TPSM82866C - 6A Step-Down Power Module I2C | Texas Instruments
料号： TPSM82866C ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.1 | $4.10 |
| 10 | $3.7 | $37.00 |
| 100 | $3.25 | $325.00 |
| 500 | $2.9 | $1,450.00 |
| 1,000 | $2.55 | $2,550.00 |
TPSM82866C 概述
A step-down power module is a complete DC-DC converter that integrates the controller, power FETs, inductor, and compensation into a single package. This integration simplifies design, reduces external component count, and minimizes PCB footprint compared to discrete buck regulator solutions. The TPSM82866C belongs to the TPSM8286xx family, which includes 4A (TPSM82864x) and 6A (TPSM82866x) variants, all pin-to-pin and BOM-to-BOM compatible, allowing easy scalability between current ratings.
Key features include a 200nH shielded inductor that enhances EMI performance, an I2C interface for dynamic voltage scaling and telemetry, and high efficiency across the load range. The module supports output voltage programming via I2C or external resistors, and includes soft-start, overcurrent protection, and thermal shutdown. The RCF MagPack package shields both the inductor and the IC, further improving EMI performance.
The TPSM82866C uses a synchronous buck topology with integrated MOSFETs, achieving high efficiency at light and full loads. The I2C interface allows real-time monitoring of output voltage, current, and temperature, enabling adaptive power management. The integrated, shielded inductor reduces EMI and simplifies layout.
Typical applications include FPGA, ASIC, and DSP power supplies, server and networking equipment, and industrial automation. The I2C interface is particularly useful in systems requiring dynamic voltage scaling or telemetry.
When designing with this module, ensure proper input and output capacitance for stability and transient response. Configure the I2C address and output voltage settings per system requirements, and provide adequate PCB copper area for heat dissipation.
直接替换替代料： TPSM82866C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： TPSM82866C （相同外形与封装尺寸） ——差异在于 Input Voltage Range, Package, Protection Features, Topology, Family.
快速对比工具——选择替代料号进行并排对比：
TPSM82864CA1PRCFR
✅ 直接替换📋 参考替代料（不在目录中）
TPSM82866CB2PRCFR
✅ 直接替换📋 参考替代料（不在目录中）
TPSM82866CB3PRCFR
✅ 直接替换📋 参考替代料（不在目录中）
TPSM82866AA1PRCFR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
TPSM82816SIER
✅ 直接替换✓ 有现货
$2.85 / 个
查看数据手册 →TPSM82866C 最大额定值与电气特性
| 拓扑 | Synchronous Step-Down (Buck) Module |
| 输入电压范围 | 2.4 V to 5.5 V |
| Output Current | 6 A |
| 输出电压 | Adjustable (variant dependent, e.g. 0.2 V to 0.838 V for A1 option) |
| Integrated Inductor | 200 nH shielded (MagPack) |
| 接口 | I2C (dynamic voltage scaling and telemetry) |
| 封装 | MagPack QFN (RCF), 2.3 mm x 3 mm |
| Power Density | Approx. 1 A per 1 mm2 |
| Family | TPSM8286xx (4A/6A, pin-to-pin and BOM-to-BOM compatible) |
| Protection Features | Overcurrent protection, thermal shutdown, soft-start |
| Output Voltage Programming | I2C or external resistors |
| 安装类型 | Surface Mount |
| EMI Performance | Shielded inductor and shielded IC for improved EMI |
| Outputs | 1 |
| Switching Regulator Type | Non-Isolated PoL Module DC-DC Converter |
| RoHS 状态 | Compliant |
TPSM82866C 引脚配置
| 引脚 1 | VIN — Input supply, 2.4V to 5.5V |
| 引脚 2 | GND — Ground |
| 引脚 3 | EN — Enable control |
| 引脚 4 | SCL — I2C clock |
| 引脚 5 | SDA — I2C data |
| 引脚 6 | VOSNS — Output voltage sense / feedback |
| 引脚 7 | VOUT — Regulated output, up to 6A |
| 引脚 8 | PGOOD — Power good indicator |
| 引脚 EP | Thermal Pad / GND — Exposed pad for thermal and electrical ground connection |
典型应用
TPSM82866C 适用于 6 应用s: FPGA/ASIC Core Power, Server and Data Center PoL, Networking Equipment, Industrial Automation, Test and Measurement Instruments, Optical Modules and Small Form-Factor Systems.
FPGA/ASIC Core Power
The TPSM82866C fits FPGA and ASIC core rails because its 6A output covers typical core currents while the I2C interface enables dynamic voltage scaling for performance-power optimization. Placed close to the device with the integrated 200nH shielded inductor, it minimizes loop area and switching noise reaching sensitive load pins. Telemetry (voltage, current, temperature) lets a system controller verify rail health in real time, and the 2.3mm x 3mm footprint keeps dense multi-rail power trees compact.
