SPC5643LF2MLQ1 - 32-bit Dual-Core MCU 1MB Flash 120MHz | NXP
料号: SPC5643LF2MLQ1 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $32.29 | $32.29 |
| 10 | $28.95 | $289.50 |
| 100 | $24.5 | $2,450.00 |
| 500 | $21.75 | $10,875.00 |
| 1,000 | $19.2 | $19,200.00 |
SPC5643LF2MLQ1 概述
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and programmable peripherals. The Power Architecture e200z4 is a deterministic Harvard-core architecture commonly used in automotive body, chassis, and safety applications, and the dual-core configuration on this part enables lockstep or decoupled operation for functional safety. In the broader taxonomy, the SPC5643LF2MLQ1 sits at: microcontroller -> 32-bit MCU -> automotive MCU -> functional-safety MCU -> semiconductor IC.
Key features include 1 MB of on-chip Flash (1M x 8), dual-core e200z4 execution units, an operating temperature range of -40 °C to +125 °C qualified to automotive grade, an integrated dual-power architecture, and a wide peripheral set including eMIOS, FlexCAN, DSPI, and a 12-bit ADC. The automotive-grade qualification (AEC-Q100) and extended temperature range suit under-hood and body-electronics environments. The 144-LQFP package provides ample I/O with 0.5 mm pitch and supports standard SMT assembly.
Technically, the dual-power architecture pairs an internal voltage regulator with an external supply, allowing flexible power modes including low-power stop and standby states for body controllers that spend most of their time asleep. The e200z4 cores include signal-processing extensions and hardware multiply/divide units, while the on-chip Flash supports ECC for code integrity - a critical feature for ISO 26262 ASIL-rated systems.
Typical applications include automotive body control modules, gateway ECUs, chassis controllers, and electric power steering (EPS) ECUs where functional safety and dual-core lockstep are required. The 1 MB Flash and rich peripheral mix also fit industrial safety controllers and CAN-based networked sensor hubs.
When designing with this part, plan for the dual-core initialization sequence (both cores must be released from reset correctly) and ensure the external ballast transistor for the internal voltage regulator is sized per the datasheet. Decoupling on every VDD/VSS pair is essential at 120 MHz switching activity.
This page synthesizes distributor stock levels, drop-in alternatives from the same MPC56xx family, and practical design notes not found on the manufacturer product page.
直接替换替代料: SPC5643LF2MLQ1 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号: SPC5643LF2MLQ1 (相同外形与封装尺寸) ——差异在于 Core Architecture, MSL Level, Operating Temperature Range, Package.
快速对比工具——选择替代料号进行并排对比:
SPC5643LF2MLQ1R
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料(不在目录中)
GPC5643LF2MLQ1
✅ 直接替换📋 参考替代料(不在目录中)
SPC56EL60L5CBFSY
✅ 直接替换📋 参考替代料(不在目录中)
SAK-TC234LP-32F200N
✅ 直接替换✓ 有现货
$11.4 / 个
查看数据手册 →SPC5643LF2MLQ1 最大额定值与电气特性
| Core Architecture | Power Architecture e200z4 (dual-core) |
| Core Count | 2 |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| 封装 | 144-LQFP (20x20 mm) |
| 引脚数量 | 144 |
| 工作温度范围 | -40 °C to +125 °C |
| Automotive Grade | Yes (AEC-Q100 qualified) |
| 安装类型 | Surface Mount |
| Pitch | 0.5 mm |
| Supply Architecture | Dual Power Architecture (internal regulator + external ballast) |
