PIC32MX570F512H-I/MR - 50MHz 512KB Flash 32-bit MCU | Microchip
MPN: PIC32MX570F512H-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.95 | $6.95 |
| 10 | $6.12 | $61.20 |
| 100 | $5.45 | $545.00 |
| 500 | $4.88 | $2,440.00 |
| 1,000 | $4.32 | $4,320.00 |
PIC32MX570F512H-I/MR Overview
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit processor core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single die. The PIC32MX5XX family sits in Microchip's PIC32 lineup between microcontrollers (an application-specific family) and 32-bit MIPS microAptiv/M4K core architecture, optimized for mixed-control and connectivity applications such as HMI, audio playback, USB peripherals, and CAN-based industrial nodes. Compared with simpler 8/16-bit MCUs, the PIC32MX570 provides higher computational headroom plus integrated high-bandwidth peripherals.
Key differentiating features include the Peripheral Pin Select (PPS) system that remaps most digital peripherals to virtually any I/O pin, a Parallel Master Port (PMP) with dual read/write buffers suited to drive TFT LCDs for graphics interfaces, a 16-channel 10-bit 1 Msps ADC, four SPI/I2S modules, five UART modules, and an integrated charge time measurement unit (CTMU) for touch sensing. The CTMU configuration combined with PPS reduces BOM cost by eliminating external muxes for capacitive-touch keypads.
The architecture combines a 5-stage pipeline M4K core with single-cycle multiply, hardware multiply-accumulate, and tightly-coupled peripherals. The 512 KB Flash and 64 KB SRAM configuration supports full TCP/IP stacks (e.g., Microchip's MPLAB Harmony) plus USB host/device stacks concurrently, while the 16-bit parallel PMP bus can stream pixel data to a TFT at frame rates required for menus and audio UI. The 2.5V / 3.3V operating voltage is selected at Flash-programming time.
Typical applications include USB audio/HID peripherals (USB headphone amps, MIDI controllers), CAN-connected industrial sensors, TFT-based HMI panels with touch, IoT gateways with USB device mode, and audio playback devices that decode MP3/AAC using libraries in Harmony. The PIC32MX570F512H-I/MR fits these because its USB OTG + I2S + CTMU + PMP combination replaces several discrete ICs.
When designing with this device, allocate PPS pins carefully: most peripherals share pins via the PPS register map and a single function can only be mapped to one pin at a time. Use MPLAB Harmony or MPLAB Code Configurator to manage pin assignments and avoid conflicts between USB D+/D-, I2S word/clock, and PMP data/control lines.
This page synthesizes distributor pricing, drop-in PIC32MX5XX family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC32MX570F512H-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX570F512H-I/MR (same form factor and footprint) — differing in Package, Core Architecture, CAN, USB, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX570F512HT-I/MR
✅ Drop-In✓ In Stock
$4.78 / Unit
View Datasheet →PIC32MX570F512H-V/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX570F512H-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Maximum CPU Frequency | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| Data Memory (SRAM) | 64 KB |
| Operating Voltage | 2.5V / 3.3V (Flash-programming-time selectable) |
| Operating Temperature Range | -40C to +85C (Industrial) |
| Package | 64-pin QFN (9x9 mm) with exposed thermal pad |
| Mounting Type | Surface Mount |
| ADC | 10-bit, 16-channel, 1 Msps |
| USB | USB 2.0 Full-Speed OTG controller |
| CAN | CAN 2.0B with DeviceNet addressing |
| SPI / I2S Modules | 3 I2S/SPI (some sources cite 4 SPI) |
| UART Modules | 5 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers |
| CTMU (Touch Sensing) | Yes |
| RoHS Status | Compliant |
PIC32MX570F512H-I/MR 64-pin qfn (9x9 mm) with exposed thermal pad Pin Configuration Guide
Pin configuration for PIC32MX570F512H-I/MR (64-pin qfn (9x9 mm) with exposed thermal pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX570F512H-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX570F512H-I/MR is suitable for 6 applications: USB Audio/HID Peripherals, CAN-Connected Industrial Sensors, TFT-based HMI Panels with Touch, IoT Gateways with USB Device Mode, Audio Playback Devices (MP3/AAC Decode), MIDI Controllers and Sequencers.
