PIC32MZ2064DAR176T-V/2J - 32-Bit 200MHz MCU, 2MB Flash | Microchip
料号： PIC32MZ2064DAR176T-V/2J ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.95 | $169.50 |
| 100 | $15.4 | $1,540.00 |
| 500 | $14.2 | $7,100.00 |
| 1,000 | $13.1 | $13,100.00 |
PIC32MZ2064DAR176T-V/2J 概述
A microcontroller (MCU) is a self-contained computer on a single chip that combines a processor core, program memory (Flash), data memory (SRAM), and peripherals such as timers, serial interfaces, and analog blocks. Within the semiconductor taxonomy, the PIC32MZ DA sits at MCU -> 32-bit microcontroller -> embedded processor -> integrated circuit, and it uniquely bridges the MCU and microprocessor (MPU) classes by pairing a 200 MHz MIPS32 microAptiv core with an integrated graphics pipeline and on-chip DDR2 memory.
Key features include 2 MB Flash, 640 KB SRAM, 200 MHz operation, an integrated Graphics Controller and Graphics Processor, and stacked DDR2 DRAM (32 MB or 128 MB externally addressable). The V/2J suffix denotes the extended V-temperature grade and the 176-pin LQFP (20x20) package, while the trailing T indicates tape-and-reel packaging.
The PIC32MZ DA family uses a cache-based MIPS32 microAptiv core with a floating-point unit, delivering MPU-like performance while retaining MCU ease of design. The integrated graphics engine offloads pixel composition from the CPU, enabling rich human-machine interfaces (HMI) without an external display controller, and the stacked DDR2 removes the need for external frame-buffer memory in many designs.
Typical applications include industrial HMI panels, medical patient monitors, automotive instrument clusters, smart-home control panels, point-of-sale terminals, and IoT gateway devices with graphical displays. The combination of 200 MHz compute, 2 MB Flash, and integrated graphics makes it well suited to GUI-centric embedded products.
When designing with this device, pay close attention to the DDR2 memory interface routing and the 176-pin LQFP thermal pad, and verify the V-temperature grade against the target operating environment. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： PIC32MZ2064DAR176T-V/2J ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ2064DAR176T-V/2J （相同外形与封装尺寸） ——差异在于 Graphics Controller, Package, ADC, CAN, MSL Level.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ2064DAR176-I/2J
✅ 直接替换✓ 有现货
$21.2 / 个
查看数据手册 →PIC32MZ2064DAL176T-V/2J
✅ 直接替换✓ 有现货
$10.05 / 个
查看数据手册 →PIC32MZ2064DAS176
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ2064DAB176-I/2J
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ2064DAK176T-I/2J
✅ 直接替换✓ 有现货
$10.2 / 个
查看数据手册 →PIC32MZ2064DAR176T-V/2J 最大额定值与电气特性
| Core Architecture | MIPS32 microAptiv |
| Core Count | Single-core |
| 最大时钟频率 | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| Data Memory (SRAM) | 640 KB |
| Integrated Graphics | Graphics Controller + Graphics Processor |
| Stacked DRAM | DDR2 (32 MB or 128 MB externally addressable) |
| 封装 | 176-LQFP (20x20 mm) |
| 安装类型 | Surface Mount |
| Temperature Grade | V-grade (extended temperature) |
| Packaging | Tape & Reel (T suffix) |
PIC32MZ2064DAR176T-V/2J 176-lqfp (20x20 mm) 引脚配置指南
PIC32MZ2064DAR176T-V/2J（176-lqfp (20x20 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： PIC32MZ2064DAR176T-V/2J.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PIC32MZ2064DAR176T-V/2J 适用于 6 应用s: Industrial HMI Panels, Medical Patient Monitors, Automotive Instrument Clusters, Smart Home Control Panels, Point-of-Sale Terminals, IoT Gateways with Displays.
Industrial HMI Panels
The PIC32MZ2064DAR176T-V/2J fits industrial human-machine interface panels because its integrated Graphics Controller and Graphics Processor offload pixel composition from the 200 MHz MIPS32 microAptiv core, while 2 MB Flash and 640 KB SRAM hold the GUI framework and application code. Stacked DDR2 DRAM (32 MB or 128 MB externally addressable) provides the frame buffer without external memory, reducing board area. In a typical design the MCU drives an RGB LCD panel through its graphics pipeline while servicing touch input and fieldbus communication. The V-temperature grade extends operation to harsher factory environments. The trade-off is that the integrated graphics engine consumes more power than a plain MCU, so thermal design of the 176-LQFP must be considered.
推荐
Medical Patient Monitors
The PIC32MZ2064DAR176T-V/2J suits medical patient monitors where a graphical display, real-time signal handling, and reliable operation are required. Its 200 MHz MIPS32 microAptiv core with floating-point unit processes sensor data, while the integrated Graphics Controller renders waveforms and vital-sign trends on an LCD. The 2 MB Flash stores the application and GUI assets, and 640 KB SRAM buffers acquisition data. Stacked DDR2 DRAM supplies the display frame buffer on-chip, simplifying the PCB and improving reliability. The V-temperature grade supports the controlled but demanding medical environment. Designers should note that medical products require additional regulatory qualification beyond the MCU's own compliance, and power dissipation of the graphics subsystem must be managed within the enclosure.
