PIC32MZ0512EFE100-I/GJX - 200MHz 32-bit FPU MCU 512KB Flash | Microchip
料号： PIC32MZ0512EFE100-I/GJX ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $10.85 | $10.85 |
| 10 | $9.77 | $97.70 |
| 100 | $8.72 | $872.00 |
| 500 | $7.65 | $3,825.00 |
| 1,000 | $6.84 | $6,840.00 |
PIC32MZ0512EFE100-I/GJX 概述
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a processor core, program and data memory, and a rich set of on-chip peripherals. PIC32MZ EF devices occupy the high-performance tier of Microchip's PIC32 portfolio and add a single-precision IEEE-754 FPU and a DSP-enhanced core with four 64-bit accumulators plus single-cycle MAC, saturating and fractional math, supporting signal-processing workloads that benefit from hardware-accelerated arithmetic. The PIC32MZ family sits in the broader taxonomy: MCU -> 32-bit MCU -> MIPS-based MCU -> PIC32 -> PIC32MZ EF.
Key features include a 200 MHz / 330 DMIPS MIPS Warrior M-class core, IEEE 754-compliant FPU, dual-panel Flash for live firmware update, an integrated crypto engine on F-variant devices (this E variant has No Crypto), and a connectivity peripheral set that includes HS USB, Ethernet MAC, CAN, and multiple I2S/SPI/I2C interfaces for audio and graphics pipelines. On-board 12-bit ADC at up to 18 Msps and analog comparators provide advanced analog capability, while the Graphics Peripheral Interface enables direct connection to TFT displays for HMI applications.
The architecture combines a 5-stage pipeline with tightly-coupled SRAM, instruction and data caches, and a dedicated bus matrix so the CPU can sustain 330 DMIPS while peripherals stream data through DMA. Dual-panel Flash allows one bank to run while the other is reprogrammed, enabling fail-safe firmware-over-the-air (FOTA) updates without downtime - a critical capability for connected industrial nodes.
Typical applications include industrial IoT gateways with Ethernet, HMI panels with TFT display driving, automotive infotainment sub-systems (non-safety-rated), high-end audio devices, motor control, and graphics-rich consumer appliances. The 100-pin TFBGA footprint suits compact board layouts where space is at a premium.
When designing with this device, use the MPLAB Harmony v3 framework for peripheral configuration and middleware, and confirm that the chosen 100-pin TFBGA layout has adequate thermal copper for sustained CPU activity. Provide a clean, low-noise 3.3 V rail; the FPU and DSP engine are sensitive to supply ripple at high clock rates.
This page synthesizes distributor pricing, same-brand drop-in alternatives (different Flash / temperature grade), and practical design notes that are not assembled in the manufacturer datasheet itself.
直接替换替代料： PIC32MZ0512EFE100-I/GJX ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ0512EFE100-I/GJX （相同外形与封装尺寸） ——差异在于 Core Architecture, Package, DSP Extensions, FPU, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ0512EFE100-E/GJX
✅ 直接替换✓ 有现货
$9.52 / 个
查看数据手册 →PIC32MZ0512EFF100-I/GJX
✅ 直接替换✓ 有现货
$5.85 / 个
查看数据手册 →PIC32MZ1024EFE100-I/GJX
✅ 直接替换✓ 有现货
$2.78 / 个
查看数据手册 →PIC32MZ2048EFG100-I/GJX
✅ 直接替换✓ 有现货
$11.85 / 个
查看数据手册 →PIC32MZ0512EFE100-I/GJX 最大额定值与电气特性
| Core Architecture | MIPS32 Warrior M-class (32-bit) |
| Maximum CPU Speed | 200 MHz |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754 single-precision (hardware) |
| DSP Extensions | 4x 64-bit accumulators, single-cycle MAC, saturating & fractional math |
| Program Flash | 512 KB (dual-panel, live-update) |
| SRAM | 128 KB |
| 电源电压 | 2.0 V to 3.6 V |
| 工作温度 | -40 °C to +85 °C (Industrial, -I suffix) |
| 封装 | 100-pin TFBGA (7x7x1.06 mm), GJX suffix |
| Cryptographic Engine | Not present (E variant: No Crypto) |
| CAN | Not present (E variant: No CAN) |
| Connectivity Peripherals | HS USB, Ethernet MAC, I2S, SPI, I2C, UART |
| ADC | 12-bit, up to 18 Msps |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
PIC32MZ0512EFE100-I/GJX 100-pin tfbga (7x7x1.06 mm), gjx suffix 引脚配置指南
PIC32MZ0512EFE100-I/GJX（100-pin tfbga (7x7x1.06 mm), gjx suffix 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MZ0512EFE100-I/GJX.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MZ0512EFE100-I/GJX 适用于 6 应用s: Industrial IoT Gateway, Graphics HMI / TFT Display Controller, Audio Processing / DSP Front-End, Motor Control / Field-Oriented Control, Connected Consumer Appliance Controller, USB Peripheral / Composite Device.
