PIC32MZ1024EFG100-I/GJX - 200MHz 32-bit MCU, 1MB Flash | Microchip
料号： PIC32MZ1024EFG100-I/GJX ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.75 | $18.75 |
| 10 | $17.1 | $171.00 |
| 100 | $15.3 | $1,530.00 |
| 500 | $13.85 | $6,925.00 |
| 1,000 | $12.5 | $12,500.00 |
PIC32MZ1024EFG100-I/GJX 概述
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one silicon die. Within the broader semiconductor hierarchy, an MCU belongs to the embedded processor category, which also includes DSPs, FPGAs with embedded cores, and microprocessors. The PIC32MZ EF family sits in the upper-performance tier of Microchip's PIC32 portfolio, distinguished from the PIC32MX series by an out-of-order superscalar CPU pipeline, higher clock rates, larger memory, and integrated connectivity peripherals such as 10/100 Ethernet and USB 2.0 High-Speed with embedded PHY.
Key features of the PIC32MZ1024EFG100-I/GJX include 200 MHz core speed (252 MHz on the EF family in general; 200 MHz is the spec for this specific speed grade), 1 MB program Flash with live update capability, 512 KB SRAM, 4 KB of EEPROM emulation, hardware crypto engine (NOTE: the 'G' variant family name is shared; this specific GJX SKU does not include the crypto module - the EFG100 'G' suffix denotes 'no crypto, no CAN' per distributor descriptions, while EFG100 'E' suffix denotes crypto and CAN), 12-bit 18 Msps ADC up to 48 channels, and a 9-bit or 12-bit DAC. The 100-pin TFBGA package supports up to 78 user I/O pins with extensive peripheral multiplexing.
The architecture combines a MIPS microAptiv core with a dedicated multi-port bus matrix, allowing concurrent CPU and DMA transfers to Flash, SRAM, and peripherals without bus contention. Prefetch cache and instruction cache minimize Flash wait-states at high clock rates. This design is particularly effective for graphical HMI stacks (where multiple frame buffers can stream via DMA while the CPU renders UI elements) and for networked IoT gateways that must run an RTOS plus TLS simultaneously.
Typical applications include industrial control HMIs with TFT LCD, IoT edge gateways with Ethernet and USB-HS connectivity, motor-control FOC drives leveraging the 12-bit high-speed ADC and PWM, medical patient monitoring, automotive body and infotainment subsystems, and consumer audio products that benefit from the I2S and SQI interfaces. The wide operating temperature and large memory make it suitable for RTOS-based designs running TCP/IP stacks, USB device/host stacks, and graphical frameworks.
When designing with this MCU, allocate adequate decoupling (100 nF + 4.7 uF per VDD/VBAT pin) and follow Microchip's recommended trace impedance for the Ethernet and USB differential pairs. Boot configuration straps (BOOT0/BOOT1) and the trace-disabled fuse map affect bootloader selection, and unused peripherals should be clock-gated via PMD registers to meet low-power budgets.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not consolidated on the manufacturer datasheet cover page.
直接替换替代料： PIC32MZ1024EFG100-I/GJX ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ1024EFG100-I/GJX （相同外形与封装尺寸） ——差异在于 Core Architecture, Ethernet, Package, FPU, USB.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ1024EFF100-I/GJX
✅ 直接替换✓ 有现货
$10.05 / 个
查看数据手册 →PIC32MZ1024EFE100-I/GJX
✅ 直接替换✓ 有现货
$2.78 / 个
查看数据手册 →PIC32MZ1024EFH100-I/GJX
✅ 直接替换✓ 有现货
$7.12 / 个
查看数据手册 →PIC32MZ1024EFF100T-I/GJX
✅ 直接替换✓ 有现货
$9.5 / 个
查看数据手册 →PIC32MZ1024EFE100-E/GJX
✅ 直接替换✓ 有现货
$5.38 / 个
查看数据手册 →PIC32MZ1024EFG100-E/GJX
✅ 直接替换✓ 有现货
$9.98 / 个
查看数据手册 →PIC32MZ1024EFG100-I/GJX 最大额定值与电气特性
| Core | MIPS32 microAptiv M-Class (32-bit RISC) |
| Maximum CPU Clock | 200 MHz |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Operating Voltage | 3.3 V (2.0-3.6 V) |
| 工作温度 | -40C to +85C (Industrial) |
| 封装 | 100-pin TFBGA, 7x7 mm, 1.06 mm height |
| User I/O Pins | 78 |
| Crypto Accelerator | Not present (G variant) |
| CAN Module | Not present (G variant) |
| Ethernet | 10/100 Mbps MAC with MII/RMII interface |
| USB | USB 2.0 High-Speed OTG with on-chip HS PHY |
| ADC | 12-bit, up to 18 Msps, up to 48 channels |
| DMA Channels | Up to 14 channels |
| SQI | Serial Quad Interface for external Flash/PSRAM |
| RoHS 状态 | Compliant |
PIC32MZ1024EFG100-I/GJX 100-pin tfbga, 7x7 mm, 1.06 mm height 引脚配置指南
PIC32MZ1024EFG100-I/GJX（100-pin tfbga, 7x7 mm, 1.06 mm height 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MZ1024EFG100-I/GJX.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MZ1024EFG100-I/GJX 适用于 7 应用s: Industrial HMI with TFT LCD, IoT Edge Gateway with Ethernet and USB-HS, Motor Control FOC Drive, Medical Patient Monitoring, Automotive Infotainment Sub-system, Consumer Audio Streaming Device, Industrial IoT Sensor Concentrator.
