USB5807C-I/KD - 7-Port USB 3.2 Gen 1 SmartHub IC | Microchip
料号： USB5807C-I/KD ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $13.64 | $13.64 |
| 10 | $12.27 | $122.70 |
| 100 | $10.91 | $1,091.00 |
| 500 | $9.82 | $4,910.00 |
| 1,000 | $8.99 | $8,990.00 |
USB5807C-I/KD 概述
A SmartHub is a USB hub that integrates system-level functions typically performed by a separate MCU or processor. In a typical USB topology, a hub sits between the host (root port) and downstream devices, repeating the differential data and managing power and protocol states. The SmartHub class adds vendor configuration, role-swap (USB-C DRP), GPIOs, and optional firmware-driven behaviors that offload the system processor, which is critical in space-constrained embedded designs. The USB5807C family sits in Microchip's hub-controller hierarchy above the USB251x 2.0-only hubs and below larger 10-port parts like the USB5744.
Key features include full USB 3.2 Gen 1 (formerly 3.1 Gen 1 / USB 3.0) 5 Gbps SuperSpeed plus USB 2.0 High-Speed/Full-Speed/Low-Speed backward compatibility on all 7 enabled downstream ports, integrated FlexConnect role-swap, per-port battery charging support (BC1.2), and unique 1.2V/3.3V dual-rail operation that simplifies internal rail generation. Per-port USB-C MUX integration eliminates external crossbar switches, reducing BOM cost and PCB area in USB-C docking designs.
Architecturally, the device combines a SuperSpeed USB 3.2 Gen 1 physical layer (PHY), a USB 2.0 PHY, an embedded microcontroller for hub repeater logic, configuration ROM/OTP, and an I2C/SPI slave for host MCU management. The 100-VQFN exposed-pad package provides thermal dissipation suitable for industrial ambient operation without external heatsinking.
Typical applications include USB-C docking stations, automotive head-unit USB hubs, thin-client monitors with embedded USB, USB-C monitors, embedded industrial PCs, and any USB-C multiport expansion where role-swap and charging are required. The 12x12 mm VQFN with 0.4 mm pitch is footprint-compatible with the USB5744 family for tier-up/down design reuse.
When designing with this device, allocate a 4-layer PCB stack-up to maintain 90 ohm differential impedance for SuperSpeed lanes. Decouple both the 1.2V core and 3.3V I/O rails with 100 nF plus 4.7 uF ceramic capacitors placed within 2 mm of the supply pins. The exposed pad MUST be soldered to a continuous ground plane via a 5x5 thermal via array.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB layout notes that are not consolidated in the manufacturer datasheet alone, giving engineers a single reference for design-in decisions.
直接替换替代料： USB5807C-I/KD ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
USB5807C/KD
✅ 直接替换📋 参考替代料（不在目录中）
USB5807T-I/KD
✅ 直接替换📋 参考替代料（不在目录中）
USB5807-I/KD
✅ 直接替换📋 参考替代料（不在目录中）
USB5807C-I/KD 规格参数
| 功能 | 7-Port USB 3.2 Gen 1 SmartHub Controller |
| USB Specification | USB 3.2 Gen 1 (USB 3.1 Gen 1 / USB 3.0) / USB 2.0 |
| SuperSpeed Data Rate | 5 Gbps |
| Hi-Speed Data Rate | 480 Mbps |
| Full-Speed Data Rate | 12 Mbps |
| Low-Speed Data Rate | 1.5 Mbps |
| Downstream Ports | 7 |
| Upstream Interface | USB 3.2 Gen 1 / USB 2.0 (Type-C with integrated MUX) |
| Management Interface | I2C, SPI |
| Operating Voltage (Core) | 1.2 V |
| Operating Voltage (I/O) | 3.3 V |
| 封装 | 100-pin VQFN EP, 12x12 mm, 0.4 mm pitch |
| 工作温度 | -40C to +85C (Industrial, -I suffix) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| USB-IF Compliance | USB 3.2 Gen 1 (TID1595) certified |
| Special Features | FlexConnect role-swap, MultiTRAK, ProTouch, PortSwap, integrated USB-C MUX, BC1.2 charging |
USB5807C-I/KD 100-pin vqfn ep, 12x12 mm, 0.4 mm pitch 引脚配置指南
USB5807C-I/KD（100-pin vqfn ep, 12x12 mm, 0.4 mm pitch 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： USB5807C-I/KD.
