PIC32MZ1024EFM124-I/TL - 200MHz 32-bit MCU, 1MB Flash, 124-VTLA | Microchip
料号： PIC32MZ1024EFM124-I/TL ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12.85 | $12.85 |
| 10 | $11.62 | $116.20 |
| 100 | $10.4 | $1,040.00 |
| 500 | $9.18 | $4,590.00 |
| 1,000 | $8.05 | $8,050.00 |
PIC32MZ1024EFM124-I/TL 概述
A 32-bit MCU (microcontroller unit) is an integrated circuit that combines a processor core, program memory, data memory, and a rich set of programmable peripherals on a single die. The PIC32MZ EF family targets connectivity applications across industrial, IoT, graphics/HMI, and motor-control segments, with the M-class MIPS core providing deterministic real-time performance, 252 MHz peak operation, hardware multiply-accumulate, and DSP extensions for signal-processing workloads.
Key features include 1 MB of Flash with ECC, 512 KB of SRAM, a 12-bit 18 MSPS ADC, USB 2.0 high-speed PHY, two CAN 2.0B controllers, Ethernet MAC with RMII/MII interfaces, multiple SPI/I2C/UART peripherals, and a 4-lane 16-bit parallel master port for graphics. The integrated FPU speeds floating-point math, while the crypto engine (in selected variants) accelerates AES/SHA operations.
Architecturally, the device combines the MIPS microAptiv core with a 5-stage pipeline, dual-bank Flash for live updates, and an extensive peripheral set mapped through Microchip's Harmony peripheral library. The 124-VTLA package exposes the full peripheral count and provides an exposed thermal pad for improved heat dissipation at 200 MHz operation.
Typical applications include industrial automation controllers, automotive infotainment/HMI, IoT edge gateways with Ethernet, motor control FOCs, and graphical touch-screen interfaces. The PIC32MZ EF family supports the MPLAB Harmony 3 framework for rapid firmware development.
When designing, ensure the 124-VTLA pad layout includes thermal vias under the exposed pad and that decoupling capacitors are placed within 3 mm of each supply pin. Programming and debugging use the standard 4-wire ICSP interface with PGECx/PGEDx pin pairs.
This page synthesizes distributor pricing, drop-in alternatives within the PIC32MZ EF family, application guidance, and practical design notes not consolidated in any single manufacturer or distributor page.
直接替换替代料： PIC32MZ1024EFM124-I/TL ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ1024EFM124-I/TL （相同外形与封装尺寸） ——差异在于 Core Architecture, ADC, Package, USB, FPU.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ1024EFH124-I/TL
✅ 直接替换✓ 有现货
$8.21 / 个
查看数据手册 →PIC32MZ1024EFE124-I/TL
✅ 直接替换✓ 有现货
$9.4 / 个
查看数据手册 →PIC32MZ1024EFF124T-I/TL
✅ 直接替换✓ 有现货
$7.45 / 个
查看数据手册 →PIC32MZ1024ECM124-I/TL
✅ 直接替换✓ 有现货
$7.85 / 个
查看数据手册 →PIC32MZ1024ECH124-I/TL
✅ 直接替换✓ 有现货
$9.3 / 个
查看数据手册 →PIC32MZ1024EFM124-E/TL
✅ 直接替换✓ 有现货
$9.45 / 个
查看数据手册 →PIC32MZ1024EFM124-I/TL 最大额定值与电气特性
| Core Architecture | MIPS32 M-Class (microAptiv) |
| Core Width | 32-bit |
| Maximum CPU Frequency | 200 MHz |
| Family Peak Frequency | 252 MHz (family-wide) |
| Program Memory (Flash) | 1 MB (1M x 8) with ECC |
| Data Memory (SRAM) | 512 KB |
| Operating Voltage Range | 2.7 V to 3.6 V |
| 封装 | 124-pin VTLA (9x9 mm) |
| 安装类型 | Surface Mount |
| 工作温度范围 | -40C to +85C (Industrial) |
| ADC | 12-bit, 18 MSPS |
| USB | USB 2.0 High-Speed PHY (embedded) |
| CAN | 2x CAN 2.0B |
| Ethernet | 10/100 MAC with RMII/MII |
| FPU | Yes (single/double precision) |
| DSP Extensions | Yes |
| RoHS 状态 | Compliant |
PIC32MZ1024EFM124-I/TL 124-pin vtla (9x9 mm) 引脚配置指南
PIC32MZ1024EFM124-I/TL（124-pin vtla (9x9 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MZ1024EFM124-I/TL.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MZ1024EFM124-I/TL 适用于 7 应用s: Industrial Automation Controllers, IoT Edge Gateways with Ethernet, Graphics HMI with Touch Screen, Motor Control and FOC Drives, Automotive Infotainment Connectivity, Audio Processing and DSP, Medical Device Controllers.
