PIC32MX570F512HT-I/MR - 32-bit MCU 512KB Flash 64KB RAM 50MHz 64-QFN | Microchip
料号： PIC32MX570F512HT-I/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.85 | $7.85 |
| 10 | $7.1 | $71.00 |
| 100 | $6.05 | $605.00 |
| 500 | $5.32 | $2,660.00 |
| 1,000 | $4.78 | $4,780.00 |
PIC32MX570F512HT-I/MR 概述
What is a PIC32MX MCU? The PIC32MX family from Microchip is a series of 32-bit microcontrollers based on the MIPS32 M4K architecture, sitting within the broader PIC microcontroller family. These MCUs bridge 8/16-bit PIC legacy to 32-bit performance, used in applications needing USB, CAN, and richer peripherals while staying within the MPLAB X / Harmony toolchain. They are widely adopted in industrial control, consumer audio, IoT edge nodes, and human-machine interface designs.
Key features of the PIC32MX570F512HT-I/MR include two I2S interfaces for digital audio, four SPI modules, Peripheral Pin Select (PPS) for flexible signal routing, a Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces, and a 10-bit ADC with up to 1 Msps conversion rate. The on-chip CTMU supports capacitive touch sensing and time measurement, while RTCC provides real-time clocking for low-power always-on domains.
Architecturally, the device uses a 5-stage pipeline MIPS32 M4K core with hardware multiply/divide, single-cycle 32-bit ALU, and pre-fetch cache, executing most instructions in one clock cycle. The 512 KB Flash is organized as 256K x 16 with prefetch, and the 64 KB SRAM supports DMA access via four channels, offloading CPU bandwidth for high-throughput peripherals such as USB and PMP graphics.
Typical applications include industrial HMI panels with TFT-LCD graphics via PMP, USB audio interfaces using I2S, automotive infotainment peripherals (CAN + USB), home automation gateways with capacitive touch keypads, and low-cost medical monitoring devices requiring RTCC timestamping. The wide peripheral mix makes it a strong fit for designs that need a single-chip controller with connectivity and a basic graphics engine.
Designers should plan oscillator and decoupling layout carefully: the 50 MHz operation requires a stable crystal or external clock, and the QFN-64 ground pad must be soldered to a continuous ground pour for thermal dissipation and EMI suppression. Use MPLAB X IDE with XC32 compiler and configure PPS before assigning peripheral functions to physical pins.
This page synthesizes distributor stock, pricing, drop-in replacement options, and engineering design notes not consolidated on the manufacturer datasheet - giving procurement and design engineers a single source for evaluation and BOM validation.
直接替换替代料： PIC32MX570F512HT-I/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MX570F512HT-I/MR （相同外形与封装尺寸） ——差异在于 Package, ADC, MSL Level, Operating Temperature, Parallel Master Port (PMP).
快速对比工具——选择替代料号进行并排对比：
PIC32MX570F512H-I/MR
✅ 直接替换✓ 有现货
$4.32 / 个
查看数据手册 →PIC32MX570F512HT-V/MR
✅ 直接替换✓ 有现货
$5.15 / 个
查看数据手册 →PIC32MX570F512HT-50I/MR
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MX564F128HT-I/MR
✅ 直接替换✓ 有现货
$4.73 / 个
查看数据手册 →PIC32MX470F512H-I/MR
✅ 直接替换✓ 有现货
$5.08 / 个
查看数据手册 →PIC32MX570F512HT-I/MR 最大额定值与电气特性
| Core Architecture | MIPS32 M4K |
| Core Bit Width | 32-bit |
| Maximum CPU Frequency | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Flash Program Memory | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| I/O Pins | 53 |
| 封装 | 64-pin QFN (9x9 mm) |
| 安装类型 | Surface Mount |
| USB Interface | USB 2.0 Full-Speed (Device/Host/OTG) |
| CAN Interface | 1x CAN 2.0B |
| SPI Modules | 4 |
| I2C Modules | 2 |
| UART Modules | 2 |
| I2S Modules | 2 |
| ADC | 10-bit, up to 1 Msps |
| Analog Comparators | 3 |
| CTMU | Yes (Charge Time Measurement Unit) |
| RTCC | Yes (Real-Time Clock/Calendar) |
| PMP | Yes (Parallel Master Port with dual buffers) |
| PPS | Yes (Peripheral Pin Select) |
| DMA Channels | 4 |
| 工作温度 | -40C to +85C (Industrial) |
| RoHS 状态 | Compliant |
PIC32MX570F512HT-I/MR 64-pin qfn (9x9 mm) 引脚配置指南
PIC32MX570F512HT-I/MR（64-pin qfn (9x9 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MX570F512HT-I/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MX570F512HT-I/MR 适用于 7 应用s: Industrial HMI with TFT Graphics, USB Audio Interface with I2S Codec, Automotive CAN Gateway Node, Capacitive Touch Keypad Controller, IoT Edge Sensor Hub with USB Tethering, Medical Monitoring and RTCC Timestamping, Consumer Audio Mixer / Effects Unit.
Industrial HMI with TFT Graphics
The PIC32MX570F512HT-I/MR drives small TFT-LCD panels through its Parallel Master Port (PMP) with dual read/write buffers, supporting 8-bit or 16-bit interface to displays up to QVGA resolution. With 64 KB SRAM and DMA offload, framebuffer updates run without blocking the CPU. The 50 MHz MIPS32 M4K core handles anti-aliased fonts and basic GUI widgets at 30+ FPS. Compared with PIC32MX534 or PIC32MX150, the larger 512 KB Flash accommodates full GUI stacks without external memory, simplifying PCB layout in factory operator panels and appliance front-panel designs.