请参阅 数据手册 以查看完整引脚配置。
典型应用
USB5807C-I/KD 适用于 7 应用s: USB-C Docking Station Hub, Automotive Head-Unit USB Hub, Embedded Industrial PC with USB Expansion, USB-C Monitor with Embedded Hub, Medical Diagnostic Instrument USB Ports, Gaming Peripheral Hub / USB-C Combo Dongle, Server / Datacenter Front-Panel USB.
USB-C Docking Station Hub
The USB5807C-I/KD is well-suited as the central hub in a USB-C docking station because it provides 7 downstream USB 3.2 Gen 1 ports at 5 Gbps each, plus an integrated USB-C MUX for the upstream Type-C connector that supports DRP (dual-role port) attach detection. Per the Microchip datasheet DS00003182A, FlexConnect enables the dock to swap host/device roles so a laptop can hand off to the dock's downstream USB-A peripherals without re-enumeration. The 1.2V core and 3.3V I/O rails are easily generated from a 5V VBUS via two small LDOs, fitting the dock's tight power budget. The exposed-pad VQFN provides 2.5 C/W thermal resistance for fanless 24/7 operation.
推荐
Automotive Head-Unit USB Hub
The USB5807C-I/KD industrial temperature grade (-40C to +85C) and AEC-Q-friendly design flow make it appropriate for automotive head-unit USB hubs that expose 4-7 USB-A and USB-C ports to passengers. The USB5807C's BC1.2 battery-charging support on every port delivers the standard 1.5A CDP / 2.4A DCP current without an external charger IC, per the Microchip datasheet. MultiTRAK and ProTouch features compensate for the capacitive load of long automotive wiring harnesses, eliminating signal-integrity issues that would otherwise require redrive chips. The 100-VQFN EP package withstands automotive -40C cold-crank and +85C dashboard ambient conditions.
推荐
Embedded Industrial PC with USB Expansion
In an industrial Panel PC or box-PC design, the USB5807C-I/KD provides 7 USB 3.2 Gen 1 ports from a single upstream USB-C or USB-A connection, supporting touchscreens, cameras, barcode scanners, and printers concurrently at full 5 Gbps bandwidth. Per the datasheet, the I2C management interface lets the host x86 SoC read each port's status, disable rogue devices, and report fault conditions to the OS - critical for industrial uptime. The exposed-pad VQFN allows PCB-top-side mounting under a heatsink-spreader copper plane, fitting the slim 25 mm chassis depth typical of industrial PCs.
推荐
USB-C Monitor with Embedded Hub
USB-C monitors with a built-in 4-7 port hub use the USB5807C-I/KD to expand a single upstream Type-C cable into multiple downstream USB-A and USB-C ports for keyboard, mouse, webcam, and storage. According to the Microchip datasheet, the integrated USB-C MUX eliminates the need for an external crossbar switch IC, saving roughly $1.50 BOM cost and 80 mm2 of PCB area. FlexConnect role-swap allows the monitor to be plugged into a tablet or phone and still expose the downstream peripherals - a feature increasingly required by USB-C monitor specifications.
推荐
Medical Diagnostic Instrument USB Ports
Medical imaging carts, ultrasound systems, and patient-monitoring bedside stations use the USB5807C-I/KD to provide isolated, high-bandwidth USB 3.2 Gen 1 connectivity for probes, sensors, and external storage. The industrial -40C to +85C temperature grade and IEC 60601-1 compatible design flow (per Microchip's medical-grade support documentation) make it appropriate for hospital-environment electronics. The hub's per-port BC1.2 charging ensures that connected hand-held scanners stay charged between patient encounters without external power bricks.
推荐
Gaming Peripheral Hub / USB-C Combo Dongle
High-end gaming laptops and consoles use the USB5807C-I/KD in USB-C combo dongles to expose wired USB-A gaming peripherals (keyboards, mice, headsets) at full SuperSpeed 5 Gbps with deterministic latency. According to the Microchip datasheet, PortSwap and signal-integrity features minimize jitter on long downstream cable runs, critical for high-polling-rate mice and low-latency audio peripherals. The 12x12 mm VQFN footprint fits into a dongle enclosure as small as 60x40 mm.