Industrial Automation Controllers
The PIC32MZ1024EFM124-I/TL fits industrial PLC and process-control applications where deterministic real-time response, robust peripherals, and 200 MHz headroom matter. Its MIPS M-class core with hardware FPU executes PID loops, floating-point signal conditioning, and modbus/ethernet-IP communications with predictable latency. The 12-bit 18 MSPS ADC samples analog sensors at high rate, while dual CAN 2.0B interfaces connect to industrial sensor networks and motor drives. The 1 MB Flash with ECC stores large control firmware plus data logging, and the 512 KB SRAM supports multi-protocol stacks simultaneously. The wide -40C to +85C industrial temperature range suits factory-floor enclosures without derating. Integrated Ethernet MAC simplifies adding industrial Ethernet or EtherCAT slave capability through external PHYs, reducing BOM and PCB area versus discrete solutions.
推荐
IoT Edge Gateways with Ethernet
For IoT edge gateways requiring both wired Ethernet backhaul and rich local processing, the PIC32MZ1024EFM124-I/TL delivers 200 MHz of MIPS performance, 1 MB Flash for protocol stacks (MQTT, HTTP, TLS), and 512 KB SRAM for buffers. The integrated 10/100 MAC with RMII/MII interface pairs directly with a low-cost PHY such as KSZ8061, eliminating external Ethernet chips. The USB 2.0 High-Speed PHY on-chip allows local Wi-Fi/BLE dongle connectivity or USB host functionality without external ULPI bridges. The hardware crypto engine (on related EFH variants) and DSP extensions accelerate AES and TLS handshake operations critical for secure cloud connectivity. Combined with low-power sleep modes and the industrial temperature range, this MCU is suited for harsh-environment edge gateways in factory automation, smart agriculture, and remote telemetry deployments.
推荐
Graphics HMI with Touch Screen
The PIC32MZ1024EFM124-I/TL drives 16-bit color QVGA/WQVGA TFT displays through its integrated parallel master port (PMP/EPMP), making it an excellent HMI controller for industrial panels, smart appliances, and medical device interfaces. The 200 MHz MIPS core with FPU accelerates graphics rendering, anti-aliased fonts, and touch gesture processing without external graphics controllers. The 512 KB SRAM holds full framebuffers for common QVGA resolutions, while 1 MB Flash stores multiple language UI assets, icons, and bitmap fonts. The on-chip USB 2.0 HS PHY enables host-mode connectivity to external touch-screen controllers or USB peripherals. Compared to PIC32MX predecessors, the EFM124 doubles CPU performance and quadruples RAM, enabling smoother animations and richer HMI without BOM inflation.
推荐
Motor Control and FOC Drives
Although the PIC32MZ1024EFM124-I/TL is the general-purpose EF variant, the same 124-VTLA platform is motor-control capable when paired with external gate drivers and a high-resolution ADC sampling scheme. The 12-bit 18 MSPS ADC samples three-phase motor currents simultaneously, while the MIPS core with DSP extensions computes field-oriented control (FOC) and space-vector PWM modulation at update rates above 20 kHz. The dual CAN 2.0B interfaces connect to multi-axis drive networks, and the Ethernet MAC supports industrial EtherCAT slave implementations. For applications requiring dedicated motor-control peripherals (high-resolution PWM, QEI, analog comparators), the drop-in compatible PIC32MZ1024ECM124-I/TL provides integrated peripherals without PCB rework, sharing identical 124-VTLA footprint and pinout for migration.
推荐
Automotive Infotainment Connectivity
The PIC32MZ1024EFM124-I/TL serves automotive infotainment and connectivity applications requiring USB host/device, Ethernet AVB, and CAN bus interfaces simultaneously. The integrated USB 2.0 High-Speed PHY supports CarPlay/AndroidAuto bridge implementations, while dual CAN 2.0B controllers interface with vehicle body and powertrain networks. The 200 MHz MIPS core handles audio decoding, Bluetooth HCI routing, and display compositor tasks. For AEC-Q100 qualified designs, the drop-in compatible PIC32MZ1024EFM124-E/TL extended-temperature variant (-40C to +125C, 180 MHz) provides automotive-grade qualification on the same VTLA-124 footprint. The large 1 MB Flash accommodates complex connectivity stacks, and 512 KB SRAM supports audio buffering for hands-free and media playback.
推荐
Audio Processing and DSP
The PIC32MZ1024EFM124-I/TL leverages its hardware FPU and DSP extensions to execute audio processing algorithms including FIR/IIR filters, FFT, codecs, and noise suppression at sample rates up to 48 kHz. The 200 MHz MIPS core delivers 200 MIPS of integer performance plus 250 MFLOPS floating-point, sufficient for multi-channel audio mixing and parametric equalization. The 12-bit ADC interfaces with MEMS microphones, while I2S peripherals connect to external audio codecs. The 512 KB SRAM supports audio frame buffers and delay-line effects without external memory. Compared to software-only DSP implementations on smaller PIC32MX parts, the EFM124 provides deterministic real-time response with the MIPS M-class core's predictable interrupt latency, making it suited for pro-audio, hearing-aid, and conference-system designs.
