-wire resistive panel. Operating from 2.3-3.6 V simplifies integration with 3.3 V LCD backlight drivers. Recommended companion parts: a 3.5 inch TFT with ILI9488 controller and a TPL0102 digital potentiometer for contrast.
推荐
Industrial Sensor Hub with USB-CDC
For industrial sensor aggregation, the PIC32MX470F512H-120/MR's six UARTs, five I2Cs, two SPI ports, and 28-channel 10-bit ADC let one MCU read multiple sensor buses simultaneously, while its USB-CDC port streams the aggregated data to a host PC at 12 Mbps. The 120 MHz MIPS32 M4K CPU with DMA sustains oversampled ADC conversions (1 Msps) without starving the USB endpoint. Fail-safe clock monitoring and -40 C to +105 C operation match industrial cabinet requirements. The 512 KB Flash accommodates Microchip's Harmony bootloader, and the 64-QFN (MR) is compact for DIN-rail enclosures. Recommended companion parts: MAX31865 RTD-to-digital converter and ADM3251E isolated RS-232 transceiver.
推荐
Motor Control (BLDC / Stepper)
The PIC32MX470F512H-120/MR can drive BLDC or stepper motors using its six PWM outputs (via OC module), two analog comparators for back-EMF sensing, and CTMU for accurate timing of zero-cross events at up to 120 MHz CPU tick resolution. The 128 KB SRAM supports field-oriented control (FOC) math tables and current-loop RAM, while 512 KB Flash holds Microchip's MPLAB Harmony Motor Control framework. The 64-QFN exposed pad dissipates several hundred mW typical for FOC firmware, suitable for small drone and appliance drives. USB OTG enables host-side tuning of PID parameters over a virtual COM port. Recommended companion parts: DRV8323 three-phase gate driver and TMCS1100 Hall-effect current sensor.
推荐
Embedded Web Server / IoT Gateway
The PIC32MX470F512H-120/MR's 512 KB Flash comfortably holds a Microchip Harmony TCP/IP stack with HTTP server and MQTT client, while its 128 KB SRAM supports multiple sockets and TLS handshakes. The 120 MHz MIPS32 M4K sustains TLS 1.2 RSA exchanges in software at acceptable latency for low-volume telemetry. The integrated 10/100 Ethernet MAC (with external PHY) makes this MCU a true wired gateway. PPS gives flexibility when remapping SPI to connect to an external Wi-Fi module such as the ATWINC1500. The 64-QFN package keeps the BOM small for DIN-rail gateways. Recommended companion parts: KSZ8041 Ethernet PHY and ATWINC1500 Wi-Fi module.
推荐
Capacitive Touch Sensing (CTMU)
The PIC32MX470F512H-120/MR's Charge Time Measurement Unit (CTMU) enables hardware-timed capacitive touch measurement with sub-ns resolution across many channels without CPU intervention, freeing the 120 MHz core for system logic. With PPS, touch electrodes can be mapped to almost any GPIO, simplifying PCB layout. The MCU supports Microchip's mTouch library, including self-capacitance and mutual-capacitance modes. Typical use cases include appliance control panels, white-goods keypads, and proximity-sensing industrial enclosures. The 64-QFN's small footprint and 2.3-3.6 V operation suit battery-powered touch devices. Recommended companion parts: CAP1188 companion capacitive touch controller and MCP1700 3.3 V LDO.
推荐
推荐产品汇总
工程参考数据： PIC32MX470F512H-120/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MX470F512H-I/MR | PIC32MX470F512H-V/MR | PIC32MX450F256H-120/MR | PIC32MX450F256HT-120/MR | PIC32MX440F512HT-80V/MR | PIC32MX370F512HT-V/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Speed | 120 MHz (150 DMIPS) | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 80 MHz | 80 MHz |
| Program Flash | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 32 KB | 32 KB | 32 KB | 64 KB |
| USB OTG | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | Yes (FS OTG) | No |
| PMP Graphics Interface | Yes | Yes | Yes | Yes | Yes | Yes | No |
| Operating Temperature | -40 C to +105 C | -40 C to +85 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Supply Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
关键差异点
- Largest SRAM in the PIC32MX4XX QFN-64 family at 120 MHz （对比 PIC32MX450F256H-120/MR)
- Same 120 MHz speed and 64-QFN package as alternatives with full 512 KB Flash （对比 PIC32MX440F512HT-80V/MR)
- Integrated USB OTG and PMP graphics in a single 64-QFN MCU （对比 PIC32MX370F512HT-V/MR)
设计说明
The 64-QFN (MR) package dissipates heat primarily through the central exposed pad (pin 65). For typical MCU workloads (<=100 mA active current at 3.3 V) the junction temperature rise is small, but for sustained 120 MHz CPU + USB + PMP refresh loads the die may approach 200-300 mW. Solder the EP to a ground copper pour of at least 100 mm^2 (recommended via Microchip AN1267 'QFN Package Land Pattern and Thermal Management') and use 4-6 thermal vias (0.3 mm drill) to the inner ground plane to keep theta_JA below 30 C/W. Estimated: Pdiss ~ 200 mW at 120 MHz core + USB active -> T_j rise ~ 6 C above ambient with proper EP soldering.
Place a 100 nF X7R 0.1 uF decoupling capacitor as close as possible to every VDD pin (pins 3, 20, 32, 48) and a bulk 4.7 uF X5R near the MCU power pin. For USB applications add a 1 uF X5R on the VUSB pin (pin 43). Per the Microchip PIC32MX3XX/4XX family datasheet, the VDD core supply and VUSB USB supply should be powered simultaneously or VUSB within 200 ms of VDD for proper USB transceiver bias; in single-rail designs tying them together is acceptable but expect higher current draw on USB suspend events.
Route the 8 MHz (or 12 MHz) primary crystal traces between OSC1 (pin 49) and OSC2 (pin 50) symmetrically, within 5 mm total length, and surround them with a guard ground hatched polygon to limit radiated EMI. Place crystal load capacitors (typically 18-22 pF NPO/C0G) directly at the MCU pins with short traces. For USB differential pair (D-/D+, pins 45/46), maintain 90-ohm differential impedance and length matching within 2 mm; route D+/D- on the same layer with continuous ground reference plane beneath them as required by USB 2.0 FS specification and Microchip AN1249.
Do not assume the PIC32MX470F512H-120/MR and the older PIC32MX460F512L share an identical PPS map - register layouts differ between PIC32MX3XX/4XX and earlier PIC32MX generations even when the QFN pinout matches. When migrating firmware, recompile against the PIC32MX470 header set in MPLAB Harmony and reconfigure PPS assignments. Also note that the analog comparator module supports only 2 comparators (vs 4 on PIC32MX460); customers migrating FOC code must remap CM1/CM3 to CM1/CM2. Source: Microchip PIC32MX3XX/4XX family datasheet DS60001143.
合规信息
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified - this part targets industrial/consumer segments; for AEC-Q100 automotive-grade PIC32 consider PIC32MX-REL or PIC32MK family.
