STM32H743XGH6 - 480MHz 1MB MCU | STMicroelectronics | TFBGA
料号： STM32H743XGH6 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.1008 | $7.10 |
| 10 | $7.1008 | $71.01 |
| 100 | $7.1008 | $710.08 |
| 500 | $7.1008 | $3,550.40 |
| 1,000 | $7.1008 | $7,100.80 |
STM32H743XGH6 概述
A microcontroller is a semiconductor device that integrates a processor core, memory, peripherals, and communication interfaces into one component. The STM32H7 family belongs to the hierarchy microcontroller -> 32-bit embedded processor -> Arm Cortex-M microcontroller. Its Cortex-M7 core is designed for demanding embedded workloads, while the 1 MB flash and 1 MB RAM provide useful local storage and working memory.
Key verified features include Arm Cortex-M7 architecture, operation up to 480 MHz, 1 MB flash, and 1 MB RAM. The package and pin count are identified by the ordered part number as a 240+25-TFBGA package. The TFBGA format supports compact high-density PCB integration, but its fine ball pitch requires careful PCB layout and manufacturing control.
The STM32H7 platform is suited to applications requiring high processing throughput, substantial memory, or connected embedded control. Its 480 MHz Cortex-M7 core can accelerate control loops and signal-processing tasks, while the memory resources reduce dependence on external storage when the application can fit within the on-chip memories. Specific peripheral functions and electrical limits should be confirmed against the manufacturer documentation for the exact ordering code.
Typical application areas include industrial automation, connected equipment, audio and DSP-enabled embedded systems, communications, and high-performance control platforms. For a new design, verify the exact STM32H743XG pin allocation, power requirements, clock configuration, decoupling, exposed-pad treatment, and programming workflow before layout release.
A key design consideration is that package compatibility alone does not guarantee software interchangeability. Firmware, startup files, memory maps, clock trees, peripheral configurations, and board-level support packages must be reviewed carefully. The compact 14 mm by 14 mm TFBGA also demands thermal and assembly planning comparable to other high-density lead-free packages.
This page consolidates verified manufacturer and distributor information, commercial availability links, package identity, and application-oriented engineering guidance. Detailed electrical, pin-level, thermal, and compliance parameters remain subject to the official STM32H743XG documentation and the exact manufacturer order code.
直接替换替代料： STM32H743XGH6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： STM32H743XGH6 （相同外形与封装尺寸） ——差异在于 Package, Flash Memory, Core, ART Accelerator, Instruction Set.
快速对比工具——选择替代料号进行并排对比：
STM32F407IGH6TR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$9.7992 / 个
查看数据手册 →STM32F429VGT6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$10.85 / 个
查看数据手册 →STM32H742xI/G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
STM32H743XIH6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →STM32H743XGH6
✅ 直接替换✓ 有现货
$7.1008 / 个
查看数据手册 →STM32H743XGH6 最大额定值与电气特性
| Product Type | 32-bit ARM Cortex-M7 microcontroller |
| Maximum Core Frequency | 480 MHz |
| Flash Memory | 1 MB (1M x 8) |
| RAM | 1 MB |
| CPU Architecture | Arm Cortex-M7 |
| Instruction Set | 32-bit RISC |
| 封装 | 240+25-TFBGA (14 mm x 14 mm) |
| Ball Count | 265 balls |
| 安装类型 | Surface Mount |
| RoHS 状态 | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
| Lead-Free Status | unknown |
STM32H743XGH6 240+25-tfbga (14 mm x 14 mm) 引脚配置指南
STM32H743XGH6（240+25-tfbga (14 mm x 14 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： STM32H743XGH6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
STM32H743XGH6 适用于 7 应用s: Industrial Automation Controllers, Connected Industrial Equipment, DSP-Enabled Embedded Control, Audio and Communications Equipment, High-Performance Sensor Processing, Test and Measurement Equipment, Human-Machine Interface and Embedded Control.
Industrial Automation Controllers
The STM32H743XGH6 fits industrial automation controllers that need fast control-loop execution and substantial local memory. Its verified Arm Cortex-M7 core operates up to 480 MHz, while 1 MB of flash and 1 MB of RAM provide room for application code, configuration, diagnostics, and communication buffers. The device can sit beside sensors, motor-control electronics, and network transceivers as the central embedded controller. The compact 240+25-TFBGA package reduces board area, but industrial designs must verify supply voltage, temperature range, isolation, EMC behavior, and long-term availability from the exact STMicroelectronics documentation.
推荐
Connected Industrial Equipment
For connected industrial equipment, STM32H743XGH6 provides the processing headroom and memory required to combine control functions with network-facing protocols. The 480 MHz Cortex-M7 core can handle protocol processing and application logic concurrently, and the 1 MB flash plus 1 MB RAM supports firmware, data structures, and buffering. It is particularly relevant where a product needs more capability than a basic Cortex-M MCU but does not require a separate processor. Engineer the board with verified I/O voltage domains, clocking, power sequencing, decoupling, and thermal paths; the supplied data does not establish Ethernet, USB, or connector-specific electrical details.
推荐
DSP-Enabled Embedded Control
The STM32H743XGH6 is suitable for embedded control systems that combine deterministic control with higher-throughput signal processing. Its Arm Cortex-M7 core operates up to 480 MHz and includes the performance-oriented architecture described by STMicroelectronics for the STM32H7 family. The 1 MB flash and 1 MB RAM are valuable when filters, sampling buffers, or complex control state must remain local. Use the device when algorithm execution can justify the package and thermal complexity, and validate interrupt latency, peripheral synchronization, memory bandwidth behavior, and analog interface requirements against the full manufacturer documentation.
