SPC5607BK0MLQ6 - 32-bit MCU, 1.5MB Flash, 64MHz | NXP | Automotive
料号： SPC5607BK0MLQ6 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $13.5 | $13.50 |
| 10 | $12.4 | $124.00 |
| 100 | $11.2 | $1,120.00 |
| 500 | $10.3 | $5,150.00 |
| 1,000 | $9.55 | $9,550.00 |
SPC5607BK0MLQ6 概述
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory, data RAM, and peripheral controllers such as CAN, LIN, SPI, and ADC modules into one chip. Within the semiconductor hierarchy, an MCU sits under the broader categories of embedded processor and system-on-chip, and the SPC5607BK0MLQ6 specifically targets the automotive-grade MCU segment governed by AEC-Q100 qualification.
Key features include 1.5 MB (1.5M x 8) of Flash program memory for large application code, a 64 MHz e200z0h RISC core delivering deterministic real-time performance, and an operating temperature range of -40C to +125C suitable for under-hood and harsh environments. The gull-wing LQFP-144 package offers 20x20 mm surface-mount footprint with 0.5 mm lead pitch, easing inspection and rework compared with BGA alternatives.
Technically, the device belongs to NXP's MPC560xB/C/D family of Power Architecture based MCUs, which NXP describes as the latest integrated devices for automotive body electronics and industrial applications. The family is supported by an enablement ecosystem including software drivers, operating systems (such as AUTOSAR stacks), and configuration tools that accelerate design execution. Supply voltage support spans 3.3 V to 5 V per distributor parametric data.
Typical applications include automotive body control modules, gateway nodes, lighting control, window/door/seat management, and industrial control systems requiring AEC-Q100 reliability. The scalable family architecture allows designers to migrate across memory sizes without redesigning the software framework.
A key design consideration is thermal budgeting: at 64 MHz in a 144-lead plastic package, verify junction temperature stays within the 125C rating using the PCB copper pour as heatsink.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： SPC5607BK0MLQ6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： SPC5607BK0MLQ6 （相同外形与封装尺寸）.
快速对比工具——选择替代料号进行并排对比：
SPC5606GBK0MLQ6
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
SPC5607BK0MLLQ6
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
SPC5643LFF2MLQ1
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →SPC5607BK0MLQ6 最大额定值与电气特性
| Core Processor | e200z0h (Power Architecture) |
| Core Size | 32-bit |
| 最大时钟频率 | 64 MHz |
| Flash Memory | 1.5 MB (1.5M x 8) |
| 电源电压 | 3.3 V / 5 V |
| 工作温度 | -40C to +125C |
| Package Type | 144-LQFP (20x20 mm) |
| Terminal Form | Gull Wing |
| 安装类型 | Surface Mount |
| Number of Terminals | 144 |
| Qualification | AEC-Q100 Automotive Grade |
| Family | MPC560xB/C/D (Qorivva / SPC5) |
| Packaging | Tray |
| RoHS 状态 | Compliant |
SPC5607BK0MLQ6 144-lqfp (20x20 mm) 引脚配置指南
SPC5607BK0MLQ6（144-lqfp (20x20 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： SPC5607BK0MLQ6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
SPC5607BK0MLQ6 适用于 6 应用s: Automotive Body Control Module, Vehicle Gateway / Network Node, Advanced Lighting Control, Seat, Door and Window Management, Industrial Control Systems, Telematics and Tracking Units.
Automotive Body Control Module
The SPC5607BK0MLQ6 fits body control modules (BCM) because its 1.5 MB Flash accommodates the full firmware stack of a modern BCM: LIN schedulers for door and seat nodes, CAN networking for the powertrain domain, relay and LED load diagnostics, and OEM-specific sleep/wake state machines - all within a single device clocked at 64 MHz on the e200z0h Power Architecture core. In a typical topology the MCU drives high-side drivers and smart switches through SPI and GPIO while monitoring switch inputs through its ADC channels. Because the device is AEC-Q100 qualified from -40C to +125C, it survives the cabin and engine-bay-adjacent thermal environments where body modules are installed. The deterministic Power Architecture core also eases ISO 26262-related safety argumentation for load-control functions.
推荐
Vehicle Gateway / Network Node
For gateway applications bridging multiple CAN and LIN buses, the SPC5607BK0MLQ6 offers 64 MHz of real-time throughput and enough Flash for concurrent network management, diagnostic services (UDS), and security access layers. Gateways demand deep message buffering and fast routing tables; the 1.5 MB Flash leaves room for dual-bank firmware supporting over-the-air update mechanisms with a safe fallback image. In deployment, the MCU typically connects to external CAN transceivers on each bus segment, with the 5 V tolerant supply operation simplifying interfacing with 12 V automotive transceiver families. The AEC-Q100 qualification and NXP's AUTOSAR-capable MCAL driver ecosystem shorten the path to OEM network compliance testing, and the 144-LQFP package provides enough I/O for multi-bus wake/sleep supervision lines.
推荐
Advanced Lighting Control
Automotive exterior and interior lighting controllers benefit from the SPC5607BK0MLQ6's combination of Flash capacity and real-time determinism. LED matrix headlamps, adaptive front-lighting, and ambient interior lighting all require timed PWM sequences, temperature-derating curves, and diagnostic fault reporting stored as sizeable firmware images - the 1.5 MB Flash accommodates these plus OTA-update frameworks. The 64 MHz e200z0h core executes closed-loop current regulation loops with predictable latency, while ADC inputs read LED current sense and NTC temperature feedback. Operating from -40C to +125C, the device tolerates lamp-housing heat soak. Layout typically pairs the MCU with LED drivers over SPI; the 144-LQFP 0.5 mm pitch gull-wing package simplifies both production inspection and field rework compared with ball-grid alternatives.