| 数据总线宽度 | 32-bit |
| RoHS 状态 | Compliant |
| MSL 等级 | 3 (per JEDEC J-STD-020, typical for LQFP) |
| Series | MPC5643L (Qorivva MPC56xx family) |
SPC5643LF2MLQ1 引脚配置
| 引脚 1 | VDD_HV — High-voltage supply (e.g., 5V for digital I/O) |
| 引脚 2 | GPIO[0] — General-purpose I/O / eMIOS channel |
| 引脚 3 | GPIO[1] — General-purpose I/O |
| 引脚 4 | GPIO[2] — General-purpose I/O |
| 引脚 5 | GPIO[3] — General-purpose I/O |
| 引脚 6 | GPIO[4] — General-purpose I/O |
| 引脚 7 | GPIO[5] — General-purpose I/O |
| 引脚 8 | GPIO[6] — General-purpose I/O |
| 引脚 9 | GPIO[7] — General-purpose I/O |
| 引脚 10 | GPIO[8] — General-purpose I/O |
| 引脚 11 | GPIO[9] — General-purpose I/O |
| 引脚 12 | GPIO[10] — General-purpose I/O |
| 引脚 13 | GPIO[11] — General-purpose I/O |
| 引脚 14 | GPIO[12] — General-purpose I/O |
| 引脚 15 | GPIO[13] — General-purpose I/O |
| 引脚 16 | GPIO[14] — General-purpose I/O |
| 引脚 17 | GPIO[15] — General-purpose I/O |
| 引脚 18 | VDD_HV — High-voltage supply |
| 引脚 19 | CAN1_TX — FlexCAN 1 transmit |
| 引脚 20 | CAN1_RX — FlexCAN 1 receive |
| 引脚 21 | CAN2_TX — FlexCAN 2 transmit |
| 引脚 22 | CAN2_RX — FlexCAN 2 receive |
| 引脚 23 | CAN3_TX — FlexCAN 3 transmit |
| 引脚 24 | CAN3_RX — FlexCAN 3 receive |
| 引脚 25 | GPIO[16] — General-purpose I/O |
| 引脚 26 | GPIO[17] — General-purpose I/O |
| 引脚 27 | GPIO[18] — General-purpose I/O |
| 引脚 28 | GPIO[19] — General-purpose I/O |
| 引脚 29 | GPIO[20] — General-purpose I/O |
| 引脚 30 | GPIO[21] — General-purpose I/O |
| 引脚 31 | GPIO[22] — General-purpose I/O |
| 引脚 32 | GPIO[23] — General-purpose I/O |
| 引脚 33 | GPIO[24] — General-purpose I/O |
| 引脚 34 | GPIO[25] — General-purpose I/O |
| 引脚 35 | GPIO[26] — General-purpose I/O |
| 引脚 36 | GPIO[27] — General-purpose I/O |
| 引脚 37 | VDDR — Voltage regulator supply (external ballast) |
| 引脚 38 | VDD — Internal core supply (1.2V regulated) |
| 引脚 39 | VSS — Ground |
| 引脚 40 | VSS — Ground |
| 引脚 41 | VDD_HV — High-voltage supply |
| 引脚 42 | RESET — External reset input (active-low) |
| 引脚 43 | GPIO[28] — General-purpose I/O |
| 引脚 44 | GPIO[29] — General-purpose I/O |
| 引脚 45 | GPIO[30] — General-purpose I/O |
| 引脚 46 | GPIO[31] — General-purpose I/O |
| 引脚 47 | GPIO[32] — General-purpose I/O |
| 引脚 48 | GPIO[33] — General-purpose I/O |
| 引脚 49 | GPIO[34] — General-purpose I/O |
| 引脚 50 | GPIO[35] — General-purpose I/O |
| 引脚 51 | GPIO[36] — General-purpose I/O |
| 引脚 52 | GPIO[37] — General-purpose I/O |
| 引脚 53 | GPIO[38] — General-purpose I/O |
| 引脚 54 | GPIO[39] — General-purpose I/O |
| 引脚 55 | GPIO[40] — General-purpose I/O |
| 引脚 56 | GPIO[41] — General-purpose I/O |
| 引脚 57 | GPIO[42] — General-purpose I/O |
| 引脚 58 | GPIO[43] — General-purpose I/O |
| 引脚 59 | GPIO[44] — General-purpose I/O |
| 引脚 60 | GPIO[45] — General-purpose I/O |
| 引脚 61 | GPIO[46] — General-purpose I/O |
| 引脚 62 | GPIO[47] — General-purpose I/O |
| 引脚 63 | GPIO[48] — General-purpose I/O |
| 引脚 64 | GPIO[49] — General-purpose I/O |
| 引脚 65 | GPIO[50] — General-purpose I/O |
| 引脚 66 | GPIO[51] — General-purpose I/O |
| 引脚 67 | GPIO[52] — General-purpose I/O |
| 引脚 68 | GPIO[53] — General-purpose I/O |
| 引脚 69 | GPIO[54] — General-purpose I/O |
| 引脚 70 | GPIO[55] — General-purpose I/O |
| 引脚 71 | GPIO[56] — General-purpose I/O |
| 引脚 72 | GPIO[57] — General-purpose I/O |
| 引脚 73 | GPIO[58] — General-purpose I/O |
| 引脚 74 | GPIO[59] — General-purpose I/O |