USB Audio/HID Peripherals
The PIC32MX570F512H-I/MR's integrated USB 2.0 Full-Speed OTG controller and three I2S/SPI modules enable USB headphone amplifiers, MIDI controllers, and USB audio interfaces in a single chip. With 83 DMIPS, the M4K core handles MP3/AAC decode and USB isochronous streaming concurrently without external DSP. The 64 KB SRAM buffers USB packets while the 512 KB Flash stores audio decoders plus HID reports. Placed at the USB-B connector side with proper 90.9 ohm USB DP/DN impedance, the part replaces a discrete MCU plus USB-serial bridge. CTMU is unused here. Compared with PIC32MX270F512L, the 570 adds USB OTG and CAN, eliminating two external ICs and reducing BOM cost by roughly $1.50 in USB-audio products.
Recommended
CAN-Connected Industrial Sensors
The PIC32MX570F512H-I/MR integrates a CAN 2.0B controller with DeviceNet addressing support, making it ideal for industrial sensor nodes on CAN bus networks. The 50 MHz M4K core can run CANopen or DeviceNet protocol stacks alongside sensor sampling routines, and the 16-channel 10-bit ADC with 1 Msps handles multiple analog sensor inputs. The industrial -40C to +85C temperature grade supports factory-floor deployment. With 512 KB Flash it accommodates full CANopen stack plus application code. Placed between the CAN transceiver (e.g., MCP2551) and sensor signal conditioning; PPS remaps the CAN RX/TX to any two I/O pins, simplifying PCB layout versus fixed-pin CAN controllers.
Recommended
TFT-based HMI Panels with Touch
The PIC32MX570F512H-I/MR's Parallel Master Port (PMP) with dual read/write buffers streams pixel data directly to TFT LCDs at frame rates suitable for menus and graphical UIs. The integrated CTMU (charge time measurement unit) handles capacitive touch sensing without external muxes, and Peripheral Pin Select (PPS) remaps both PMP and CTMU functions to free pins. The 64 KB SRAM provides display framebuffer headroom while 512 KB Flash holds UI assets. Use MPLAB Harmony's graphics library plus the touch driver; the 16-bit PMP bus supports typical QVGA/WQVGA TFTs. This combination replaces a discrete LCD controller plus external touch IC, cutting PCB area by roughly 30% versus two-chip solutions.
Recommended
IoT Gateways with USB Device Mode
The PIC32MX570F512H-I/MR's USB 2.0 Full-Speed OTG controller enables IoT gateway designs that present as USB devices to a host PC or USB-embedded hub. The 50 MHz M4K core runs Microchip's MPLAB Harmony TCP/IP stack while maintaining the USB device link, and the 512 KB Flash hosts the full Harmony framework plus application code. UART, SPI, and I2C peripherals connect to external radios (Wi-Fi, LoRa, BLE modules) and sensors. Placed between the upstream USB host and downstream sensors, the part acts as a protocol bridge. Compared to separate MCU + USB-serial chipsets, this single-chip solution reduces gateway cost and PCB footprint.
Recommended
Audio Playback Devices (MP3/AAC Decode)
The PIC32MX570F512H-I/MR's combination of 83 DMIPS compute, three I2S/SPI modules, and ample 512 KB Flash / 64 KB SRAM makes it well-suited for standalone MP3/AAC playback devices. The M4K core can decode compressed audio using optimized libraries in MPLAB Harmony while streaming PCM to an external DAC via I2S. The five UART modules provide control interfaces for buttons, rotary inputs, and IR remotes. The industrial temperature grade supports in-vehicle and outdoor audio installations. Compared to dedicated audio decoder ICs, the 570 adds a programmable control surface, eliminating a separate user-interface MCU in the BOM.