Industrial HMI with TFT LCD
The PIC32MZ1024EFG100-I/GJX is well-suited for industrial HMI panels driving TFT LCDs up to WVGA resolution. Its 200 MHz MIPS32 core with hardware FPU accelerates graphical stacks (emWin, LVGL, Microchip MPLAB Harmony) while the 512 KB SRAM holds multiple frame buffers. The dedicated Graphics Controller (GLCD) and PMP interfaces simplify display connection, and the 12-bit ADC samples touch-screen coordinates. With -40C to +85C industrial temperature range, this MCU operates reliably in factory-floor enclosures where ambient heat and electrical noise are common. Engineers typically pair it with an external SDRAM over SQI or PMP for full-screen frame buffering.
推荐
IoT Edge Gateway with Ethernet and USB-HS
The PIC32MZ1024EFG100-I/GJX integrates a 10/100 Mbps Ethernet MAC and USB 2.0 High-Speed OTG controller with on-chip HS PHY, eliminating the need for external PHY or bridge chips in IoT gateways. Combined with the 200 MHz core and 1 MB Flash, the MCU can run a TCP/IP stack (Microchip Harmony Net) plus an embedded TLS library simultaneously. The 14 DMA channels offload packet handling from the CPU, allowing sustained line-rate throughput. Engineers building Modbus/TCP to MQTT bridges or BACnet gateways benefit from this integration. Use external RMII PHY with magnetics for galvanic isolation in industrial environments.
推荐
Motor Control FOC Drive
Sensorless and sensored Field-Oriented Control (FOC) motor drives benefit from the PIC32MZ1024EFG100-I/GJX's high-resolution 12-bit ADC sampling at up to 18 Msps and its flexible PWM/OC motor-control peripherals. The 200 MHz core executes FOC math within the 10-20 us control loop budget while leaving headroom for the RTOS and CANopen stack. Hardware quadrature encoder interfaces and a dedicated MCPWM module simplify closed-loop control of PMSM, BLDC, and ACIM motors. The industrial temperature range ensures reliable operation in motor cabinets. Design tip: route ADC analog and digital grounds separately to within 2 mm of the MCU's AVSS pin for best SNR on current-sense measurements.
推荐
Medical Patient Monitoring
Medical patient monitors for vital-sign measurement (ECG, SpO2, NIBP, temperature) leverage the PIC32MZ1024EFG100-I/GJX's integrated 12-bit ADC for high-resolution signal acquisition and its USB-HS port for data upload to a host PC or tablet. The 1 MB Flash holds application code and patient data logs, while the 512 KB SRAM buffers waveform captures before compression. The industrial temperature range plus IEC 60601-1 compliance at the system level makes it suitable for bedside monitors. The hardware FPU accelerates DSP algorithms such as FIR filters and FFT for heart-rate variability analysis. Pair with external Bluetooth or Wi-Fi modules for wireless telemetry.
推荐
Automotive Infotainment Sub-system
Although the -I grade targets industrial -40C to +85C, designers can substitute the -E grade (PIC32MZ1024EFG100-E/GJX) for AEC-Q100 automotive infotainment sub-systems requiring 100-pin TFBGA footprint compatibility. The MCU handles audio routing via I2S, drives TFT LCDs for rear-seat entertainment, and supports USB device mode for media playback from USB sticks. The Ethernet MAC supports automotive AVB/TSN bridges when paired with an external PHY. The 200 MHz MIPS core runs audio codecs and graphical UI concurrently with low interrupt latency. Ensure the PCB thermal design keeps junction temperature below 125C at maximum CPU load in sealed dashboards.
推荐
Consumer Audio Streaming Device
Networked audio receivers and multi-room wireless speakers benefit from the PIC32MZ1024EFG100-I/GJX's Ethernet MAC for AirPlay/Chromecast bridging and its I2S interface for direct connection to 24-bit DACs. The hardware FPU accelerates audio DSP effects such as equalization, bass enhancement, and room correction, while the 512 KB SRAM holds sample buffers for click-free playback. USB-HS host mode supports external storage for local media. The SQI interface connects to a small QSPI Flash holding firmware updates over-the-air. The 100-pin TFBGA package fits inside compact speaker enclosures where board real estate is at a premium.