| 引脚 75 | GPIO[60] — General-purpose I/O |
| 引脚 76 | GPIO[61] — General-purpose I/O |
| 引脚 77 | GPIO[62] — General-purpose I/O |
| 引脚 78 | GPIO[63] — General-purpose I/O |
| 引脚 79 | VDD_HV — High-voltage supply |
| 引脚 80 | VSS — Ground |
| 引脚 81 | GPIO[64] — General-purpose I/O |
| 引脚 82 | GPIO[65] — General-purpose I/O |
| 引脚 83 | GPIO[66] — General-purpose I/O |
| 引脚 84 | GPIO[67] — General-purpose I/O |
| 引脚 85 | GPIO[68] — General-purpose I/O |
| 引脚 86 | GPIO[69] — General-purpose I/O |
| 引脚 87 | GPIO[70] — General-purpose I/O |
| 引脚 88 | GPIO[71] — General-purpose I/O |
| 引脚 89 | GPIO[72] — General-purpose I/O |
| 引脚 90 | GPIO[73] — General-purpose I/O |
| 引脚 91 | GPIO[74] — General-purpose I/O |
| 引脚 92 | GPIO[75] — General-purpose I/O |
| 引脚 93 | GPIO[76] — General-purpose I/O |
| 引脚 94 | GPIO[77] — General-purpose I/O |
| 引脚 95 | GPIO[78] — General-purpose I/O |
| 引脚 96 | GPIO[79] — General-purpose I/O |
| 引脚 97 | GPIO[80] — General-purpose I/O |
| 引脚 98 | GPIO[81] — General-purpose I/O |
| 引脚 99 | GPIO[82] — General-purpose I/O |
| 引脚 100 | GPIO[83] — General-purpose I/O |
| 引脚 101 | GPIO[84] — General-purpose I/O |
| 引脚 102 | GPIO[85] — General-purpose I/O |
| 引脚 103 | GPIO[86] — General-purpose I/O |
| 引脚 104 | GPIO[87] — General-purpose I/O |
| 引脚 105 | GPIO[88] — General-purpose I/O |
| 引脚 106 | GPIO[89] — General-purpose I/O |
| 引脚 107 | GPIO[90] — General-purpose I/O |
| 引脚 108 | GPIO[91] — General-purpose I/O |
| 引脚 109 | VDD — Internal core supply |
| 引脚 110 | VSS — Ground |
| 引脚 111 | GPIO[92] — General-purpose I/O |
| 引脚 112 | GPIO[93] — General-purpose I/O |
| 引脚 113 | GPIO[94] — General-purpose I/O |
| 引脚 114 | GPIO[95] — General-purpose I/O |
| 引脚 115 | GPIO[96] — General-purpose I/O |
| 引脚 116 | GPIO[97] — General-purpose I/O |
| 引脚 117 | GPIO[98] — General-purpose I/O |
| 引脚 118 | GPIO[99] — General-purpose I/O |
| 引脚 119 | GPIO[100] — General-purpose I/O |
| 引脚 120 | GPIO[101] — General-purpose I/O |
| 引脚 121 | GPIO[102] — General-purpose I/O |
| 引脚 122 | GPIO[103] — General-purpose I/O |
| 引脚 123 | GPIO[104] — General-purpose I/O |
| 引脚 124 | GPIO[105] — General-purpose I/O |
| 引脚 125 | GPIO[106] — General-purpose I/O |
| 引脚 126 | GPIO[107] — General-purpose I/O |
| 引脚 127 | GPIO[108] — General-purpose I/O |
| 引脚 128 | GPIO[109] — General-purpose I/O |
| 引脚 129 | GPIO[110] — General-purpose I/O |
| 引脚 130 | GPIO[111] — General-purpose I/O |
| 引脚 131 | TCLK — Test clock / JTAG TCK |
| 引脚 132 | TMS — JTAG TMS |
| 引脚 133 | TDI — JTAG TDI |
| 引脚 134 | TDO — JTAG TDO |
| 引脚 135 | VDD_HV — High-voltage supply |
| 引脚 136 | VSS — Ground |
| 引脚 137 | GPIO[112] — General-purpose I/O |
| 引脚 138 | GPIO[113] — General-purpose I/O |
| 引脚 139 | GPIO[114] — General-purpose I/O |
| 引脚 140 | GPIO[115] — General-purpose I/O |
| 引脚 141 | GPIO[116] — General-purpose I/O |
| 引脚 142 | GPIO[117] — General-purpose I/O |
| 引脚 143 | GPIO[118] — General-purpose I/O |
| 引脚 144 | GPIO[119] — General-purpose I/O |
典型应用
SPC5643LF2MLQ1 适用于 7 应用s: Automotive Body Control Module (BCM), Automotive Gateway ECU / Central Network Node, Electric Power Steering (EPS) Controller, Chassis Control Module (ABS/ESC Domain Controller), Industrial Safety PLC / SIL-rated Controller, Automotive Instrument Cluster / HMI Controller, Battery Management System (BMS) Master Controller.
