PIC32MZ1024EFG100-I/GJX - 200MHz 32-bit MCU, 1MB Flash | Microchip
Référence : PIC32MZ1024EFG100-I/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.75 | $18,75 |
| 10 | $17.1 | $171,00 |
| 100 | $15.3 | $1 530,00 |
| 500 | $13.85 | $6 925,00 |
| 1 000 | $12.5 | $12 500,00 |
PIC32MZ1024EFG100-I/GJX Présentation
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one silicon die. Within the broader semiconductor hierarchy, an MCU belongs to the embedded processor category, which also includes DSPs, FPGAs with embedded cores, and microprocessors. The PIC32MZ EF family sits in the upper-performance tier of Microchip's PIC32 portfolio, distinguished from the PIC32MX series by an out-of-order superscalar CPU pipeline, higher clock rates, larger memory, and integrated connectivity peripherals such as 10/100 Ethernet and USB 2.0 High-Speed with embedded PHY.
Key features of the PIC32MZ1024EFG100-I/GJX include 200 MHz core speed (252 MHz on the EF family in general; 200 MHz is the spec for this specific speed grade), 1 MB program Flash with live update capability, 512 KB SRAM, 4 KB of EEPROM emulation, hardware crypto engine (NOTE: the 'G' variant family name is shared; this specific GJX SKU does not include the crypto module - the EFG100 'G' suffix denotes 'no crypto, no CAN' per distributor descriptions, while EFG100 'E' suffix denotes crypto and CAN), 12-bit 18 Msps ADC up to 48 channels, and a 9-bit or 12-bit DAC. The 100-pin TFBGA package supports up to 78 user I/O pins with extensive peripheral multiplexing.
The architecture combines a MIPS microAptiv core with a dedicated multi-port bus matrix, allowing concurrent CPU and DMA transfers to Flash, SRAM, and peripherals without bus contention. Prefetch cache and instruction cache minimize Flash wait-states at high clock rates. This design is particularly effective for graphical HMI stacks (where multiple frame buffers can stream via DMA while the CPU renders UI elements) and for networked IoT gateways that must run an RTOS plus TLS simultaneously.
Typical applications include industrial control HMIs with TFT LCD, IoT edge gateways with Ethernet and USB-HS connectivity, motor-control FOC drives leveraging the 12-bit high-speed ADC and PWM, medical patient monitoring, automotive body and infotainment subsystems, and consumer audio products that benefit from the I2S and SQI interfaces. The wide operating temperature and large memory make it suitable for RTOS-based designs running TCP/IP stacks, USB device/host stacks, and graphical frameworks.
When designing with this MCU, allocate adequate decoupling (100 nF + 4.7 uF per VDD/VBAT pin) and follow Microchip's recommended trace impedance for the Ethernet and USB differential pairs. Boot configuration straps (BOOT0/BOOT1) and the trace-disabled fuse map affect bootloader selection, and unused peripherals should be clock-gated via PMD registers to meet low-power budgets.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not consolidated on the manufacturer datasheet cover page.
Alternatives de remplacement direct pour PIC32MZ1024EFG100-I/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFG100-I/GJX (même facteur de forme et même empreinte) — différant par Core Architecture, Ethernet, Package, FPU, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFF100-I/GJX
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Voir la fiche technique →PIC32MZ1024EFE100-I/GJX
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Voir la fiche technique →PIC32MZ1024EFH100-I/GJX
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Voir la fiche technique →PIC32MZ1024EFF100T-I/GJX
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Voir la fiche technique →PIC32MZ1024EFE100-E/GJX
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Voir la fiche technique →PIC32MZ1024EFG100-E/GJX
✅ Remplacement direct✓ En stock
$9.98 / unité
Voir la fiche technique →PIC32MZ1024EFG100-I/GJX Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv M-Class (32-bit RISC) |
| Maximum CPU Clock | 200 MHz |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Operating Voltage | 3.3 V (2.0-3.6 V) |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 100-pin TFBGA, 7x7 mm, 1.06 mm height |
| User I/O Pins | 78 |
| Crypto Accelerator | Not present (G variant) |
| CAN Module | Not present (G variant) |
| Ethernet | 10/100 Mbps MAC with MII/RMII interface |
| USB | USB 2.0 High-Speed OTG with on-chip HS PHY |
| ADC | 12-bit, up to 18 Msps, up to 48 channels |
| DMA Channels | Up to 14 channels |
| SQI | Serial Quad Interface for external Flash/PSRAM |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ1024EFG100-I/GJX 100-pin tfbga, 7x7 mm, 1.06 mm height
Configuration des broches du PIC32MZ1024EFG100-I/GJX (boîtier 100-pin tfbga, 7x7 mm, 1.06 mm height). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1024EFG100-I/GJX.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1024EFG100-I/GJX convient pour 7 applications: Industrial HMI with TFT LCD, IoT Edge Gateway with Ethernet and USB-HS, Motor Control FOC Drive, Medical Patient Monitoring, Automotive Infotainment Sub-system, Consumer Audio Streaming Device, Industrial IoT Sensor Concentrator.