推荐
USB Audio Interface with I2S Codec
The two on-chip I2S interfaces and USB 2.0 Full-Speed OTG make the PIC32MX570F512HT-I/MR a strong fit for USB-to-I2S audio bridges, headset dongles, and recording interfaces. The 83 DMIPS performance handles 48 kHz/24-bit stereo audio streams with low CPU overhead, while the CTMU supports push-button or capacitive-touch volume controls. The 64 KB SRAM accommodates stereo audio buffering without external memory. This outperforms 8-bit PIC16 designs that cannot process full-rate stereo USB audio in real time.
推荐
Automotive CAN Gateway Node
The integrated CAN 2.0B controller and 50 MHz processing capability suit the PIC32MX570F512HT-I/MR for non-safety CAN gateway nodes such as body control modules, climate interfaces, and infotainment peripherals. The 512 KB Flash fits CANopen or J1939 protocol stacks, while 64 KB SRAM buffers message queues. Engineers pairing this with LIN or CAN-FD bridges can build gateway nodes at modest BOM cost. The -40C to +85C industrial temperature range covers cabin and under-hood accessory domains.
推荐
Capacitive Touch Keypad Controller
The on-chip CTMU and PPS flexibility let the PIC32MX570F512HT-I/MR scan 20+ capacitive touch keys without external charge-timing circuitry. The 512 KB Flash supports user-defined gesture recognition libraries, and USB HID output makes it a plug-and-play touch controller for industrial keypads and appliance controls. With 64 KB SRAM, designers can buffer multi-touch sequences locally before reporting to the host MCU. The QFN-64 small footprint suits slim industrial front-panel designs.
推荐
IoT Edge Sensor Hub with USB Tethering
The PIC32MX570F512HT-I/MR serves as a USB-tethered edge hub for industrial sensors, leveraging USB 2.0 Full-Speed for both power and data, plus four SPI and two I2C ports to interface SPI sensors, I2C ADCs, and external flash. The 512 KB Flash accommodates sensor-fusion logic and local calibration tables. RTCC provides timestamping for logged sensor data without external RTC. Designers upgrading from PIC24 designs benefit from the 32-bit performance jump without changing USB host software.
推荐
Medical Monitoring and RTCC Timestamping
The PIC32MX570F512HT-I/MR fits compact patient monitors and home-health peripherals that require a real-time clock, USB device connectivity, and 10-bit ADC channels for analog biosensors. The RTCC retains time across power cycles via VBAT, while 64 KB SRAM buffers short-term waveform samples before upload. The 50 MHz core executes simple digital filtering on ECG or pulse-oximeter streams. Medical designs should still validate IEC 60601 compliance at the system level, as the MCU itself is not a medical-grade component.
推荐
Consumer Audio Mixer / Effects Unit
With two I2S inputs/outputs, four SPI control ports, and 50 MHz MIPS performance, the PIC32MX570F512HT-I/MR runs audio mixers and effects processors for consumer DJ controllers, karaoke machines, and headphone amplifiers. The 64 KB SRAM hosts short audio delay lines and convolution buffers, while USB connects to host PCs for firmware updates. The PMP graphics port can drive a small status LCD alongside audio routing. The QFN-64 footprint suits compact handheld audio product form factors.
推荐
推荐产品汇总
工程参考数据： PIC32MX570F512HT-I/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MX570F512H-I/MR | PIC32MX570F512HT-V/MR | PIC32MX570F512HT-50I/MR | PIC32MX564F128HT-I/MR | PIC32MX470F512H-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same |
| Max CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 120 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 128 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 128 KB |
| USB Controller | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN Controller | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B | 1x CAN 2.0B |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +105C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| I/O Pins | 53 | 53 | 53 | 53 | 53 | 53 |
关键差异点
- Largest Flash/RAM combo in the PIC32MX5xx 64-pin QFN family （对比 PIC32MX564F128HT-I/MR)
- Extended -40C to +105C variant available in same package （对比 PIC32MX570F512HT-V/MR)
- Higher CPU performance available at same pinout （对比 PIC32MX470F512H-I/MR)
设计说明
The QFN-64 (9x9 mm) package relies on the exposed thermal pad for heat dissipation. At full 50 MHz CPU load with all peripherals active, internal die dissipation can reach 200-300 mW. Solder the thermal pad to a continuous ground pour of at least 1 square inch of copper; vias stitching the pad to internal ground planes further reduce theta-JA. Without proper PCB thermal design, junction temperature can exceed the 85C industrial limit in enclosed housings.
Place decoupling capacitors as close as possible to each VDD pin: 100 nF ceramic for each digital supply pin and a single 4.7 uF bulk capacitor near the MCU. The USB D+/D- lines require 90 ohm differential routing with matched length; place the 27 ohm series termination resistors near the MCU side. Keep high-speed PMP traces short and length-matched to avoid graphics glitches on the LCD bus.
Crystal or external clock traces must be kept short and routed over a continuous ground plane to minimize EMI. If using the internal PLL, the loop filter capacitor on VCAP must be rated low-ESR (X7R or better) and placed within 5 mm of the pin. Peripheral Pin Select (PPS) reassignment should be finalized early in firmware to avoid floating inputs; unused I/O pins should be configured as outputs low or inputs with internal pull-ups to reduce quiescent current.
Do not exceed the absolute maximum VDD of 3.6 V - even brief over-voltage events during USB hot-plug can latch-up the MCU. Configure the RTCC backup battery correctly so VBAT does not backfeed VDD when system power is removed. When using USB Host mode, the VBUS pin must not be back-driven; an external power switch IC is required. Always use Microchip MPLAB XC32 compiler v2.40+ for correct C99 peripheral library support.
合规信息
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - use PIC32MX570F512HT-V/MR for extended temperature or design-in AEC-Q100 qualified parts for safety-critical automotive.
