PIC32MZ1064DAK169T-V/HF - 200MHz 32-bit MCU 1MB Flash LFBGA-169
Référence : PIC32MZ1064DAK169T-V/HF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.65 | $76,50 |
| 100 | $6.85 | $685,00 |
| 500 | $6.2 | $3 100,00 |
| 1 000 | $5.65 | $5 650,00 |
PIC32MZ1064DAK169T-V/HF Présentation
A 32-bit microcontroller (MCU) is a single-chip computer integrating a 32-bit CPU core, Flash program memory, SRAM, and a rich set of peripherals (ADC, timers, communication interfaces). The PIC32MZ DA series occupies the upper tier of the PIC32 family, positioned between conventional MCUs and microprocessors: it offers MPU-class compute and memory bandwidth while retaining the deterministic interrupt response, low power modes, and ease-of-use typical of an MCU. Within the broader taxonomy it sits as MCU -> 32-bit MCU -> MIPS-based MCU -> PIC32 -> PIC32MZ DA (graphics). This combination is engineered for embedded graphical user-interface (GUI) applications.
Key features of this part include: a 12-bit 18 MSPS ADC with up to 45 analog inputs for mixed-signal data acquisition, integrated 2D graphics processor and display controller, HS USB 2.0 with integrated PHY, CAN, and multiple UART/SPI/I2C interfaces. The integrated DDR2 controller offloads external memory management from the CPU, while the on-chip crypto engine accelerates AES/SHA. Operating voltage range is 2.3V to 3.6V.
The PIC32MZ1064DAK169T-V/HF is built on a superscalar microAptiv core with 16KB I-cache and 4KB D-cache, enabling efficient execution of complex GUIs. The 200 MHz core delivers 252 DMIPS, while the integrated GPU handles block transfer, color conversion, alpha blending, and alpha masking, offloading display refresh from the CPU.
Typical applications include industrial HMI panels, automotive instrument clusters, medical patient monitors, point-of-sale terminals, and any GUI-driven embedded product that needs MPU-class graphics performance without an external microprocessor. The wide ADC input count also suits multi-sensor data acquisition front ends.
When designing with this part, allocate the largest continuous DDR2 trace length matching and use controlled-impedance routing; the LFBGA-169 footprint also requires careful thermal via arrays under the exposed pad to keep junction temperature within limits at full CPU load. Trust Microchip's MPLAB Harmony graphics suite for driver and middleware integration.
This page synthesizes distributor pricing, drop-in alternatives within the same PIC32MZ DA family, and practical PCB design guidance not found in the bare datasheet.
Alternatives de remplacement direct pour PIC32MZ1064DAK169T-V/HF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1064DAK169T-V/HF (même facteur de forme et même empreinte) — différant par USB, Core Architecture, Package, Graphics Controller, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1064DAK169T-I/HF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1064DAK169-V/HF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1064DAB169T-I/HF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.52 / unité
Voir la fiche technique →PIC32MZ1064DAB169-I/HF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$12.4 / unité
Voir la fiche technique →PIC32MZ1064DAA169-I/HF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$12.1 / unité
Voir la fiche technique →PIC32MZ1025DAK169-I/HF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.95 / unité
Voir la fiche technique →PIC32MZ1064DAK169T-V/HF Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv |
| Bit Width | 32-bit |
| Maximum CPU Frequency | 200 MHz |
| Program Flash Memory | 1 MB (1M x 8) |
| SRAM | 640 KB |
| External DDR2 DRAM Support | 32 MB or 128 MB |
| Instruction Cache | 16 KB |
| Data Cache | 4 KB |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated 2D GPU + Display Controller |
| USB | HS USB 2.0 with integrated PHY |
| CAN | Yes |
| Operating Voltage | 2.3 V to 3.6 V |
| Température de fonctionnement | -40 C to +105 C (V-temp) |
| Boîtier | 169-LFBGA (11x11) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ1064DAK169T-V/HF 169-lfbga (11x11)
Configuration des broches du PIC32MZ1064DAK169T-V/HF (boîtier 169-lfbga (11x11)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1064DAK169T-V/HF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1064DAK169T-V/HF convient pour 7 applications: Industrial HMI Touch Panels, Automotive Instrument Clusters, Medical Patient Monitoring Displays, Point-of-Sale (POS) Terminals, Building Automation Control Panels, Portable Test and Measurement Instruments, Smart Home Touchscreen Controllers.
Industrial HMI Touch Panels
The PIC32MZ1064DAK169T-V/HF is well-suited for industrial human-machine interface (HMI) touch panels requiring TFT LCD displays up to WVGA or higher resolutions. The integrated 2D graphics processor handles block transfer, color conversion, alpha blending, and alpha masking in hardware, freeing the 200 MHz MIPS microAptiv CPU for application logic and touch gesture processing. The V-temp -40C to +105C range supports factory-floor environments, while the 169-LFBGA package and DDR2 controller allow compact PCB layouts with up to 128 MB of external frame buffer for high-color-depth GUIs.
Recommandé
Automotive Instrument Clusters
The PIC32MZ1064DAK169T-V/HF can drive automotive instrument cluster displays by combining its integrated 2D GPU with the 12-bit 18 MSPS ADC for analog gauge signal acquisition. The 200 MHz core, 1 MB Flash, and 640 KB SRAM provide headroom for cluster graphics, while the V-temp -40C to +105C range covers cabin and engine-bay-adjacent deployments. The HS USB 2.0 and CAN interfaces support diagnostic connectivity, and the DDR2 controller enables smooth gauge needle animations at high refresh rates.
