PIC32MZ1064DAK169T-V/HF - 200MHz 32-bit MCU 1MB Flash LFBGA-169
料号： PIC32MZ1064DAK169T-V/HF ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.65 | $76.50 |
| 100 | $6.85 | $685.00 |
| 500 | $6.2 | $3,100.00 |
| 1,000 | $5.65 | $5,650.00 |
PIC32MZ1064DAK169T-V/HF 概述
A 32-bit microcontroller (MCU) is a single-chip computer integrating a 32-bit CPU core, Flash program memory, SRAM, and a rich set of peripherals (ADC, timers, communication interfaces). The PIC32MZ DA series occupies the upper tier of the PIC32 family, positioned between conventional MCUs and microprocessors: it offers MPU-class compute and memory bandwidth while retaining the deterministic interrupt response, low power modes, and ease-of-use typical of an MCU. Within the broader taxonomy it sits as MCU -> 32-bit MCU -> MIPS-based MCU -> PIC32 -> PIC32MZ DA (graphics). This combination is engineered for embedded graphical user-interface (GUI) applications.
Key features of this part include: a 12-bit 18 MSPS ADC with up to 45 analog inputs for mixed-signal data acquisition, integrated 2D graphics processor and display controller, HS USB 2.0 with integrated PHY, CAN, and multiple UART/SPI/I2C interfaces. The integrated DDR2 controller offloads external memory management from the CPU, while the on-chip crypto engine accelerates AES/SHA. Operating voltage range is 2.3V to 3.6V.
The PIC32MZ1064DAK169T-V/HF is built on a superscalar microAptiv core with 16KB I-cache and 4KB D-cache, enabling efficient execution of complex GUIs. The 200 MHz core delivers 252 DMIPS, while the integrated GPU handles block transfer, color conversion, alpha blending, and alpha masking, offloading display refresh from the CPU.
Typical applications include industrial HMI panels, automotive instrument clusters, medical patient monitors, point-of-sale terminals, and any GUI-driven embedded product that needs MPU-class graphics performance without an external microprocessor. The wide ADC input count also suits multi-sensor data acquisition front ends.
When designing with this part, allocate the largest continuous DDR2 trace length matching and use controlled-impedance routing; the LFBGA-169 footprint also requires careful thermal via arrays under the exposed pad to keep junction temperature within limits at full CPU load. Trust Microchip's MPLAB Harmony graphics suite for driver and middleware integration.
This page synthesizes distributor pricing, drop-in alternatives within the same PIC32MZ DA family, and practical PCB design guidance not found in the bare datasheet.
直接替换替代料： PIC32MZ1064DAK169T-V/HF ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ1064DAK169T-V/HF （相同外形与封装尺寸） ——差异在于 USB, Core Architecture, Package, Graphics Controller, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ1064DAK169T-I/HF
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1064DAK169-V/HF
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1064DAB169T-I/HF
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.52 / 个
查看数据手册 →PIC32MZ1064DAB169-I/HF
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$12.4 / 个
查看数据手册 →PIC32MZ1064DAA169-I/HF
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$12.1 / 个
查看数据手册 →PIC32MZ1025DAK169-I/HF
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$10.95 / 个
查看数据手册 →PIC32MZ1064DAK169T-V/HF 最大额定值与电气特性
| Core Architecture | MIPS32 microAptiv |
| Bit Width | 32-bit |
| Maximum CPU Frequency | 200 MHz |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 640 KB |
| External DDR2 DRAM Support | 32 MB or 128 MB |
| Instruction Cache | 16 KB |
| Data Cache | 4 KB |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated 2D GPU + Display Controller |
| USB | HS USB 2.0 with integrated PHY |
| CAN | Yes |
| Operating Voltage | 2.3 V to 3.6 V |
| 工作温度 | -40 C to +105 C (V-temp) |
| 封装 | 169-LFBGA (11x11) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
PIC32MZ1064DAK169T-V/HF 169-lfbga (11x11) 引脚配置指南
PIC32MZ1064DAK169T-V/HF（169-lfbga (11x11) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MZ1064DAK169T-V/HF.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MZ1064DAK169T-V/HF 适用于 7 应用s: Industrial HMI Touch Panels, Automotive Instrument Clusters, Medical Patient Monitoring Displays, Point-of-Sale (POS) Terminals, Building Automation Control Panels, Portable Test and Measurement Instruments, Smart Home Touchscreen Controllers.
Industrial HMI Touch Panels
The PIC32MZ1064DAK169T-V/HF is well-suited for industrial human-machine interface (HMI) touch panels requiring TFT LCD displays up to WVGA or higher resolutions. The integrated 2D graphics processor handles block transfer, color conversion, alpha blending, and alpha masking in hardware, freeing the 200 MHz MIPS microAptiv CPU for application logic and touch gesture processing. The V-temp -40C to +105C range supports factory-floor environments, while the 169-LFBGA package and DDR2 controller allow compact PCB layouts with up to 128 MB of external frame buffer for high-color-depth GUIs.
推荐
Automotive Instrument Clusters
The PIC32MZ1064DAK169T-V/HF can drive automotive instrument cluster displays by combining its integrated 2D GPU with the 12-bit 18 MSPS ADC for analog gauge signal acquisition. The 200 MHz core, 1 MB Flash, and 640 KB SRAM provide headroom for cluster graphics, while the V-temp -40C to +105C range covers cabin and engine-bay-adjacent deployments. The HS USB 2.0 and CAN interfaces support diagnostic connectivity, and the DDR2 controller enables smooth gauge needle animations at high refresh rates.
