PIC32MZ1024ECG124T-I/TL - 200MHz 1MB Flash MCU | Microchip
料号： PIC32MZ1024ECG124T-I/TL ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.2 | $132.00 |
| 100 | $11.85 | $1,185.00 |
| 500 | $10.55 | $5,275.00 |
| 1,000 | $9.4 | $9,400.00 |
PIC32MZ1024ECG124T-I/TL 概述
What is a PIC32MZ microcontroller? PIC32MZ is Microchip's high-performance 32-bit MCU family based on the MIPS32 microAptiv core, succeeding the PIC32MX series. It sits in the hierarchy: 32-bit MCU -> MIPS architecture -> PIC32MZ family -> Embedded Connectivity (EC) sub-family. The EC line differentiates itself from the EF (Enhanced Floating-point) and EK (Ethernet + crypto) variants by combining Ethernet, USB, CAN, and a rich peripheral mix without on-chip crypto acceleration or the EF family's higher 252 MHz clock.
Key features include 1 MB Flash and 512 KB SRAM, an integrated 10/100 Ethernet MAC, USB 2.0 High-Speed OTG, two CAN 2.0b modules, six UART, four SPI, and four I2C peripherals. The 200 MHz core delivers 330 DMIPS / 831 CoreMark performance, and the part offers up to 97 programmable I/O lines with multiple 5V-tolerant inputs. Hardware crypto acceleration is absent on the EC line - designs requiring AES/SHA should select the EK variant.
Architecturally, the device integrates a FPU-less MIPS32 microAptiv core with a 5-stage pipeline, 16 KB I-cache, 4 KB D-cache, and tightly-coupled prefetch buffer. The 32-channel DMA controller and 9 input-capture/output-compare PWM timers make it well suited for time-deterministic control loops. The 124-pin VTLA package is a thermally-enhanced bottom-thermal-pad LGA-style land-grid package.
Typical applications include industrial Ethernet gateways, building automation controllers, USB/CAN-connected sensor hubs, low-end HMI panels, and graphical display terminals. Designers who need floating-point performance should evaluate PIC32MZ EF parts instead. The wide operating temperature range of -40C to +85C (industrial) supports deployment in factory and outdoor enclosures.
A key design consideration is the VTLA package's exposed thermal pad - it MUST be soldered to a top-layer copper pour of at least 25 mm squared to keep junction temperatures within spec under sustained CPU load. The 124-pin LGA-style land pattern requires precise stencil design; NSMD pads with 0.4 mm pitch are recommended.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet - giving engineers a one-stop reference for the PIC32MZ1024ECG124T-I/TL.
直接替换替代料： PIC32MZ1024ECG124T-I/TL ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ1024ECG124T-I/TL （相同外形与封装尺寸） ——差异在于 Core Architecture, Package, Mounting Type, ADC, Ethernet.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ1024ECK124T-I/TL
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1024EFK124T-I/TL
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1024ECG124-I/TL
✅ 直接替换✓ 有现货
$11.85 / 个
查看数据手册 →PIC32MZ1024ECG124T-E/TL
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1024EFG124T-I/TL
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1024ECG100T-I/PF
✅ 直接替换✓ 有现货
$6.75 / 个
查看数据手册 →PIC32MZ1024ECG124T-I/TL 最大额定值与电气特性
| Core Architecture | MIPS32 microAptiv (PIC32) |
| CPU Bit Width | 32-bit |
| Maximum CPU Frequency | 200 MHz |
| Flash Program Memory | 1 MB (1024 KB) |
| SRAM | 512 KB |
| 封装 | 124-pin VTLA (9x9 mm) |
| 引脚数量 | 124 |
| Programmable I/O Pins | 97 |
| Ethernet | 10/100 MAC (integrated, requires external PHY) |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2x CAN 2.0b |
| UART | 6 |
| SPI | 4 |
| I2C | 4 |
| DMA Channels | 32 |
| 工作温度范围 | -40C to +85C (industrial) |
| 安装类型 | Surface Mount (LGA-style land grid) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| MSL 等级 | 3 (168 hours) |
PIC32MZ1024ECG124T-I/TL 124-pin vtla (9x9 mm) 引脚配置指南
PIC32MZ1024ECG124T-I/TL（124-pin vtla (9x9 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MZ1024ECG124T-I/TL.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MZ1024ECG124T-I/TL 适用于 6 应用s: Industrial Ethernet Gateway, Building Automation Controller, USB Connected Sensor Hub, Low-End HMI / Display Terminal, Motor Control Front-End, IoT Edge Gateway with Ethernet.
Industrial Ethernet Gateway
The PIC32MZ1024ECG124T-I/TL fits industrial Ethernet gateways because it integrates a 10/100 MAC plus 1 MB Flash and 512 KB SRAM, enough headroom for TCP/IP, TLS, and Modbus TCP stacks. The 200 MHz MIPS32 microAptiv core delivers 330 DMIPS / 831 CoreMark, keeping wire-speed packet processing achievable. At 24 MHz system tick with DMA-driven MAC, the CPU stays available for application logic. The 124-pin VTLA footprint offers 97 I/O lines, sufficient for RS-485, RS-232, and digital inputs.
推荐
Building Automation Controller
The PIC32MZ1024ECG124T-I/TL supports BACnet MS/TP, KNX, or DALI gateways with its dual CAN 2.0b controllers, six UARTs, and ample Flash for protocol stacks. The 1 MB Flash accommodates both BACnet and Modbus stacks simultaneously, while 512 KB SRAM buffers protocol transactions without overflow. Industrial temperature grade (-40C to +85C) covers unheated equipment rooms. Designers can later migrate firmware to PIC32MZ EF or EK variants in the same VTLA-124 footprint for higher CPU throughput.