推荐
Server and Data Center PoL
In server baseboard and NIC designs, board area near processors is scarce; the TPSM82866C integrates the inductor into its MagPack package to deliver nearly 1A per 1mm2 power density. Operating from 2.4V to 5.5V intermediate rails, it converts to sub-1V core or SOC rails at 6A. I2C telemetry supports rack-level health monitoring, while shielded construction reduces EMI in high-speed signal environments common to server platforms.
推荐
Networking Equipment
Routers and switches pack many ASICs and PHYs needing compact, efficient low-voltage rails. The TPSM82866C's 2.4V to 5.5V input accepts the 5V or 3.3V board rails, and its adjustable output (set by variant or I2C) matches diverse ASIC requirements. The integrated shielded inductor limits radiated emissions near sensitive receive paths, and BOM-to-BOM scalability with the 4A TPSM82864x lets one layout serve multiple rail currents.
推荐
Industrial Automation
Industrial controllers and drives require robust point-of-load conversion with monitoring. The TPSM82866C provides overcurrent protection, thermal shutdown, and soft-start for fault-tolerant operation, while I2C telemetry enables predictive maintenance by reporting rail current and temperature. Its surface-mount MagPack package withstands vibration better than through-hole inductors, and the shielded 200nH inductor keeps EMI within limits in electrically noisy factory environments.
推荐
Test and Measurement Instruments
Bench instruments and modular test cards need small, low-noise, programmable rails. The TPSM82866C's I2C-controlled output allows software-adjustable supply levels during calibration or characterization, useful when exciting devices under test at different voltages. High efficiency across the load range reduces internal heating in enclosed instruments, and telemetry logs rail conditions for diagnostics and compliance reporting.
推荐
Optical Modules and Small Form-Factor Systems
Optical transceiver modules and other small form-factor systems are severely space constrained, yet still require efficient sub-1V or 1V-class rails at multi-amp loads. The TPSM82866C's 2.3mm x 3mm MagPack footprint and integration of the inductor remove the tallest external component from the assembly, aiding low-profile designs. Its 2.4V to 5.5V input covers common module supply rails, and shielded construction limits EMI near high-speed serial links.
推荐
推荐产品汇总
工程参考数据： TPSM82866C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | TPSM82864CA1PRCFR | TPSM82866CB2PRCFR | TPSM82816 |
|---|---|---|---|---|
| Package | MagPack QFN (RCF) 2.3mm x 3mm | MagPack QFN (RCF) 2.3mm x 3mm - same | MagPack QFN (RCF) 2.3mm x 3mm - same | MagPack QFN - similar footprint |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Output Current | 6 A | 4 A | 6 A | 6 A |
| I2C Interface | Yes (DVS + telemetry) | Yes | Yes | No |
| Integrated Inductor | 200 nH shielded (MagPack) | 200 nH shielded (MagPack) | 200 nH shielded (MagPack) | Integrated, proprietary material |
| Pin/BOM Compatibility | TPSM8286xx family, pin-to-pin and BOM-to-BOM | Pin-to-pin and BOM-to-BOM compatible | Pin-to-pin compatible (same die family) | Not BOM-to-BOM; check layout |
关键差异点
- I2C dynamic voltage scaling and telemetry （对比 TPSM82866A)
- Higher output voltage option available （对比 TPSM82866CB2PRCFR)
- 6A in the same footprint as 4A （对比 TPSM82864CA1PRCFR)
设计说明
Place input capacitance (e.g., 22uF ceramic) as close to the VIN and GND pins as possible to minimize input ripple and EMI. Use a solid ground plane and connect the exposed thermal pad to multiple ground vias - this pad is both the thermal path and the power ground return for the 6A output. Follow the layout section of TI datasheet (tpsm82866c.pdf) for recommended land pattern and via stitching.
At high VIN-VOUT differentials and full 6A load, power loss concentrates in the small 2.3mm x 3mm package. Provide at least 1 square inch of copper pour connected to the exposed pad, and verify junction temperature stays within the datasheet limit for your airflow condition. Use I2C temperature telemetry to validate thermal margin during system-level testing.
The TPSM8286xx family has multiple VOUT option variants (e.g., CA1: 0.2-0.838V, CB2: 0.4-1.675V). Ordering the wrong VOUT option is a common error - verify the ordering code against your rail voltage before release. Also configure the I2C address to avoid bus conflicts, and do not omit the recommended output capacitance, which affects loop stability and transient response.
合规信息
RoHS compliance per TI product page and DigiKey listing. Other compliance details not stated in provided data.