Industrial IoT Gateway
The PIC32MZ0512EFE100-I/GJX is well matched to industrial IoT gateway designs that require deterministic 32-bit processing, integrated Ethernet MAC, HS USB, and multiple serial interfaces on a single chip. At 330 DMIPS with hardware FPU, the device can simultaneously handle an MQTT/SNMP stack, FreeRTOS task scheduling, and protocol conversion between Modbus TCP and RS-485. The 512 KB dual-panel Flash supports fail-safe firmware-over-the-air updates so remote nodes can be patched without site visits. Operating from 2.0 V to 3.6 V at -40 °C to +85 °C industrial temperature range, it tolerates factory-floor supply noise and ambient swings, while the 100-pin TFBGA footprint keeps the gateway compact enough for DIN-rail enclosures.
推荐
Graphics HMI / TFT Display Controller
The PIC32MZ EF device family includes a Graphics Peripheral Interface (parallel PMP/EBIOBUS) and a dedicated TFT timing engine that stream pixel data directly to color LCDs without CPU intervention, making the PIC32MZ0512EFE100-I/GJX suitable for HMI panels with WVGA resolution. The 200 MHz core and DMA channels drive buttons, gauges, and animations while leaving headroom for an embedded UI framework (SEGGER emWin, Microchip MPLAB Harmony graphics suite). The 128 KB SRAM holds an off-screen framebuffer for smooth transitions, and the 12-bit 18 Msps ADC reads touch-screen and front-panel analog inputs. The compact 7x7 mm TFBGA package allows slim bezel designs.
推荐
Audio Processing / DSP Front-End
With its DSP-enhanced MIPS core (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) and IEEE 754 hardware FPU, the PIC32MZ0512EFE100-I/GJX handles real-time audio tasks such as beamforming, sample-rate conversion, and acoustic echo cancellation on I2S streams. The integrated I2S/SSI block connects directly to MEMS microphones and audio DACs, while the HS USB 2.0 interface provides a high-throughput path to a host PC for development or to a streaming endpoint in production. Compared with a separate DSP + MCU architecture, this single-chip solution reduces BOM cost and simplifies the audio pipeline firmware.
推荐
Motor Control / Field-Oriented Control
The 200 MHz MIPS core with single-cycle MAC and 18 Msps 12-bit ADC makes the PIC32MZ0512EFE100-I/GJX capable of running field-oriented control (FOC) loops for brushless DC and permanent-magnet synchronous motors. PWM/SCCP/OCMP peripherals with dead-time insertion drive three-phase inverter bridges at switching frequencies above 50 kHz while the ADC samples phase currents synchronously. The 330 DMIPS headroom supports state estimators, MTPA, and field-weakening algorithms in real time. Note: this E variant omits CAN, so for CAN-based motor networks (CANopen, CiA 402) migrate to PIC32MZ0512EFF100-I/GJX with identical 100-pin TFBGA footprint.
推荐
Connected Consumer Appliance Controller
Connected home appliances - washing machines, ovens, air conditioners - benefit from the PIC32MZ0512EFE100-I/GJX's blend of high-performance control and connectivity. The Ethernet MAC and HS USB enable Wi-Fi/BLE companion modules to provide cloud connectivity, while the 200 MHz core drives UI rendering, sensor fusion, and motor control in parallel. The 512 KB dual-panel Flash supports safe OTA updates and A/B rollback, critical for in-field firmware management. Industrial -40 °C to +85 °C operation tolerates hot appliance enclosures, while the small TFBGA footprint suits slim control board layouts behind touch panels.