Industrial HMI with TFT LCD
The PIC32MZ1024EFG100-I/GJX is well-suited for industrial HMI panels driving TFT LCDs up to WVGA resolution. Its 200 MHz MIPS32 core with hardware FPU accelerates graphical stacks (emWin, LVGL, Microchip MPLAB Harmony) while the 512 KB SRAM holds multiple frame buffers. The dedicated Graphics Controller (GLCD) and PMP interfaces simplify display connection, and the 12-bit ADC samples touch-screen coordinates. With -40C to +85C industrial temperature range, this MCU operates reliably in factory-floor enclosures where ambient heat and electrical noise are common. Engineers typically pair it with an external SDRAM over SQI or PMP for full-screen frame buffering.
Recommandé
IoT Edge Gateway with Ethernet and USB-HS
The PIC32MZ1024EFG100-I/GJX integrates a 10/100 Mbps Ethernet MAC and USB 2.0 High-Speed OTG controller with on-chip HS PHY, eliminating the need for external PHY or bridge chips in IoT gateways. Combined with the 200 MHz core and 1 MB Flash, the MCU can run a TCP/IP stack (Microchip Harmony Net) plus an embedded TLS library simultaneously. The 14 DMA channels offload packet handling from the CPU, allowing sustained line-rate throughput. Engineers building Modbus/TCP to MQTT bridges or BACnet gateways benefit from this integration. Use external RMII PHY with magnetics for galvanic isolation in industrial environments.
Recommandé
Motor Control FOC Drive
Sensorless and sensored Field-Oriented Control (FOC) motor drives benefit from the PIC32MZ1024EFG100-I/GJX's high-resolution 12-bit ADC sampling at up to 18 Msps and its flexible PWM/OC motor-control peripherals. The 200 MHz core executes FOC math within the 10-20 us control loop budget while leaving headroom for the RTOS and CANopen stack. Hardware quadrature encoder interfaces and a dedicated MCPWM module simplify closed-loop control of PMSM, BLDC, and ACIM motors. The industrial temperature range ensures reliable operation in motor cabinets. Design tip: route ADC analog and digital grounds separately to within 2 mm of the MCU's AVSS pin for best SNR on current-sense measurements.
Recommandé
Medical Patient Monitoring
Medical patient monitors for vital-sign measurement (ECG, SpO2, NIBP, temperature) leverage the PIC32MZ1024EFG100-I/GJX's integrated 12-bit ADC for high-resolution signal acquisition and its USB-HS port for data upload to a host PC or tablet. The 1 MB Flash holds application code and patient data logs, while the 512 KB SRAM buffers waveform captures before compression. The industrial temperature range plus IEC 60601-1 compliance at the system level makes it suitable for bedside monitors. The hardware FPU accelerates DSP algorithms such as FIR filters and FFT for heart-rate variability analysis. Pair with external Bluetooth or Wi-Fi modules for wireless telemetry.
Recommandé
Automotive Infotainment Sub-system
Although the -I grade targets industrial -40C to +85C, designers can substitute the -E grade (PIC32MZ1024EFG100-E/GJX) for AEC-Q100 automotive infotainment sub-systems requiring 100-pin TFBGA footprint compatibility. The MCU handles audio routing via I2S, drives TFT LCDs for rear-seat entertainment, and supports USB device mode for media playback from USB sticks. The Ethernet MAC supports automotive AVB/TSN bridges when paired with an external PHY. The 200 MHz MIPS core runs audio codecs and graphical UI concurrently with low interrupt latency. Ensure the PCB thermal design keeps junction temperature below 125C at maximum CPU load in sealed dashboards.
Recommandé
Consumer Audio Streaming Device
Networked audio receivers and multi-room wireless speakers benefit from the PIC32MZ1024EFG100-I/GJX's Ethernet MAC for AirPlay/Chromecast bridging and its I2S interface for direct connection to 24-bit DACs. The hardware FPU accelerates audio DSP effects such as equalization, bass enhancement, and room correction, while the 512 KB SRAM holds sample buffers for click-free playback. USB-HS host mode supports external storage for local media. The SQI interface connects to a small QSPI Flash holding firmware updates over-the-air. The 100-pin TFBGA package fits inside compact speaker enclosures where board real estate is at a premium.