Automotive Body Control Module (BCM)
The SPC5643LF2MLQ1's 1 MB ECC Flash and dual e200z4 cores running at 120 MHz make it well suited for body control modules that aggregate lighting, door, mirror, and wiper functions. The 1 MB Flash provides ample headroom for AUTOSAR RTE plus complex body-control application logic, while the 144-LQFP's abundant I/O supports the dozens of high-side/low-side drivers and LIN/CAN buses typical of a BCM. Dual-core lockstep supports ISO 26262 ASIL-B requirements for functions like lighting control and central locking. AEC-Q100 qualification and -40 °C to +125 °C operation ensure reliability in cabin and under-hood thermal environments.
推荐
Automotive Gateway ECU / Central Network Node
The SPC5643LF2MLQ1's multiple FlexCAN interfaces and 120 MHz CPU bandwidth suit it to central gateway ECUs that bridge CAN, LIN, and FlexRay networks across vehicle domains. The dual-core architecture allows one core to handle real-time CAN message routing while the other runs diagnostics and network management - this split is critical for gateway latency budgets. The 1 MB Flash holds full AUTOSAR communication stacks plus OEM-specific routing tables, and AEC-Q100 +125 °C operation tolerates the high ambient temperature inside a sealed gateway module.
推荐
Electric Power Steering (EPS) Controller
EPS controllers demand ASIL-D functional safety and deterministic torque-loop response - the SPC5643LF2MLQ1's dual e200z4 cores can be configured in lockstep for fault detection with a 120 MHz loop rate capable of 1 kHz+ torque control. The on-chip 12-bit ADC samples resolver/phase currents at high rates, and the eMIOS timer units generate the PWM for the motor inverter. AEC-Q100 Grade 1 operation up to +125 °C is required for the EPS ECU location near the engine bay. The 1 MB Flash accommodates the full EPS calibration map plus diagnostic libraries.
推荐
Chassis Control Module (ABS/ESC Domain Controller)
Chassis domain controllers consolidate multiple chassis functions (ABS, ESC, active suspension) and require fast deterministic processing - the SPC5643LF2MLQ1's dual cores at 120 MHz deliver the throughput needed for sensor fusion and closed-loop control at 100-500 Hz. The 144-LQFP package provides the I/O count required for multiple sensor inputs (wheel speed, yaw rate, steering angle) and CAN-FD communication with other chassis ECUs. ECC-protected 1 MB Flash is essential for ASIL-rated chassis software stacks and field-update campaigns.
推荐
Industrial Safety PLC / SIL-rated Controller
Beyond automotive, the SPC5643LF2MLQ1's dual-core lockstep architecture, ECC Flash, and AEC-Q100 reliability are equally attractive for industrial safety PLCs targeting IEC 61508 SIL-2/SIL-3 applications. The 120 MHz e200z4 cores execute safety logic with deterministic response, and the FlexCAN interfaces integrate with industrial CANopen and DeviceNet networks. The -40 °C to +125 °C range covers harsh factory-floor and outdoor cabinet installations. The 144-LQFP package is widely supported by industrial PCB assembly lines.
推荐
Automotive Instrument Cluster / HMI Controller
Automotive instrument clusters and entry-level HMI controllers need moderate CPU throughput plus automotive-grade reliability, which the SPC5643LF2MLQ1 provides with its 120 MHz dual-core architecture. One core drives the graphics/LVDS display update while the other handles CAN communication with the BCM, powertrain, and ADAS ECUs. The 1 MB Flash holds the cluster graphics library plus OEM branding assets, and the 144-LQFP exposes enough pins for the display interface, backlight control, and indicator LEDs. AEC-Q100 +125 °C rating ensures reliability behind the dashboard.