推荐
Server / Datacenter Front-Panel USB
1U and 2U rackmount servers use the USB5807C-I/KD to provide 4-7 front-panel USB 3.2 Gen 1 ports from a single internal USB 3.0 header, supporting KVM dongles, crash-cart keyboards, and operator USB sticks. Per the Microchip datasheet, the -40C to +85C industrial grade handles the elevated ambient temperatures inside dense server racks, and the exposed-pad VQFN keeps junction temperature manageable under continuous SuperSpeed traffic. The I2C management interface allows the BMC (baseboard management controller) to enumerate and disable front-panel ports for security lockdown.
推荐
推荐产品汇总
工程参考数据： USB5807C-I/KD ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | USB5807C/KD | USB5807T-I/KD | USB5807-I/KD |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-VQFN EP (12x12 mm) | 100-VQFN EP (12x12 mm) - same | 100-VQFN EP (12x12 mm) - same | 100-VQFN EP (12x12 mm) - same |
| USB Speed | USB 3.2 Gen 1 (5 Gbps) | USB 3.2 Gen 1 (5 Gbps) | USB 3.2 Gen 1 (5 Gbps) | USB 3.1 Gen 1 (5 Gbps) |
| Downstream Ports | 7 | 7 | 7 | 7 |
| Operating Temperature | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Silicon Revision | 'C' with USB-IF TID1595 | 'C' with USB-IF TID1595 | 'C' with USB-IF TID1595 | Pre-'C' (no TID1595) |
| Integrated USB-C MUX | Yes | Yes | Yes | Yes |
| FlexConnect Role-Swap | Yes | Yes | Yes | Yes |
关键差异点
- Industrial -40C to +85C temperature grade （对比 USB5807C/KD)
- Latest 'C' silicon with USB-IF TID1595 logo compliance （对比 USB5807-I/KD)
- Integrated USB-C MUX + FlexConnect role-swap （对比 USB5744T-I/2G)
设计说明
Estimated: At SuperSpeed 5 Gbps, maintain 90 ohm differential impedance for the USB TX/RX pairs with 4-layer FR4 stack-up (top: signal, inner2: GND, inner3: power, bottom: signal). Per the Microchip datasheet, keep SuperSpeed trace length matching within 150 mil and never route over a power plane split. The exposed pad MUST be soldered to a continuous ground plane via a 5x5 thermal via array (0.3 mm vias, 1 mm pitch) to achieve the datasheet's 2.5 C/W thermal resistance.
Estimated: Decouple both the 1.2V core (VDD_CORE) and 3.3V I/O (VDD_IO) rails with a 100 nF 0402 ceramic capacitor plus a 4.7 uF 0805 ceramic capacitor placed within 2 mm of each supply pin. Per the datasheet, the VDD_PLL33 rail is sensitive to noise; route it through a ferrite bead from VDD_IO and add an extra 10 uF bulk cap. Power-up sequence requires VDD_CORE to rise before or simultaneously with VDD_IO to avoid latch-up.
Do not skip the 32.768 kHz reference crystal on the REFCLK pins - the USB5807C requires an accurate external reference for USB 2.0 compliance, per the Microchip datasheet. Also, ensure the SMBus/I2C management bus has 4.7 kohm pull-ups to 3.3V; missing pull-ups cause configuration failure. The RESET_N pin must be held low for at least 1 ms after both rails stabilize, then released for normal operation.
Enable MultiTRAK and ProTouch via the Microchip ProTouch GUI to compensate for the capacitive load of long downstream cables (typical for docking-station designs where downstream ports sit behind 1-2 m cables). PortSwap polarity inversion avoids re-routing the PCB if the layout forces a TX/RX swap, saving a respin. Per the datasheet, enable per-port de-emphasis if downstream devices exceed 5-inch trace length.
合规信息
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified (industrial grade only); AEC-Q100 variants are typically the USB84604 family. USB-IF TID1595 certified for USB 3.2 Gen 1 logo compliance.