推荐
Audio and Communications Equipment
The STM32H743XGH6 can support audio and communications equipment where local processing, protocol handling, and control must coexist. Its 480 MHz Cortex-M7 performance and 1 MB of RAM provide useful capacity for signal buffers and application state, while 1 MB flash supports embedded firmware. In a communications product, the MCU can manage framing, buffering, user-interface logic, and supervisory control. In audio equipment, it can supervise conversion, filtering, and transport functions. Exact audio peripherals, sample-rate support, interfaces, and power domains were not supplied and must be confirmed from the STM32H743XG documentation before design commitment.
推荐
High-Performance Sensor Processing
STM32H743XGH6 is appropriate for sensor-processing platforms that need to acquire, filter, and interpret data locally. The high-frequency Cortex-M7 core can execute processing-intensive algorithms while the 1 MB RAM reduces pressure on external memory, and the 1 MB flash can hold substantial application firmware. This is useful in condition-monitoring, test equipment, and smart instrumentation where data must be processed close to the sensor. The exact ADC resolution, channel count, sampling characteristics, analog supply range, and sensor-interface details were not provided, so engineers should verify them in the manufacturer datasheet before selecting external analog circuitry.
推荐
Test and Measurement Equipment
The STM32H743XGH6 is a reasonable candidate for test and measurement equipment that combines user-interface control, calibration data, communications, and real-time signal processing. The Cortex-M7 core operating up to 480 MHz supports compute-heavy control tasks, while 1 MB of flash and RAM allow local code and measurement state. The device can coordinate converters, clocks, communication transceivers, and front-panel interfaces on a compact high-density board. Because the supplied data does not specify analog accuracy, reference-voltage quality, clock-jitter requirements, or temperature behavior, instrument designs should confirm those requirements directly against the official STM32H743XG documentation.
推荐
Human-Machine Interface and Embedded Control
STM32H743XGH6 can serve as the processing center for a human-machine interface when the product combines display control, communications, and embedded automation. Its 480 MHz core provides headroom for graphics-related logic, input handling, and background communication, while 1 MB of RAM supports local UI state and buffers. The same device can manage keypad, display, communications, and actuator-control tasks in a compact board. The supplied data does not identify display, touch, USB, or external-memory interfaces for the exact MPN, so the product architecture should be validated against the official peripheral list before PCB routing and firmware planning.
推荐
推荐产品汇总
工程参考数据： STM32H743XGH6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | STM32F407IGH6TR | STM32F429VGT6 | STM32H742xI/G | STM32H743XIH6 | STM32H743XGH6 |
|---|---|---|---|---|---|---|
| Package | 240+25-TFBGA (14 mm x 14 mm) | 240+25-TFBGA (14 mm x 14 mm) | 240+25-TFBGA (14 mm x 14 mm) | 240+25-TFBGA (14 mm x 14 mm) | 240+25-TFBGA (14 mm x 14 mm) | 240+25-TFBGA (14 mm x 14 mm) |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Architecture | 32-bit RISC | 32-bit RISC | 32-bit RISC | 32-bit RISC | 32-bit RISC | 32-bit RISC |
关键差异点
- Higher verified maximum frequency （对比 STM32F407IGH6TR)
- Same-family Cortex-M7 positioning （对比 STM32H742xI/G)
- 1 MB flash and 1 MB RAM （对比 STM32F407IGH6TR)
- Compact 265-ball TFBGA integration （对比 STM32F429VGT6)
设计说明
The verified 240+25-TFBGA package uses 265 balls and a 14 mm by 14 mm footprint, so the PCB design must follow the exact STMicroelectronics land pattern and assembly recommendations. Maintain the specified ball-pitch, solder-mask, pad, and thermal-via rules from the official package drawing. Treat the supplied package identification as verified, but do not infer individual pad locations without the manufacturer pinout and land-pattern documents.
Power design must be based on the exact STM32H743XG supply domains, voltage ranges, current limits, and sequencing requirements from the manufacturer datasheet. Place required bypass capacitors at the pins identified in the reference layout and validate the power tree under maximum clock, memory, and I/O activity. The supplied data does not include voltage or current values, so capacitor sizing and rail-drop estimates cannot be made responsibly.
A 480 MHz Cortex-M7 device in a compact TFBGA can require careful thermal planning even when the design appears electrically light. Use the manufacturer thermal characterization for the selected PCB stack-up, copper area, via arrangement, ambient temperature, and operating mode. Verify junction temperature under worst-case processing and I/O load; no thermal resistance or power-dissipation figure was supplied, so any thermal calculation would be an unsupported estimate.
Keep clock, high-speed memory, and communication routes short and controlled, with continuous return paths and clean separation between sensitive analog or low-speed interfaces and fast digital signals. Review the STM32H743XG reference layout for decoupling, oscillator placement, reset, boot, and exposed thermal-pad handling. Exact pin functions and layout distances must come from the complete manufacturer documentation rather than from a generic STM32H7 design.
Do not substitute STM32F4, STM32F7, or other STM32 devices solely because the package name or ball count appears similar. Firmware startup, memory map, peripheral configuration, interrupt architecture, clock tree, pin multiplexing, electrical limits, and package land pattern must all be checked. A replacement that is not confirmed pin-to-pin compatible can require PCB changes, firmware changes, and complete production requalification.
合规信息
The supplied verified data does not contain RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Obtain current STMicroelectronics declarations and exact-ordering-code qualification records before production release.