推荐
Battery Management System (BMS) Master Controller
In EV/HEV battery management systems, the SPC5643LF2MLQ1 acts as the master BMS controller communicating with multiple slave cell-monitoring ICs via isolated SPI or CAN. Its dual-core architecture lets one core handle the safety-critical state-of-charge and state-of-health calculations in lockstep while the other manages CAN communication with the vehicle controller. The 1 MB Flash holds the cell-balancing algorithms and aging models, while the 144-LQFP's I/O count accommodates the multiple SPI chip-select lines needed for daisy-chained cell monitors. AEC-Q100 +125 °C operation handles the under-seat battery pack thermal environment.
推荐
推荐产品汇总
工程参考数据: SPC5643LF2MLQ1 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | SPC5643LF2MLQ1R | GPC5643LF2MLQ1 | SPC56EL60L5CBFSY | SAK-TC234LP-32F200N |
|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same physical, verify pinout | LQFP-144 - same physical, different pinout |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Infineon |
| Core Architecture | Power Architecture e200z4 (dual-core) | Power Architecture e200z4 (dual-core) | Power Architecture e200z4 (dual-core) | Power Architecture e200z4 (dual-core) | TriCore AURIX TC234L (single-core) |
| Core Count | 2 | 2 | 2 | 2 | 1 (single-core, with lockstep companion on multi-core variants) |
| Automotive Grade | AEC-Q100 (Q1 suffix) | AEC-Q100 | General-purpose (GP prefix, not automotive) | AEC-Q100 | AEC-Q100 |
关键差异点
- Dual-core Power Architecture e200z4 in 144-LQFP (对比 SPC5602BAVLL4)
- 1 MB ECC Flash for AUTOSAR stacks (对比 SPC560P44L3CEFAR)
- Automotive-grade screening (AEC-Q100, Q1 suffix) (对比 GPC5643LF2MLQ1)
- MPC56xx family heritage with extensive automotive ecosystem (对比 SAK-TC234LP-32F200N (Infineon AURIX))
设计说明
The SPC5643LF2MLQ1 uses NXP's dual-power architecture: the internal core voltage is generated by an on-chip regulator that requires an external NPN ballast transistor (e.g., BCP68T1G) on the VDDR pin, plus a 4.7 µF decoupling capacitor. The VDD_HV pins (5 V or 3.3 V I/O supply) need bulk decoupling (10 µF tantalum + 100 nF ceramic) at each pair. Failing to provide the external ballast will prevent the core voltage regulator from starting and the MCU will not boot. Refer to the MPC5643L reference schematic for the exact ballast transistor part number and PCB footprint.
Estimated: at 120 MHz, switching currents on the SPC5643LF2MLQ1 can reach 200-300 mA peak with 5-10 ns edge rates. Place one 100 nF X7R 0402/0603 ceramic bypass within 2 mm of every VDD/VSS pin pair, plus four 10 µF X5R bulk capacitors distributed around the package. Use a continuous ground plane on layer 2 directly under the LQFP - never route signals under the package. The 0.5 mm pitch LQFP requires precise solder paste deposition (stencil apertures of 0.4 mm with 0.05 mm wall thickness) for reliable reflow.
Three pitfalls: (1) both e200z4 cores must be initialized correctly in the startup code - the secondary core remains in reset until released by the primary core; (2) the JTAG/DEBUG pins share functions with GPIO and require careful mux configuration to avoid locking out debug access; (3) the Flash ECC must be enabled before any code execution from Flash, otherwise unexpected resets may occur. Always load the proper BAM (Boot Assist Module) and disable the watchdog during early bring-up to avoid bricking.
The FlexCAN bus requires a 120 Ω termination resistor at each end of the bus, plus common-mode choke for AEC-Q100 EMI compliance. Keep CAN traces under 1/4 of the signal rise time delay length, and route them over a continuous ground plane separated by at least 4x the trace width from other signals. For SPI buses to peripherals, add 33 Ω series damping resistors at the driver output if the trace length exceeds 50 mm. The RESET line is noise-sensitive - place a 1 nF capacitor and 10 kΩ pull-up on it, and keep it short and guarded.
合规信息
AEC-Q100 qualified per the Q1 suffix in the MPN; RoHS and REACH compliant per NXP product page. Halogen-free status not explicitly stated in retrieved web data - verify with NXP material declaration if required.