Recommandé
Medical Patient Monitoring Displays
The PIC32MZ1064DAK169T-V/HF is a strong fit for medical patient monitoring equipment that combines TFT waveform displays with multi-channel analog data acquisition. The 12-bit 18 MSPS ADC with up to 45 analog inputs can sample multiple ECG, SpO2, and respiration channels simultaneously, while the integrated GPU renders waveforms and numeric readouts in real time. The 640 KB SRAM supports substantial waveform buffer storage, and the V-temp range supports medical equipment housings that run warm during continuous operation.
Recommandé
Point-of-Sale (POS) Terminals
The PIC32MZ1064DAK169T-V/HF supports point-of-sale terminals that require a color touchscreen, secure payment flow, and multiple peripheral interfaces. The integrated HS USB 2.0 supports payment PIN pads and printers, the CAN interface supports cash-drawer or peripheral integration, and the 1 MB Flash accommodates GUI assets and transaction logic. The DDR2 controller drives WVGA-resolution touchscreens with smooth page transitions, and the V-temp range handles retail backroom thermal loads.
Recommandé
Building Automation Control Panels
The PIC32MZ1064DAK169T-V/HF can serve as the central controller for building automation touch panels that display HVAC, lighting, and security status on a TFT color display. The 12-bit ADC with up to 45 inputs accepts analog sensor inputs from temperature, humidity, and air-quality sensors, while the integrated GPU animates gauge widgets and trend graphs. The CAN interface connects to building automation fieldbuses, and the V-temp grade supports basement mechanical-room environments.
Recommandé
Portable Test and Measurement Instruments
The PIC32MZ1064DAK169T-V/HF is suitable for portable oscilloscopes, data loggers, and handheld spectrum analyzers that combine a TFT display with multi-channel high-speed ADC. The 12-bit 18 MSPS ADC supports oscilloscope front-end digitizers, while the 200 MHz CPU runs waveform math, FFT processing, and on-screen UI rendering in parallel with the GPU offloading display refresh. The V-temp range supports field-deployed instruments in extreme environments.
Recommandé
Smart Home Touchscreen Controllers
The PIC32MZ1064DAK169T-V/HF drives smart-home touchscreen controllers that aggregate lighting, climate, security, and multimedia controls on a wall-mounted TFT display. The integrated GPU accelerates tile-based UI animations for scene selection, while the DDR2 controller drives higher-resolution panels for showing security camera feeds. The HS USB 2.0 supports firmware updates, and the V-temp range handles wall-box thermal rise behind the display.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1064DAK169T-V/HF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1064DAK169T-I/HF | PIC32MZ1064DAK169-V/HF | PIC32MZ1064DAB169T-I/HF | PIC32MZ1064DAB169-I/HF | PIC32MZ1064DAA169-I/HF |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Core / Frequency | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz | MIPS32 microAptiv / 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) |
| Graphics Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller | Integrated 2D GPU + Display Controller |
| Packaging Carrier | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tray | Tray |
Principaux différenciateurs
- V-temp 105C operation in 169-LFBGA (vs PIC32MZ1064DAK169T-I/HF)
- Latest silicon revision in the DAK mask set (vs PIC32MZ1064DAA169-I/HF)
- Tape-and-reel packaging for high-volume SMT (vs PIC32MZ1064DAK169-V/HF)
Notes de conception
The 169-LFBGA (11x11) package has a 0.8 mm ball pitch, requiring laser-drilled microvias on inner layers and ENIG surface finish for reliable assembly. Place a thermal via array directly under the exposed pad (a continuous ground plane on the top layer connected to inner thermal copper) to keep the junction temperature below 100C at full 200 MHz CPU load. Estimated: at 0.8 W typical dissipation, the thermal pad keeps theta_JA below 25 C/W on a 4-layer 1 oz board, which is critical for the V-temp 105C ceiling.
The external DDR2 interface requires matched-length routing within +/-25 mils for the data/byte-group strobes and +/-50 mils for the address/command lanes. Use 100 ohm differential impedance for the DDR2 DQS pairs and 50 ohm single-ended for the address/command. According to Microchip's DDR2 layout application note, route all DDR2 signals on inner layers between two solid ground planes, and place the 169-LFBGA decoupling capacitors on the opposite side directly under their respective power pins.
Estimated: ensure VDDP (1.8V core) is sequenced to come up after VDDE (3.3V I/O) per the PIC32MZ DA family power-up requirements - reverse sequencing can cause latch-up or permanent damage. Connect the NRST pin to a 10 kohm pull-up to VDDE and a 100 nF decoupling capacitor to ground; do not leave NRST floating. Verify all unused ADC inputs are tied to analog ground through 10 kohm resistors rather than left floating, to prevent injected switching noise from coupling into active channels.
The integrated 2D GPU and 200 MHz core can each draw substantial current under sustained load. Estimated: at full CPU + GPU + DDR2 throughput, total power dissipation can reach 1.0-1.2 W. For V-temp 105C operation in a sealed enclosure, design for 0.9 W maximum sustained dissipation - throttling graphics frame rate in firmware during high ambient conditions is acceptable practice.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - the part targets industrial/consumer markets. AEC-Q100 grade available separately in the PIC32MZ DA family per Microchip automotive datasheet addendum.
