PIC32MZ2048EFG100-I/GJX - 200MHz 32-bit MCU, 2MB Flash, 100-TFBGA | Microchip
MPN: PIC32MZ2048EFG100-I/GJX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.65 | $166.50 |
| 100 | $14.8 | $1,480.00 |
| 500 | $13.2 | $6,600.00 |
| 1,000 | $11.85 | $11,850.00 |
PIC32MZ2048EFG100-I/GJX Overview
A 32-bit microcontroller (MCU) is a programmable processor that combines a CPU core, non-volatile program memory, volatile data memory, and a rich set of on-chip peripherals (ADC, timers, communication controllers) on a single silicon die. The PIC32MZ EF family sits in Microchip's high-performance MCU portfolio alongside the PIC32MM, PIC32MX, and PIC32MK families, targeting embedded connectivity and graphics applications. Within the system hierarchy, an MCU belongs to microcontrollers, embedded processors, semiconductors, and integrated circuits.
Key features of this device include a 12-bit 18 MSPS 40-channel ADC, dual-panel Flash supporting live firmware swap, a Memory Management Unit (MMU) for embedded OS use, Hi-Speed USB 2.0, 10/100 Ethernet MAC, SQI (Serial Quad Interface), CAN, I2S/audio, and graphics peripherals. The Harvard architecture provides separate buses for instruction and data fetch, allowing deterministic zero-wait-state execution from Flash under most conditions.
Designed for industrial, automotive, IoT, graphics/HMI, and motor control markets, the part supports large graphical user interfaces via its integrated graphics controller and external bus interface. The 100-TFBGA package offers compact 7x7 mm footprint for space-constrained designs while exposing 78 GPIO through peripheral multiplexing. Voltage range is typically 2.3V-3.6V with multiple on-chip regulators for core and I/O rails.
Typical applications include HMI panels with TFT-LCD, industrial IoT gateways, motor control drives, audio processing, and Ethernet-connected sensors. When designing, ensure the TFBGA PCB layout uses microvia stacks with 0.4 mm pitch escape routing, and review the family's errata sheet for any device-specific silicon revisions before committing to production.
Drop-in alternatives for PIC32MZ2048EFG100-I/GJX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ2048EFG100-I/GJX (same form factor and footprint) — differing in Package, Core Architecture, Ethernet, CAN, FPU.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1024EFG100-I/GJX
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View Datasheet →PIC32MZ2048EFH100-I/GJX
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View Datasheet →PIC32MZ2048EFM100-I/GJX
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View Datasheet →PIC32MZ2048EFG100T-I/GJX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ2048EFG100-E/GJX
✅ Drop-In✓ In Stock
$11.95 / Unit
View Datasheet →STM32F765VGH6
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ2048EFG100-I/GJX Maximum Ratings & Electrical Characteristics
| Core | MIPS32 M-Class (MIPS Warrior) |
| Core Architecture | MIPS M-class, 32-bit |
| Maximum CPU Speed | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 512 KB |
| FPU | IEEE 754 single/double-precision |
| DSP Extensions | 4x 64-bit accumulators, single-cycle MAC, saturating & fractional math |
| Operating Voltage | 2.3 V to 3.6 V |
| ADC | 12-bit, 18 MSPS, 40-channel |
| Flash Architecture | Dual Panel Flash with Live Update support |
| MMU | Yes (Memory Management Unit) |
| USB | Hi-Speed USB 2.0 |
| Ethernet | 10/100 MAC |
| SQI | Serial Quad Interface |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 100-TFBGA (7x7 mm) |
| Pin Count | 100 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC32MZ2048EFG100-I/GJX 100-tfbga (7x7 mm) Pin Configuration Guide
Pin configuration for PIC32MZ2048EFG100-I/GJX (100-tfbga (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ2048EFG100-I/GJX.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ2048EFG100-I/GJX is suitable for 8 applications: Industrial IoT Gateway, Human-Machine Interface (HMI) with TFT-LCD, Motor Control and Variable-Frequency Drive, Audio Processing and Effects Unit, Connected Medical Device, Automotive Connectivity Module, Smart Sensor Hub with Edge Analytics, Industrial Control with EtherCAT SubDevice.
Industrial IoT Gateway
The PIC32MZ2048EFG100-I/GJX is well suited for IoT gateway designs that aggregate sensor data from fieldbus peripherals and push it to the cloud over Ethernet. Its integrated 10/100 Ethernet MAC, Hi-Speed USB 2.0, and SQI interface let it connect to WiFi/BLE modules, external QSPI Flash, and 4G/LTE modems concurrently. The 2 MB dual-panel Flash supports over-the-air (OTA) firmware updates with zero downtime, while the 512 KB SRAM buffers TCP/IP stacks, TLS sessions, and sensor payloads. The MIPS M-class core's 330 DMIPS can run mqttOS, lwIP + TLS, and JSON serialization without offloading to a network processor. Industrial -40C to +85C operation and the compact 100-TFBGA footprint suit DIN-rail mounted gateways.