推荐
Medical Device Controllers
Medical device controllers benefit from the PIC32MZ1024EFM124-I/TL's hardware ECC on Flash, deterministic MIPS core, and rich analog peripherals. The 12-bit 18 MSPS ADC samples biosensor signals (ECG, SpO2, temperature) with sufficient resolution for diagnostic-grade equipment. The 200 MHz core executes DSP filters and feature extraction algorithms in real time. Hardware crypto acceleration (on EFH variants) supports secure patient-data transmission. The industrial -40C to +85C temperature range suits clinical environments. The 1 MB Flash with ECC provides reliable firmware storage critical for FDA-regulated devices. Although not FDA-cleared as a component, the EFM124's documentation quality, MPLAB Harmony 3 certification evidence support, and long-term Microchip product longevity commitment make it a strong platform choice for medical device OEMs.
推荐
推荐产品汇总
工程参考数据： PIC32MZ1024EFM124-I/TL ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ1024EFH124-I/TL | PIC32MZ1024EFE124-I/TL | PIC32MZ1024ECM124-I/TL | PIC32MZ1024EFM124-E/TL |
|---|---|---|---|---|---|
| Package | 124-VTLA (9x9) | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 180 MHz (-10%) |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) |
| USB 2.0 HS PHY | Yes (integrated) | Yes | No | Yes | Yes |
| Ethernet MAC | Yes (10/100 RMII/MII) | Yes | No | Yes | Yes |
| Crypto Engine | No | Yes (AES/SHA/RNG) | No | No | No |
| Motor-Control Peripherals | Standard peripherals | Standard | Standard | Yes (PWM/QEI/CMP) | Standard |
关键差异点
- On-chip USB 2.0 High-Speed PHY plus Ethernet MAC （对比 PIC32MZ1024EFE124-I/TL)
- Highest frequency in the PIC32MZ EF 124-VTLA family （对比 PIC32MZ1024EFM124-E/TL)
- Full peripheral set with FPU + DSP extensions （对比 PIC32MZ1024EFE124-I/TL)
设计说明
Estimated: At 200 MHz with 3.3 V core supply, the PIC32MZ1024EFM124-I/TL draws up to approximately 250 mA (estimated from PIC32MZ EF family typical power benchmarks). The 124-VTLA package exposes a thermal pad on the bottom that must be soldered to a PCB copper pour with thermal vias for heat dissipation. A minimum 25x25 mm copper area on top and bottom layers with 9 thermal vias (0.3 mm drill, 1 mm pitch) keeps junction temperature within the 85C industrial limit at full load. Without proper thermal pad soldering, the device may throttle or trigger thermal shutdown under continuous DSP workloads.
Use a dedicated 3.3 V LDO (such as Microchip MCP1700 or LM1117) for the MCU core supply, isolated from analog rails. Place a 10 uF tantalum or ceramic bulk capacitor plus 0.1 uF decoupling cap within 3 mm of each VDD/VDDIO pin pair. The analog AVDD pin requires additional filtering (10 ohm + 10 uF) to reject digital switching noise that would otherwise couple into the 12-bit ADC. Estimated: total decoupling requires at least 8-10 capacitor placements around the package perimeter.
The 124-VTLA package (9x9 mm) has a 0.5 mm pitch with a central exposed thermal pad. Use 4-layer PCB with continuous ground plane beneath the device to provide both thermal spreading and signal reference. Route high-speed USB 2.0 HS differential pair (DP/DM) with 90 ohm differential impedance and length matching within 150 mils. The Ethernet RMII signals to external PHY should be length-matched within 50 mils and kept under 50 mm total length to avoid signal integrity issues at 50 MHz.
Place the 12 MHz external crystal or oscillator within 5 mm of the OSC1/OSC2 pins, with a ground guard ring around the traces to isolate from switching noise. The ICSP programming pins (PGECx/PGEDx) must be accessible for in-circuit programming; route them to a header or test pad even if programming is via bootloader. Keep the parallel master port (PMP) data/control traces short and length-matched if used for graphics, with series damping resistors (22-33 ohm) near the MCU to control edge rates.
Do not operate PIC32MZ1024EFM124-I/TL above 200 MHz without confirming the PLL configuration matches the crystal; mismatched PLL settings cause unstable operation. Ensure the ENVREG pin is tied correctly for internal voltage regulator operation. The TRCLK/TRACE pins must be left floating or grounded if trace debug is unused. Avoid routing high-frequency signals (USB, Ethernet) over gaps in the ground plane, which creates EMI radiation and signal integrity issues. Finally, do not exceed 3.6 V on any VDD pin or latch-up may occur.
合规信息
RoHS and REACH compliant per Microchip product page. The PIC32MZ1024EFM124-I/TL is industrial-grade (-40C to +85C) and is NOT AEC-Q100 qualified; choose the -E/TL extended-temperature variant for AEC-Q100 automotive applications.