推荐
Automotive Instrument Clusters
The PIC32MZ2064DAR176T-V/2J is used in automotive instrument clusters where a 200 MHz MIPS32 microAptiv core and integrated Graphics Controller drive gauge and warning displays. The 2 MB Flash holds cluster firmware and graphics assets, 640 KB SRAM buffers runtime data, and stacked DDR2 DRAM provides the frame buffer for the display. The V-temperature grade supports the wide temperature swings of the vehicle cabin. In a cluster design the MCU renders the instrument graphics while communicating over CAN and other vehicle buses. Note that automotive qualification (AEC-Q100) is a separate requirement; designers must confirm the specific part's qualification status before committing to a safety-related automotive design.
推荐
Smart Home Control Panels
The PIC32MZ2064DAR176T-V/2J fits smart home control panels that combine a touch display with connectivity and local processing. The integrated Graphics Controller and Graphics Processor render the user interface, while the 200 MHz MIPS32 microAptiv core runs the application stack. 2 MB Flash stores firmware and UI assets, 640 KB SRAM handles runtime data, and stacked DDR2 DRAM supplies the display frame buffer on-chip, keeping the panel compact. The device can drive an LCD panel directly and interface with wireless modules over serial or SPI. The main trade-off is power: a graphics-capable MCU draws more than a simple control MCU, so thermal and power budgeting matter in wall-powered and PoE designs.
推荐
Point-of-Sale Terminals
The PIC32MZ2064DAR176T-V/2J suits point-of-sale terminals that need a responsive graphical interface plus secure local processing. Its 200 MHz MIPS32 microAptiv core and integrated Graphics Controller render the transaction UI, while 2 MB Flash and 640 KB SRAM hold the payment application and buffers. Stacked DDR2 DRAM provides the display frame buffer without external memory, reducing component count and board complexity in a compact terminal. The device interfaces with card readers, printers, and network modules over its serial and USB peripherals. Designers should account for the graphics subsystem's power draw and ensure adequate decoupling and thermal relief on the 176-LQFP in sealed terminal enclosures.
推荐
IoT Gateways with Displays
The PIC32MZ2064DAR176T-V/2J fits IoT gateways that include a local display for configuration and monitoring. The 200 MHz MIPS32 microAptiv core handles protocol stacks and data aggregation, while the integrated Graphics Controller and Graphics Processor render status dashboards. 2 MB Flash stores gateway firmware and UI assets, 640 KB SRAM buffers network and sensor data, and stacked DDR2 DRAM supplies the display frame buffer on-chip. The device bridges sensor networks to upstream systems over its serial, SPI, and USB interfaces. The trade-off versus a display-less gateway MCU is higher power and cost, so choose this part only when a graphical local interface is genuinely required.
推荐
推荐产品汇总
工程参考数据： PIC32MZ2064DAR176T-V/2J ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ2064DAR176-I/2J | PIC32MZ2064DAL176T-V/2J | PIC32MZ2064DAS176 | PIC32MZ2064DAB176-I/2J |
|---|---|---|---|---|---|
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Maximum Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Memory (Flash) | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| Data Memory (SRAM) | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Integrated Graphics | Graphics Controller + Graphics Processor | Graphics Controller + Graphics Processor | Graphics Controller + Graphics Processor | Graphics Controller + Graphics Processor | Graphics Controller + Graphics Processor |
| Stacked DRAM | DDR2 (32 MB or 128 MB externally addressable) | DDR2 (32 MB or 128 MB externally addressable) | DDR2 (32 MB or 128 MB externally addressable) | DDR2 (32 MB or 128 MB externally addressable) | DDR2 (32 MB or 128 MB externally addressable) |
关键差异点
- Extended V-temperature grade （对比 PIC32MZ2064DAR176-I/2J)
- Integrated graphics plus stacked DDR2 （对比 PIC32MZ2064DAS176)
- Tape-and-reel packaging for automated assembly （对比 PIC32MZ2064DAR176-I/2J)
设计说明
Route the stacked DDR2 memory interface with controlled impedance and matched trace lengths, keeping the memory bus as short as possible. The PIC32MZ DA family integrates DDR2 DRAM, so the high-speed memory signals are internal to the package, but the external addressable DRAM interface still requires careful layout. Use a solid ground plane under the 176-LQFP and avoid routing noisy signals beneath the memory interface traces.
Estimated: the 176-LQFP (20x20 mm) package with integrated graphics and DDR2 dissipates more power than a plain MCU. Provide a thermal pad and adequate copper area on the PCB to spread heat, and verify junction temperature against the V-grade limit for your ambient. Because the graphics engine and DDR2 contribute significant dynamic power, thermal analysis should be performed at the maximum expected graphics load, not just at idle.
Decouple each supply pin with a 0.1 uF ceramic capacitor placed as close to the pin as possible, plus bulk capacitance on the main rails. The integrated graphics and DDR2 create fast current transients, so low-ESR ceramic capacitors and a well-planned power distribution network are essential. Follow the Microchip PIC32MZ DA family hardware design guidelines for the recommended decoupling network and power sequencing.
Confirm the temperature grade before substituting parts: the V/2J suffix denotes the extended V-temperature grade, while the I/2J suffix denotes the industrial grade. Although the two are pin-compatible in the same 176-LQFP package, using an I-grade part in a V-grade application can violate the operating temperature requirement. Always verify the suffix and the datasheet temperature range against your target environment.
合规信息
Compliance data for the PIC32MZ2064DAR176T-V/2J was not present in the provided verified web data. Confirm RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status from the Microchip product page or the manufacturer datasheet before design release.