推荐
Seat, Door and Window Management
Distributed comfort modules controlling motors, hall-effect position sensors, and anti-pinch algorithms need exactly the profile of the SPC5607BK0MLQ6: enough Flash for anti-pinch safety logic and OEM diagnostic stacks, 64 MHz real-time response for motor current monitoring, and AEC-Q100 -40C to +125C robustness for door-mirror-mounted electronics. In a typical window-lift module, the MCU drives an H-bridge or smart half-bridge through PWM outputs while sampling ripple-count position feedback on its ADC channels, using the Power Architecture core for deterministic velocity estimation. The 144-LQFP footprint supplies sufficient GPIO for hall sensors, switch matrices, and relay control. Using a scalable SPC560x family design also lets one firmware base serve master and satellite variants, cutting validation cost across the module line.
推荐
Industrial Control Systems
Beyond automotive, NXP positions the MPC560xB/C/D family, including the SPC5607BK0MLQ6, for industrial applications where the same robustness translates to advantage: motor control panels, pump and valve controllers, and building automation masters benefit from the -40C to +125C temperature rating, the deterministic 64 MHz Power Architecture core, and 1.5 MB of Flash for protocol stacks such as CANopen or Modbus over CAN hardware. In industrial deployments the 5 V supply mode simplifies interfacing with legacy sensors and actuators, while the 144-LQFP through-hole-inspectable gull-wing leads support conformal-coated boards common in harsh factory environments. Longevity matters in industrial programs, and NXP's active lifecycle status plus Rochester Electronics long-term supply channels provide the multi-year availability continuity that industrial OEMs require for certified equipment platforms.
推荐
Telematics and Tracking Units
Fleet telematics and asset-tracking control units use the SPC5607BK0MLQ6 as the deterministic host that aggregates GNSS receiver data, cellular modem AT-interfaces, CAN bus vehicle data extraction (including FMS profiles for trucks), and driver-ID inputs. The 1.5 MB Flash holds the data-logger, buffering, and OTA-update firmware, while the 64 MHz core performs geofence and trip logic with real-time deadlines even during heavy CAN traffic. The -40C to +125C AEC-Q100 rating covers engine-bay and rooftop antenna-mount installations. Designers typically connect the MCU to a cellular module over UART and a GNSS module over UART or SPI; the 5 V/3.3 V supply flexibility eases mixed-voltage board design. The 144-LQFP package leaves abundant GPIO for ignition sensing, immobilizer relays, and tamper switches.
推荐
推荐产品汇总
工程参考数据： SPC5607BK0MLQ6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SPC5606GBK0MLQ6 | SPC5607BK0MLLQ6 | SPC5643LFF2MLQ1 |
|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP - same | 144-LQFP - same land pattern class |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C (automotive) |
| AEC-Q100 Qualification | Qualified (Automotive Grade) | Qualified | Qualified | Qualified |
关键差异点
- Largest Flash in its family tier （对比 SPC5606GBK0MLQ6)
- Deterministic single-core Power Architecture （对比 SPC5643LFF2MLQ1)
- Automotive qualification with industrial crossover （对比 SPC5607BK0MLLQ6)
设计说明
The SPC5607BK0MLQ6 supports 3.3 V and 5 V supply domains per distributor parametric data. In automotive 12 V systems, regulate the module's clamp supply (e.g. from a load-dump-protected pre-regulator) down to 5 V, then derive 3.3 V for the MCU core I/O through an automotive LDO. Add bulk 100 uF plus 100 nF ceramic decoupling at each supply pin group of the 144-LQFP, placed within 3 mm of the pins. Verify the regulator can supply inrush during flash programming and wake-up current surges when multiple CAN/LIN peripherals activate simultaneously.
Estimated: at 64 MHz with flash execution and several CAN/LIN peripherals active, the SPC5607BK0MLQ6 dissipates on the order of a few hundred milliwatts (input values: core voltage ~3.3 V class, typical MCU active current for this family class). In a 125C ambient under-hood module, even 0.5 W at an assumed theta_JA of roughly 40-50 C/W for a 144-LQFP with 2 oz copper pour yields a 20-25 C junction rise, consuming much of the margin. Confirm exact theta_JA from the NXP datasheet thermal table and size the PCB copper pour accordingly.
The 144-LQFP 20x20 mm package uses 0.5 mm lead pitch. Use NSMD pads with ~0.25 mm opening and solder-mask defined windows to reduce bridging risk in reflow. Route the CAN/LIN transceiver SPI and crystal traces short and away from motor-drive PWM lines to preserve signal integrity. Provide a solid ground plane under the MCU and place the crystal with its load capacitors within 10 mm of the OSC pins. The exposed gull-wing leads permit AOI inspection - define a paste aperture of 90-100% of pad to avoid tombstoning at 0.5 mm pitch.
Do not assume cross-family code portability: firmware written for S12X or SPC5643 families will not run unmodified on the SPC560xB e200z0h core - rebuild against the MPC560xB peripheral map and linker script. Also verify the exact ordering suffix (K0MLQ6 defines flash size, temperature grade, and packaging); adjacent suffixes in the SPC5607B family denote different memory or package options, a frequent procurement error that produces functionally incompatible parts on the same footprint.
合规信息
RoHS Compliant: Yes per Newark product listing. Automotive AEC-Q100 grade per distributor parametric data (datasheets.com). REACH and conflict-mineral declarations should be obtained from NXP's compliance portal.