Recommended
Human-Machine Interface (HMI) with TFT-LCD
For TFT-LCD HMI panels, the PIC32MZ2048EFG100-I/GJX provides the graphics peripherals, processing headroom, and memory to drive a 480x272 WVGA or larger TFT display with touch input. The 12-bit 18 MSPS 40-channel ADC handles touch-sensing and analog user controls concurrently. The 512 KB SRAM fits double-buffered 16-bit color framebuffers at common panel resolutions. The graphics LCD (GLCI) controller, PMP, and DMA work in tandem. The MIPS warrior M-class architecture with hardware multiply/accumulate delivers smooth UI rendering at 60 fps. The 7x7 mm TFBGA package keeps the panel PCB compact behind the LCD.
Recommended
Motor Control and Variable-Frequency Drive
The PIC32MZ2048EFG100-I/GJX is a strong fit for AC induction, BLDC, and PMSM motor drives up to several kW. The 200 MHz MIPS M-class core, IEEE 754 FPU, and DSP extensions (4x 64-bit accumulators, single-cycle MAC) execute field-oriented control (FOC) and space-vector PWM at switching frequencies above 20 kHz. The 12-bit 18 MSPS 40-channel ADC samples phase currents and DC-bus voltage with low latency. The Hi-Speed USB 2.0 supports PC commissioning tools, while Ethernet enables industrial protocols like EtherCAT or Modbus TCP. The dual-panel Flash enables live safety-update of motor control firmware. Industrial temp range is suitable for factory-floor drives.
Recommended
Audio Processing and Effects Unit
Audio applications such as multi-channel amplifiers, effects processors, and networked audio devices benefit from the PIC32MZ2048EFG100-I/GJX's DSP capabilities and Hi-Speed USB 2.0 for digital audio streaming. The MIPS M-class core with 4x 64-bit accumulators executes biquad filters, FFT, and dynamics processing at audio sample rates. The 12-bit 18 MSPS ADC handles multi-channel analog input. The 512 KB SRAM fits audio buffers for several seconds of audio at 48 kHz. Ethernet enables networked audio via Dante or AES67. The SQI interface supports external Flash for sample libraries and preset storage. Compact BGA fits slim-line audio products.
Recommended
Connected Medical Device
Patient-monitoring and diagnostic devices in clinical or home-care environments leverage the PIC32MZ2048EFG100-I/GJX's combination of connectivity, computation, and analog performance. The 12-bit 18 MSPS ADC captures bio-signals (ECG, SpO2, respiration) with sufficient resolution. The Ethernet and Hi-Speed USB provide wired connectivity to hospital networks or bedside monitors. The 2 MB Flash supports FDA-compliant firmware with detailed revision history. The dual-panel Flash enables safe firmware updates between patient sessions. The MMU supports secure OS partitioning. Industrial-grade temperature and 100-TFBGA fit portable device form factors.
Recommended
Automotive Connectivity Module
In-vehicle infotainment controllers, telematics control units (TCUs), and OBD-II data loggers can use the PIC32MZ2048EFG100-I/GJX, though automotive designers should prefer the AEC-Q100 qualified EFG100-E/GJX variant for production. The 200 MHz core runs CAN stack parsing, GPS dead-reckoning, and Bluetooth/WiFi management. The Ethernet MAC connects to 100BASE-T1 automotive PHYs for backbone networking. The SQI supports fast external Flash for map data. The 512 KB SRAM buffers diagnostic data. Designers should review the errata document and validate against ISO 26262 functional-safety requirements before deployment.
Recommended
Smart Sensor Hub with Edge Analytics
Smart sensor hubs aggregating multiple sensors (temperature, pressure, motion) with on-device analytics benefit from the PIC32MZ2048EFG100-I/GJX's DSP, low-latency ADC, and dual connectivity options. The 12-bit 18 MSPS 40-channel ADC samples many sensors concurrently, while the DSP-enhanced core runs FFT, filtering, and threshold detection. Hi-Speed USB 2.0 supports high-rate data streaming to a host PC for visualization, while Ethernet provides standalone cloud connectivity. The 2 MB Flash fits ML model parameters and edge-inference code. Industrial temp range suits outdoor and factory sensor hubs. Compact TFBGA enables small-form-factor modules.