Recommandé
Industrial IoT Sensor Concentrator
Industrial sensor concentrators aggregating data from RS-485, Modbus, IO-Link, and 4-20 mA field devices benefit from the PIC32MZ1024EFG100-I/GJX's rich serial peripheral set: 6 UART, 4 SPI, and 4 I2C channels. The 1 MB Flash holds protocol stacks while the 512 KB SRAM buffers measurement bursts from high-speed IO-Link sensors. The Ethernet MAC uplinks aggregated data to SCADA servers via Modbus/TCP or OPC UA. The hardware crypto accelerator (in the F/H variants) secures field-bus authentication. The industrial temperature range plus on-chip ADC for analog 4-20 mA measurements reduces the external component count.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFG100-I/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFF100-I/GJX | PIC32MZ1024EFE100-I/GJX | PIC32MZ1024EFH100-I/GJX |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TFBGA (7x7 mm) | 100-pin TFBGA (7x7 mm) - same | 100-pin TFBGA (7x7 mm) - same | 100-pin TFBGA (7x7 mm) - same |
| Core | MIPS32 microAptiv M-Class, 200 MHz | MIPS32 microAptiv M-Class, 200 MHz | MIPS32 microAptiv M-Class, 200 MHz | MIPS32 microAptiv M-Class, 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB |
| Crypto Accelerator | No | Yes | Yes | Yes |
| CAN-FD | No | Yes | Yes | Yes |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| USB | USB 2.0 HS OTG with on-chip PHY | USB 2.0 HS OTG with on-chip PHY | USB 2.0 HS OTG with on-chip PHY | USB 2.0 HS OTG with on-chip PHY |
Principaux différenciateurs
- Drop-in variant with hardware crypto and CAN-FD at no silicon difference (vs PIC32MZ1024EFF100-I/GJX)
- Highest MIPS performance per watt in PIC32 portfolio (vs PIC32MX795F512L-80I/PF)
- Compact 100-pin TFBGA (7x7 mm) for space-constrained designs (vs PIC32MZ1024EFG100-I/PF)
Notes de conception
Estimated power budget at 200 MHz with full peripheral activity: VDD current approximately 80-100 mA. Use at least one 4.7 uF bulk decoupling capacitor plus a 100 nF ceramic on each VDD/VBAT pin pair, placed within 3 mm of the BGA balls. AVSS analog ground should be tied to digital ground at a single point near the MCU's AVSS pin to avoid ground-loop noise coupling into the 12-bit ADC.
Estimated junction temperature rise: with 100 mA at 3.3 V (0.33 W dissipation) and a typical 100-pin TFBGA theta_JA of approximately 30 C/W on a 4-layer JEDEC test board, junction temperature rises about 10C above ambient. In a sealed enclosure with no airflow, ambient can climb 20-30C above room temperature. For continuous high-CPU-load applications inside enclosures, monitor junction temperature via the on-chip die-temp diode and reduce clock to 150 MHz if it approaches 100C.
The 100-pin TFBGA (7x7 mm, 0.65 mm pitch, 1.06 mm height) requires 4-layer PCB design with 0.4 mm laser-drilled microvias and via-in-pad for full BGA escape. Fanout via trace width 0.1 mm with 0.1 mm clearance is typical. Follow IPC-7351 and Microchip's package specification document for land pattern dimensions. Leave a continuous ground plane under the BGA to provide a low-impedance return path for high-speed signals.
Do not omit the 32.768 kHz external crystal on SOSC pins - it is required for the RTCC (Real-Time Clock/Calendar) module and for low-power Sleep mode wake-up timing. Do not leave unused analog pins floating; tie them to AVSS through 10 kohm resistors to prevent ADC channel cross-talk. The BOOT0/BOOT1 strap pins must be pulled to defined logic levels at reset (typically via 10 kohm pull-up/down) to select the correct boot source.
Route the USB DP/DM differential pair with 90-ohm differential impedance, matched length within 150 mil, and a continuous ground reference plane beneath. Route the Ethernet RMII signals (50 MHz REF_CLK + 8 data/control) as length-matched traces within 50 mil. Place the 24 MHz crystal within 5 mm of the OSC1/OSC2 pins and guard the traces with a ground pour to minimize EMI pickup.
Informations de conformité
RoHS and REACH compliant per Microchip product page. The -I grade is industrial temperature -40C to +85C and is NOT AEC-Q100 qualified; for automotive AEC-Q100 grade, choose the -E suffix variant such as PIC32MZ1024EFG100-E/GJX. Lead-free and halogen-free per Microchip environmental compliance datasheet.