推荐
Medical Patient Monitoring Displays
The PIC32MZ1064DAK169T-V/HF is a strong fit for medical patient monitoring equipment that combines TFT waveform displays with multi-channel analog data acquisition. The 12-bit 18 MSPS ADC with up to 45 analog inputs can sample multiple ECG, SpO2, and respiration channels simultaneously, while the integrated GPU renders waveforms and numeric readouts in real time. The 640 KB SRAM supports substantial waveform buffer storage, and the V-temp range supports medical equipment housings that run warm during continuous operation.
推荐
Point-of-Sale (POS) Terminals
The PIC32MZ1064DAK169T-V/HF supports point-of-sale terminals that require a color touchscreen, secure payment flow, and multiple peripheral interfaces. The integrated HS USB 2.0 supports payment PIN pads and printers, the CAN interface supports cash-drawer or peripheral integration, and the 1 MB Flash accommodates GUI assets and transaction logic. The DDR2 controller drives WVGA-resolution touchscreens with smooth page transitions, and the V-temp range handles retail backroom thermal loads.
推荐
Building Automation Control Panels
The PIC32MZ1064DAK169T-V/HF can serve as the central controller for building automation touch panels that display HVAC, lighting, and security status on a TFT color display. The 12-bit ADC with up to 45 inputs accepts analog sensor inputs from temperature, humidity, and air-quality sensors, while the integrated GPU animates gauge widgets and trend graphs. The CAN interface connects to building automation fieldbuses, and the V-temp grade supports basement mechanical-room environments.
推荐
Portable Test and Measurement Instruments
The PIC32MZ1064DAK169T-V/HF is suitable for portable oscilloscopes, data loggers, and handheld spectrum analyzers that combine a TFT display with multi-channel high-speed ADC. The 12-bit 18 MSPS ADC supports oscilloscope front-end digitizers, while the 200 MHz CPU runs waveform math, FFT processing, and on-screen UI rendering in parallel with the GPU offloading display refresh. The V-temp range supports field-deployed instruments in extreme environments.
推荐
Smart Home Touchscreen Controllers
The PIC32MZ1064DAK169T-V/HF drives smart-home touchscreen controllers that aggregate lighting, climate, security, and multimedia controls on a wall-mounted TFT display. The integrated GPU accelerates tile-based UI animations for scene selection, while the DDR2 controller drives higher-resolution panels for showing security camera feeds. The HS USB 2.0 supports firmware updates, and the V-temp range handles wall-box thermal rise behind the display.
推荐
推荐产品汇总
工程参考数据： PIC32MZ1064DAK169T-V/HF ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ1064DAK169T-I/HF | PIC32MZ1064DAK169-V/HF | PIC32MZ1064DAB169T-I/HF | PIC32MZ1064DAB169-I/HF | PIC32MZ1064DAA169-I/HF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Core / Frequency | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Graphics Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller |
| Packaging Carrier | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tray | Tray |
关键差异点
- V-temp 105C operation in 169-LFBGA （对比 PIC32MZ1064DAK169T-I/HF)
- Latest silicon revision in the DAK mask set （对比 PIC32MZ1064DAA169-I/HF)
- Tape-and-reel packaging for high-volume SMT （对比 PIC32MZ1064DAK169-V/HF)
设计说明
The 169-LFBGA (11x11) package has a 0.8 mm ball pitch, requiring laser-drilled microvias on inner layers and ENIG surface finish for reliable assembly. Place a thermal via array directly under the exposed pad (a continuous ground plane on the top layer connected to inner thermal copper) to keep the junction temperature below 100C at full 200 MHz CPU load. Estimated: at 0.8 W typical dissipation, the thermal pad keeps theta_JA below 25 C/W on a 4-layer 1 oz board, which is critical for the V-temp 105C ceiling.
The external DDR2 interface requires matched-length routing within +/-25 mils for the data/byte-group strobes and +/-50 mils for the address/command lanes. Use 100 ohm differential impedance for the DDR2 DQS pairs and 50 ohm single-ended for the address/command. According to Microchip's DDR2 layout application note, route all DDR2 signals on inner layers between two solid ground planes, and place the 169-LFBGA decoupling capacitors on the opposite side directly under their respective power pins.
Estimated: ensure VDDP (1.8V core) is sequenced to come up after VDDE (3.3V I/O) per the PIC32MZ DA family power-up requirements - reverse sequencing can cause latch-up or permanent damage. Connect the NRST pin to a 10 kohm pull-up to VDDE and a 100 nF decoupling capacitor to ground; do not leave NRST floating. Verify all unused ADC inputs are tied to analog ground through 10 kohm resistors rather than left floating, to prevent injected switching noise from coupling into active channels.
The integrated 2D GPU and 200 MHz core can each draw substantial current under sustained load. Estimated: at full CPU + GPU + DDR2 throughput, total power dissipation can reach 1.0-1.2 W. For V-temp 105C operation in a sealed enclosure, design for 0.9 W maximum sustained dissipation - throttling graphics frame rate in firmware during high ambient conditions is acceptable practice.
合规信息
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - the part targets industrial/consumer markets. AEC-Q100 grade available separately in the PIC32MZ DA family per Microchip automotive datasheet addendum.