推荐
Industrial IoT Sensor Concentrator
Industrial sensor concentrators aggregating data from RS-485, Modbus, IO-Link, and 4-20 mA field devices benefit from the PIC32MZ1024EFG100-I/GJX's rich serial peripheral set: 6 UART, 4 SPI, and 4 I2C channels. The 1 MB Flash holds protocol stacks while the 512 KB SRAM buffers measurement bursts from high-speed IO-Link sensors. The Ethernet MAC uplinks aggregated data to SCADA servers via Modbus/TCP or OPC UA. The hardware crypto accelerator (in the F/H variants) secures field-bus authentication. The industrial temperature range plus on-chip ADC for analog 4-20 mA measurements reduces the external component count.
推荐
推荐产品汇总
工程参考数据： PIC32MZ1024EFG100-I/GJX ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ1024EFF100-I/GJX | PIC32MZ1024EFE100-I/GJX | PIC32MZ1024EFH100-I/GJX |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (7x7 mm) | 100-pin TFBGA (7x7 mm) - same | 100-pin TFBGA (7x7 mm) - same | 100-pin TFBGA (7x7 mm) - same |
| Core | MIPS32 microAptiv M-Class, 200 MHz | MIPS32 microAptiv M-Class, 200 MHz | MIPS32 microAptiv M-Class, 200 MHz | MIPS32 microAptiv M-Class, 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB |
| Crypto Accelerator | No | Yes | Yes | Yes |
| CAN-FD | No | Yes | Yes | Yes |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| USB | USB 2.0 HS OTG with on-chip PHY | USB 2.0 HS OTG with on-chip PHY | USB 2.0 HS OTG with on-chip PHY | USB 2.0 HS OTG with on-chip PHY |
关键差异点
- Drop-in variant with hardware crypto and CAN-FD at no silicon difference （对比 PIC32MZ1024EFF100-I/GJX)
- Highest MIPS performance per watt in PIC32 portfolio （对比 PIC32MX795F512L-80I/PF)
- Compact 100-pin TFBGA (7x7 mm) for space-constrained designs （对比 PIC32MZ1024EFG100-I/PF)
设计说明
Estimated power budget at 200 MHz with full peripheral activity: VDD current approximately 80-100 mA. Use at least one 4.7 uF bulk decoupling capacitor plus a 100 nF ceramic on each VDD/VBAT pin pair, placed within 3 mm of the BGA balls. AVSS analog ground should be tied to digital ground at a single point near the MCU's AVSS pin to avoid ground-loop noise coupling into the 12-bit ADC.
Estimated junction temperature rise: with 100 mA at 3.3 V (0.33 W dissipation) and a typical 100-pin TFBGA theta_JA of approximately 30 C/W on a 4-layer JEDEC test board, junction temperature rises about 10C above ambient. In a sealed enclosure with no airflow, ambient can climb 20-30C above room temperature. For continuous high-CPU-load applications inside enclosures, monitor junction temperature via the on-chip die-temp diode and reduce clock to 150 MHz if it approaches 100C.
The 100-pin TFBGA (7x7 mm, 0.65 mm pitch, 1.06 mm height) requires 4-layer PCB design with 0.4 mm laser-drilled microvias and via-in-pad for full BGA escape. Fanout via trace width 0.1 mm with 0.1 mm clearance is typical. Follow IPC-7351 and Microchip's package specification document for land pattern dimensions. Leave a continuous ground plane under the BGA to provide a low-impedance return path for high-speed signals.
Do not omit the 32.768 kHz external crystal on SOSC pins - it is required for the RTCC (Real-Time Clock/Calendar) module and for low-power Sleep mode wake-up timing. Do not leave unused analog pins floating; tie them to AVSS through 10 kohm resistors to prevent ADC channel cross-talk. The BOOT0/BOOT1 strap pins must be pulled to defined logic levels at reset (typically via 10 kohm pull-up/down) to select the correct boot source.
Route the USB DP/DM differential pair with 90-ohm differential impedance, matched length within 150 mil, and a continuous ground reference plane beneath. Route the Ethernet RMII signals (50 MHz REF_CLK + 8 data/control) as length-matched traces within 50 mil. Place the 24 MHz crystal within 5 mm of the OSC1/OSC2 pins and guard the traces with a ground pour to minimize EMI pickup.
合规信息
RoHS and REACH compliant per Microchip product page. The -I grade is industrial temperature -40C to +85C and is NOT AEC-Q100 qualified; for automotive AEC-Q100 grade, choose the -E suffix variant such as PIC32MZ1024EFG100-E/GJX. Lead-free and halogen-free per Microchip environmental compliance datasheet.