Recommended
Industrial Control with EtherCAT SubDevice
EtherCAT sub-device controllers in factory automation use the PIC32MZ2048EFG100-I/GJX for distributed I/O and motion slave roles, leveraging its high-performance core and integrated peripherals. The 10/100 Ethernet MAC combined with an external ET1200 EtherCAT slave controller handles the EtherCAT protocol stack with deterministic timing. The 200 MHz MIPS core executes the application layer. The 12-bit ADC reads analog field signals, while GPIO drives relays and digital I/O. The 2 MB Flash fits full EtherCAT slave stack and application code. The compact BGA enables DIN-rail mounted sub-device modules.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ2048EFG100-I/GJX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1024EFG100-I/GJX | PIC32MZ2048EFH100-I/GJX | PIC32MZ2048EFM100-I/GJX | PIC32MZ2048EFG100T-I/GJX | STM32F765VGH6 |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7) | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA (7x7) - same | 100-TFBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | STMicroelectronics | |
| Core | MIPS Warrior M-class, 200 MHz | MIPS Warrior M-class, 200 MHz | MIPS Warrior M-class, 200 MHz | ARM Cortex-M7, 216 MHz | ||
| Flash | 2 MB | 1 MB | 2 MB | 1 MB | ||
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | ||
| FPU | Yes, IEEE 754 | Yes, IEEE 754 | Yes, IEEE 754 (double precision) | |||
| Crypto Engine | No | Yes | Yes (AES, Hash) | |||
| CAN | No | Yes | Yes | |||
| Hi-Speed USB | Yes | Yes | Yes (USB 2.0 OTG) | |||
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C |
Key Differentiators
- Highest Flash density in 100-TFBGA PIC32MZ EF lineup (vs PIC32MZ1024EFG100-I/GJX)
- MIPS M-class DSP and FPU for control and signal processing (vs STM32F765VGH6)
- Dual-panel Flash architecture for live firmware update (vs PIC32MX series)
- Integrated Hi-Speed USB 2.0, Ethernet, and Graphics LCD peripherals (vs PIC32MX210)
Design Notes
The 100-TFBGA package uses 0.5 mm ball pitch and 7x7 mm body, requiring microvia-in-pad PCB technology with stacked vias for escape routing. Use laser-drilled microvias (4-6 mil) for the breakout, and ensure the BGA land pads include a non-solder-mask-defined (NSMD) finish for reliable reflow. Per Microchip's BGA routing application note, fan-out should use 4-layer stackup with continuous ground plane beneath the device. Verify coplanarity under 0.1 mm for production reflow yield.
The PIC32MZ2048EFG100-I/GJX requires three supply rails: VDDI (2.3-3.6 V), VDDCORE (1.8-2.0 V internal LDO), and a separate AVDD for the analog ADC. Decouple each VDDI pin with 100 nF + 4.7 uF ceramic as close to the balls as possible. Per the datasheet, the internal LDO can be bypassed if an external 1.8 V regulator is supplied to VDDCORE. The ADC requires a clean AVDD with a ferrite bead isolation from VDDI noise. Estimated: total IC current at 200 MHz core + active peripherals reaches ~120 mA.
Common pitfalls: (1) Using 'High-Z' as the default for unused pins can draw extra current - configure unused pins as outputs driven low. (2) The dual-panel Flash has a sequential programming model - read the family reference manual section before implementing live update. (3) The 12-bit ADC needs 10 us acquisition time minimum - reducing it below spec degrades linearity. (4) The TFBGA requires X-ray inspection for production QA; optical inspection alone cannot verify BGA solder joints. (5) Review the latest errata for the silicon revision marked on the package top.
At 200 MHz core + full peripheral activity, the TFBGA package typically dissipates under 700 mW. Per the Microchip thermal model, theta_JA for the 100-TFBGA on a JEDEC EIA/JESD51 4-layer test board is approximately 35 C/W. Estimated: at 25C ambient the junction rises 24C, well within the 125C maximum. For industrial -40C to +85C designs with sealed enclosures and no airflow, verify the junction temperature with actual measurements rather than rely on theta_JA. The exposed pad (if present) should be soldered to the internal ground pour for improved dissipation.
Mixed-signal layout must keep the AVDD/AVSS+ ground or other than the noisy digital VDDI/AVSS return paths, connected at a single point near the IC. The 12-bit ADC achieves 70 dB SNR with proper grounding; failing to isolate returns can drop SNR to 55 dB. The high-speed USB 2.0 differential pair (D+/D-) must be 90 ohm impedance-controlled with maximum 4 mm length mismatch. The Ethernet MII/RMII signals to the external PHY should be length-matched within 50 mil to meet timing. Place the 25 MHz Ethernet reference clock crystal within 5 mm of the PHY.
Compliance Information
Industrial -40C to +85C variant; RoHS and REACH compliant per Microchip product documentation. For automotive applications choose the EFG100-E/GJX extended temperature variant which is AEC-Q100 qualified.