推荐
USB Connected Sensor Hub
USB 2.0 High-Speed OTG on the PIC32MZ1024ECG124T-I/TL enables it to act as a USB device or host, ideal for industrial sensor hubs interfacing to a PC or embedded host. The 200 MHz MIPS core plus 32-channel DMA handles bulk and interrupt USB transfers without CPU intervention. 1 MB Flash stores USB class drivers (CDC, HID, vendor), and 512 KB SRAM buffers data before forwarding over Ethernet or CAN. The part runs Microchip's MPLAB Harmony USB stack with proven driver support.
推荐
Low-End HMI / Display Terminal
The PIC32MZ1024ECG124T-I/TL serves as the host MCU for low-resolution color LCD panels driven over parallel PMP or SPI, with the 200 MHz core and 512 KB SRAM supporting emWin or Microchip Harmony graphics libraries. USB HID (touch input) and CAN (panel network) are easily multiplexed through the rich peripheral set. Designers building displays up to 4.3 inch can rely on this part without an external graphics controller. Migrating to PIC32MZ EF parts in the same 124-VTLA package doubles CPU throughput for higher-resolution panels.
推荐
Motor Control Front-End
PWM-rich motor control front-ends benefit from the PIC32MZ1024ECG124T-I/TL's nine input-capture/output-compare timers plus 32-channel DMA. Designers can drive a BLDC or PMSM with FOC algorithm, plus simultaneous Ethernet/CAN feedback to a higher-level controller. The 200 MHz MIPS32 microAptiv executes FOC loops in well under 10 microseconds. The 124-pin VTLA package offers thermal headroom for sustained computation when paired with proper PCB copper pour.
推荐
IoT Edge Gateway with Ethernet
An IoT edge gateway aggregating sensor data over Ethernet and CAN can run MQTT-SN or CoAP clients directly on the PIC32MZ1024ECG124T-I/TL, eliminating a separate SBC. The 1 MB Flash stores TLS certificates and an MQTT stack, while the 512 KB SRAM buffers publish queues. Microchip's MPLAB Harmony 3 framework simplifies integration with AWS IoT or Azure IoT SDKs. For designs needing the integrated crypto of TLS 1.3 hardware, migrating to PIC32MZ1024ECK124T-I/TL is a drop-in PCB change.
推荐
推荐产品汇总
工程参考数据： PIC32MZ1024ECG124T-I/TL ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ1024ECK124T-I/TL | PIC32MZ1024EFK124T-I/TL | PIC32MZ1024ECG124-I/TL | PIC32MZ1024ECG124T-E/TL | PIC32MZ1024EFG124T-I/TL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-pin VTLA (9x9 mm) | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same |
| Core / Architecture | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 252 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 252 MHz |
| Flash / SRAM | 1 MB / 512 KB | 1 MB / 512 KB | 1 MB / 512 KB | 1 MB / 512 KB | 1 MB / 512 KB | 1 MB / 512 KB |
| Hardware Crypto (AES/SHA) | No | Yes | Yes | No | No | No |
| FPU | No | No | Yes | No | No | Yes |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) | Yes (10/100) |
| USB | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG |
| CAN | 2x CAN 2.0b | 2x CAN 2.0b | 2x CAN 2.0b | 2x CAN 2.0b | 2x CAN 2.0b | 2x CAN 2.0b |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) |
关键差异点
- Highest Flash + RAM combination in the PIC32MZ EC family at 124 pins （对比 PIC32MZ1024ECK124T-I/TL)
- 200 MHz CPU at lower power vs EF family （对比 PIC32MZ1024EFK124T-I/TL)
- Industrial-grade temperature range with widest pin-compatible migration path （对比 PIC32MZ1024ECG124T-E/TL)
设计说明
The 124-pin VTLA package exposes a thermal pad on the bottom that MUST be soldered to a top-layer copper pour of at least 25 mm squared (per the Microchip PIC32MZ EC family datasheet). Without this thermal path, junction temperature can exceed 125C at full 200 MHz CPU load under industrial ambient. Use thermal via arrays (0.3 mm drill, 1.0 mm pitch, plugged-and-capped) connecting the top pad to internal copper planes for additional spreading.
The 124-pin VTLA is an LGA-style package with a 0.4 mm pitch. Microchip recommends NSMD (Non-Solder Mask Defined) pads with a 0.2 mm aperture reduction to avoid solder wicking under the land pad. Stencil thickness of 0.125 mm with electro-polished finish and Type 3 or Type 4 solder paste is recommended. Keep the thermal pad stencil opening windowed to ~50% coverage to prevent floating during reflow.
Decouple the PIC32MZ1024ECG124T-I/TL with a 100 nF X7R 0402 within 2 mm of each AVDD/VDD pair, plus a single 4.7 uF X5R bulk capacitor on each power domain. The internal 1.2V core regulator requires a 4.7 uF X5R + 100 nF X7R pair on the VCAP pin per the family datasheet. Place the bulk cap within 5 mm of the VCAP pin and keep traces short and wide.
Do not assume the EC sub-family has hardware crypto - the PIC32MZ1024ECG124 has no AES/SHA accelerators. If your application needs TLS 1.3 hardware offload, switch to the PIC32MZ1024ECK124T-I/TL drop-in replacement. Also, MPLAB Harmony 3 project configuration differs between EC and EF families: peripheral clock trees and PPS pin mapping must be re-verified when migrating firmware between them.
合规信息
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications select from Microchip's dsPIC33 or SAM E70 automotive-qualified families. Reach compliance per EU REACH SVHC declaration on Microchip.com.