推荐
USB Peripheral / Composite Device
The PIC32MZ0512EFE100-I/GJX integrates a High-Speed USB 2.0 controller with on-chip PHY and full USB-IF compliance for HID, CDC, mass-storage, vendor-class, and composite device stacks. Paired with the 200 MHz core, firmware can implement USB 3.0-style data throughput at 480 Mbps while serving real-time device-class tasks. The Ethernet MAC and HS USB combination also enables USB-to-Ethernet dongles, USB tethering bridges, and oscilloscope/data-logger front-ends. Firmware is developed under MPLAB Harmony v3, which provides certified USB stacks and CDC/HID/MSC class drivers out of the box.
推荐
推荐产品汇总
工程参考数据： PIC32MZ0512EFE100-I/GJX ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFF100-I/GJX | PIC32MZ1024EFE100-I/GJX | PIC32MZ2048EFG100-I/GJX |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (GJX) 7x7 mm | 100-pin TFBGA (GJX) 7x7 mm - same | 100-pin TFBGA (GJX) 7x7 mm - same | 100-pin TFBGA (GJX) 7x7 mm - same | 100-pin TFBGA (GJX) 7x7 mm - same |
| Core / Max Clock | MIPS Warrior M-class / 200 MHz (330 DMIPS) | MIPS Warrior M-class / 200 MHz | MIPS Warrior M-class / 200 MHz | MIPS Warrior M-class / 200 MHz | MIPS Warrior M-class / 200 MHz |
| Flash | 512 KB (dual-panel) | 512 KB (dual-panel) | 512 KB (dual-panel) | 1 MB (dual-panel) | 2 MB (dual-panel) |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 512 KB |
| Hardware Crypto Engine | No | No | Yes (AES/SHA/RNG) | No | Yes (AES/SHA/RNG) |
| CAN | No | No | Yes (CAN-FD) | No | Yes (CAN-FD) |
| Temperature Grade | Industrial -40 to +85 °C | Extended -40 to +125 °C | Industrial -40 to +85 °C | Industrial -40 to +85 °C | Industrial -40 to +85 °C |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
关键差异点
- Pin-compatible crypto upgrade path （对比 PIC32MZ0512EFF100-I/GJX)
- Dual-panel Flash for live firmware update （对比 PIC32MX570F512LT-I/GJX)
- Hardware FPU + DSP extensions （对比 PIC32MX795F512LT-80I/PT)
设计说明
Use a 4-layer PCB with a continuous ground plane beneath the 100-pin TFBGA (GJX) footprint. The 0.8 mm ball pitch requires 0.4 mm laser-drilled microvias in the fan-out; verify your board house supports stacked microvias or use dog-bone fan-out with 0.2 mm vias. Place bulk 4.7 µF + 0.1 µF decoupling pairs within 2 mm of every VDD/AVDD pin, and provide a ferrite bead between digital and analog supply rails to keep ADC noise below 1 LSB.
Estimated: at 200 MHz with all peripherals enabled, core current draw is approximately 80 mA from a 3.3 V supply, giving ~0.26 W dissipation. The 100-pin TFBGA has a junction-to-ambient theta_JA of approximately 40 °C/W on a 4-layer JEDEC test board, so junction temperature rise is around 10 °C above ambient - well within the 125 °C maximum. Sustained industrial-temperature operation at 85 °C ambient is feasible without a heatsink, but consider thermal vias to an internal copper pour for margin.
When routing the HS USB 2.0 differential pair (D+/D-), keep 90 Ω differential impedance, length matching within 150 mil, and avoid splits in the reference ground plane. For Ethernet, route the RMII/RGMII traces with 50 Ω controlled impedance and series-terminate clock lines at the source. Use the Microchip IBIS models to simulate signal integrity before tape-out, especially for the parallel PMP/EBIOBUS interface used for TFT displays.
Do not confuse the E-suffix (No Crypto, No CAN) with the F-suffix (Crypto + CAN-FD); both share the same 100-pin TFBGA GJX footprint and are pin-compatible, but the peripheral map differs and firmware must be rebuilt against the correct Harmony configuration. Also note that the '0512' in the part number denotes Flash size in KB; the '2048' PIC32MZ2048EFG100 variant has a different pinout with additional high-speed pins enabled - confirm the package datasheet before re-using a layout.
合规信息
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified; for automotive applications review PIC32MZ EF automotive grade parts separately. Halogen-free status not stated in provided web data - set to unknown.