Recommended
MIDI Controllers and Sequencers
The PIC32MX570F512H-I/MR's USB Full-Speed OTG, ample Flash for MIDI mapping tables, and CTMU for touch-sensitive pads make it ideal for USB MIDI controllers and sequencers. The 50 MHz M4K core handles USB MIDI 1.0 streaming plus local LED/PWM updates for button lighting with sub-millisecond latency. The 64-pin QFN exposes enough I/O for 16+ buttons, 8+ rotary encoders, and 4+ faders. Placed at the USB-B upstream connector, the part serves as the sole MCU in MIDI controllers. Compared with PIC18F-based MIDI controllers, the 570 adds USB Full-Speed OTG natively and eliminates external USB-MIDI converters.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX570F512H-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX570F512HT-I/MR | PIC32MX570F512H-V/MR | PIC32MX570F512H-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | TQFP-64 - different |
| Core / Max Frequency | MIPS32 M4K / 50 MHz | MIPS32 M4K / 50 MHz - same | MIPS32 M4K / 50 MHz - same | MIPS32 M4K / 50 MHz - same |
| Flash | 512 KB | 512 KB - same | 512 KB - same | 512 KB - same |
| SRAM | 64 KB | 64 KB - same | 64 KB - same | 64 KB - same |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C - same | Extended -40C to +105C (“V” grade) | Industrial -40C to +85C - same |
| Packaging Form | Tube | Tape and Reel | Tube | Tray |
| USB OTG | Yes (Full-Speed) | Yes (Full-Speed) - same | Yes (Full-Speed) - same | Yes (Full-Speed) - same |
| CAN 2.0B | Yes (DeviceNet) | Yes (DeviceNet) - same | Yes (DeviceNet) - same | Yes (DeviceNet) - same |
Key Differentiators
- Integrated USB OTG + CAN 2.0B in a 64-pin QFN (vs PIC32MX270F512L-50I/PF)
- PPS remaps nearly all digital peripherals to any I/O pin (vs PIC32MX340F512H-80I/MR)
- Parallel Master Port with dual buffers for TFT graphics (vs DSPIC33EP256MU810-E/PT)
Design Notes
Estimated: The PIC32MX570F512H-I/MR exposes roughly 50 usable I/O pins through PPS remapping, but most peripherals share pin groups. Allocate USB DP/DN on fixed dedicated pins first, then map UART, SPI, and I2S via PPS to avoid conflicts. Use MPLAB Code Configurator's Pin Manager view to detect collisions before PCB layout. Estimated pin utilization: USB 2 pins fixed, PMP up to 16 pins, ADC max 16 pins, leaving roughly 16-20 free GPIO for buttons and LEDs.
The 64-pin QFN (9x9 mm) package has a large center exposed thermal pad that MUST be soldered to a ground plane for both thermal dissipation and electrical grounding. Use an array of thermal vias (typically 9-16 vias at 0.3 mm drill, 0.6 mm pad) under the EP to conduct heat into inner ground planes. Failure to solder the EP results in the part exceeding thermal limits at full 50 MHz operation under heavy USB + CAN + SPI load.
Do not exceed the maximum 3.6V supply voltage on any VDD pin even though the PIC32MX570 supports both 2.5V and 3.3V operation. Place a 10 uF bulk capacitor plus 0.1 uF decoupling capacitor within 5 mm of each VDD pin pair, and 1 uF near the VBAT pin if battery backup is used. The USB bus-powered configuration needs a 4.7 uF capacitor on VBUS within 1 cm of the VBUS pin per USB 2.0 spec.
For USB Full-Speed operation, route the DP and DN traces as a 90 ohm differential pair with controlled impedance (target 90 ohm +/- 10%) over a continuous ground reference plane. Maximum trace length should not exceed 50 mm, and the pair must not cross any other signal trace or split the ground plane. Add a common-mode choke (e.g., DLW21SN) near the USB connector for EMI compliance in consumer products.
Compliance Information
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; for AEC-Q100 automotive applications use PIC32MX570F512H-V/MR (“V” grade) instead.
